A cutting device for silicon wafers

Abstract

The utility model relates to the technical field of silicon wafer cutting, especially to a cutting device of silicon wafer, which comprises: a frame body installed in a protective shell; a winding wire cylinder arranged at the top of the frame body; a tensioning wheel and a guide wheel rotatably connected to one side of the frame body; a gas cylinder installed at the top of the protective shell and fixedly connected to the frame body at the output end; and a water pump fixedly installed inside the protective shell. In the utility model, multiple groups of spray heads are arranged to directly flush the cutting area, the cleaning liquid carrying the debris flows into the first water tank through the through slot of the support plate, and is filtered through the filter plate. The filtered cleaning liquid flows into the inside of the second water tank through the through hole and is used again, thereby saving the cleaning liquid. Meanwhile, the brush plate is fixed at the bottom of the support plate, and when the brush plate moves horizontally with the driving mechanism, the bottom thereof automatically scrapes the surface of the filter plate, thereby removing the accumulated debris in real time, reducing the blockage of the filter plate, and ensuring the smooth circulation of the cleaning liquid as much as possible.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer cutting technology, and in particular to a silicon wafer cutting device. Background Technology

[0002] After silicon wafers are manufactured, they need to be cut using a cutting device. Since silicon wafers are brittle crystals, traditional cutting devices can easily damage the structure of the silicon wafers. Therefore, diamond wire cutting machines are generally used to cut silicon wafers.

[0003] When a diamond wire cutting machine is cutting, it usually cleans the debris by spraying cleaning fluid from the nozzle and cools the contact area between the diamond wire and the silicon wafer. However, most existing cooling methods involve connecting an external water pump to the nozzle and pumping external water into the nozzle before spraying it out. There is no circulation mechanism at the bottom, which wastes water resources.

[0004] In related technologies, the surface of the cut monocrystalline silicon wafer is cleaned by several spray heads. The cleaned liquid flows down the support plate with slots, carrying away the debris. The cleaned liquid is then filtered through a filter plate, achieving the circulation of the cleaning liquid. However, a large amount of debris is generated during the cutting process, and a lot of debris will gradually accumulate on the filter plate. This debris will clog the filter plate and affect the normal use of the device. Utility Model Content

[0005] The purpose of this invention is to provide a silicon wafer cutting device to solve the problems mentioned in the background art.

[0006] The technical solution adopted in this utility model is:

[0007] A silicon wafer dicing apparatus, comprising:

[0008] The frame is installed within a protective casing;

[0009] A wire winding spool is located at the top of the frame.

[0010] The tension wheel and guide wheel are rotatably connected to one side of the frame;

[0011] A cylinder is installed on the top of the protective housing, and the output end of the cylinder is fixedly connected to the frame.

[0012] The water pump is fixedly installed inside the protective housing;

[0013] A circulation component is provided at the bottom of the frame; the circulation component includes:

[0014] A storage mechanism, located below the frame, is used to store cleaning fluid;

[0015] A drive mechanism, located on one side of the protective housing, is used to feed the silicon wafer;

[0016] A support plate is installed on one side of the drive mechanism, and the support plate has a through groove inside;

[0017] The first slider is fixedly connected to the side of the support plate, and the first slider is disposed on the top of the storage mechanism;

[0018] The nozzle is fixedly connected to the top of the first slider, and the nozzle is connected to the outlet of the water pump through a hose;

[0019] The brush plate is fixedly installed at the bottom of the support plate;

[0020] A filter plate, located inside the storage mechanism, is used to filter the cleaning fluid.

[0021] Optionally, the storage mechanism includes:

[0022] The first water tank and the second water tank are fixedly installed inside the protective shell. The top of the first water tank is slidably connected to the support plate, and both the first water tank and the second water tank are located below the frame.

[0023] An inlet is provided between the first water tank and the second water tank to allow the filtered cleaning solution to flow from the first water tank into the interior of the second water tank.

[0024] Optionally, the width and height of the first water tank are both greater than those of the second water tank, and the inlet pipe of the water pump is inserted into the interior of the second water tank.

[0025] Optionally, the drive mechanism includes:

[0026] The motor is fixedly installed on one side of the protective housing, and the motor is electrically connected to an external power source;

[0027] A threaded sleeve is fixedly connected to the output end of the motor.

[0028] A threaded rod is threaded into the inside of the threaded sleeve, and one end of the threaded rod is fixedly connected to the support plate.

[0029] Optionally, it may also include an installation component for installing and removing the filter plate.

