Wafer carrier apparatus and semiconductor apparatus

Abstract

A wafer carrier device and semiconductor equipment are disclosed. The wafer carrier device includes: a ejector pin, the ejector pin having a first end and a second end opposite to the first end, the first end of the ejector pin being used to carry a wafer, and the second end of the ejector pin having a first protrusion structure; an ejector pin base, used to carry the ejector pin and to raise or lower the ejector pin, the ejector pin base having a first groove, the first groove corresponding one-to-one with the first protrusion structure, and the first groove and the first protrusion structure being adapted to each other; by providing the first groove in the ejector pin base, the first protrusion structure at the bottom of the ejector pin is adapted to the first groove, so that when the ejector pin moves up and down, the first groove can constrain the movement of the first protrusion structure in the horizontal direction, thereby reducing the probability of the first protrusion structure deviating in the horizontal direction, and thus improving the stability of the ejector pin.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing, and in particular to a wafer carrier device and semiconductor equipment. Background Technology

[0002] With the rapid development of technology, smartphones, tablets, and other electronic products have become indispensable in modern life. These electronic products contain many semiconductor chips, and the main material for manufacturing semiconductor chips is wafers. Wafers need to be etched with circuit patterns, which is usually done using semiconductor process equipment.

[0003] Semiconductor process equipment typically includes a pin receiving tray with through holes along its thickness. Pins move within these through holes, thereby driving the wafer to rise and fall.

[0004] However, the stability of the ejector pin still needs to be improved. Utility Model Content

[0005] The problem solved by this utility model embodiment is to provide a wafer carrier device and semiconductor equipment, which is beneficial to improving the stability of the ejector pin.

[0006] To address the aforementioned problems, this utility model provides a wafer carrier device, comprising: a ejector pin, the ejector pin including a first end and a second end opposite to the first end, the first end of the ejector pin being used to carry a wafer, and the second end of the ejector pin having a first protrusion structure; and an ejector pin base, used to carry the ejector pin and to raise or lower the ejector pin, the ejector pin base having a first groove, the first groove corresponding one-to-one with the first protrusion structure, and the first groove being adapted to the first protrusion structure.

[0007] Optionally, the first groove is concave hemispherical and the first protrusion is convex hemispherical.

[0008] Optionally, with the extension direction perpendicular to the pin as the lateral direction, the lateral dimension of the first groove is larger than the lateral dimension of the first protrusion structure.

[0009] Optionally, with the extension direction perpendicular to the pin being the lateral direction, the difference between the lateral dimension of the first groove and the lateral dimension of the first protrusion structure is 1 mm to 2 mm.

[0010] Optionally, the length of the ejector pin is greater than or equal to 15 centimeters.

[0011] Optionally, the length of the ejector pin is 15 cm to 20 cm.

[0012] Optionally, the wafer carrier further includes a counterweight structure located on the sidewall near the second end of the ejector pin or located at the second end of the ejector pin.

[0013] Optionally, the counterweight structure and the ejector pin are an integral structure, or the counterweight structure and the ejector pin are detachably connected.

[0014] Optionally, if the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located on the side wall near the second end of the ejector pin, and the second end of the ejector pin is in contact with the first protrusion structure; or, if the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located at the second end of the ejector pin, and the counterweight structure is in contact with the first protrusion structure.

[0015] Optionally, if the counterweight structure and the ejector pin are detachably connected, the counterweight structure further includes: an annular weight, which is sleeved on the side wall of the ejector pin and protrudes from the first protruding structure.

[0016] Optionally, if the counterweight structure and the ejector pin are detachably connected, the counterweight structure further includes a weight, the bottom of which has the first protrusion structure, and the weight is disposed at the second end of the ejector pin.

[0017] Optionally, the hammer has a second groove, the bottom of which is higher than the top of the first protrusion, and the second end of the pin is located within the second groove.

[0018] Optionally, the weight and the ejector pin are detachably connected.

[0019] Optionally, the ejector pin has a first connector on its sidewall near the second end; the weight has a second connector on its inner wall, and the weight and the ejector pin are detachably connected via the first and second connectors; the first connector is a third groove on the sidewall of the ejector pin, and the second connector is a second protrusion on the inner wall of the weight, the second protrusion engaging in the third groove; or, the first connector is a third protrusion on the sidewall of the ejector pin, and the second connector is a fourth groove on the inner wall of the weight, the third protrusion engaging in the fourth groove; or, the first connector is an external thread structure on the sidewall of the ejector pin, and the second connector is an internal thread structure on the inner wall of the weight, the external thread structure engaging with the internal thread structure for threaded connection.

[0020] Optionally, the counterweight structure includes a ceramic counterweight structure, a nickel counterweight structure, or a nickel-plated counterweight structure.

