A ceramic-embedded IC carrier board

Abstract

The utility model relates to IC carrier plate technical field especially IC carrier plate of buried pottery, including first base plate, the bottom of first base plate is installed with wiring board, the top of first base plate is seted up with mounting groove, the inside of mounting groove is equipped with ceramic block, the top of ceramic block reaches the outside of mounting groove, and the top of first base plate is connected with second base plate, the top of second base plate is seted up with mounting through slot, the top of ceramic block reaches in mounting through slot, and the bottom edge of ceramic block is extended and is equipped with the edge of surrounding, and the edge of surrounding reaches the below of second base plate, the top of ceramic block is installed with the copper clad layer, and the edge of copper clad layer extends to the top of second base plate, and the edge of copper clad layer is flush with the top edge of second base plate, and the bottom edge of copper clad layer is installed with the heat conduction frame, and the bottom of heat conduction frame reaches the side of wiring board. The cooperation of the edge of surrounding and mounting groove and second base plate can increase the installation stability of ceramic block and improve the installation effect.

Description

Technical Field

[0001] This utility model relates to the field of IC substrate technology, and in particular to an IC substrate with embedded ceramic. Background Technology

[0002] Embedded ceramic IC substrates are an advanced packaging technology that embeds ceramic materials into integrated circuit substrates, and are mainly used for high-power, high-frequency or high-reliability electronic devices.

[0003] In existing ceramic-embedded IC substrates, the ceramic block is typically embedded in the substrate and fixed with insulating adhesive during installation. However, during use, the ceramic block is prone to detachment due to vibration, resulting in poor installation performance. Furthermore, the heat generated by the chip during operation is generally dissipated through the copper plating layer on the ceramic block. However, relying solely on the copper plating layer and the ceramic block for heat dissipation is slow, leading to heat buildup and ineffective heat dissipation. Therefore, we propose a ceramic-embedded IC substrate. Utility Model Content

[0004] The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing an IC substrate with embedded ceramic.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: designing an IC carrier board with embedded ceramic, including a first substrate, a wiring board installed at the bottom of the first substrate, a mounting groove opened at the top of the first substrate, a ceramic block inside the mounting groove, and the top of the ceramic block extending to the outside of the mounting groove.

[0006] A second substrate is connected to the top of the first substrate. A mounting slot is provided on the top of the second substrate. The top of the ceramic block extends into the mounting slot, and a surrounding edge extends from the bottom edge of the ceramic block to the bottom of the second substrate.

[0007] A copper-clad layer is installed on the top of the ceramic block, the edge of which extends to the top of the second substrate and is flush with the top edge of the second substrate. A heat-conducting frame is installed on the bottom edge of the copper-clad layer, and the bottom of the heat-conducting frame extends to the side of the wiring board.

[0008] Through holes are provided on the top of the wiring board, the first substrate, the ceramic block, the second substrate, and the copper cladding layer. The inner surfaces of the through holes are connected by a conductive layer. The top of the conductive layer is electrically connected to the copper cladding layer, and the bottom of the conductive layer is electrically connected to the circuit on the wiring board.

[0009] Preferably, the edge of the edging is fitted with the inner wall of the mounting groove with a clearance, and the edge of the edging is bonded and fixed to the inner wall of the mounting groove with insulating adhesive.

[0010] Preferably, the top of the ceramic block is flush with the top of the second substrate.

[0011] Preferably, the top edge of the second substrate is provided with a second rounded corner, and a first rounded corner is provided at the connection between the heat-conducting frame and the copper cladding layer. When the copper cladding layer covers the second substrate, the first rounded corner is stacked on the side of the second rounded corner.

[0012] Preferably, the side of the ceramic block is fitted with the inner wall of the mounting groove with a clearance, and the two are bonded together with insulating adhesive.

[0013] Preferably, a thermally conductive silicone grease layer is provided on the side of the thermally conductive frame.

[0014] Preferably, the bottom of the wiring board has pads that are soldered to the PCB board, and the through holes are connected to the top of the pads.

[0015] The design scheme proposed in this utility model has the following beneficial effects in application:

[0016] 1. By combining the surrounding edge, the mounting groove, and the second substrate, the installation stability of the ceramic block can be increased, and the installation effect can be improved.

