Power distribution cabinet

Abstract

The utility model discloses a power distribution cabinet, including the cabinet body, power distribution mounting panel, semiconductor refrigeration device, temperature sensor and controller, power distribution mounting panel is located in the cabinet body, and power distribution mounting panel divides the cabinet body in and separates into power distribution cavity and heat dissipation cavity, the first mounting surface and the second mounting surface of cooperation in its thickness direction are opposite to the accessory mounting panel, and the first mounting surface is used to install power distribution device, and semiconductor refrigeration device is located on the second mounting surface of power distribution mounting panel, and the semiconductor refrigeration device has cold end face and hot end face, and the cold end face of semiconductor refrigeration device is inlaid with power distribution mounting panel, temperature sensor is located on the first mounting surface of power distribution mounting panel, and temperature sensor is used to gather the temperature data in power distribution cavity, controller is connected with temperature sensor to receive the temperature data in power distribution cavity that temperature sensor gathered, and controller is connected with semiconductor refrigeration device, and the power distribution cabinet of utility model embodiment has good heat dissipation performance.

Description

Technical Field

[0001] This utility model belongs to the field of power distribution technology, and specifically relates to a power distribution cabinet. Background Technology

[0002] In modern power systems, distribution cabinets occupy a critical position at the end of the power distribution system and are widely used in various locations such as industrial plants, office buildings, and residential communities. Their role is crucial; they precisely protect, monitor, and control various loads, ensuring the stability and security of the power supply.

[0003] Inside the distribution cabinet, numerous equipment components work together. For example, high-power transformers continuously generate considerable heat during voltage conversion due to electromagnetic conversion and winding resistance; contactors, which open and close frequently, also generate heat due to contact resistance at the moment of switching on and off. If the heat generated by these components cannot be dissipated in time, it will accumulate continuously in the relatively enclosed space of the distribution cabinet. Once the temperature of the distribution cabinet becomes too high, serious hazards will follow.

[0004] For power distribution components, high temperatures accelerate the aging process of materials. For example, the electrolyte in capacitors is prone to drying out at high temperatures, causing the capacitor's performance to decline or even fail; insulating materials will become brittle and crack when exposed to heat for a long time, losing their proper insulating and protective function and greatly shortening the service life of the components.

[0005] From the perspective of normal component operation, high temperature can interfere with the electrical performance of electronic components, causing deviations in signal transmission, malfunctions in some precision control circuits, and affecting the normal operation of the entire power distribution system.

[0006] Even more seriously, when the temperature rises to a certain level and reaches the ignition point of certain flammable materials, it is very likely to cause a fire. Once the fire spreads, it will cause incalculable damage to the surrounding power facilities, equipment and personnel safety, and may even cause a large-scale power outage, affecting the normal operation of society. Utility Model Content

[0007] This utility model aims to at least partially solve one of the technical problems in the related art.

[0008] Therefore, an embodiment of this utility model proposes a power distribution cabinet.

[0009] The power distribution cabinet of this utility model embodiment includes:

[0010] Cabinet;

[0011] A power distribution mounting plate is disposed inside the cabinet, and the power distribution mounting plate divides the cabinet into a power distribution cavity and a heat dissipation cavity; the power distribution mounting plate has a first mounting surface and a second mounting surface that cooperate with each other in its thickness direction, the first mounting surface is used to mount power distribution devices, the first mounting surface faces the power distribution cavity, and the second mounting surface faces the heat dissipation cavity.

[0012] A semiconductor cooling device is disposed on the second mounting surface of the power distribution mounting plate. The semiconductor cooling device has a cold end face and a hot end face, and the cold end face of the semiconductor cooling device is in contact with the power distribution mounting plate.

[0013] A temperature sensor is disposed on the first mounting surface of the power distribution mounting plate, and the temperature sensor is used to collect temperature data inside the power distribution cavity;

[0014] A controller is connected to the temperature sensor to receive temperature data collected by the temperature sensor within the power distribution cavity. The controller is also connected to the semiconductor cooling device to control the semiconductor cooling device based on the relationship between the temperature data collected by the temperature sensor within the power distribution cavity and a first preset temperature value.