[0021] Optionally, the counterweight structure is a counterweight structure with a weight in the range of 20 grams to 100 grams.

[0022] Optionally, the wafer carrier device further includes: a receiving tray and a guide sleeve; the receiving tray includes a bearing surface for bearing the wafer, and the receiving tray also has through holes, each corresponding to a ejector pin; the ejector pin is inserted into the corresponding through hole, and the first end of the ejector pin is located on one side of the bearing surface; the top end of the guide sleeve is disposed in the through hole, and the guide sleeve extends in a direction away from the bearing surface, the guide sleeve is sleeved on the outer periphery of the ejector pin and exposes the counterweight structure, and the inner diameter of the guide sleeve is less than or equal to the outer diameter of the counterweight structure.

[0023] Optionally, the receiving tray may include an electrostatic chuck or a vacuum chuck.

[0024] Accordingly, this utility model embodiment also provides a semiconductor device, including: the wafer carrier device described in any embodiment of this utility model.

[0025] Compared with the prior art, the technical solution of this utility model embodiment has the following advantages:

[0026] This utility model provides a wafer carrier device, including: a ejector pin, the ejector pin having a first end and a second end opposite to the first end, the first end of the ejector pin being used to carry a wafer, and the second end of the ejector pin having a first protrusion structure; an ejector pin base, used to carry the ejector pin and to raise or lower the ejector pin, the ejector pin base having a first groove, the first groove corresponding one-to-one with the first protrusion structure, and the first groove and the first protrusion structure being adapted to each other; by providing a first groove in the ejector pin base, the first protrusion structure at the second end of the ejector pin is adapted to the first groove, so that when the ejector pin moves up and down, the first groove can constrain the movement of the first protrusion structure in the horizontal direction, thereby reducing the probability of the first protrusion structure deviating in the horizontal direction, and thus improving the stability of the ejector pin.

[0027] In an optional embodiment, where the counterweight structure and the ejector pin are detachably connected, the counterweight structure further includes: an annular weight, which is sleeved on the side wall of the ejector pin and protrudes from the first protruding structure; by sleeved on the side wall of the ejector pin, the center of gravity of the ejector pin is lowered, making the ejector pin more stable during lifting and lowering movements, thereby further improving the stability of the ejector pin.

[0028] In an optional embodiment, where the counterweight structure and the ejector pin are detachably connected, the counterweight structure further includes a weight, the bottom of which has the first protrusion structure, and the weight is disposed at the second end of the ejector pin. Because the bottom of the weight has the first protrusion structure and the weight is disposed at the second end of the ejector pin, it helps to reduce the impact on the length of the ejector pin, thereby shortening the distance between the ejector pin and the receiving plate, and thus shortening the movement distance of the ejector pin.

[0029] In an optional embodiment, the hammer has a second groove, the bottom of which is higher than the top of the first protrusion structure, and the second end of the ejector pin is located within the second groove. Because the hammer has a second groove, it is not a hollow ring, which helps to increase the weight of the hammer, thereby further lowering the center of gravity of the ejector pin and further improving the stability of the ejector pin.

[0030] In an optional embodiment, the wafer carrier device further includes a receiving tray and a guide sleeve. The receiving tray includes a bearing surface for supporting the wafer and a through hole, each corresponding to a ejector pin. The ejector pin is inserted into the corresponding through hole, with its first end located on one side of the bearing surface. The top end of the guide sleeve is disposed in the through hole and extends in a direction away from the bearing surface. The guide sleeve is fitted around the outer periphery of the ejector pin and exposes the counterweight structure. The inner diameter of the guide sleeve is less than or equal to the outer diameter of the counterweight structure. Because the inner diameter of the guide sleeve is less than or equal to the outer diameter of the counterweight structure, a mechanical limit is formed by the close cooperation between the guide sleeve and the counterweight, thereby precisely controlling the height of the ejector pin and improving the consistency of the height of multiple ejector pins, thus improving the stability of the wafer placed on the ejector pin. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of a wafer carrier device;

[0032] Figure 2 This is a schematic diagram of the structure of an embodiment of the wafer carrier device of this utility model;

[0033] Figure 3 This is a structural schematic diagram of an embodiment of the ejector pin of this utility model;

[0034] Figure 4 This is a structural schematic diagram of an embodiment of the ejector pin base of this utility model.

[0035] Figure 5 This is a top view of the weight in the first embodiment of the wafer carrier device of this utility model;

[0036] Figure 6This is a schematic diagram of the structure of an embodiment of the first connecting component and the second connecting component of this utility model;

[0037] Figure 7 This is a cross-sectional view of the counterweight in the second embodiment of the wafer carrier device of this utility model;

[0038] Figure 8 This is a scatter plot showing the wafer offset when the wafer is transported using the wafer carrier device of this invention, compared with a scatter plot showing the wafer offset when the wafer is transported using a wafer carrier device of the prior art.