[0017] 2. The copper-clad layer and thermally conductive frame can quickly transfer some of the heat generated by the chip to the external heat sink for heat dissipation. Then, through the vias and conductive layers, some of the heat generated by the chip can be transferred to the pads for heat dissipation. The heat dissipation speed is fast and the heat dissipation effect is improved. Attached Figure Description

[0018] Figure 1 This is a structural dispersion diagram of the present invention;

[0019] Figure 2 This is a schematic diagram of the copper-clad layer and heat-conducting frame structure of this utility model;

[0020] Figure 3 This is a cross-sectional view of the through-hole structure of this utility model;

[0021] Figure 4 This is a side sectional view of the structural part of this utility model.

[0022] In the figure: 1. Wiring board; 2. First substrate; 3. Mounting groove; 4. Edge; 5. Second substrate; 6. Thermally conductive frame; 7. Copper cladding layer; 8. Through hole; 9. First rounded corner; 10. Mounting through groove; 11. Second rounded corner; 12. Ceramic block; 13. Solder pad; 14. Conductive layer. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0024] Reference Figures 1-4 An IC carrier board with embedded ceramics includes a first substrate 2, a wiring board 1 mounted on the bottom of the first substrate 2, and a pad 13 provided on the bottom of the wiring board 1, the pad 13 being soldered to a PCB circuit board.

[0025] like Figure 1 As shown, a mounting groove 3 is provided on the top of the first substrate 2, and a ceramic block 12 is provided inside the mounting groove 3. The top of the ceramic block 12 extends to the outside of the mounting groove 3. A second substrate 5 is connected to the top of the first substrate 2. A mounting through groove 10 is provided on the top of the second substrate 5. The top of the ceramic block 12 extends into the mounting through groove 10. The side of the ceramic block 12 is in clearance fit with the inner wall of the mounting through groove 10, and the two are bonded together with insulating adhesive. The ceramic block 12 can increase the mechanical strength and stability of the carrier plate, so that the carrier plate will not be damaged when subjected to high temperature.

[0026] like Figure 1 and Figure 4 As shown, a rim 4 extends from the bottom edge of the ceramic block 12 to below the second substrate 5. The edge of the rim 4 is fitted with the inner wall of the mounting groove 3 with a clearance, and the edge of the rim 4 is bonded to the inner wall of the mounting groove 3 with insulating adhesive. The rim 4 can increase the connection strength between the ceramic block 12 and the first substrate 2 and the second substrate 5, and prevent the ceramic block 12 from falling off due to vibration during use.

[0027] like Figure 1 and Figure 2 As shown, a copper-clad layer 7 is mounted on the top of the ceramic block 12. The edge of the copper-clad layer 7 extends to the top of the second substrate 5, and the edge of the copper-clad layer 7 is flush with the top edge of the second substrate 5. In actual use, by soldering the chip onto the copper-clad layer 7, and the edge of the copper-clad layer 7 can be connected to the heat sink, the heat generated by the chip can be transferred to the copper-clad layer 7 and quickly transferred to the heat sink for heat dissipation, resulting in fast heat dissipation.

[0028] It should be noted that the top of the ceramic block 12 is flush with the top of the second substrate 5, so that the bottom of the copper clad layer 7 will make full contact with the top of the second substrate 5, thereby improving the installation stability of the copper clad layer 7.

[0029] like Figure 2 and Figure 4 As shown, a thermally conductive frame 6 is installed on the bottom edge of the copper-clad layer 7. The bottom of the thermally conductive frame 6 extends to the side of the wiring board 1. A thermally conductive grease layer is provided on the side of the thermally conductive frame 6. The thermally conductive grease can connect the thermally conductive frame 6 to the external heat sink, which can increase the connection area between the carrier board and the heat sink and speed up the heat dissipation.

[0030] like Figure 1 and Figure 3As shown, through holes 8 are provided on the top of the wiring board 1, the first substrate 2, the ceramic block 12, the second substrate 5 and the copper cladding layer 7, and the through holes 8 are connected to the top of the pad 13. In this way, some of the heat generated by the chip can be transferred to the pad 13 below through the through holes 8 for heat dissipation, thereby accelerating the heat dissipation speed.

[0031] It should be noted that the inner surface of the through hole 8 is connected by the conductive layer 14. The top of the conductive layer 14 is electrically connected to the copper cladding layer 7, and the bottom of the conductive layer 14 is electrically connected to the circuit on the wiring board 1. The conductive layer 14 is made of metallic copper. The chip can be connected to the circuit in the wiring board 1 through the conductive layer 14.

[0032] Specifically, during installation, the bottom of the first substrate 2 is connected to the wiring board 1, the ceramic block 12 is placed in the mounting groove 3, and then the second substrate 5 is installed on top of the first substrate 2, so that the ceramic block 12 is located in the mounting through groove 10. At the same time, the surrounding edge 4 provided at the bottom edge of the ceramic block 12 is located below the second substrate 5, which can limit the ceramic block 12 and make the ceramic block 12 installed stably.

