A PCB board dry film lamination device

Abstract

This utility model provides a PCB board dry film lamination device, including a heating table, a lower fixed plate embedded in the heating table, a mounting frame fixed at the top of the heating table, a moving component mounted on the mounting frame, a moving table connected to the moving component, and a hydraulic cylinder at the bottom of the moving table. This utility model has the following advantages: by controlling the regulating valve, the heat transfer oil with unsuitable initial temperature can be quickly removed from the upper hot platen for replacement; when the temperature is suitable, the transfer speed can be slowed down to ensure sufficient heat exchange, reduce power consumption, and resist the influence of environmental changes. This provides a well-controlled working environment for the PCB board dry film lamination, improving the lamination effect and quality. The detachable upper hot platen allows for replacement with different sizes of upper hot platens to accommodate different PCB board sizes, thereby improving the compatibility between the upper hot platen and the PCB board, ensuring effective dry film lamination and preventing air bubbles.

Description

Technical Field

[0001] This utility model is a PCB board dry film application device, belonging to the field of PCB boards. Background Technology

[0002] With the rapid development of electronic technology, electronic products are constantly evolving towards miniaturization, high performance, and multifunctional integration. Hole processing is a crucial step in PCB manufacturing, not only enabling electrical connections between different layers of traces but also providing mechanical support. In recent years, PCB hole structures have become increasingly diverse, with larger diameter and irregularly shaped holes being used more frequently. Large diameter holes are often used for pin connections in high-power electronic components to carry larger currents; irregularly shaped holes can be designed according to specific circuit layouts or component shapes, optimizing PCB space utilization and electrical performance. However, due to the larger wall area of ​​large diameter holes, the dry film is difficult to adhere evenly to the entire hole wall during hot pressing, easily leading to defects such as bubbles and wrinkles, affecting the sealing quality. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a PCB board dry film lamination device.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0005] A PCB dry film laminating device includes a heating table, a lower fixed plate embedded in the heating table, a mounting frame fixed at the top of the heating table, a movable component mounted on the mounting frame, a movable table connected to the movable component, a hydraulic cylinder at the bottom of the movable table, a mounting plate fixed at the bottom of the piston rod of the hydraulic cylinder, an upper hot press plate fixed on the mounting plate with screws, a flow channel inside the upper hot press plate, and connecting pipes connecting to the flow channel at both ends of the upper hot press plate, one connecting pipe being an inlet pipe and the other a outlet pipe, the connecting pipes being connected to an external heat transfer oil heater, and a flue gas purification component on the heating table.

[0006] Furthermore, an oil temperature sensor is fixed to the outer wall of the upper hot plate with screws, and a regulating valve is arranged on the connecting pipe of the outlet pipe.

[0007] Furthermore, the movable component includes a transverse electric slide fixed on the mounting frame, a slide plate on the transverse electric slide, a longitudinal electric slide at the bottom of the slide plate, and a movable stage mounted on the auxiliary slide plate of the longitudinal electric slide.

[0008] Furthermore, the flue gas purification component includes a suction fan fixed to the top of the heating platform, with a filter box connected to the exhaust pipe of the suction fan and a suction component connected to the exhaust pipe of the suction fan.

[0009] Furthermore, the suction assembly includes an inlet-shaped frame surrounding a lower fixed plate. The inside of the inlet-shaped frame is a cavity structure, and suction heads communicating with the internal cavity are evenly arranged on the inner side of the inlet-shaped frame.

[0010] Furthermore, the filter box is equipped with an activated carbon filter assembly, which includes two activated carbon filter plates. Multiple sets of cross-shaped auxiliary activated carbon filter plates are fixed between the activated carbon filter plates. A mounting plate is fixed to the top of the activated carbon filter plates. The mounting plate is fixed to the top of the filter box with screws. An exhaust pipe is provided at the end of the filter box away from the suction fan.

[0011] Furthermore, the lower fixed plate is provided with adsorption pipes that are arranged in a rectangular shape, and the adsorption pipes are connected to an external vacuum pump.

