A hot plate module and wafer heating device

Abstract

This utility model relates to a hot plate module and a wafer heating device. The hot plate module includes a first cavity and a second cavity; a heating assembly located in the first cavity, including a connecting plate, a ring plate, a heating plate, and a lifting member passing through the heating plate. The lifting member can move up and down relative to the heating plate under external force to drive wafer loading or unloading. The heating plate is used to heat the wafer. The ring plate can move up and down under external force to have a first position and a second position. When in the first position, the ring plate abuts against the outer shell to form an accommodating space separated from the first cavity with the connecting plate; a driving assembly located in the second cavity, including a first driving member and a second driving member. The first driving member is connected to the ring plate and is used to drive the ring plate to switch between the first position and the second position. The second driving member is connected to the lifting member. The heating assembly and the driving assembly are separated to avoid mutual interference, and the heating plate can provide more stable and uniform heat, improving the quality of wafer heating.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, specifically to a hot plate module and a wafer heating device. Background Technology

[0002] With the continuous development of semiconductor manufacturing technology, the requirements for precision and efficiency in wafer processing are becoming increasingly stringent. In the wafer processing process, the hot plate module is one of the key pieces of equipment, used to heat the wafer to meet different process requirements.

[0003] In the existing technology, the heating components are not arranged properly, and the driving components and the heating space are placed in the same cavity. This causes mutual interference between the driving components and the heating components, which not only affects the wafer heating effect, but also causes the heat generated by the heating components to affect the driving components and reduce their service life.

[0004] Therefore, it is necessary to improve the existing technology to overcome the aforementioned defects. Utility Model Content

[0005] In view of this, embodiments of this application provide a hot plate module to solve at least one problem existing in the prior art, comprising:

[0006] The outer casing has a first cavity and a second cavity separated from the first cavity;

[0007] A heating assembly, located within the first cavity, includes a connecting plate, an annular plate above the connecting plate, a heating plate within the connecting plate, and a lifting member passing through the heating plate. The lifting member can move up and down relative to the heating plate under external force to drive wafer loading or unloading. The heating plate is used to heat the wafer. The annular plate can move up and down under external force to have a first position and a second position. When in the first position, the annular plate abuts against the outer shell to form an accommodating space separated from the first cavity with the connecting plate.

[0008] The drive assembly, located within the second cavity, includes a first drive member and a second drive member. The first drive member is connected to the ring plate and is used to drive the ring plate to switch between a first position and a second position. The second drive member is connected to the lifting member.

[0009] Optionally, in the hot plate module described above, the lifting member is provided with a hollow cavity, which is connected to the adsorption device and can generate negative pressure to fix the wafer.

[0010] Optionally, in the above-mentioned hot plate module, the heating assembly further includes a heat spreader plate located above the heating plate and a flexible plate disposed between the heating plate and the heat spreader plate, and the lifting member passes through the heat spreader plate, the flexible plate and the heating plate in sequence.

[0011] Optionally, in the above-mentioned hot plate module, the heating component further includes a mirror sheet metal layer located below the heating plate, and the periphery of the mirror sheet metal layer is connected to the ring plate to form the accommodating space.

[0012] Optionally, the hot plate module described above further includes a first fan and a second fan disposed opposite to each other in the second cavity. The first fan is used to deliver external airflow into the second cavity, and the second fan is used to deliver airflow from the second cavity to the outside.

[0013] This application also provides a wafer heating device, including:

[0014] The frame has several chambers;

[0015] A plurality of hot plate modules are provided, each disposed in one of the aforementioned chambers, wherein the hot plate module is any one of the hot plate modules described above.

[0016] Optionally, the wafer heating device described above further includes several guiding components, each including a first guide rail disposed on the rack and a second guide rail disposed on the hot plate module, wherein the hot plate module can move relative to the rack under the action of the first guide rail and the second guide rail.

[0017] Optionally, the wafer heating device described above further includes a locking member disposed at the end of the guide assembly, the locking member being used to prevent the first guide rail from disengaging from the second guide rail.

[0018] Optionally, the wafer heating device described above further includes a nitrogen assembly, which includes a first conveying channel extending along a plurality of the chambers, a first air inlet communicating with the first conveying channel, a plurality of first air outlets, and a conveying pipe communicating with the plurality of first air outlets and the accommodating space.

