High-precision solder paste printing structure for tin-planting net
By introducing an independently adjustable cylinder and vacuum pump system into the solder paste printing structure of the solder mesh, the problems of uneven solder paste printing and positional deviation in the existing device are solved, achieving high-precision solder paste application and leveling, and improving printing quality and efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- DONGGUAN CHANGSHAN PRECISION TECH CO LTD
- Filing Date
- 2025-07-18
- Publication Date
- 2026-06-05
AI Technical Summary
Existing solder paste printing equipment for solder mesh lacks a precise height adjustment mechanism, making it difficult to achieve high precision in solder paste application and leveling, resulting in uneven thickness and printing position deviations.
The system employs an operating platform with a first lifting cylinder and a second lifting cylinder, allowing for independent adjustment of the height of the coating cylinder and the leveling cylinder. Combined with a vacuum pump, replaceable coating strips, and detachable scrapers, it enables precise control of solder paste application and leveling operations.
It achieves high-precision solder paste printing, ensuring the uniformity and flatness of the solder paste, improving printing quality and efficiency, and reducing maintenance costs and time.
Smart Images

Figure CN224323720U_ABST