A fanless water-cooling heat dissipation device for a case

Abstract

The utility model discloses a kind of machine case fanless water-cooling heat sink, it is related to machine case water-cooling heat dissipation technical field, including machine case, the side surface of machine case is provided with data interface, the bottom surface of machine case is symmetrically provided with two first installation plates, the top surface of machine case is equipped with heat dissipation fin plate, and the other side of machine case is equipped with water-cooling heat dissipation component;The utility model is through the cooperation of upper heat dissipation fin and lower heat dissipation fin of water-cooling heat dissipation component, and the connecting boss and the cooperation of plug-in block, the splicing installation of upper heat dissipation fin and lower heat dissipation fin are facilitated, the assembly efficiency of water-cooling heat dissipation component is improved, and then the function of quick assembly water-cooling heat dissipation component can be realized, finally solve the existing machine case heat dissipation device There is still water cooling fan-assisted heat dissipation to cause noise to meet the problem such as silent demand, improve the efficiency, stability, convenience of machine case heat dissipation, realize the effect of fanless silent high-efficiency heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of chassis water cooling technology, and in particular to a fanless chassis water cooling device. Background Technology

[0002] In the field of electronic equipment, the heat dissipation performance of the chassis is crucial to the stable operation and lifespan of the equipment. With the rapid development of electronic technology, the integration of electronic components is constantly improving and the power density is increasing day by day. This has led to a significant increase in the heat generated inside the chassis, especially in some application scenarios with high heat dissipation requirements, such as high-performance servers and professional graphics workstations. Effective heat dissipation measures have become the key to ensuring the normal operation of the equipment.

[0003] Traditional computer case cooling methods mainly include air cooling and water cooling. Air cooling relies on fans to force convection and remove heat. While it can meet cooling needs to a certain extent, the fans generate considerable noise during operation. In noise-sensitive environments such as quiet offices and home theaters, this seriously affects the quietness of the work and living environment. Furthermore, fans have a limited lifespan, requiring regular maintenance and replacement, increasing operating costs. Over time, dust can accumulate, leading to decreased cooling efficiency and potentially causing equipment failure. Water cooling, as a relatively efficient cooling method, is gradually being widely adopted. However, many current water cooling devices still require fans for auxiliary cooling during operation. These fans accelerate airflow to help the heat dissipation components in the water cooling system dissipate heat more effectively, but this inevitably introduces noise problems, failing to meet users' stringent requirements for quiet operation. Especially in special applications with extremely high noise requirements, such as recording studios and medical testing equipment, existing water cooling devices are unsuitable due to fan noise. Therefore, improvements are needed to address these issues. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies by proposing a fanless water-cooled heat dissipation device for computer cases.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a fanless water-cooled heat dissipation device for a chassis, comprising a chassis, a data interface on one side of the chassis, two first mounting plates symmetrically arranged on both sides of the bottom surface of the chassis, a heat dissipation fin plate on the top surface of the chassis, and a water-cooled heat dissipation component on the other side of the chassis.

[0006] Preferably, the two first mounting plates are provided with mounting holes, and the first mounting plates are fixed to the bottom surface of the chassis with bolts. The top surface of the heat dissipation fin plate is provided with multiple bolts at equal intervals to be fixed to the top surface of the chassis.

[0007] Preferably, a PCB board is fixedly installed on the bottom surface of the chassis, and multiple fixing plates are symmetrically arranged on both sides of the PCB board. Fixing bolts are inserted through the fixing plates and the bottom surface of the chassis. Heat sinks are fixedly installed on the CPU of the PCB board.

[0008] Preferably, the water-cooled heat dissipation component includes upper heat dissipation fins and lower heat dissipation fins arranged symmetrically on both sides. The upper heat dissipation fins and lower heat dissipation fins are spliced ​​together to form a cylindrical shape. The upper heat dissipation fins are provided with connecting protrusions on both sides symmetrically, and the lower heat dissipation fins are provided with plug-in blocks corresponding to the connecting protrusions on both sides symmetrically.

[0009] Preferably, the upper end of the upper heat dissipation fin is fixedly provided with an upper fixing frame, and the lower end of the lower heat dissipation fin is fixedly provided with a lower fixing frame. The upper fixing frame and the lower fixing frame are spliced ​​together to form a square frame structure. One side of the upper fixing frame and the lower fixing frame is fixedly connected to the outer wall of the chassis, and a protrusion is provided at the splicing point on the other side of the upper fixing frame and the lower fixing frame. Fixing bolts are passed through the protrusions.