[0039] Figure 9 This is a comparison table showing the wafer offset data when the wafer is transmitted using the wafer carrier device of this invention, and the wafer offset data when the wafer is transmitted using a wafer carrier device of the prior art. Detailed Implementation

[0040] Currently, the stability of the ejector pin still needs improvement. This paper analyzes the reasons why the stability of the ejector pin still needs improvement, using a schematic diagram of a wafer carrier device as an example. Figure 1 This is a schematic diagram of the structure of a wafer carrier device.

[0041] refer to Figure 1 The wafer carrier device includes: a ejector pin 10, the ejector pin 10 having a first end 11 and a second end 12 opposite to the first end 11, the first end 11 of the ejector pin 10 being used to carry a wafer 13, and the end face of the second end 12 of the ejector pin 10 being a plane; an ejector pin base 14, used to carry the ejector pin 10 and to raise or lower the ejector pin 10; a receiving plate 15, the receiving plate 15 having a bearing surface 16 for carrying the wafer 13, the receiving plate 15 also having a through hole 17, the through hole 17 corresponding one-to-one with the ejector pin 10; and a guide sleeve 18, the top end of the guide sleeve 18 being disposed in the through hole 17, and the guide sleeve 18 extending in a direction opposite to the bearing surface 16, the guide sleeve 18 being sleeved on the outer periphery of the ejector pin 10 and exposing the second end 12 of the ejector pin 10.

[0042] Research revealed the following problems with the ejector pins 10 during the lifting and lowering process when using a wafer carrier to transport wafer 13: During the lifting process, the gap between the guide sleeve 18 and the ejector pin 10 easily causes radial vibration, affecting its stability. During the lowering process, when the second end 12 of the ejector pin 10 contacts the ejector pin base 14, uneven pressure distribution on the contact surface easily causes radial displacement, also affecting its stability. Furthermore, during the entire lifting and lowering process, the difference in frictional resistance between each ejector pin 10 and the guide sleeve 18 easily leads to asynchronous movement of multiple ejector pins 10, causing the wafer 13 to shift position.

[0043] Currently, a common method to improve the stability of the ejector pin 10 is to form a protruding structure at the second end 12 of the ejector pin 10. The protruding structure is shaped like a convex hemisphere. However, when the protruding structure of the ejector pin 10 contacts the ejector pin base 14, the pressure distribution on the contact surface is still uneven. Consequently, the ejector pin 10 will still undergo radial displacement when subjected to force, thus the stability of the ejector pin 10 still needs to be improved.

[0044] To address the aforementioned technical problem, this utility model provides a wafer carrier device, comprising: a ejector pin, the ejector pin including a first end and a second end opposite to the first end, the first end of the ejector pin being used to carry a wafer, and the second end of the ejector pin having a first protrusion structure; and an ejector pin base, used to carry the ejector pin and to raise or lower the ejector pin, the ejector pin base having a first groove, the first groove corresponding one-to-one with the first protrusion structure, and the first groove being adapted to the first protrusion structure.

[0045] In the solution disclosed in this utility model embodiment, by setting a first groove in the ejector base, the first protrusion structure at the second end of the ejector is adapted to the first groove. Thus, when the ejector moves up and down, the first groove can constrain the movement of the first protrusion structure in the horizontal direction, thereby reducing the probability of the first protrusion structure deviating in the horizontal direction and improving the stability of the ejector.

[0046] To make the above-mentioned objectives, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0047] Figure 2 This is a schematic diagram of the structure of one embodiment of the wafer carrier device of this utility model. Figure 3 This is a structural schematic diagram of an embodiment of the ejector pin of this utility model. Figure 4 This is a structural schematic diagram of an embodiment of the ejector pin base of this utility model. Figure 5 This is a top view of the first embodiment of the hammer of this utility model. Figure 6 This is a structural schematic diagram of an embodiment of the first connecting component and the second connecting component of this utility model. Figure 7 This is a cross-sectional view of the second embodiment of the hammer of this utility model. Figure 8 This is a scatter plot showing the wafer offset when the wafer is transported using the wafer carrier device of this invention, compared with a scatter plot showing the wafer offset when the wafer is transported using a wafer carrier device of the prior art. Figure 9 This is a comparison table showing the wafer offset data when the wafer is transmitted using the wafer carrier device of this invention, and the wafer offset data when the wafer is transmitted using a wafer carrier device of the prior art.