[0015] Therefore, the power distribution cabinet of this utility model embodiment can dissipate heat in the heat dissipation cavity by setting a semiconductor cooling device, so that the power distribution devices installed on the power distribution mounting plate can always work at a suitable temperature, which can avoid the temperature in the heat dissipation cavity from being too high, and thus avoid the temperature of the power distribution cabinet from being too high, greatly improving the heat dissipation performance of the power distribution cabinet.

[0016] The power distribution cabinet of this embodiment further includes a heat dissipation component disposed on the hot end face of the semiconductor cooling device, the heat dissipation component including a heat sink and heat dissipation fins.

[0017] The heat sink has a first heat-conducting surface and a second heat-conducting surface disposed opposite to each other in its thickness direction. The first heat-conducting surface is in contact with the hot end face of the semiconductor cooling device, and the heat dissipation fins are disposed on the second heat-conducting surface.

[0018] In some embodiments, there are multiple heat dissipation fins, which are spaced apart in the vertical direction.

[0019] In some embodiments, the portion of the cabinet corresponding to the heat dissipation cavity is provided with a first heat dissipation air inlet and a first heat dissipation air outlet;

[0020] There are two first heat dissipation air inlets, which are respectively located on the left and right sides of the cabinet.

[0021] The first heat dissipation vent is a single vent, and the single first heat dissipation vent is located on the rear side of the cabinet.

[0022] The power distribution cabinet of this utility model embodiment also includes a first cooling fan, which is disposed in the heat dissipation cavity and at the first heat dissipation outlet.

[0023] The controller is connected to the first cooling fan to control the first cooling fan based on the relationship between the temperature data collected by the temperature sensor in the power distribution cavity and the second preset temperature value.

[0024] The second preset temperature value is greater than the first preset temperature value.

[0025] In some embodiments, both the first heat dissipation air inlet and the first heat dissipation air outlet are provided with a first filter.

[0026] In some embodiments, the portion of the cabinet corresponding to the power distribution cavity is provided with a second heat dissipation air inlet and a second heat dissipation air outlet;

[0027] The second heat dissipation air inlet is a single one, and the single second heat dissipation air inlet is located on the left side of the cabinet;

[0028] The second heat dissipation vent is a single vent, and the single second heat dissipation vent is located on the right side of the cabinet.

[0029] The power distribution cabinet of this utility model embodiment also includes a second cooling fan, which is disposed in the heat dissipation cavity and at the second heat dissipation outlet.

[0030] The controller is connected to the second cooling fan to control the second cooling fan based on the relationship between the temperature data collected by the temperature sensor in the power distribution cavity and the third preset temperature value.

[0031] The third preset temperature value is greater than the second preset temperature value.

[0032] In some embodiments, both the first heat dissipation air inlet and the first heat dissipation air outlet are provided with a second filter.

[0033] In some embodiments, the power distribution cabinet of this utility model further includes a display screen, which is disposed on the cabinet and connected to the controller to display the temperature data of the power distribution cavity collected by the temperature sensor. Attached Figure Description

[0034] Figure 1 This is one of the structural schematic diagrams of the power distribution cabinet according to an embodiment of this utility model;

[0035] Figure 2 This is the second schematic diagram of the power distribution cabinet according to an embodiment of this utility model;

[0036] Figure 3 This is a schematic diagram of the internal structure of the power distribution cabinet according to an embodiment of the present utility model;

[0037] Figure 4 This is a flow control diagram of the power distribution cabinet according to an embodiment of this utility model.

[0038] Icon labels:

[0039] 1. Cabinet; 2. Power distribution mounting plate; 21. First mounting surface; 22. Second mounting surface; 3. Semiconductor cooling device; 31. Cold end face; 32. Hot end face; 4. Temperature sensor; 5. Controller; 6. Heat sink; 61. Heat sink plate; 611. First heat conduction surface; 612. Second heat conduction surface; 62. Heat sink fins; 7. First heat dissipation air inlet; 8. First heat dissipation air outlet; 9. First cooling fan; 10. First filter; 11. Second heat dissipation air inlet; 12. Second heat dissipation air outlet; 13. Second filter; 14. Display screen; 15. Power distribution cavity; 16. Heat dissipation cavity; 17. Second cooling fan. Detailed Implementation

[0040] The embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0041] The following is in conjunction with the appendix Figure 1-4 This invention describes a power distribution cabinet according to an embodiment of the present invention.

