A finished circuit board

Abstract

This utility model belongs to the field of circuit board technology, specifically, it provides a finished circuit board; comprising: an FPC, the FPC including a first surface, the first surface including a first soldering area and a first non-soldering area; and a PCB, the PCB including a second surface, the second surface including a second soldering area and a second non-soldering area; an adhesive layer is provided at the edge of the first soldering area and / or the edge of the second soldering area. This utility model saves the dispensing steps required for soldering the FPC board and PCB board by applying adhesive at the edge of the soldering area, avoiding adhesive overflow that would thicken the battery, and achieving the effects of enhanced soldering stability, reduced battery thickness, and reduced adhesive costs.

Description

Technical Field

[0001] This utility model belongs to the field of circuit board technology, and more specifically, relates to a finished circuit board. Background Technology

[0002] PCB, or Printed Circuit Board, is the support structure for electronic components. FPC, or Flexible Printed Circuit Board, is a highly reliable and flexible printed circuit board. It features high wiring density, light weight, thinness, and good bendability. Thermoforming and reflow soldering used in PCB-FPC bonding require the use of insulating and curing adhesives such as UV glue to ensure fixation and insulation. This design involves an adhesive application process, which carries the risk of glue overflow and thickening, and hinders the trend towards thinner and lighter batteries and devices.

[0003] Therefore, there is an urgent need to invent a finished circuit board to solve the aforementioned technical problems. Utility Model Content

[0004] The technical problem this invention aims to solve is how to address the issue that traditional PCB and FPC board welding often requires the application of insulating and curing adhesives such as UV glue, which may lead to glue overflow and thickening during the dispensing process, thus hindering the trend of thinner and lighter batteries and electrical appliances.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is to provide a finished circuit board, comprising:

[0006] The FPC includes a first surface and an FPC, the first surface including a first soldering area; the PCB includes a second surface, the second surface including a second soldering area and a second non-soldering area; an adhesive layer is provided at the edge of the first soldering area and / or the edge of the second soldering area. The technical solution of this application eliminates the adhesive application process, reduces the battery thickness, avoids adhesive overflow, and reduces the amount of adhesive used, further saving costs.

[0007] Specifically, during the soldering process, the PCB can be soldered first, and then glue can be applied to the soldering edges of the PCB. In this embodiment, red glue, UV glue, or underfill glue is used. Next, the FPC is bonded to the PCB, the soldering areas of the two are aligned and bonded, and finally, they are combined and soldered and the glue is cured.

[0008] In some embodiments, the welding process involves first soldering tin onto the PCB, then attaching the FPC board to the PCB, followed by applying adhesive to the welding edges, and finally curing the adhesive. It's important to note that the adhesive application step in this welding process is not performed on the welding area itself, but rather on one edge of the weld for fixation. This achieves a height reduction of 0.4mm and an 80% reduction in adhesive usage.

[0009] Specifically, both the first and second non-welded areas are covered with an insulating layer.

[0010] More specifically, the insulating layer is ink or a cover film, which can prevent short circuits and protect the FPC board and PCB board.

[0011] Furthermore, the second welding area is covered with a tin layer, which facilitates the welding operation and further improves the reliability and conductivity of the welding.

[0012] Preferably, the adhesive layer can be red glue, UV glue, or underfill glue. These types of adhesives are suitable for the dispensing process in devices such as batteries.

[0013] Specifically, the first soldering area matches the second soldering area. This design allows the FPC board and PCB board to be soldered together more precisely.

[0014] Preferably, the second welding area is opened using the SMD window method; or the second welding area is opened using the NSMD window method.

[0015] Preferably, the first welding area is rectangular in shape and at least two are provided. The first welding areas are arranged in a rectangular array, and the width of the first welding area on the side closer to the end of the FPC is greater than that on the side farther from the end of the FPC.

[0016] Preferably, the shape of the first welding area includes at least one of a circle, an ellipse, and a polygon.

[0017] More preferably, the adhesive layer is disposed on one edge of the first welding area.

[0018] This way, the battery area won't be increased, and the stability of the weld can be enhanced.

[0019] The beneficial effects of this utility model are as follows: by performing the dispensing process in the dispensing area at the edge of the welding area, there will be no glue overflow, and the thickness of the glue layer can be reduced, thereby reducing the overall thickness of the battery and saving the cost of glue. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a perspective view of the structure of this utility model;

[0022] Figure 2 This is a top view of the structure of this utility model;

[0023] Figure 3 This is the window structure of the PCB of this utility model;

[0024] Figure 4 This is a windowed structure of the PCB in some embodiments of this utility model;

[0025] Figure 5 This is the window structure of the FPC in some embodiments of this utility model;

[0026] Figure 6 This is the window structure of the FPC in some embodiments of this utility model;

[0027] Figure 7 This is a structural diagram of the FPC welding surface of this utility model.

[0028] Figure label:

[0029] 1-FPC;

[0030] 11-First surface; 111-First welding area; 112-First non-welding area;

[0031] 2-PCB;

[0032] 21-Second surface; 211-Second welding zone; 212-Second non-welding zone;

[0033] 3-Adhesive layer. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this utility model, not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0035] Please refer to Figure 1-7 This utility model provides a finished circuit board. This application aims to solve the technical problem in the prior art where glue overflow occurs during the battery welding and dispensing process, resulting in a thicker battery overall and hindering the development of thinner batteries. A new finished circuit board is proposed, saving the dispensing step. The structure of this application includes: FPC1 and PCB2. FPC1 includes a first surface 11, and the first surface 11 includes a first welding area 111 and a first non-welding area 112.