[0030] Optionally, the installation components include:

[0031] The second slider is slidably connected to the inside of one side of the filter plate;

[0032] A guide rod is fixedly connected inside the second slider, the guide rod is slidably connected to the second slider, and a spring is sleeved on the outside of the guide rod;

[0033] A handle is fixedly connected to one side of the guide rod, and the handle extends to the outside of the filter plate and is slidably connected to the filter plate;

[0034] A limiting plate is fixedly installed inside the storage mechanism, and the limiting plate is slidably connected to the filter plate.

[0035] Optionally, the bottom of the second slider extends below the filter plate, the protruding part is provided with a slope, and the interior of the storage mechanism is provided with a groove that matches the protruding part of the second slider.

[0036] Optionally, the first slider and the nozzle are a set, and multiple sets are provided on the side of the support plate.

[0037] Compared with the prior art, the beneficial effects of this utility model are:

[0038] The device is equipped with multiple sets of nozzles to directly rinse the cutting area. The cleaning fluid, carrying debris, flows into the first water tank through the support plate channel and is filtered by the filter plate. The filtered cleaning fluid flows into the second water tank through the inlet and is then pumped out for reuse, realizing the circulation of the cleaning fluid. At the same time, a brush plate is fixed at the bottom of the support plate. When the brush plate moves horizontally with the drive mechanism, its bottom automatically scrapes the surface of the filter plate to remove accumulated debris (such as silicon powder and crystal particles) in real time, reducing the clogging of the filter plate and ensuring the smooth circulation of the cleaning fluid as much as possible. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the overall structure in this application;

[0041] Figure 2 This is a schematic diagram of the structure of the loop component in this application;

[0042] Figure 3 This is a schematic diagram of the structure of the first and second water tanks in this application.

[0043] Figure 4 This is a schematic diagram of the drive mechanism and support plate in this application;

[0044] Figure 5 This is a schematic diagram of the filter plate in this application;

[0045] Figure 6 This is a schematic diagram of the structure of the mounting components in this application.

[0046] Figure label:

[0047] 1. Frame; 2. Winding spool; 3. Tensioner wheel; 4. Guide wheel; 5. Cylinder;

[0048] 6. Circulation component; 61. Storage mechanism; 611. First water tank; 612. Second water tank; 613. Inlet; 62. Drive mechanism; 621. Motor; 622. Threaded sleeve; 623. Threaded rod; 63. Support plate; 64. No. 1 slider; 65. No. 1 nozzle; 66. Brush plate; 67. Filter plate;

[0049] 7. Installation components; 71. Second slider; 72. Guide rod; 73. Handle; 74. Limit plate;

[0050] 8. Water pump; 9. Protective casing. Detailed Implementation

[0051] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and to simplify the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0052] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0053] In current related technologies, the surface of the cut monocrystalline silicon wafer is cleaned by several spray heads. The cleaned liquid flows down the support plate with grooves, carrying away the debris. The cleaned liquid is then filtered through a filter plate, achieving the circulation of the cleaning liquid. However, a large amount of debris is generated during the cutting process, and a lot of debris will gradually accumulate on the filter plate. This debris will clog the filter plate and affect the normal use of the device.

[0054] Combination Figures 1-6 This application provides an organic waste biological combined treatment device and a silicon wafer cutting device, comprising: a frame 1, which is installed in a protective shell 9; a wire winding spool 2, which is disposed on the top of the frame 1; a tension wheel 3 and a guide wheel 4, which are rotatably connected to one side of the frame 1; a cylinder 5, which is installed on the top of the protective shell 9, and the output end of the cylinder 5 is fixedly connected to the frame 1; a water pump 8, which is fixedly installed inside the protective shell 9; and a circulation component 6 is disposed below the frame 1; the circulation component 6 includes: a storage mechanism 61, which is disposed below the frame 1 for storing cleaning fluid; A drive mechanism 62 is located on one side of the protective housing 9 and is used to feed the silicon wafer; a support plate 63 is fixedly installed on one side of the drive mechanism 62, and the support plate 63 has multiple through slots inside; a first slider 64 is installed on the side of the support plate 63 and is located on the top of the storage mechanism 61; a nozzle 65 is fixedly connected to the top of the first slider 64 and is connected to the outlet of the water pump 8 through a hose; a brush plate 66 is fixedly installed on the bottom of the support plate 63; and a filter plate 67 is located inside the storage mechanism 61 and is used to filter the cleaning fluid.