[0010] Preferably, a closed cover is threaded and suspended on one side of the upper and lower heat dissipation fins, and a small pump is inserted on the other side of the upper and lower heat dissipation fins. The small pump has inlet pipes and outlet pipes symmetrically arranged on both sides, and the ends of the inlet pipes and outlet pipes are connected to the heat dissipation fins. A serpentine tube is provided on the top surface of the small pump, and the serpentine tube is located inside the upper and lower heat dissipation fins.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: This utility model, through the symmetrical arrangement of upper and lower heat dissipation fins in the water-cooling heat dissipation assembly, and the cooperation of connecting protrusions and plug-in blocks, facilitates the splicing and installation of the upper and lower heat dissipation fins, improving the assembly efficiency of the water-cooling heat dissipation assembly and enabling rapid assembly. The cooperation between the upper and lower fixing frames, the outer wall of the chassis, and the fixing bolts facilitates the stable installation of the water-cooling heat dissipation assembly on the chassis, improving the installation stability and ensuring reliable operation. The cooperation between the upper and lower heat dissipation fins and the closing cover facilitates internal maintenance and repair of the water-cooling heat dissipation assembly, improving maintenance convenience. This design facilitates easy cleaning of internal impurities and component inspection. The combination of upper and lower heat dissipation fins with a small pump, inlet pipe, outlet pipe, and heat sinks allows for efficient coolant circulation within the water cooling system, improving heat removal efficiency and achieving high-efficiency cooling. Furthermore, the small pump and serpentine tubing further enhance coolant dissipation within the water cooling components, further reducing coolant temperature and ensuring continuous effective cooling. Ultimately, this design solves the problem of existing chassis cooling systems requiring fan assistance for water cooling, resulting in insufficient noise levels. It improves the efficiency, stability, and convenience of chassis cooling, achieving fanless, quiet, and efficient cooling. Attached Figure Description

[0012] The accompanying drawings, which are included to provide a further understanding of the present invention and form part of this application, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings:

[0013] Figure 1 This is a first-view schematic diagram of the overall structure proposed in this utility model;

[0014] Figure 2 This is a first-view schematic diagram of the overall cross-sectional structure proposed in this utility model;

[0015] Figure 3 This is a first-view schematic diagram of the overall cross-sectional structure of the water-cooled heat dissipation component proposed in this utility model.

[0016] Figure 4 This is a second-view schematic diagram of the overall cross-sectional structure of the water-cooled heat dissipation component proposed in this utility model.

[0017] The numbers in the diagram are: 1. Chassis; 2. Data interface; 3. First mounting plate; 4. Heat sink plate; 5. PCB board; 6. Upper heat sink fins; 7. Lower heat sink fins; 8. Upper fixing frame; 9. Lower fixing frame; 10. Closing cover; 11. Small pump; 12. Serpentine tube. Detailed Implementation

[0018] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0019] Example: See Figure 1-4This utility model discloses a fanless water-cooled heat dissipation device for a computer chassis, comprising a chassis 1. A data interface 2 is provided on one side of the chassis 1. Two first mounting plates 3 are symmetrically arranged on both sides of the bottom surface of the chassis 1. A heat dissipation fin plate 4 is provided on the top surface of the chassis 1. A water-cooling heat dissipation component is provided on the other side of the chassis 1. The chassis 1 provides a stable space for housing and protection of the entire device, while also supporting other components. The data interface 2 facilitates data exchange between the chassis 1 and external devices. The first mounting plates 3 provide connection positions for the installation of the chassis 1, ensuring that the chassis 1 can be stably placed in the appropriate position. The heat dissipation fin plate 4... This helps dissipate heat from inside the chassis 1, achieving initial heat dissipation and improving its heat dissipation performance. It prevents overheating from affecting the normal operation of electronic components inside the chassis 1. The water-cooling component is the core heat dissipation component of the entire device, providing a more efficient heat dissipation method for the chassis 1 and ensuring that the electronic components inside the chassis 1 operate at a suitable temperature. Two first mounting plates 3 have mounting holes, and bolts are used to fix the first mounting plates 3 to the bottom surface of the chassis 1. Multiple bolts are equidistantly arranged on the top periphery of the heat dissipation fin plate 4, fixing it to the top surface of the chassis 1. The mounting holes and bolts on the first mounting plates 3... The connection method makes the installation of chassis 1 more secure and reliable, improving the stability of chassis 1 installation and making it easier for users to install chassis 1 in the required position. This avoids the impact of chassis 1 shaking on the operation of internal components. The heat sink fin plate 4 is fixed to the top surface of chassis 1 by multiple bolts, ensuring a tight connection between the heat sink fin plate 4 and chassis 1. This ensures that heat can be effectively conducted from chassis 1 to heat sink fin plate 4, enhancing the heat dissipation effect and preventing heat accumulation due to loose connections. A PCB board 5 is fixedly installed on the bottom surface of chassis 1. Multiple fixing plates are symmetrically arranged on both sides of the PCB board 5, and the fixing plates are connected to the chassis fin plate 4. The bottom of the inner side of the enclosure 1 is fitted with fixing bolts, and a heat sink is fixed on the CPU of the PCB board 5. The installation position and fixing method of the PCB board 5 ensure its stability within the enclosure 1, enabling it to work normally and avoiding circuit failures caused by loosening of the PCB board 5. The cooperation between the fixing plate and the bolts enhances the installation firmness of the PCB board 5, ensuring its stable operation. The heat sink on the CPU of the PCB board 5 can quickly absorb the heat generated by the CPU, preventing the CPU from overheating and causing performance degradation, thus improving the working stability and reliability of the CPU and ensuring the normal operation of the entire electronic device.

