A heat dissipating mounting structure

Abstract

This utility model discloses a heat dissipation mounting structure, including: a heat-conducting plate, which is attached to a heat-generating electronic component; a mounting base, which is connected to the heat-conducting plate and is located on the side of the heat-conducting plate, and the mounting base is provided with multiple heat dissipation fins; and a heat pipe, one end of which is connected to the outer wall of the heat-conducting plate and the other end of which is connected to the mounting base, and the heat pipe is located on the side of the heat-conducting plate away from the heat-generating electronic component. In this solution, the heat generated by the heat-generating electronic component is evenly conducted to the heat-conducting plate, and then quickly conducted to the heat dissipation fins of the mounting base through the heat pipe, thus achieving rapid heat dissipation. By changing the heat dissipation fins from the traditional vertical contact with the heat-generating electronic component to heat dissipation on the side of the heat-generating electronic component, an ideal heat dissipation effect can be achieved, solving the problem that traditional heat dissipation cannot adapt to the internal space limitations of the chassis, reducing the space requirements in the vertical height direction of the chassis; and making reasonable use of the extra space on the inner side of the chassis, resulting in high space utilization of the chassis.

Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for heat-generating electronic components, and more specifically, to a heat dissipation mounting structure. Background Technology

[0002] As computer systems increasingly demand higher performance from processors, graphics cards, and accelerators, solving the thermal design challenges of our systems within limited space and cost constraints through efficient heat dissipation has become a challenging task. Chassis architectures such as CPC I(e), VPX, and ATCA utilize specific slots to accommodate high-heat-generating electronic components like processors, graphics cards, APUs, DSPs, and FPGAs, providing various required functions and facilitating expansion and replacement. These chassis architectures are widely used in telecommunications, military, aerospace, and industrial automation fields.

[0003] Currently, due to limitations in chassis size and slot width, it is inconvenient to directly apply traditional stacked heat dissipation structures to the surfaces of heat-generating electronic components such as graphics cards and power supplies. This means that it is not convenient to vertically stack heat dissipation fins, heat spreaders, or other heat dissipation methods on heat-generating electronic components. Consequently, due to space limitations in the chassis, traditional heat dissipation structures cannot achieve ideal heat dissipation effects, affecting the performance of heat-generating electronic components in this chassis architecture.

[0004] Therefore, it is necessary to provide a heat dissipation mounting structure to solve the above-mentioned technical problems. Utility Model Content

[0005] The purpose of this invention is to provide a heat dissipation installation structure to solve the above-mentioned technical problems.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A heat dissipation mounting structure for dissipating heat from electronic components inside a chassis, comprising:

[0008] A heat-conducting sheet is attached to the heat-generating electronic component;

[0009] The mounting base is connected to the heat-conducting plate and is located on the side of the heat-conducting plate. The mounting base is provided with multiple heat dissipation fins.

[0010] A heat pipe, one end of which is connected to the outer wall of the heat-conducting plate and the other end of which is connected to the mounting base, is located on the side of the heat-conducting plate away from the heat-generating electronic component.

[0011] Furthermore, the heat pipe is L-shaped, and the angle between the side of the heat pipe located on the heat-conducting plate and the side located on the mounting base is a right angle.

[0012] Furthermore, it also includes a bracket mounted on the chassis, and both the mounting base and the heat-conducting plate are connected to the bracket.

[0013] Furthermore, it also includes a partition plate disposed on the chassis, the heat-generating electronic component is installed between the partition plate and the bracket, and the two sides of the heat-conducting sheet are respectively connected to the partition plate and the bracket.

[0014] Furthermore, the bracket is provided with a card plate, and the card plate and the middle partition are respectively provided with a first card slot and a second card slot adapted to the heating electronic component.

[0015] Furthermore, the heat-conducting sheet is provided with multiple fixing holes, and the card plate and the middle partition plate are provided with connection holes corresponding to the fixing holes;

[0016] The mounting base has multiple mounting holes, and the bracket has mating holes corresponding to the mounting holes.

[0017] Furthermore, a fan is also provided inside the chassis, and the fan is located on the side of the heat sink fins away from the bracket.

[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0019] In this solution, the heat generated by the heat-generating electronic components is evenly conducted to the heat-conducting plate, and then quickly conducted to the heat dissipation fins of the mounting base via heat pipes, achieving rapid heat dissipation. By changing the traditional vertical contact of the heat-generating electronic components to side contact, ideal heat dissipation effect is achieved, improving the performance of the heat-generating electronic components inside the chassis. This avoids the need to stack heat dissipation structures on the heat-generating electronic components and solves the problem of traditional heat dissipation being unable to adapt to the internal space limitations of the chassis. This heat dissipation structure is located on the lateral side of the heat-generating electronic components, greatly reducing the space requirements in the vertical height direction of the chassis. Furthermore, it makes reasonable use of the extra space on the side of the chassis, resulting in high space utilization. It also allows the fans on the side walls of the chassis to be closer to the heat dissipation fins, enabling them to dissipate heat more quickly and achieve better heat dissipation. Attached Figure Description

[0020] Figure 1 This is a schematic diagram of the heat dissipation structure of this utility model after installation.