[0036] PCB2 includes a second surface 21, which includes a second soldering area 211 and a second non-soldering area 212. The first surface 11 faces the second surface 21, and the first soldering area 111 is soldered to the second soldering area 211.

[0037] An adhesive layer 3 is disposed between the first welding area 111 and the second welding area 211, with the adhesive layer 3 located at the edge of the first welding area 111. During welding, this structure can solve the aforementioned technical problems, eliminating the need for adhesive application, reducing the battery thickness, and conserving adhesive resources.

[0038] Please refer to further information. Figure 2 , Figure 7 The non-soldered area 112 is covered with an insulating layer, which can be ink or a cover film. The function of the insulating layer is to prevent current flow and avoid electrical problems such as short circuits. The insulating layer material mentioned here can be ink or a cover film. Ink is a common insulating material, usually applied to the non-soldered area by printing or other methods to form insulating protection. It has good insulating properties and adhesion, effectively isolating the circuit. The cover film is a pre-made insulating film that is applied to the non-soldered area by adhesive or other methods. The cover film has high insulating strength and chemical corrosion resistance, providing reliable insulating protection. This design is commonly used in electrical equipment such as electronic circuit boards to ensure that no electrical connection occurs outside the soldered area, improving the safety and stability of the equipment.

[0039] Please refer to further information. Figure 5-6 The second soldering area 211 is covered with a tin layer. This tin layer can enhance the reliability and conductivity of the soldering, enabling electronic components to be connected to the PCB more firmly and stably.

[0040] Please refer to further information. Figure 1 Layer 3 can be a red adhesive layer, a UV adhesive layer, or a base filler layer. Red adhesive has good viscosity and flowability and is easy to dispense, making it suitable for automated production and improving efficiency. Additionally, wave soldering compatibility is important for PCB manufacturing. The high transparency and precise adhesion of UV adhesive may be useful in optical or precision electronic components, making it suitable for dispensing solder on PCBs. The main function of the base filler is to enhance structural reliability.

[0041] Furthermore, the second soldering area 211 employs an SMD (Surface Mount Device) window opening method; alternatively, the second soldering area 211 employs an NSMD (Surface Mount Device) window opening method. SMD window opening refers to a PCB design where the solder mask window size is the same as or slightly larger than the surface mount size, allowing it to be fully exposed. This allows for better solder contact with components during surface mount component mounting, improving soldering reliability and stability. NSMD window opening refers to a larger-than-maximum window size on the PCB's solder mask layer, surrounded by a ring of solder mask. This method reduces stress during processing, protects edges, and improves mechanical stability.

[0042] Please refer to further information. Figure 3 In some embodiments, the first welding area 111 is rectangular in shape and at least two are provided. The first welding areas 111 are arranged in a rectangular array, and the width of the first welding area 111 on the side closer to the end of FPC1 is greater than that on the side farther from the end of FPC.

[0043] Please refer to further information. Figure 4 In some embodiments, the shape of the first welding area 111 includes at least one of a circle, an ellipse, and a polygon.

[0044] Furthermore, the adhesive layer 3 is disposed on one edge of the first welding area 111. The above description is merely a specific embodiment of this utility model, enabling those skilled in the art to understand or implement it. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this utility model. Therefore, this utility model is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A finished circuit board, characterized in that, include: FPC (1), the FPC (1) includes a first surface (11), the first surface (11) includes a first welded area (111) and a first non-welded area (112); PCB (2), the PCB (2) includes a second surface (21), the second surface (21) includes a second soldering area (211) and a second non-soldering area (212); The first surface (11) faces the second surface (21), and the first welding area (111) is welded to the second welding area (211); An adhesive layer (3) is provided between the first welding area (111) and the second welding area (211), and the adhesive layer (3) is located at the edge of the first welding area (111).

2. The finished circuit board according to claim 1, characterized in that: Both the first non-welded area (112) and the second non-welded area (212) are covered with an insulating layer.

3. The finished circuit board according to claim 2, characterized in that: The insulating layer is ink or a cover film.

4. The finished circuit board according to claim 1, characterized in that: The second welding area (211) is covered with a tin layer.

5. The finished circuit board according to claim 1, characterized in that: The adhesive layer (3) is a red adhesive layer, a UV adhesive layer, or a base filler layer.

6. The finished circuit board according to claim 1, characterized in that: The second welding area (211) is opened using the SMD windowing method.

7. The finished circuit board according to claim 1, characterized in that: The second welding area (211) is opened using the NSMD window opening method.

8. The finished circuit board according to claim 1, characterized in that: At least two first welding areas (111) are provided. The first welding areas (111) are arranged in a rectangular array. The width of the first welding area (111) on the side closer to the end of the FPC (1) is greater than that on the side farther from the end of the FPC (1).

9. The finished circuit board according to claim 1, characterized in that: The shape of the first welding area (111) includes at least one of a circle, an ellipse and a polygon.

10. The finished circuit board according to claim 1, characterized in that: The adhesive layer (3) is disposed on one edge of the first welding area (111).

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