[0042] The power distribution cabinet of this utility model embodiment includes a cabinet body 1, a power distribution mounting plate 2, a semiconductor refrigeration device 3, a temperature sensor 4, and a controller 5.

[0043] like Figure 1 As shown, cabinet 1 has a rectangular box structure, which has front-back, left-right and up-down directions.

[0044] The power distribution mounting plate 2 is located inside the cabinet 1. The power distribution mounting plate 2 is perpendicular to the front and back direction of the cabinet 1. The power distribution mounting plate 2 divides the cabinet 1 into a power distribution cavity 15 and a heat dissipation cavity 16. The accessory mounting plate has a first mounting surface 21 and a second mounting surface 22 that are opposite to each other in the thickness direction. The first mounting surface 21 is used to install power distribution devices. The first mounting surface 21 faces the power distribution cavity 15, and the second mounting surface 22 faces the heat dissipation cavity 16. That is to say, the front side is the power distribution cavity 15, and the rear side is the heat dissipation cavity 16.

[0045] It is understandable that, in order to quickly transfer the heat generated by the power distribution components to the heat dissipation cavity 16, the power distribution mounting plate 2 should be made of a material with good thermal conductivity.

[0046] The semiconductor cooling device 3 is disposed on the second mounting surface 22 of the power distribution mounting plate 2, that is, the semiconductor cooling device 3 is located in the heat dissipation cavity 16. The semiconductor cooling device 3 has a cold end surface 31 and a hot end surface 32, and the cold end surface 31 of the semiconductor cooling device 3 is in contact with the power distribution mounting plate 2.

[0047] It is understandable that, in order to enable the power distribution mounting plate 2 to better transfer heat to the cold end face 31 of the semiconductor cooling device 3, thermal grease may be applied between the second mounting surface 22 of the power distribution mounting plate 2 and the cold end face 31 of the semiconductor cooling device 3.

[0048] Temperature sensor 4 is located on the first mounting surface 21 of the power distribution mounting plate 2. Temperature sensor 4 is used to collect temperature data inside the power distribution cavity 15.

[0049] The controller 5 is connected to the temperature sensor 4 to receive the temperature data collected by the temperature sensor 4 inside the power distribution cavity 15. The controller 5 is also connected to the semiconductor cooling device 3 to control the semiconductor cooling device 3 according to the relationship between the temperature data collected by the temperature sensor 4 inside the power distribution cavity 15 and the first preset temperature value.

[0050] Optionally, the controller 5 may be an electronic device such as a microprocessor, PLC, or CPU that can receive data, send data, receive instructions, send instructions, and process data.

[0051] When the temperature data collected by the temperature sensor 4 exceeds the first preset temperature value, the controller 5 controls the semiconductor cooling device 3 to start cooling; when the temperature is lower than the first preset temperature value, the controller 5 controls the semiconductor cooling device 3 to stop working. It can start cooling when heat dissipation is needed and stop cooling when heat dissipation is not needed, which can reduce the energy consumption of the semiconductor cooling device 3.

[0052] Therefore, by setting up a semiconductor cooling device 3, the power distribution cabinet of this utility model embodiment can dissipate heat in the heat dissipation cavity 16, so that the power distribution devices installed on the power distribution mounting plate 2 can always work at a suitable temperature, and the temperature in the heat dissipation cavity 16 can be avoided from being too high.

[0053] In some embodiments, the power distribution cabinet of this utility model further includes a heat sink 6 disposed on the hot end face 32 of the semiconductor cooling device 3. The heat sink 6 includes a heat sink plate 61 and heat sink fins 62. The heat sink plate 61 has a first heat-conducting surface 611 and a second heat-conducting surface 612 disposed opposite to each other in its thickness direction. The first heat-conducting surface 611 is in contact with the hot end face 32 of the semiconductor cooling device 3, and the heat sink fins 62 are disposed on the second heat-conducting surface 612.

[0054] Furthermore, there are multiple heat dissipation fins 62, which are spaced apart in the vertical direction.

[0055] The heat sink 61 is made of a metal material with high thermal conductivity, which can quickly transfer the heat generated by the hot end face 32 of the semiconductor cooling device 3 to the heat sink 62. At the same time, the heat sink 62 greatly increases the heat dissipation area and improves the heat dissipation efficiency. It can also further reduce the temperature of the hot end face 32 of the semiconductor cooling device 3, thereby improving the cooling efficiency of the semiconductor cooling device 3.