[0048] refer to Figure 2 The wafer carrier device includes: a ejector pin 100, the ejector pin 100 including a first end 101 and a second end 102 opposite to the first end 101, the first end 101 of the ejector pin 100 is used to carry a wafer 103, and the second end 102 of the ejector pin 100 has a first protrusion structure 104; and an ejector pin base 105, used to carry the ejector pin 100 and to raise or lower the ejector pin 100, the ejector pin base 105 having a first groove 106, the first groove 106 corresponding one-to-one with the first protrusion structure 104, and the first groove 106 being adapted to the first protrusion structure 104.

[0049] It should be noted that by providing a first groove 106 in the ejector base 105, the first protrusion structure 104 of the second end 102 of the ejector 100 is adapted to the first groove 106. Thus, when the ejector 100 moves up and down, the first groove 106 can constrain the movement of the first protrusion structure 104 in the horizontal direction, thereby reducing the probability of the first protrusion structure 104 deviating in the horizontal direction and improving the stability of the ejector 100.

[0050] The ejector pin 100 contacts the wafer 103 through its first end 101, thereby facilitating the delivery of the wafer 103 out of the process chamber or the transfer of the wafer 103 to the receiving tray by a transfer device such as a robotic arm.

[0051] The ejector pin 100, through the first protrusion structure 104 of the second end 102, cooperates with the first groove 106 in the ejector pin base 105 to improve the stability of the ejector pin 100.

[0052] refer to Figure 3 In this embodiment, the length L of the ejector pin 100 is greater than or equal to 15 centimeters.

[0053] It should be noted that during the ascent of the ejector pin 100, the height to which the ejector pin base 105 rises is preset. To ensure that the wafer 103 can accurately reach the predetermined position, this can be achieved by increasing the length L of the ejector pin 100. Therefore, in this embodiment, the length L of the ejector pin 100 is greater than or equal to 15 centimeters.

[0054] refer to Figure 3 The length L of the ejector pin 100 should not be too long. If the length L of the ejector pin 100 is too long, the distance between the ejector pin 100 and the ejector pin base 105 will increase during the upward movement of the ejector pin 100, which will easily cause radial vibration of the ejector pin 100 and reduce the stability of the ejector pin 100. Therefore, in this embodiment, the length L of the ejector pin 100 is 15 cm to 20 cm.

[0055] The ejector base 105 is used to control the movement of the ejector pin 100, thereby lifting or placing the wafer 103 by raising or lowering the ejector pin 100.

[0056] The first groove 106 is used to constrain the horizontal movement of the first protrusion structure 104.

[0057] It should be noted that the ejector base 105 has a first groove 106, which corresponds one-to-one with the first protrusion structure 104, and the first groove 106 is adapted to the first protrusion structure 104, which is beneficial to achieve precise positioning between the ejector 100 and the ejector base 105.

[0058] In this embodiment, reference Figure 3 and Figure 4 The first groove 106 has a concave hemispherical shape, and the first protrusion structure 104 has a convex hemispherical shape.

[0059] It should be noted that during the lifting and lowering movement of the ejector pin 100, the concave hemispherical shape of the first groove 106 and the convex hemispherical shape of the first protrusion structure 104 cooperate with each other, enabling the ejector pin 100 to make slight angular offsets and position compensations within the ejector pin base 105. This allows for automatic correction of the movement trajectory deviation of the ejector pin 100, effectively preventing jamming or wear of the ejector pin 100 and thus improving the stability of the ejector pin 100.

[0060] In this embodiment, reference Figure 3 and Figure 4 With the extension direction perpendicular to the pin 100 as the lateral direction, the lateral dimension W1 of the first groove 106 is greater than the lateral dimension W2 of the first protrusion structure 104.

[0061] It should be noted that during the lifting and lowering movement of the ejector pin 100, the lateral dimension W1 of the first groove 106 is greater than the lateral dimension W2 of the first protrusion structure 104. This is beneficial for the ejector pin 100 to have sufficient lateral movement space within the first groove 106, thereby enabling the ejector pin 100 to make slight angular offsets and position compensations within the ejector pin base 105. This effectively avoids the ejector pin 100 from being subjected to concentrated stress due to deviations in its movement trajectory, thereby reducing the probability of the ejector pin 100 breaking.

[0062] refer to Figure 3 and Figure 4 With the extension direction perpendicular to the ejector pin 100 as the lateral direction, the difference between the lateral dimension W1 of the first groove 106 and the lateral dimension W2 of the first protrusion structure 104 should not be too large or too small. If the difference between the lateral dimension W1 of the first groove 106 and the lateral dimension W2 of the first protrusion structure 104 is too large, the ejector pin 100 may have too much lateral movement space within the ejector pin base 105, resulting in significant lateral swaying of the ejector pin 100 during movement, thus reducing the stability of the ejector pin 100. If the difference between the lateral dimension W1 of the first groove 106 and the lateral dimension W2 of the first protrusion structure 104 is too small, the ejector pin 100 may have too little lateral movement space within the ejector pin base 105, resulting in jamming of the ejector pin 100 during movement, thereby increasing the probability of the ejector pin 100 breaking. Therefore, in this embodiment, with the extension direction perpendicular to the pin 100 as the lateral direction, the difference between the lateral dimension W1 of the first groove 106 and the lateral dimension W2 of the first protrusion structure 104 is 1 mm to 2 mm.