[0020] In this utility model, the water-cooled heat dissipation component includes upper heat dissipation fins 6 and lower heat dissipation fins 7 arranged symmetrically from left to right. The upper and lower heat dissipation fins 6 and 7 are joined together to form a cylindrical shape. Connecting protrusions are symmetrically arranged on both sides of the upper heat dissipation fins 6, and corresponding insertion blocks are symmetrically arranged on both sides of the lower heat dissipation fins 7. The symmetrical arrangement and joining method of the upper and lower heat dissipation fins 6 and 7 facilitates the assembly of the water-cooled heat dissipation component. The cylindrical shape increases the heat dissipation area and improves heat dissipation efficiency. The cooperation of the connecting protrusions and insertion blocks ensures a tight connection between the upper and lower heat dissipation fins 6 and 7, guaranteeing the structural integrity of the water-cooled heat dissipation component and preventing insufficient heat dissipation due to weak joining. The stable structure of the water-cooling heat dissipation component ensures efficient heat dissipation. An upper fixing frame 8 is fixed to the upper end of the upper heat dissipation fin 6, and a lower fixing frame 9 is fixed to the lower end of the lower heat dissipation fin 7. The upper fixing frame 8 and lower fixing frame 9 are joined together to form a square frame structure. One side of the upper fixing frame 8 and lower fixing frame 9 is fixed to the outer wall of the chassis 1, and protrusions extend from the joint on the other side of the upper fixing frame 8 and lower fixing frame 9. Fixing bolts pass through the protrusions. The upper fixing frame 8 and lower fixing frame 9 not only help to fix the upper heat dissipation fin 6 and lower heat dissipation fin 7 together, but also provide a connection structure between the water-cooling heat dissipation component and the chassis 1. By assembling them into a square frame structure, the overall installation and layout of the water-cooling heat dissipation component are facilitated. This enhances structural stability. The secure connection to the outer wall of the chassis 1 and the use of fixing bolts further strengthen the installation of the water-cooling heat dissipation components on the chassis 1, ensuring a stable installation and preventing displacement of the components due to vibration or other factors during use. This guarantees the stability and reliability of the heat dissipation process. A closed cover 10 is threaded onto one side of the upper heat dissipation fin 6 and the lower heat dissipation fin 7. A small pump 11 is inserted into the other side of the upper heat dissipation fin 6 and the lower heat dissipation fin 7. The small pump 11 has symmetrical inlet and outlet pipes on both sides, with the ends of the inlet and outlet pipes connected to the heat dissipation fins. A serpentine tube 12 is located on the top surface of the small pump 11, positioned on the upper heat dissipation fin. The closed cover 10 inside the upper and lower heat dissipation fins 6 and 7 facilitates maintenance and repair. The threaded suspension makes it easy to open and close, improving the convenience of maintenance operations. The small pump 11 and its inlet and outlet pipes form a coolant circulation system, which is connected to the heat dissipation fins to ensure that the coolant can effectively remove heat and improve the heat dissipation efficiency. The serpentine tube 12 increases the contact area between the coolant and the upper and lower heat dissipation fins 6 and 7, allowing the coolant to better exchange heat when flowing through, further improving the heat dissipation performance of the water cooling heat dissipation components, ensuring that the temperature inside the chassis 1 can be effectively controlled, and enabling the electronic components inside the chassis 1 to work stably at a suitable temperature.