[0033] Next, the staff will install the copper-clad layer 7 on top of the ceramic block 12, so that the copper-clad layer 7 covers the top of the second substrate 5. At the same time, the thermally conductive frame 6 of the edge of the copper-clad layer 7 will cover the edges of the wiring board 1, the first substrate 2 and the second substrate 5. The thermally conductive frame 6 will be connected to the heat sink through thermal grease. Then the chip will be fixed on top of the copper-clad layer 7. Finally, the bottom pad 13 of the wiring board 1 will be soldered to the preset position on the PCB board to complete the installation.

[0034] During use, some of the heat generated by the chip is transferred to the copper layer 7, and then to the heat sink through the thermally conductive frame 6 for heat dissipation. In addition, some heat is also transferred to the pad 13 through the conductive layer 14 in the via 8 for heat dissipation. The heat dissipation speed is fast and the heat dissipation effect is improved.

[0035] Furthermore, such as Figure 1 and Figure 4 As shown, the top edge of the second substrate 5 is provided with a second rounded corner 11, and a first rounded corner 9 is provided at the connection between the heat-conducting frame 6 and the copper-clad layer 7. When the copper-clad layer 7 covers the second substrate 5, the first rounded corner 9 is stacked on the side of the second rounded corner 11. Through the cooperation of the first rounded corner 9 and the second rounded corner 11, stress concentration can be avoided at the connection between the second substrate 5 and the heat-conducting frame 6 and the copper-clad layer 7 during use, thereby avoiding damage to the carrier board.

[0036] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. An IC substrate with embedded ceramic, comprising a first substrate (2), characterized in that: The bottom of the first substrate (2) is equipped with a wiring board (1), and the top of the first substrate (2) is provided with a mounting groove (3). A ceramic block (12) is provided inside the mounting groove (3), and the top of the ceramic block (12) extends to the outside of the mounting groove (3). A second substrate (5) is connected to the top of the first substrate (2). A mounting groove (10) is provided on the top of the second substrate (5). The top of the ceramic block (12) extends into the mounting groove (10), and a surrounding edge (4) extends from the bottom edge of the ceramic block (12) to the bottom of the second substrate (5). A copper-clad layer (7) is installed on the top of the ceramic block (12). The edge of the copper-clad layer (7) extends to the top of the second substrate (5), and the edge of the copper-clad layer (7) is flush with the top edge of the second substrate (5). A heat-conducting frame (6) is installed on the bottom edge of the copper-clad layer (7), and the bottom of the heat-conducting frame (6) extends to the side of the wiring board (1). Through holes (8) are provided on the top of the wiring board (1), the first substrate (2), the ceramic block (12), the second substrate (5) and the copper clad layer (7). The inner surface of the through hole (8) is connected by a conductive layer (14). The top of the conductive layer (14) is electrically connected to the copper clad layer (7), and the bottom of the conductive layer (14) is electrically connected to the circuit on the wiring board (1).

2. The IC substrate with embedded ceramic according to claim 1, characterized in that: The edge of the rim (4) is fitted with the inner wall of the mounting groove (3) with a clearance, and the edge of the rim (4) is bonded and fixed to the inner wall of the mounting groove (3) with insulating adhesive.

3. The IC substrate with embedded ceramic according to claim 1, characterized in that: The top of the ceramic block (12) is flush with the top of the second substrate (5).

4. The IC substrate with embedded ceramic according to claim 1, characterized in that: The top edge of the second substrate (5) is provided with a second rounded corner (11), and a first rounded corner (9) is provided at the connection between the heat-conducting frame (6) and the copper clad layer (7). When the copper clad layer (7) covers the second substrate (5), the first rounded corner (9) is stacked on the side of the second rounded corner (11).

5. The IC substrate with embedded ceramic according to claim 1, characterized in that: The side of the ceramic block (12) is fitted with the inner wall of the mounting groove (10) with a clearance, and the two are bonded together with insulating adhesive.

6. The IC substrate with embedded ceramic according to claim 1, characterized in that: The side of the heat-conducting frame (6) is provided with a heat-conducting silicone grease layer.

7. The IC substrate with embedded ceramic according to claim 1, characterized in that: The bottom of the wiring board (1) is provided with a pad (13), which is soldered to the PCB circuit board, and the through hole (8) is connected to the top of the pad (13).

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