[0019] Optionally, the wafer heating device described above further includes an air extraction assembly, which includes a second conveying channel extending along a plurality of the chambers, a second air inlet disposed on a plurality of the hot plate modules, and a second air outlet communicating with the second conveying channel. Each second air inlet communicates with the second conveying channel and the accommodating space.

[0020] Compared with the prior art, this application has the following beneficial effects: by providing a first cavity and a second cavity, a heating component and a driving component, with the heating component located in the first cavity and the driving component located in the second cavity, the heating component and the driving component are separated to avoid mutual interference, and the heating component includes a connecting plate and an annular plate located above the connecting plate, as well as a heating plate and a lifting member located inside the connecting plate. The annular plate can move up and down under the action of external force. When it is in the first position, the annular plate rises and abuts against the outer shell to form an accommodating space separated from the first cavity with the connecting plate, so that the heating plate can provide more stable and uniform heat and improve the quality of wafer heating. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the structure of a wafer heating device shown in this embodiment;

[0022] Figure 2 yes Figure 1 A cross-sectional view of the wafer heating device shown;

[0023] Figure 3 yes Figure 1 Another cross-sectional view of the wafer heating device shown;

[0024] Figure 4 yes Figure 1 A schematic diagram of the wafer heating device from another direction;

[0025] Figure 5 yes Figure 4 A partial enlarged view of the wafer heating device shown;

[0026] Figure 6 yes Figure 1 The diagram shows the structure of the hot plate module in the wafer heating device.

[0027] Figure 7 yes Figure 6 A cross-sectional view of the hot plate module shown;

[0028] Figure 8 yes Figure 6 A cross-sectional view of the hot plate module shown from another direction;

[0029] Figure 9 yes Figure 1 A cross-sectional view of the heating device shown from another direction;

[0030] Figure 10 yes Figure 9 A partially enlarged view of the heating device shown.

[0031] Figure Descriptions: 100: Frame; 101: Chamber; 200: Hot plate module; 201: Outer shell; 201a: First cavity; 201b: Second cavity; 202: Heating component; 202a: Connecting plate; 202b: Ring plate; 202c: Heating plate; 202h: Mirror-finish sheet metal layer; 203: Drive component; 203a: First drive element; 203b: Second drive element; 204a: First fan; 204b: Second fan; 30 0: Guide assembly; 301: First guide rail; 302: Second guide rail; 303: Locking component; 400: Nitrogen assembly; 401: First conveying channel; 402: First air inlet; 403: First air outlet; 404: Conveying pipe; 500: Air extraction assembly; 501: Second conveying channel; 502: Second air inlet; 503: Second air outlet; 600: Quick-release structure; 601: Connecting block; 602: Connecting block; 603: Transition component. Detailed Implementation

[0032] The exemplary embodiments disclosed in this application will now be described in more detail. Numerous specific details are set forth in the following description to provide a more thorough understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without one or more of these details. In other instances, to avoid confusion with this application, some technical features well-known in the art have not been described; that is, not all features of actual embodiments are described herein, nor are well-known functions and structures described in detail.

[0033] It should be understood that when an element or layer is referred to as "on," "adjacent to," "connected to," or "coupled to" other elements or layers, it may be directly on, adjacent to, connected to, or coupled to other elements or layers, or there may be intervening elements or layers. Conversely, when an element is referred to as "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other elements or layers, there are no intervening elements or layers. It should be understood that although the terms first, second, third, etc., may be used to describe various elements, components, areas, layers, and / or portions, these elements, components, areas, layers, and / or portions should not be limited by these terms. These terms are only used to distinguish one element, component, area, layer, or portion from another element, component, area, layer, or portion. Therefore, without departing from the teachings of this application, the first element, component, area, layer, or portion discussed below may be referred to as a second element, component, area, layer, or portion. And the discussion of a second element, component, area, layer, or portion does not imply that the first element, component, area, layer, or portion necessarily exists in this application.

[0034] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used here for convenience to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms are intended to also include different orientations of devices in use and operation.