[0021] Figure 2 This is a schematic diagram of the connection structure of the heat-conducting sheet, heat dissipation fins and heat pipe of this utility model;

[0022] Figure 3 for Figure 2 A schematic diagram of the bottom view structure in the middle;

[0023] Figure 4 This is a schematic diagram of the structure of the bracket and the partition of this utility model.

[0024] Explanation of the labels in the diagram:

[0025] 1. Heating electronic component; 2. Heat-conducting plate; 3. Mounting base; 4. Heat dissipation fins; 5. Heat pipe; 6. Bracket; 7. Middle partition; 8. Clip plate; 9. First slot; 10. Second slot; 11. Fixing hole; 12. Connection hole; 13. Mounting hole; 14. Fan. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-4 A heat dissipation mounting structure for dissipating heat from heat-generating electronic components 1 inside a chassis, comprising:

[0028] The heat-conducting sheet 2 is attached to the heat-generating electronic component 1, and the heat-conducting sheet 2 is made of copper.

[0029] Mounting base 3 is connected to heat conduction plate 2 and is located on the side of heat conduction plate 2. Multiple heat dissipation fins 4 are provided on mounting base 3. The heat dissipation fins 4 are made of copper or aluminum alloy. The material, quantity and size of heat dissipation fins 4 can be selected according to the heat dissipation of the specific heat-generating electronic component 1 and the requirements of the environment.

[0030] The heat pipe 5 has one end connected to the outer wall of the heat-conducting plate 2 and the other end connected to the mounting base 3. The heat pipe 5 is located on the side of the heat-conducting plate 2 away from the heat-generating electronic component 1. Different diameters and numbers of heat pipes 5 can be selected according to the different heat consumption of the heat-generating electronic component 1 to meet the needs of different situations.

[0031] Specifically, the heat-conducting plate 2 is mounted on the heat-generating electronic component 1, with the heat-conducting plate 2 in contact with the surface of the heat-generating electronic component 1. The mounting base 3 is then mounted to the side of the heat-conducting plate 2, meaning that the heat dissipation fins 4 on the mounting base 3 are located on the side of the heat-generating electronic component 1. The two ends of the heat pipe 5 are welded and fixed to the heat-conducting plate 2 and the mounting base 3 respectively, resulting in a compact and robust structure. During use, the heat generated by the heat-generating electronic component 1 is evenly conducted to the heat-conducting plate 2, and then quickly conducted through the heat pipe 5 to the heat dissipation fins 4 of the mounting base 3, allowing for rapid heat dissipation. By changing the traditional method of placing the heat dissipation fins 4 in a vertical position to contact the heat-generating electronic component 1, and instead placing them on the side of the heat-generating electronic component 1 for heat dissipation, the need to stack heat dissipation structures on the heat-generating electronic component 1 is avoided. This solves the problem that traditional heat dissipation methods cannot adapt to the internal space limitations of chassis architectures such as CPC I(e), VPX, and ATCA, achieving ideal heat dissipation effects and thus improving the working performance of the heat-generating electronic component 1 inside the chassis. This heat dissipation structure is located on the lateral side of the heat-generating electronic component 1, greatly reducing the space requirements in the vertical height direction of the chassis. Furthermore, it makes reasonable use of the extra space on the side of the chassis, resulting in high space utilization of the chassis. It also allows the fans on the side walls of the chassis to be closer to the heat dissipation fins 4, dissipating heat more quickly and achieving better heat dissipation effects.

[0032] In this embodiment, please refer to Figure 1-3 The heat pipe 5 is L-shaped, and the angle between one side of the heat pipe 5 on the heat-conducting plate 2 and the other side on the mounting base 3 is a right angle. The right-angled L-shape of the heat pipe 5 connects to the heat-conducting plate 2 and the mounting base 3 on its two sides, respectively, so that the heat on the heat-conducting plate 2 can be conducted to the mounting base 3 on the side. This allows the heat dissipation fins 4 to dissipate heat on the side of the heat-generating electronic component 1 and the heat-conducting plate 2. The heat pipe 5 plays the role of connecting and conducting heat.

[0033] In this embodiment, please refer to Figure 1-4 It also includes a bracket 6 mounted on the chassis, with the mounting base 3 and the heat-conducting plate 2 both connected to the bracket 6. Connecting the bracket 6 to the chassis, and connecting the mounting base 3 and the heat-conducting plate 2 to the bracket 6, ensures the stability of the mounting base 3 and the heat-conducting plate 2.