[0012] Furthermore, the rectangularly distributed adsorption pipes are composed of multiple sets of pipes arranged in a slot-like pattern. Each set of pipes is equipped with a secondary docking pipe, which is connected to the suction end of the vacuum pump. Each secondary docking pipe is also equipped with a solenoid valve.

[0013] The beneficial effects of this utility model are:

[0014] The PCB board is fixed on the lower fixing plate, and then the connecting pipe is connected to the external heat transfer oil heater. During subsequent film application, the upper hot plate is heated. Heat transfer oil is introduced into the upper hot plate through the oil inlet pipe of the heat transfer oil heater. An oil temperature sensor detects the temperature of the oil flowing inside the upper hot plate, and a regulating valve adjusts the transmission speed of the heat transfer oil. Therefore, the power consumption of the heat transfer oil heater to maintain the pressing temperature is reduced. The oil temperature sensor allows for real-time monitoring of the temperature inside the upper hot plate, facilitating adjustments to the output power of the heat transfer oil heater, reducing the number of adjustments, and improving work efficiency. By controlling the regulating valve, heat transfer oil with unsuitable initial temperatures can be quickly removed from the upper hot plate for replacement. When the temperature is suitable, the transmission speed can be slowed down to ensure sufficient heat exchange, reducing power consumption and resisting the effects of environmental changes. This provides a well-controlled working environment for the PCB board during hot pressing and dry film application, improving the film application effect and quality.

[0015] By detaching and installing a hot press plate, different sizes of hot press plates can be replaced to accommodate PCB boards of different sizes, thereby improving the compatibility between the hot press plate and the PCB board and ensuring effective dry film lamination to avoid air bubbles. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a front view of a PCB board dry film application device according to the present invention;

[0018] Figure 2 This is a schematic diagram of the upper hot platen of a PCB board dry film laminating device according to the present invention;

[0019] Figure 3 This is a schematic diagram of the activated carbon filter component of a PCB board dry film bonding device according to the present invention;

[0020] Figure 4 This is a schematic diagram of the adsorption pipe of a PCB board dry film bonding device according to the present invention.

[0021] In the diagram, 1. Heating platform; 2. Lower fixed plate; 3. Setting frame; 4. Moving platform; 5. Hydraulic cylinder; 6. Mounting plate; 7. Upper hot press plate; 8. Flow channel; 9. Docking pipe; 10. Oil temperature sensor; 11. Horizontal electric slide; 12. Slide table; 13. Longitudinal electric slide; 14. Suction fan; 15. Filter box; 16. Opening frame; 17. Suction head; 18. Activated carbon filter plate; 19. Secondary activated carbon filter plate; 20. Mounting top plate; 21. Adsorption pipe; 22. Secondary docking pipe. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-4This utility model provides a PCB board dry film lamination device, including a heating platform 1, a lower fixing plate 2 embedded in the heating platform 1, a mounting frame 3 fixed at the top of the heating platform 1, a moving component installed on the mounting frame 3, a moving platform 4 connected to the moving component, a hydraulic cylinder 5 at the bottom of the moving platform 4, an mounting plate 6 fixed at the bottom of the piston rod of the hydraulic cylinder 5, an upper hot press plate 7 fixed on the mounting plate 6 with screws, a flow channel 8 inside the upper hot press plate 7, and connecting pipes 9 at both ends of the upper hot press plate 7 respectively, which are connected to the flow channel 8. One connecting pipe 9 is an inlet pipe and the other connecting pipe 9 is an outlet pipe. The connecting pipes 9 are connected to an external heat transfer oil heater. A flue gas purification component is provided on the heating platform 1.

[0024] See Figure 1-2 An oil temperature sensor 10 is fixed to the outer wall of the upper hot platen 7 with screws, and a regulating valve is arranged on the connecting pipe 9 for the outlet pipe. The regulating valve regulates the transmission speed of the heat transfer oil, thus reducing the amount of electricity consumed by the heat transfer oil heater to ensure the pressing temperature. The oil temperature sensor allows people to know the temperature inside the upper hot platen 7 at any time, thereby facilitating the adjustment of the heat transfer oil heater to adjust the oil delivery temperature.