[0056] In some embodiments, the portion of the cabinet 1 corresponding to the heat dissipation cavity 16 is provided with a first heat dissipation air inlet 7 and a first heat dissipation air outlet 8; there are two first heat dissipation air inlets 7, which are respectively located on the left and right sides of the cabinet 1; there is a single first heat dissipation air outlet 8, which is located on the rear side of the cabinet 1. This layout design allows air to form good convection within the heat dissipation cavity 16, improving the heat dissipation effect.

[0057] Furthermore, the power distribution cabinet in this embodiment of the present invention also includes a first cooling fan 9, which is disposed in the heat dissipation cavity 16 and at the first heat dissipation outlet 8; such a layout design enables air to form good convection in the heat dissipation cavity 16, further improving the heat dissipation effect.

[0058] Meanwhile, the controller 5 is connected to the cooling fan to control the first cooling fan 9 based on the relationship between the temperature data collected by the temperature sensor 4 in the power distribution cavity 15 and the second preset temperature value; the second preset temperature value is greater than the first preset temperature value.

[0059] When the temperature data collected by the temperature sensor 4 exceeds the second preset temperature value, the controller 5 controls the first cooling fan 9 to start and begin cooling; when the temperature is lower than the second preset temperature value, the controller 5 controls the first cooling fan 9 to stop working.

[0060] In other words, when the temperature inside the power distribution cavity 15 is higher than the second preset temperature value, the controller 5 controls the first cooling fan 9 and the semiconductor cooling device 3 to work simultaneously, which can further and more quickly dissipate heat from the power distribution cavity 15.

[0061] Furthermore, both the first heat dissipation air inlet 7 and the first heat dissipation air outlet 8 are equipped with a first filter screen 10. The first filter screen 10 can effectively filter dust and impurities in the air and prevent them from entering the heat dissipation cavity 16 of the power distribution cabinet and affecting the normal operation of related equipment.

[0062] In some embodiments, the portion of the cabinet 1 corresponding to the electrical distribution cavity 15 is provided with a second heat dissipation air inlet 11 and a second heat dissipation air outlet 12; the second heat dissipation air inlet 11 is a single one, and the single second heat dissipation air inlet 11 is located on the left side of the cabinet 1; the second heat dissipation air outlet 12 is a single one, and the single second heat dissipation air outlet 12 is located on the right side of the cabinet 1. This layout design allows air to form good convection within the heat dissipation cavity 16, further improving the heat dissipation effect.

[0063] Furthermore, the power distribution cabinet of this utility model embodiment also includes a second cooling fan 17, which is disposed in the heat dissipation cavity 16 and at the second heat dissipation outlet 12; the controller 5 is connected to the second cooling fan 17 to control the second cooling fan 17 according to the relationship between the temperature data in the power distribution cavity 15 collected by the temperature sensor 4 and the third temperature preset value; the third temperature preset value is greater than the second temperature preset value.

[0064] When the temperature data collected by the temperature sensor 4 exceeds the third preset temperature value, the controller 5 controls the first cooling fan 9 to start and begin heat dissipation; when the temperature is lower than the third preset temperature value, the controller 5 controls the first cooling fan 9 to stop working.

[0065] In other words, when the temperature inside the power distribution cavity 15 is higher than the second preset temperature value, the controller 5 controls the second cooling fan 17, the first cooling fan 9 and the semiconductor cooling device 3 to work simultaneously, which can further and more quickly dissipate heat from the power distribution cavity 15.

[0066] In some embodiments, both the first heat dissipation air inlet 7 and the first heat dissipation air outlet 8 are provided with a second filter 13.

[0067] In some embodiments, the power distribution cabinet of this utility model further includes a display screen 14, which is disposed on the front end face of the cabinet 1. The display screen 14 is connected to the controller 5 to display the temperature data in the power distribution cavity 15 collected by the temperature sensor 4, so as to facilitate the staff to observe the temperature data in the power distribution cabinet.