[0034] In this embodiment, please refer to Figure 1 and Figure 4 It also includes a partition 7 mounted on the chassis, with the heat-generating electronic component 1 installed between the partition 7 and the bracket 6. The heat-conducting plate 2 has its two sides connected to both the partition 7 and the bracket 6. The heat-conducting plate 2 is positioned on the partition 7 and the bracket 6 respectively, and is fixedly connected to both. The partition 7 and the bracket 6 also limit the movement of the heat-generating electronic component 1, improving its stability.

[0035] In this embodiment, please refer to Figure 1 and Figure 4The bracket 6 is provided with a retaining plate 8, and the retaining plate 8 and the middle partition 7 are respectively provided with a first retaining groove 9 and a second retaining groove 10 adapted to the heating electronic component 1. One side of the heat-conducting sheet 2 rests on the retaining plate 8, that is, it is connected to the retaining plate 8; both sides of the heating electronic component 1 are slidably adapted to the first retaining groove 9 and the second retaining groove 10, that is, the heating electronic component 1 can slide along the first retaining groove 9 and the second retaining groove 10, which facilitates the movement of the heating electronic component 1 and provides stable positioning.

[0036] In this embodiment, please refer to Figure 1-4 The heat-conducting sheet 2 has multiple fixing holes 11, and the clamping plate 8 and the middle partition plate 7 have connection holes 12 corresponding to the fixing holes 11. By using screws and the fixing holes 11 and connection holes 12, the heat-conducting sheet 2 can be fixed on the clamping plate 8 and the middle partition plate 7, thus achieving stable installation of the heat-conducting sheet 2.

[0037] The mounting base 3 has multiple mounting holes 13, and the bracket 6 has mating holes corresponding to the mounting holes 13. By engaging screws with the mounting holes 13, the mounting base 3 can be fixed to the bracket 6, thus achieving stable installation of the mounting base 3.

[0038] In this embodiment, please refer to Figure 1 The chassis also includes a fan 14, located on the side of the heatsink fins 4 away from the bracket 6. The fan 14 effectively removes heat transferred to the heatsink fins 4 through forced air cooling, thus improving heat dissipation.

[0039] It should be understood that the examples and embodiments described herein are for illustrative purposes only and are not intended to limit the present invention. Those skilled in the art can make various modifications or changes based on them. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0040] It should be noted that if the embodiments of this utility model involve directional indicators such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicators will also change accordingly.

[0041] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the meaning of "and / or" throughout the text includes three parallel solutions; for example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, "multiple" refers to two or more. Moreover, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

Claims

1. A heat dissipation mounting structure for dissipating heat from heat-generating electronic components (1) inside a chassis, characterized in that, include: The heat-conducting sheet (2) is attached to the heat-generating electronic component (1); Mounting base (3) is connected to the heat-conducting plate (2), and the mounting base (3) is located on the side of the heat-conducting plate (2). Multiple heat dissipation fins (4) are provided on the mounting base (3). A heat pipe (5) is connected at one end to the outer wall of the heat-conducting plate (2) and at the other end to the mounting base (3). The heat pipe (5) is located on the side of the heat-conducting plate (2) away from the heat-generating electronic component (1).

2. The heat dissipation mounting structure according to claim 1, characterized in that, The heat pipe (5) is "L" shaped, and the angle between one side of the heat pipe (5) on the heat-conducting plate (2) and the other side on the mounting base (3) is a right angle.

3. The heat dissipation mounting structure according to claim 1, characterized in that, It also includes a bracket (6) mounted on the chassis, and the mounting base (3) and the heat-conducting plate (2) are both connected to the bracket (6).

4. The heat dissipation mounting structure according to claim 3, characterized in that, It also includes a partition plate (7) disposed on the chassis, the heating electronic component (1) is installed between the partition plate (7) and the bracket (6), and the two sides of the heat-conducting sheet (2) are respectively connected to the partition plate (7) and the bracket (6).

5. The heat dissipation mounting structure according to claim 4, characterized in that, The bracket (6) is provided with a card plate (8), and the card plate (8) and the partition plate (7) are respectively provided with a first card slot (9) and a second card slot (10) adapted to the heating electronic component (1).

6. The heat dissipation mounting structure according to claim 5, characterized in that, The heat-conducting sheet (2) has multiple fixing holes (11), and the card plate (8) and the middle partition plate (7) both have connection holes (12) corresponding to the fixing holes (11); The mounting base (3) has multiple mounting holes (13), and the bracket (6) has mating holes corresponding to the mounting holes (13).

7. The heat dissipation mounting structure according to claim 3, characterized in that, The chassis is also equipped with a fan (14), which is located on the side of the heat sink fins (4) away from the bracket (6).

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