[0025] See Figure 1 The moving component includes a horizontal electric slide 11 fixed on the mounting frame 3, a sliding plate 12 mounted on the horizontal electric slide 11, and a vertical electric slide 13 mounted at the bottom of the sliding plate 12. The moving stage 4 is mounted on the auxiliary sliding plate of the vertical electric slide 13. The electric slides are of existing structure. The horizontal electric slide 11 and the vertical electric slide 13 allow for adjustment of the position of the upper hot plate 7 in all directions, enabling better alignment of the upper hot plate 7 with the PCB board.

[0026] See Figure 1 and Figure 3The flue gas purification component includes a suction fan 14 fixed to the top of the heating platform 1. The exhaust pipe of the suction fan 14 is connected to a filter box 15, and the intake pipe of the suction fan 14 is connected to a suction component. The suction component includes an inlet-shaped frame 16, which surrounds the lower fixing plate 2. The inside of the inlet-shaped frame 16 is a cavity structure, and suction heads 17 communicating with the internal cavity are evenly arranged on the inner side of the inlet-shaped frame 16. An activated carbon filter component is installed inside the filter box 15. The activated carbon filter component includes two activated carbon filter plates 18. Multiple sets of cross-shaped auxiliary activated carbon filter plates 19 are fixed between the activated carbon filter plates 18. A mounting top plate 20 is fixed to the top of the activated carbon filter plates 18. The mounting top plate 20 is fixed to the top of the filter box 15 with screws. An exhaust pipe is provided at the end of the filter box 15 away from the suction fan 14. During the heating process, the circuit board will produce odorous gas after being heated. If the staff inhales the gas, it will cause harm to their health. The suction fan 14 is started and the activated carbon filter plate 18 and the auxiliary activated carbon filter plate 19 in the filter box are used to purify the gas and improve the working environment.

[0027] See Figure 1 and Figure 4 A rectangular array of adsorption pipes 21 are installed on the lower fixed plate 2. These pipes connect to an external vacuum pump. The rectangular adsorption pipes 21 consist of multiple sets of pipes arranged in a slotted pattern. Each set of slotted pipes has a secondary connecting pipe 22, which connects to the suction end of the vacuum pump. Each secondary connecting pipe 22 is equipped with a solenoid valve. The solenoid valve controls the opening and closing of the corresponding slotted pipe. Therefore, by adjusting the size of the rectangular adsorption pipes 21 in conjunction with the vacuum pump's adsorption, PCB boards of different sizes can be adsorbed and fixed, ensuring stability during operation.

[0028] In use, the PCB board is fixed on the lower fixing plate 2, and then the connecting pipe 9 is connected to the external heat transfer oil heater. During subsequent film application, the interior of the upper hot plate 7 is heated. Heat transfer oil is introduced into the upper hot plate 7 through the oil inlet pipe of the heat transfer oil heater. The oil temperature sensor detects the temperature of the oil flowing inside the upper hot plate 7, and the regulating valve adjusts the transmission speed of the heat transfer oil. Therefore, the power consumption of the heat transfer oil heater to ensure the pressing temperature is reduced. The oil temperature sensor allows for real-time monitoring of the temperature inside the upper hot plate 7, facilitating adjustments to the output power of the heat transfer oil heater, reducing the number of adjustments, and improving work efficiency. By controlling the regulating valve, heat transfer oil with unsuitable initial temperature can be quickly removed from the upper hot plate 7 for replacement. When the temperature is suitable, the transmission speed can be slowed down to ensure sufficient heat exchange, reducing power consumption and resisting the effects of environmental changes. This provides a well-controlled working environment for the PCB board during hot pressing and dry film application, improving the film application effect and quality. By detachably installing the upper hot press plate 7 and replacing it with different sizes, it can be used on PCBs of different sizes, i.e., on different circuit boards with machining holes. This improves the compatibility between the upper hot press plate 7 and the PCB board, ensuring effective dry film lamination and preventing air bubbles. An oil temperature sensor 10 is fixed to the outer wall of the upper hot press plate 7 with screws. The oil temperature sensor 10 is detachably connected, and its probe extends into the upper hot press plate 7. The probe can be positioned close to the edge of the flow channel 8 to effectively detect the oil temperature. This invention can be used not only for hot-pressing dry film lamination on machining holes but also on PCB boards, requiring the use of upper hot press plates 7 of different sizes and shapes.