[0063] In this embodiment, the wafer carrier device further includes a counterweight structure 117, located on the side wall near the second end 102 of the ejector pin 100 or located at the second end 102 of the ejector pin 100.

[0064] It should be noted that the counterweight structure 117 is located on the side wall near the second end 102 of the ejector pin 100 or on the second end 102 of the ejector pin 100, which helps to lower the center of gravity of the ejector pin 100 and further makes the ejector pin 100 more stable when it is moving up and down.

[0065] Specifically, the counterweight structure 117 and the ejector pin 100 are an integral structure, or the counterweight structure 117 and the ejector pin 100 are detachably connected.

[0066] It should be noted that the counterweight structure 117 and the ejector pin 100 are an integral structure, so the counterweight structure 117 and the ejector pin 100 can be formed in one process, thereby reducing processing steps and material waste.

[0067] It should also be noted that the counterweight structure 117 and the ejector pin 100 are detachably connected, which makes it easy to replace the counterweight 107 or the ejector pin 100 separately during the subsequent maintenance of the wafer carrier device, thereby reducing the cost of maintaining the wafer carrier device.

[0068] As an example, see reference Figure 5 When the counterweight structure 117 and the ejector pin 100 are detachably connected, the counterweight structure 117 further includes an annular weight 107, which is sleeved on the side wall of the ejector pin 100 and exposes the first protrusion structure 104.

[0069] It should be noted that by fitting a counterweight 107 on the side wall of the ejector pin 100, the center of gravity of the ejector pin 100 is lowered, making the ejector pin 100 more stable during lifting and lowering movements, thereby further improving the stability of the ejector pin 100.

[0070] It should also be noted that since the weight 107 is connected to the side wall of the ejector pin 100 in a sleeve manner, the mass of the weight 107 is distributed evenly around the axis of the ejector pin 100, thereby effectively preventing the ejector pin 100 from tilting laterally during movement. Consequently, the ejector pin 100 can always move in a direction perpendicular to the surface of the ejector pin base 105. In addition, since the weight 107 is connected to the side wall of the ejector pin 100 in a sleeve manner, no additional support is required, thereby improving space utilization.

[0071] In other embodiments, the counterweight may be fixedly connected to the ejector pin, or the counterweight and ejector pin may be an integral structure.

[0072] Specifically, when the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located on the side wall near the second end of the ejector pin, and the second end of the ejector pin is in contact with the first protrusion structure; or, when the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located at the second end of the ejector pin, and the counterweight structure is in contact with the first protrusion structure.

[0073] refer to Figure 6 The ejector pin 100 has a first connector 109 on the side wall near the second end 102 [e.g.] Figure 6 (a) shows that the inner wall of the counterweight 107 has a second connector 110 [as shown in the image]. Figure 6 As shown in (b), the hammer 107 and the pin 100 are detachably connected via the first connector 109 and the second connector 110.

[0074] It should be noted that, through the cooperation of the first connector 109 and the second connector 110, the counterweight 107 and the ejector pin 100 are detachably connected, which helps to simplify the assembly and disassembly process of the counterweight 107 and the ejector pin 100 and improve work efficiency.

[0075] In this embodiment, we continue to refer to Figure 6 The first connecting member 109 is a third groove 111 disposed on the side wall of the ejector pin 100 [e.g.] Figure 6 As shown in (a), the second connecting member 110 is a second protruding structure 112 disposed on the inner wall of the counterweight 107 [as shown in (a)]. Figure 6 As shown in (b), the second protrusion structure 112 is engaged in the third groove 111.

[0076] It should be noted that the first connector 109 is a third groove 111 provided on the side wall of the ejector pin 100, and the second connector 110 is a second protrusion structure 112 provided on the inner wall of the counterweight 107. On the one hand, the forming process of the third groove 111 and the second protrusion structure 112 is simple, thereby reducing the difficulty of manufacturing the first connector 109 and the second connector 110; on the other hand, during assembly, it is only necessary to align the second protrusion structure 112 with the third groove 111 and push it in to achieve the connection between the counterweight 107 and the ejector pin 100, thereby simplifying the difficulty of connecting the counterweight 107 and the ejector pin 100.