[0035] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. When used herein, the singular forms “a,” “an,” and “ / the” are also intended to include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “compose” and / or “comprising,” when used in this specification, identify the presence of features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups. When used herein, the term “and / or” includes any and all combinations of the associated listed items.

[0036] To fully understand this application, detailed steps and structures will be presented in the following description to illustrate the technical solution of this application. Preferred embodiments of this application are described in detail below; however, in addition to these detailed descriptions, this application may have other implementation methods.

[0037] Please refer to Figures 1-4 As shown in the preferred embodiment of this application, a wafer heating apparatus is used to heat the bonding adhesive on a wafer to improve the wafer bonding effect. The apparatus includes a rack 100 having several chambers 101 and several hot plate modules 200. The hot plate modules 200 are respectively disposed within the several chambers 101 to heat several wafers at once, thereby improving wafer bonding efficiency.

[0038] Specifically, the hot plate module 200 includes a housing 201, a heating component 202, and a driving component 203. The housing 201 has a first cavity 201a and a second cavity 201b separated from the first cavity 201a. The heating component 202 is located in the first cavity 201a, while the driving component 203 is located in the second cavity 201b.

[0039] Further, refer to Figures 6-8As shown, the heating assembly 202 includes a connecting plate 202a, an annular plate 202b located on the connecting plate 202a, a heating plate 202c located within the connecting plate 202a, and a lifting member passing through the heating plate 202c. The lifting member can move up and down relative to the heating plate 202c under external force to load or unload the wafer. The heating plate 202c is used to heat the wafer. The annular plate 202b can move up and down under external force to have a first position and a second position. When the annular plate 202b is in the first position, it abuts against the outer shell 201 to form an accommodating space separated from the first cavity 201a. The heating plate 202c is located within this accommodating space, allowing the wafer to be processed within it. When the annular plate 202b is in the second position, there is a space between the annular plate 202b and the outer shell 201 to facilitate wafer loading or unloading.

[0040] Understandably, by separating the heating component 202 from the driving component 203, the mutual interference between the heating component 202 and the driving component 203 can be reduced. Furthermore, by providing an annular plate 202b with a first position and a second position, a accommodating space can be formed in the first position to reduce heat loss from the heating plate 202c, ensuring the wafer processing effect and further reducing the impact on the driving component 203.

[0041] In this embodiment, the driving assembly 203 includes a first driving member 203a and a second driving member 203b. The first driving member 203a is connected to the ring plate 202b and is used to drive the ring plate 202b to switch between a first position and a second position. The second driving member 203b is connected to the lifting member and is used to drive the lifting member to rise and fall, thereby facilitating wafer loading or unloading. Specifically, during wafer loading, the second driving member 203b drives the lifting member to rise above the height of the heating plate 202c to facilitate receiving the wafer, or to lower the received wafer so that the wafer is positioned above the heating plate 202c. It should be noted that in this embodiment, the heating plate 202c is provided with several protrusions for placing the wafer, thereby reducing the contact area between the wafer and the protrusions. This facilitates wafer loading and unloading and also reduces the possibility of wafer surface contamination.

[0042] Furthermore, the lifting component is provided with a hollow cavity, which is connected to the adsorption device and can generate negative pressure to fix the wafer.

[0043] Understandably, by directly setting a hollow cavity inside the lifting component, the wafer can be fixed by negative pressure on the one hand, and the negative pressure value can be used to determine whether it is placed above the heating plate 202c, without the need for other detection structures.

[0044] Furthermore, the heating assembly 202 also includes a heat spreader plate located above the heating plate 202c and a flexible plate disposed between the heating plate 202c and the heat spreader plate. The aforementioned lifting member passes sequentially through the heat spreader plate, the flexible plate, and the heating plate 202c. It should be noted that the heat spreader plate is a silicon carbide plate, and the flexible plate is a graphite gasket. The reason for this arrangement is that silicon carbide plates are prone to breakage, while graphite gaskets are compressible and can be heated evenly. This prevents direct contact between the heating plate 202c and the silicon carbide plate, thus avoiding damage, and also does not affect the heating effect.

[0045] Furthermore, the heating assembly 202 also includes a mirror sheet metal layer 202h located below the heating plate 202c, and the periphery of the mirror sheet metal layer 202h is connected to the ring plate 202b to form an accommodating space.