[0055] In use, the stepper motor of the winding drum 2 (not shown in the figure) is started, and the stepper motor drives the winding drum 2 to rotate. The diamond wire is wound on the winding drum 2, two tensioning wheels 3 and two guide wheels 4. As the tensioning wheel 3 of the winding drum rotates, the diamond wire moves along the wire groove of the tensioning wheel 3 and the guide wheel 4, fixing the silicon wafer to the top of the support plate 63 by the clamp (the clamp is a cross clamp, and the sample block on which the silicon wafer is mounted is fixed by fastening screws, which is not shown in the figure and is existing technology, so it will not be described in detail here). The cylinder 5 is started to adjust the frame 1 downward, so that the diamond wire and the object being cut will grind and form a cut.

[0056] Furthermore, after the silicon wafer is fixed, the water pump 8 is started to extract the cleaning fluid from the second water tank 612. The extracted water passes through the outlet of the water pump 8 (the hose is set between the water pump 8 and the nozzle 65, not shown in the figure) and is sprayed out from the nozzle 65. The sprayed cleaning fluid carries the cutting debris from the silicon wafer and flows into the first water tank 611 through the groove on the support plate 63. The debris is filtered by the filter plate 67. The filtered cleaning fluid flows into the second water tank 612 through the port 613 and is then extracted by the water pump 8 to realize the circulation of the cleaning fluid.

[0057] Furthermore, during silicon wafer cutting, it is necessary not only to start the cylinder 5 to move the frame 1 for vertical cutting, but also to start the motor 621 to drive the threaded sleeve 622 to rotate. Since the threaded rod 623 is fixedly connected to the support plate 63, and the support plate 63 is slidably connected to the top of the first water tank 611, the support plate 63 and the threaded rod 623 will not rotate with the rotation of the threaded sleeve 622. Thus, the threaded action between the threaded sleeve 622 and the threaded rod 623 drives the threaded rod 623 and the support plate 63 to move in the same direction, thereby adjusting the position of the support plate 63 and the silicon wafer on top of the support plate 63, realizing silicon wafer feeding, changing the grinding direction of the diamond wire and the silicon wafer, thereby cutting the silicon wafer in the horizontal direction. The bottom of the brush plate 66 is in contact with the top of the filter plate 67. When the support plate 63 moves, the brush plate 66 will push the debris accumulated on the surface of the filter plate 67, making the filter plate 67 less likely to be blocked by the accumulated debris.

[0058] In some embodiments, the storage mechanism 61 includes: a first water tank 611 and a second water tank 612, which are fixedly installed inside the protective housing 9. The top of the first water tank 611 is slidably connected to the support plate 63, and both the first water tank 611 and the second water tank 612 are located below the frame 1; and a through-hole 613, which is opened between the first water tank 611 and the second water tank 612 for introducing the filtered cleaning liquid from the first water tank 611 into the interior of the second water tank 612.

[0059] After the cleaning solution is filtered by the filter plate 67, it flows into the second water tank 612 through the inlet 613. Then, the water pump 8 draws out the cleaning solution, which facilitates the recycling of the cleaning solution and saves the cleaning solution.

[0060] In some embodiments, the width and height of the first water tank 611 are both greater than those of the second water tank 612. The inlet pipe of the water pump 8 is inserted into the interior of the second water tank 612. Since the width and height of the first water tank 611 are both higher than those of the second water tank 612, and the moving range of the support plate 63 is all above the first water tank 611, it can be ensured as much as possible that the cleaning fluid with debris flowing down from the support plate 63 can fall into the interior of the first water tank 611. Moreover, the edge of the first water tank 611 can block the debris falling from the support plate 63 to a certain extent, reducing the probability of it falling into the interior of the second water tank 612.

[0061] In some embodiments, the drive mechanism 62 includes: a motor 621, which is fixedly installed on one side of the protective housing 9 and is electrically connected to an external power source; a threaded sleeve 622, which is fixedly connected to the output end of the motor 621; and a threaded rod 623, which is threadedly connected to the inside of the threaded sleeve 622 and one end of the threaded rod 623 is fixedly connected to the support plate 63, so as to change the moving direction of the support plate 63 by rotating the motor 621 in both directions, thereby changing the feeding direction of the silicon wafer.

[0062] In some embodiments, an installation component 7 is further included. The installation component 7 is used to install and remove the filter plate 67. The installation component 7 includes: a second slider 71, which is slidably connected to the inside of one side of the filter plate 67; a guide rod 72, which is fixedly connected to the inside of the second slider 71 and is slidably connected to the second slider 71, and a spring is sleeved on the outside of the guide rod 72; a handle 73, which is fixedly connected to one side of the guide rod 72 and extends to the outside of the filter plate 67 and is slidably connected to the filter plate 67; and a limiting plate 74, which is fixedly disposed inside the storage mechanism 61 and is slidably connected to the filter plate 67.