[0077] In other embodiments, the first connector is a third protrusion structure disposed on the side wall of the ejector pin, and the second connector is a fourth groove disposed on the inner wall of the counterweight, wherein the third protrusion structure is engaged in the fourth groove; or, the first connector is an external thread structure disposed on the side wall of the ejector pin, and the second connector is an internal thread structure disposed on the inner wall of the counterweight, wherein the external thread structure and the internal thread structure cooperate to form a threaded connection.

[0078] In this embodiment, the counterweight structure 117 includes a ceramic counterweight structure, a nickel counterweight structure, or a nickel-plated counterweight structure. As an example, the counterweight structure 117 is a ceramic counterweight structure.

[0079] It should be noted that ceramic counterweight structures, nickel counterweight structures, or nickel-plated counterweight structures have advantages such as high temperature resistance and corrosion resistance, which helps to reduce particulate pollution caused by material oxidation or surface wear during operation.

[0080] The weight of the counterweight structure 117 should not be too large or too small. If the weight of the counterweight structure 117 is too large, it is easy for the counterweight structure 117 to generate a large inertia, which may cause the ejector pin 100 to sway significantly during the lifting and lowering movement, thus affecting the stability of the ejector pin 100. If the weight of the counterweight structure 117 is too small, the effect of lowering the center of gravity of the ejector pin 100 may be poor, thus affecting the stability of the ejector pin 100. Therefore, in this embodiment, the counterweight structure 117 is a counterweight structure with a weight in the range of 20 grams to 100 grams.

[0081] refer to Figure 8 , Figure 8 This is a scatter plot showing the wafer offset when transporting a wafer using the wafer carrier device of this invention, compared to a scatter plot showing the wafer offset when transporting a wafer using a prior art wafer carrier device. The vertical axis represents the amount of wafer offset, where the origin 0 represents the starting position of the wafer, negative values ​​indicate a negative offset, and positive values ​​indicate a positive offset. The scatter plot within the solid lines represents the amount of wafer offset when transporting a wafer using a prior art wafer carrier device, and the scatter plot within the dashed lines represents the amount of wafer offset when transporting a wafer using the wafer carrier device of this invention. Figure 8 As can be seen, compared to the scatter plot within the solid line box, the scatter plot within the solid line box converges more towards the origin 0. That is, when the wafer carrier device of this utility model is used to transmit the wafer, the offset of the wafer is less than that when the wafer carrier device of the prior art is used to transmit the wafer.

[0082] Reference Figure 9 , Figure 9 This table compares the wafer offset data generated when transmitting wafers using the wafer carrier device of this invention with the wafer offset data generated when transmitting wafers using existing wafer carrier devices. Figure 9As shown in the table, when using the existing wafer carrier device, the main offset range in the X direction is 300 to 580 and -300 to -380, with an average offset of 339.36. The main offset range in the Y direction is 150 to 500 and -100 to -400, with an average offset of 197.64. However, when using the wafer carrier device of this invention, the main offset range in the X direction is reduced to 0 to 240 and 0 to -220, with an average offset of 120.78. The main offset range in the Y direction is reduced to 0 to 250 and 0 to -180, with an average offset of 137.68. Therefore, when using the wafer carrier device of this invention to transport wafers, the offset of the wafer is less than that when using the existing wafer carrier device.

[0083] It should be noted that during the wafer transfer process, the wafer offset is determined by the offset of the robotic arm that picks up and places the wafer. Specifically, for the same wafer, the position when the robotic arm places the wafer is recorded as the initial position, while the position when the robotic arm picks up the wafer is recorded as the offset position.

[0084] It should also be noted that since the wafer's offset in the X and Y directions can be positive or negative, two opposite offset ranges need to be defined for the X and Y directions. Specifically, the X direction includes a first direction (not shown) and a second direction (not shown) opposite to the first direction. The first direction indicates that the wafer has offset in the positive direction of the X direction, and the second direction indicates that the wafer has offset in the negative direction of the X direction. The Y direction includes a third direction (not shown) and a fourth direction (not shown) opposite to the third direction. The third direction indicates that the wafer has offset in the positive direction of the Y direction, and the fourth direction indicates that the wafer has offset in the negative direction of the Y direction. The X direction is perpendicular to the Y direction.

[0085] In this embodiment, reference Figure 2 The wafer carrier device further includes a receiving plate 113 and a guide sleeve 114; the receiving plate 113 includes a bearing surface 115 for bearing the wafer 103, and the receiving plate 113 also has a through hole 116, the through hole 116 corresponding to the ejector pin 100; the ejector pin 100 passes through the corresponding through hole 116, and the first end 101 of the ejector pin 100 is located on one side of the bearing surface 115; the top end of the guide sleeve 114 is disposed in the through hole 116, and the guide sleeve 114 extends in a direction away from the bearing surface 115, the guide sleeve 114 is sleeved on the outer periphery of the ejector pin 100 and exposes the counterweight structure 117, and the inner diameter of the guide sleeve 114 is less than or equal to the outer diameter of the counterweight structure 117.