[0046] Understandably, the mirror sheet metal layer 202h has good reflective properties, which can reflect the heat radiated downwards by the heating plate 202c back to the heating area, thereby improving the heat utilization efficiency, reducing heat loss, reducing energy consumption, and further ensuring the uniformity of the temperature in the heating area. At the same time, the closed accommodating space formed by the mirror sheet metal layer 202h and the ring plate 202b provides a relatively independent and stable heating environment for the heating component 202, reducing the interference of external environmental factors on the heating process and enhancing the stability and reliability of the heating component 202.

[0047] Furthermore, the hot plate module 200 also includes a first fan 204a and a second fan 204b disposed opposite to each other in the second cavity 201b. The first fan 204a is used to deliver external airflow into the second cavity 201b, and the second fan 204b is used to deliver the airflow in the second cavity 201b to the outside.

[0048] Understandably, the first fan 204a delivers external airflow to the second cavity 201b, providing continuous cooling airflow for the drive component 203. This promptly removes the heat generated by the drive component 203 during operation, preventing performance degradation or malfunction due to overheating and ensuring stable operation of the drive component 203 in a suitable temperature environment. The second fan 204b, on the other hand, exhausts the hot airflow from the second cavity 201b to the outside, further enhancing the heat dissipation effect and forming a good air circulation system. This not only improves the service life and reliability of the drive component 203 but also helps maintain the temperature balance of the entire heat plate module 200, improving the overall performance and working efficiency of the module.

[0049] Further, refer to Figure 4 and Figure 5As shown, the wafer heating device also includes several guide components 300. Each guide component 300 includes a first guide rail 301 disposed on the rack 100 and a second guide rail 302 disposed on the hot plate module 200. The hot plate module 200 can move relative to the rack 100 under the action of the first guide rail 301 and the second guide rail 302.

[0050] Understandably, through the function of the guide component 300, each hot plate module 200 can be moved relative to the rack 100 as needed, facilitating wafer loading and unloading operations for operators and reducing operational difficulty and time costs. At the same time, when maintenance, repair or replacement of the hot plate module 200 is required, the hot plate module 200 can be quickly removed from the rack 100, improving the convenience and efficiency of maintenance work, reducing equipment downtime, and helping to improve the continuity and stability of the entire production process.

[0051] Furthermore, the device also includes a locking member 303 disposed at the end of the guide assembly 300. The locking member 303 is used to prevent the first guide rail 301 from disengaging from the second guide rail 302. During normal operation of the wafer heating device, the locking member 303 securely locks the first guide rail 301 and the second guide rail 302, preventing the hot plate module 200 from accidentally shifting or detaching from the rack 100 due to external vibration or other factors, thus ensuring the reliability and safety of the equipment operation. At the same time, the presence of the locking member 303 also provides more stable support for the hot plate module 200 during the heating process, which is beneficial to improving the accuracy and quality of wafer heating processing.

[0052] Further, refer to Figure 2 and Figure 3 As shown, the device also includes a nitrogen gas assembly 400 and a vacuum assembly 500. The nitrogen gas assembly 400 is used to provide a nitrogen environment for the wafer to prevent the bonding adhesive on the wafer from oxidizing and affecting the processing effect. The vacuum assembly 500 is used to work in conjunction with the nitrogen gas assembly 400 to facilitate the uniform distribution and rapid replacement of nitrogen, ensuring that the containment space is always filled with high-purity nitrogen.

[0053] Specifically, the nitrogen assembly 400 includes a first conveying channel 401 extending along several chambers 101, a first air inlet 402 communicating with the first conveying channel 401, several first air outlets 403, and a conveying pipe 404 connecting the several first air outlets 403 to the accommodating space; the extraction assembly 500 includes a second conveying channel 501 extending along several chambers 101, a second air inlet 502 disposed on several hot plate modules 200, and a second air outlet 503 communicating with the second conveying channel 501, with each second air inlet 502 connecting the second conveying channel 501 to the accommodating space. Nitrogen enters the first conveying channel 401 from the first air inlet 402, and is then conveyed to each conveying pipe 404 through the several first air outlets 403. Finally, the nitrogen is conveyed to the accommodating space through the conveying pipe 404, thereby providing nitrogen to each accommodating space and ensuring that the accommodating space is always filled with high-purity nitrogen.