[0021] Working Principle: When this utility model is used, the heat generated by the fanless water cooling device of the chassis 1 is initially dissipated by the electronic components and the CPU on the PCB board 5 inside the chassis 1 through the chassis 1 to the top heat sink fin plate 4 and the CPU heat sink. In the water cooling component, the small pump 11 draws coolant into the pipe connected to the CPU heat sink through the inlet pipe. After absorbing heat, it flows back through the outlet pipe and is pumped into the serpentine tube 12 inside the upper heat sink fin 6 and the lower heat sink fin 7. In the serpentine tube 12, the coolant exchanges heat with the upper heat sink fin 6 and the lower heat sink fin 7, and the heat is dissipated into the air. The closed cover 10 on one side of the upper heat sink fin 6 and the lower heat sink fin 7 can be used for maintenance and repair to ensure smooth circulation. The chassis 1 is fixed by the first mounting plate 3 on the bottom surface. The water cooling component is fixed to the chassis 1 by the upper fixing frame 8 and the lower fixing frame 9 to ensure the stability of the device. The data interface 2 on the side of the chassis 1 can transmit data normally. In this way, the components work together to effectively dissipate heat, ensure the stable operation of the components, and avoid fan noise.

[0022] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A fanless water-cooled heat dissipation device for computer cases, comprising a computer case (1), characterized in that: A data interface (2) is provided on one side of the chassis (1), two first mounting plates (3) are symmetrically provided on both sides of the bottom surface of the chassis (1), a heat dissipation fin plate (4) is provided on the top surface of the chassis (1), and a water cooling heat dissipation component is provided on the other side of the chassis (1).

2. The fanless water-cooled heat dissipation device for a computer chassis according to claim 1, characterized in that: The first mounting plates (3) are provided with mounting holes. The first mounting plates (3) are fixed to the bottom surface of the chassis (1) with bolts. The top surface of the heat dissipation fin plate (4) is provided with multiple bolts at equal intervals to the top surface of the chassis (1).

3. The fanless water-cooling heat dissipation device for a computer chassis according to claim 2, characterized in that: A PCB board (5) is fixedly installed on the bottom surface of the chassis (1). Multiple fixing plates are symmetrically arranged on both sides of the PCB board (5). Fixing bolts are inserted through the fixing plates and the bottom surface of the chassis (1). Heat sinks are fixed on the CPU of the PCB board (5).

4. The fanless water-cooled heat dissipation device for a computer chassis according to claim 3, characterized in that: The water-cooled heat dissipation component includes an upper heat dissipation fin (6) and a lower heat dissipation fin (7) arranged symmetrically on the left and right sides. The upper heat dissipation fin (6) and the lower heat dissipation fin (7) are spliced ​​together to form a cylindrical shape. The upper heat dissipation fin (6) has symmetrical connecting protrusions on both sides, and the lower heat dissipation fin (7) has symmetrical plug-in blocks corresponding to the connecting protrusions on both sides.

5. A fanless water-cooled heat dissipation device for a computer chassis according to claim 4, characterized in that: The upper end of the upper heat dissipation fin (6) is fixedly provided with an upper fixing frame (8), and the lower end of the lower heat dissipation fin (7) is fixedly provided with a lower fixing frame (9). The upper fixing frame (8) and the lower fixing frame (9) are spliced ​​together to form a square frame structure. One side of the upper fixing frame (8) and the lower fixing frame (9) is fixedly connected to the outer wall of the chassis (1). The other side of the upper fixing frame (8) and the lower fixing frame (9) is provided with a protrusion at the splice point, and a fixing bolt is passed through the protrusion.

6. The fanless water-cooling heat dissipation device for a computer chassis according to claim 5, characterized in that: A closed cover (10) is threaded and suspended on one side of the upper heat dissipation fin (6) and the lower heat dissipation fin (7). A small pump (11) is inserted on the other side of the upper heat dissipation fin (6) and the lower heat dissipation fin (7). An inlet pipe and an outlet pipe are symmetrically arranged on both sides of the small pump (11). The ends of the inlet pipe and the outlet pipe are connected to the heat dissipation fin. A serpentine tube (12) is provided on the top surface of the small pump (11). The serpentine tube (12) is located inside the upper heat dissipation fin (6) and the lower heat dissipation fin (7).

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