[0029] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A PCB board dry film lamination device, characterized in that, The heating platform (1) is equipped with a lower fixed plate (2) embedded in the heating platform (1). A mounting frame (3) is fixed at the top of the heating platform (1). A moving component is installed on the mounting frame (3). A moving platform (4) is connected to the moving component. A hydraulic cylinder (5) is installed at the bottom of the moving platform (4). An installation plate (6) is fixed at the bottom of the piston rod of the hydraulic cylinder (5). An upper hot press plate (7) is fixed on the installation plate (6) with screws. A flow channel (8) is provided inside the upper hot press plate (7). A connecting pipe (9) connecting the flow channel (8) is provided at both ends of the upper hot press plate (7). One connecting pipe (9) is an inlet pipe and the other connecting pipe (9) is an outlet pipe. The connecting pipe (9) is connected to an external heat transfer oil heater. A flue gas purification component is provided on the heating platform (1).

2. The PCB board dry film lamination device according to claim 1, characterized in that, An oil temperature sensor (10) is fixed to the outer wall of the upper hot plate (7) with screws, and a regulating valve is arranged on the connecting pipe (9) of the outlet pipe.

3. The PCB board dry film lamination device according to claim 2, characterized in that, The moving component includes a transverse electric slide (11) fixed on the mounting frame (3), a slide plate (12) is provided on the transverse electric slide (11), a longitudinal electric slide (13) is provided at the bottom of the slide plate (12), and the moving platform (4) is installed on the auxiliary slide plate of the longitudinal electric slide (13).

4. A PCB board dry film lamination device according to claim 3, characterized in that, The flue gas purification assembly includes a suction fan (14) fixed on the top of the heating platform (1), the exhaust pipe of the suction fan (14) is connected to a filter box (15), and the intake pipe of the suction fan (14) is connected to a suction assembly.

5. A PCB board dry film lamination device according to claim 4, characterized in that, The suction assembly includes an inlet-shaped frame (16), which surrounds the lower fixed plate (2). The inside of the inlet-shaped frame (16) is a cavity structure, and suction heads (17) communicating with the internal cavity are evenly arranged on the inner side of the inlet-shaped frame (16).

6. A PCB board dry film lamination device according to claim 5, characterized in that, An activated carbon filter assembly is provided inside the filter box (15). The activated carbon filter assembly includes two activated carbon filter plates (18). Multiple sets of cross-shaped auxiliary activated carbon filter plates (19) are fixed between the activated carbon filter plates (18). A mounting plate (20) is fixed at the top of the activated carbon filter plates (18). The mounting plate (20) is fixed to the top of the filter box (15) with screws. An exhaust pipe is provided at the end of the filter box (15) away from the suction fan (14).

7. A PCB board dry film lamination device according to claim 6, characterized in that, The lower fixed plate (2) is provided with an adsorption pipe (21) that is arranged in a rectangular shape. The adsorption pipe (21) is connected to an external vacuum pump.

8. A PCB board dry film lamination device according to claim 7, characterized in that, The rectangular adsorption pipes (21) are composed of multiple sets of pipes arranged in a slot shape. Each set of pipes arranged in a slot shape is provided with a secondary docking pipe (22). The docking pipes are connected to the suction end of the vacuum pump, and each secondary docking pipe (22) is provided with a solenoid valve.

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