[0054] It is worth noting that, in this embodiment, reference Figure 9 and Figure 10 As shown, the device also includes at least two sets of quick-release structures 600. One set of quick-release structures 600 connects the first air outlet 403 to the first conveying channel 401, and the other set of quick-release structures 600 connects the second air inlet 502 to the second conveying channel 501, facilitating the quick installation and removal of each hot plate module. In this embodiment, four hot plate modules are provided, and correspondingly, four quick-release structures are provided for each set. When it is necessary to remove any hot plate module, quick-release can be achieved by removing the two sets of quick-release structures and the corresponding hot plate module.

[0055] Specifically, each quick-release structure 600 includes a connecting block 601 mounted on the frame 100, a connecting block 602 mounted on the hot plate module, and a transition piece 603 connecting the connecting block 601 and the connecting block 602. One end of the transition piece 603 is fixedly connected to the connecting block 601, and the other end is embedded in the connecting block 602. The transition piece 603 can deform under external force to form a certain amount of pressing in, which can both ensure the sealing effect between the connecting block 601 and the connecting block 602 and realize the quick release of each hot plate module.

[0056] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A hot plate module, characterized in that, include: The outer casing has a first cavity and a second cavity separated from the first cavity; A heating assembly, located within the first cavity, includes a connecting plate, an annular plate above the connecting plate, a heating plate within the connecting plate, and a lifting member passing through the heating plate. The lifting member can move up and down relative to the heating plate under external force to drive wafer loading or unloading. The heating plate is used to heat the wafer. The annular plate can move up and down under external force to have a first position and a second position. When in the first position, the annular plate abuts against the outer shell to form an accommodating space separated from the first cavity with the connecting plate. The drive assembly, located within the second cavity, includes a first drive member and a second drive member. The first drive member is connected to the ring plate and is used to drive the ring plate to switch between a first position and a second position. The second drive member is connected to the lifting member.

2. The hot plate module according to claim 1, characterized in that, The lifting component is provided with a hollow cavity, which is connected to the adsorption device and can generate negative pressure to fix the wafer.

3. The hot plate module according to claim 1, characterized in that, The heating assembly also includes a heat spreader plate located above the heating plate and a flexible plate disposed between the heating plate and the heat spreader plate, and the lifting member passes through the heat spreader plate, the flexible plate and the heating plate in sequence.

4. The hot plate module according to claim 3, characterized in that, The heating assembly also includes a mirrored sheet metal layer located below the heating plate, and the periphery of the mirrored sheet metal layer is connected to the ring plate to form the accommodating space.

5. The hot plate module according to claim 1, characterized in that, The hot plate module also includes a first fan and a second fan disposed opposite to each other in the second cavity. The first fan is used to deliver external airflow into the second cavity, and the second fan is used to deliver airflow from the second cavity to the outside.

6. A wafer heating device, characterized in that, include: The frame has several chambers; A plurality of hot plate modules are provided, each disposed in one of the plurality of the aforementioned chambers, wherein the hot plate module is the hot plate module as described in any one of claims 1-5.

7. The wafer heating apparatus according to claim 6, characterized in that, The device also includes several guiding components, each including a first guide rail disposed on the frame and a second guide rail disposed on the hot plate module. The hot plate module can move relative to the frame under the action of the first guide rail and the second guide rail.

8. The wafer heating apparatus according to claim 7, characterized in that, The device further includes a locking member disposed at the end of the guide assembly, the locking member being used to prevent the first guide rail from disengaging from the second guide rail.

9. The wafer heating apparatus according to claim 6, characterized in that, The device further includes a nitrogen assembly, which includes a first delivery channel extending along a plurality of the chambers, a first air inlet communicating with the first delivery channel, a plurality of first air outlets, and a delivery pipe communicating with the plurality of first air outlets and the accommodating space.

10. The wafer heating apparatus according to claim 7, characterized in that, The device further includes an air extraction assembly, which includes a second conveying channel extending along a plurality of the chambers, a second air inlet disposed on a plurality of the hot plate modules, and a second air outlet communicating with the second conveying channel. Each second air inlet communicates the second conveying channel with the accommodating space.

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