[0063] When a blockage occurs inside the filter plate 67, preventing the cleaning fluid from flowing properly and causing water leakage inside the protective housing 9, the filter plate 67 needs to be replaced. In this case, the operator holds handle 73 and lifts it upwards to remove the second slider 71 from inside the first water tank 611. Then, aligning the handle 73 with the limit plate 74, the operator pulls the handle 73 to remove the filter plate 67 from inside the first water tank 611, thus disassembling the filter plate 67. When installing a new filter plate 67, the two sides of the filter plate 67... When the side groove is aligned with the limiting plate 74 and inserted into the first water tank 611, the inclined surface at the bottom of the second slider 71 is first abutted by the edge of the first water tank 611, pushing the second slider 71 upward into the interior of the filter plate 67. At the same time, the spring outside the drive mechanism 62 is compressed. When the second slider 71 reaches the groove at the top of the first water tank 611, the second slider 71 is pushed downward into the groove at the top of the first water tank 611 by the spring, limiting the movement of the filter plate 67, thereby completing the installation of the filter plate 67, which is convenient and quick.

[0064] In some embodiments, the bottom of the second slider 71 extends below the filter plate 67, the protruding part is provided with a slope, and the interior of the storage mechanism 61 is provided with a groove that matches the protruding part of the second slider 71, so that the second slider 71 can be inserted into the groove to limit the filter plate 67.

[0065] In some embodiments, the first slider 64 and the nozzle 65 are a group, and multiple groups are provided on the side of the support plate 63 to increase the stability of the sliding of the support plate 63.

[0066] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A silicon wafer cutting device, characterized in that, include: The frame is installed within a protective casing; A wire winding spool is located at the top of the frame. The tension wheel and guide wheel are rotatably connected to one side of the frame; A cylinder is installed on the top of the protective housing, and the output end of the cylinder is fixedly connected to the frame. The water pump is fixedly installed inside the protective housing; A circulation component is provided at the bottom of the frame; the circulation component includes: A storage mechanism, located below the frame, is used to store cleaning fluid; A drive mechanism, located on one side of the protective housing, is used to feed the silicon wafer; A support plate is installed on one side of the drive mechanism, and the support plate has a through groove inside; The first slider is fixedly connected to the side of the support plate, and the first slider is disposed on the top of the storage mechanism; The nozzle is fixedly connected to the top of the first slider, and the nozzle is connected to the outlet of the water pump through a hose; The brush plate is fixedly installed at the bottom of the support plate; A filter plate, located inside the storage mechanism, is used to filter the cleaning solution.

2. The silicon wafer cutting device according to claim 1, characterized in that, The storage mechanism includes: The first water tank and the second water tank are fixedly installed inside the protective shell. The top of the first water tank is slidably connected to the support plate, and both the first water tank and the second water tank are located below the frame. An inlet is provided between the first water tank and the second water tank to allow the filtered cleaning solution to flow from the first water tank into the interior of the second water tank.

3. The silicon wafer cutting device according to claim 2, characterized in that: The width and height of the first water tank are both greater than those of the second water tank, and the inlet pipe of the water pump is inserted into the interior of the second water tank.

4. The silicon wafer cutting device according to claim 1, characterized in that, The drive mechanism includes: The motor is fixedly installed on one side of the protective housing, and the motor is electrically connected to an external power source; A threaded sleeve is fixedly connected to the output end of the motor. A threaded rod is threaded into the inside of the threaded sleeve, and one end of the threaded rod is fixedly connected to the support plate.

5. The silicon wafer cutting apparatus according to claim 1, characterized in that, It also includes an installation component for installing and removing the filter plate.

6. The silicon wafer cutting apparatus according to claim 5, characterized in that, The installation components include: The second slider is slidably connected to the inside of one side of the filter plate; A guide rod is fixedly connected inside the second slider, the guide rod is slidably connected to the second slider, and a spring is sleeved on the outside of the guide rod; A handle is fixedly connected to one side of the guide rod, and the handle extends to the outside of the filter plate and is slidably connected to the filter plate; A limiting plate is fixedly installed inside the storage mechanism, and the limiting plate is slidably connected to the filter plate.

7. The silicon wafer cutting apparatus according to claim 6, characterized in that, The bottom of the second slider extends to the bottom of the filter plate, and the protruding part is provided with a slope. The inside of the storage mechanism is provided with a groove that matches the protruding part of the second slider.

8. The silicon wafer cutting device according to claim 1, characterized in that: The first slider and the nozzle are a set, and multiple sets are provided on the side of the support plate.

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