[0086] The receiving tray 113 is used to provide a bearing surface 115 for the wafer 103, ensuring that the wafer 103 remains horizontal and stable during processing or transport.

[0087] The through-hole 116 corresponds one-to-one with the ejector pin 100, which is beneficial for the ejector pin 100 to accurately pass through the through-hole 116 and contact the bottom of the wafer 103, thereby realizing the lifting or positioning operation of the wafer 103.

[0088] The guide sleeve 114 is used to guide the ejector pin 100, ensuring that the ejector pin 100 can move in a straight line during the lifting and lowering process, and preventing the ejector pin 100 from deviating or shaking.

[0089] It should be noted that since the inner diameter of the guide sleeve 114 is less than or equal to the outer diameter of the counterweight structure 117, a mechanical limit is formed by the close cooperation between the guide sleeve 114 and the counterweight structure 117, thereby accurately controlling the height of the ejector pin 100, thereby improving the consistency of the height of multiple ejector pins 100, and thus improving the stability of the wafer 103 placed on the ejector pin 100.

[0090] It should also be noted that the combined use of the receiving plate 113 and the guide sleeve 114 provides stable support and precise guidance for the wafer 103, enabling the ejector pin 100 to operate the wafer 103 smoothly during the lifting and lowering process, reducing the risk of damage to the wafer 103 caused by vibration or shaking.

[0091] In this embodiment, the receiving tray 107 includes an electrostatic chuck or a vacuum chuck. As an example, the receiving tray 107 is an electrostatic chuck.

[0092] The electrostatic chuck mainly uses the principle of electrostatic adsorption to adsorb the wafer 103 onto the surface. Therefore, the electrostatic chuck can provide a stable fixing force for the wafer 103 through a uniform electric field, thereby suppressing the deformation of the wafer 103 during the processing.

[0093] Vacuum chucks primarily work by drawing air out through a pipe connected to a vacuum pump, creating a negative pressure at the top of the chuck, thus adsorbing the 103 wafer onto its surface. The relatively simple structure of vacuum chucks results in lower manufacturing and maintenance costs.

[0094] Figure 7 This is a cross-sectional view of the weight in the second embodiment of the wafer carrier device of this utility model.

[0095] The similarities between this embodiment and the previous embodiments will not be repeated here. The difference between this embodiment and the previous embodiments is that the bottom of the hammer 207 has the first protruding structure 104.

[0096] refer to Figure 7 and in conjunction with references Figure 2 When the counterweight structure 117 and the ejector pin 100 are detachably connected, the counterweight structure 117 further includes a weight 207, the bottom of which has the first protrusion structure 104, and the weight 207 is disposed at the second end 102 of the ejector pin 100.

[0097] It should be noted that, since the bottom of the weight 207 has the first protruding structure 104, and the weight 207 is disposed at the second end 102 of the ejector pin 100, it is beneficial to reduce the impact on the length of the ejector pin 100, thereby shortening the distance between the ejector pin 100 and the receiving plate, and thus shortening the movement distance of the ejector pin 100.

[0098] Specifically, the hammer 207 has a second groove 208, the bottom of which is higher than the top of the first protrusion structure 104, and the second end 102 of the pin 100 is located in the second groove 208.

[0099] It should be noted that, since the weight 207 has a second groove 208, the weight 207 is not a hollow ring, which helps to increase the weight of the weight 207, thereby further lowering the center of gravity of the ejector pin 100 and further improving the stability of the ejector pin 100.

[0100] In other embodiments, the weight may not have a second groove, and the weight may be detachably connected to the second end of the ejector pin in other ways.

[0101] In other embodiments, the counterweight may be fixedly connected to the ejector pin, or the counterweight and ejector pin may be an integral structure.

[0102] Specifically, when the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located on the side wall near the second end of the ejector pin, and the second end of the ejector pin is in contact with the first protrusion structure; or, when the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located at the second end of the ejector pin, and the counterweight structure is in contact with the first protrusion structure.

[0103] Reference Figure 2 This utility model embodiment also provides a semiconductor device, including: the wafer carrier device described in any embodiment of this utility model.

[0104] During the wafer 103 processing, the first protrusion structure 104 of the ejector pin 100, the first groove 106 of the ejector pin base 105, and the counterweight 107 in the wafer carrier device work together to improve the stability of the ejector pin 100, thereby improving the stability of the wafer 103 on the ejector pin 100. As a result, during the wafer 103 processing, the wafer 103 is more likely to remain in a stable position, reducing the probability of the wafer 103 colliding with other components, and thus improving the quality of the wafer 103 processing.