[0068] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0069] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0070] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0071] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0072] In this utility model, the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of this utility model. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0073] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A power distribution cabinet, characterized in that, include: Cabinet (1); A power distribution mounting plate (2) is disposed inside the cabinet (1). The power distribution mounting plate (2) divides the cabinet (1) into a power distribution cavity (15) and a heat dissipation cavity (16). The power distribution mounting plate (2) has a first mounting surface (21) and a second mounting surface (22) that are opposite to each other in its thickness direction. The first mounting surface (21) is used to mount power distribution devices. The first mounting surface (21) faces the power distribution cavity (15), and the second mounting surface (22) faces the heat dissipation cavity (16). A semiconductor cooling device (3) is disposed on the second mounting surface (22) of the power distribution mounting plate (2). The semiconductor cooling device (3) has a cold end surface (31) and a hot end surface (32). The cold end surface (31) of the semiconductor cooling device (3) is in contact with the power distribution mounting plate (2). Temperature sensor (4), the temperature sensor (4) is disposed on the first mounting surface (21) of the power distribution mounting plate (2), the temperature sensor (4) is used to collect temperature data in the power distribution cavity (15); The controller (5) is connected to the temperature sensor (4) to receive the temperature data in the power distribution cavity (15) collected by the temperature sensor (4). The controller (5) is connected to the semiconductor cooling device (3) to control the semiconductor cooling device (3) according to the relationship between the temperature data in the power distribution cavity (15) collected by the temperature sensor (4) and the first temperature preset value.

2. The power distribution cabinet according to claim 1, characterized in that, It also includes a heat sink (6) disposed on the hot end face (32) of the semiconductor cooling device (3), the heat sink (6) including a heat sink plate (61) and heat sink fins (62). The heat sink (61) has a first heat-conducting surface (611) and a second heat-conducting surface (612) disposed opposite to each other in its thickness direction. The first heat-conducting surface (611) is in contact with the hot end surface (32) of the semiconductor cooling device (3), and the heat sink fins (62) are disposed on the second heat-conducting surface (612).

3. The power distribution cabinet according to claim 2, characterized in that, There are multiple heat dissipation fins (62), and the multiple heat dissipation fins (62) are spaced apart in the vertical direction.

4. The power distribution cabinet according to claim 2, characterized in that, The cabinet (1) is provided with a first heat dissipation air inlet (7) and a first heat dissipation air outlet (8) in the part corresponding to the heat dissipation cavity (16). There are two first heat dissipation air inlets (7), which are respectively located on the left and right sides of the cabinet (1); The first heat dissipation vent (8) is a single one, and the single first heat dissipation vent (8) is located on the rear side of the cabinet (1).

5. The power distribution cabinet according to claim 4, characterized in that, It also includes a first cooling fan (9), which is located inside the heat dissipation cavity (16) and at the first heat dissipation outlet (8); The controller (5) is connected to the first cooling fan (9) to control the first cooling fan (9) according to the relationship between the temperature data in the power distribution cavity (15) collected by the temperature sensor (4) and the second temperature preset value. The second preset temperature value is greater than the first preset temperature value.

6. The power distribution cabinet according to claim 4, characterized in that, Both the first heat dissipation air inlet (7) and the first heat dissipation air outlet (8) are provided with a first filter screen (10).

7. The power distribution cabinet according to claim 5, characterized in that, The cabinet (1) is provided with a second heat dissipation air inlet (11) and a second heat dissipation air outlet (12) in the part corresponding to the power distribution cavity (15). The second heat dissipation air inlet (11) is a single one, and the single second heat dissipation air inlet (11) is located on the left side of the cabinet (1); The second heat dissipation vent (12) is a single one, and the single second heat dissipation vent (12) is located on the right side of the cabinet (1).

8. The power distribution cabinet according to claim 7, characterized in that, It also includes a second cooling fan (17), which is located inside the heat dissipation cavity (16) and at the second heat dissipation outlet (12); The controller (5) is connected to the second cooling fan (17) to control the second cooling fan (17) according to the relationship between the temperature data in the power distribution cavity (15) collected by the temperature sensor (4) and the third temperature preset value. The third preset temperature value is greater than the second preset temperature value.

9. The power distribution cabinet according to claim 8, characterized in that, Both the first heat dissipation air inlet (7) and the first heat dissipation air outlet (8) are equipped with a second filter (13).

10. The power distribution cabinet according to claim 1, characterized in that, It also includes a display screen (14), which is located on the cabinet (1) and connected to the controller (5) to display the temperature data in the power distribution cavity (15) collected by the temperature sensor (4).

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