[0105] While the present invention has been disclosed above, it is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A wafer carrier device, characterized in that, include: A ejector pin, along its extending direction, includes a first end and a second end opposite to the first end, the first end of the ejector pin being used to support a wafer, and the second end of the ejector pin having a first protrusion structure; The ejector base is used to support the ejector pin and enable the ejector pin to move up and down. The ejector base has a first groove, which corresponds one-to-one with the first protrusion structure, and the first groove is adapted to the first protrusion structure.

2. The wafer carrier device as described in claim 1, characterized in that, The first groove is concave hemispherical in shape, and the first protrusion is convex hemispherical in shape.

3. The wafer carrier device as described in claim 1, characterized in that, With the extension direction perpendicular to the pin as the transverse direction, the transverse dimension of the first groove is greater than the transverse dimension of the first protrusion structure.

4. The wafer carrier device as described in claim 3, characterized in that, With the extension direction perpendicular to the pin as the lateral direction, the difference between the lateral dimension of the first groove and the lateral dimension of the first protrusion structure is 1 mm to 2 mm.

5. The wafer carrier device as described in claim 1, characterized in that, The length of the thimble is greater than or equal to 15 centimeters.

6. The wafer carrier device as described in claim 5, characterized in that, The length of the thimble is 15 to 20 centimeters.

7. The wafer carrier device as described in claim 1, characterized in that, The wafer carrier further includes a counterweight structure located on the sidewall near the second end of the ejector pin, or located at the second end of the ejector pin.

8. The wafer carrier device as described in claim 7, characterized in that, The counterweight structure and the ejector pin are an integral structure, or the counterweight structure and the ejector pin are detachably connected.

9. The wafer carrier device as described in claim 8, characterized in that, When the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located on the side wall near the second end of the ejector pin, and the second end of the ejector pin is in contact with the first protrusion structure; or, when the counterweight structure and the ejector pin are an integral structure, the counterweight structure is located at the second end of the ejector pin, and the counterweight structure is in contact with the first protrusion structure.

10. The wafer carrier device as claimed in claim 8, characterized in that, When the counterweight structure and the ejector pin are detachably connected, the counterweight structure includes: an annular weight, which is sleeved on the side wall of the ejector pin and protrudes from the first protruding structure.

11. The wafer carrier device as claimed in claim 8, characterized in that, When the counterweight structure and the ejector pin are detachably connected, the counterweight structure includes a weight, the bottom of which has the first protrusion structure, and the weight is disposed at the second end of the ejector pin.

12. The wafer carrier device as claimed in claim 11, characterized in that, The hammer has a second groove, the bottom of which is higher than the top of the first protrusion, and the second end of the pin is located within the second groove.

13. The wafer carrier device as described in claim 10 or 12, characterized in that, The ejector pin has a first connector on its side wall near the second end; the weight has a second connector on its inner wall, and the weight and the ejector pin are detachably connected through the first connector and the second connector. The first connector is a third groove provided on the side wall of the ejector pin, and the second connector is a second protrusion provided on the inner wall of the counterweight, the second protrusion being engaged in the third groove; Alternatively, the first connector is a third protrusion structure disposed on the side wall of the ejector pin, and the second connector is a fourth groove disposed on the inner wall of the counterweight, with the third protrusion structure engaging in the fourth groove; Alternatively, the first connecting member is an external thread structure disposed on the side wall of the ejector pin, and the second connecting member is an internal thread structure disposed on the inner wall of the counterweight, wherein the external thread structure and the internal thread structure cooperate to form a threaded connection.

14. The wafer carrier device according to any one of claims 7 to 12, characterized in that, The counterweight structure includes a ceramic counterweight structure, a nickel counterweight structure, or a nickel-plated counterweight structure.

15. The wafer carrier device according to any one of claims 7 to 12, characterized in that, The counterweight structure is a counterweight structure with a weight in the range of 20 grams to 100 grams.

16. The wafer carrier device according to any one of claims 7 to 12, characterized in that, The wafer carrier device further includes: a receiving tray and a guide sleeve; The receiving tray includes a bearing surface for supporting the wafer, and the receiving tray also has through holes, each corresponding to a ejector pin; The ejector pin is inserted into the corresponding through hole, and the first end of the ejector pin is located on one side of the bearing surface; The top end of the guide sleeve is disposed in the through hole, and the guide sleeve extends in a direction away from the bearing surface. The guide sleeve is sleeved on the outer periphery of the ejector pin and exposes the counterweight structure. The inner diameter of the guide sleeve is less than or equal to the outer diameter of the counterweight structure.

17. The wafer carrier device as claimed in claim 16, characterized in that, The receiving plate includes an electrostatic chuck or a vacuum chuck.

18. A semiconductor device, characterized in that, Includes the wafer carrier device as described in any one of claims 1 to 17.

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