5G mobile phone body structure with heat dissipation channel

Abstract

The utility model belongs to the technical field of cell -phone body structure, especially has a heat dissipation channel's 5G cell -phone body structure, including the back cover main part still includes the heat conduction mechanism, the heat conduction mechanism is fixed in the inner wall of back cover main part, and the heat conduction mechanism includes: metal heat conduction board, metal heat conduction board is fixed in the inner wall of back cover main part, and in the metal heat conduction board processing has multiple along its length direction equidistantly distributed micro -channel, in the side of back cover main part processing has with micro -channel communicates one breathable micropore, in the utility model, through setting the heat conduction mechanism, metal heat conduction board adopts the copper board with micro -channel structure, micro -channel structure can prevent sundries invasion cell -phone on one side, on the other side, micro -channel structure has higher heat dissipation area, can make the heat of the heat -generating element in cell -phone core fastly lead out, has better heat dissipation performance, in addition, micro -channel structure has smaller volume, will not occupy more cell -phone inside space.

Description

Technical Field

[0001] This utility model belongs to the field of mobile phone body structure technology, specifically relating to a 5G mobile phone body structure with heat dissipation channels. Background Technology

[0002] The structure of a mobile phone can generally be divided into two main parts: the external structure and the internal structure. The external structure includes the screen, frame, and back cover, while the internal structure includes the motherboard, battery, camera module, display assembly, heat dissipation module, and mid-frame.

[0003] In actual use, although the phone has a built-in heat dissipation module, it still generates a lot of heat when users play large games or use large software, which leads to a decrease in the phone's performance.

[0004] A search revealed that in the prior art, Chinese utility model patent with authorization announcement number CN221487769U discloses "a mobile phone back cover with good heat dissipation effect", which includes: a back cover body, a first sliding cover and a second sliding cover. A groove is formed in the middle of the lower side of the back cover body, and through grooves are formed at equal intervals at the upper end of the groove. Sliding grooves are formed in the middle of both sides of the groove. Sliding posts are welded to the middle of both sides of one end of the first sliding cover and the second sliding cover.

[0005] While existing mobile phone back covers, including those mentioned above, offer improved heat dissipation efficiency compared to traditional phone bodies, in actual use, opening the two sliding covers creates large channels. Although this helps with heat dissipation, external dust and other foreign objects can easily pass through these channels and enter the phone, affecting its safety.

[0006] To address the aforementioned issues, this utility model proposes a 5G mobile phone body structure with a heat dissipation channel. Utility Model Content

[0007] To address the aforementioned problems in the existing technology, this utility model provides a 5G mobile phone body structure with a heat dissipation channel, which is convenient to use and has high safety performance.

[0008] To achieve the above objectives, this utility model provides the following technical solution: a 5G mobile phone body structure with a heat dissipation channel, including a back cover body and a heat conduction mechanism, wherein the heat conduction mechanism is fixed to the inner wall of the back cover body, and the heat conduction mechanism includes:

[0009] A metal heat-conducting plate is fixed to the inner wall of the back cover body, and multiple microchannels are processed in the metal heat-conducting plate at equal intervals along its length direction. A first-level ventilating microhole communicating with the microchannels is processed on the side of the back cover body.

[0010] As a preferred embodiment of this utility model, the metal heat-conducting plate is a copper plate with a thickness of 0.1mm-0.3mm.

[0011] As a preferred embodiment of this utility model, the microchannel is a rectangular hole with a side length of 0.08mm-0.28mm.

[0012] As a preferred embodiment of this utility model, the heat-conducting mechanism further includes:

[0013] An upper graphene heat dissipation film is bonded and fixed to the top surface of the metal heat-conducting plate.

[0014] As a preferred embodiment of this utility model, the heat-conducting mechanism further includes:

[0015] The lower graphene heat dissipation film is bonded and fixed to the bottom surface of the metal heat-conducting plate and to the interior of the rear cover body.

[0016] In a preferred embodiment of this invention, the upper graphene heat dissipation film and the lower graphene heat dissipation film have the same thickness, both ranging from 2μm to 20μm.

[0017] As a preferred technical solution of this utility model, it also includes:

[0018] The dustproof sheet has two ventilation micro-holes machined on it, and through grooves are machined on both sides of the back cover body. The dustproof sheet is fixed to the side of the back cover body at the position corresponding to the through groove.

[0019] As a preferred embodiment of this utility model, a fixing hole is also processed on the dustproof sheet, and a reserved threaded hole corresponding to the fixing hole is processed on the back cover body. The dustproof sheet is fixed to the side of the back cover body with screws.

[0020] Compared with the prior art, the beneficial effects of this utility model are:

[0021] In this invention, the heat-conducting mechanism is designed so that the metal heat-conducting plate is made of copper plate with a microchannel structure. The microchannel structure can prevent foreign objects from entering the phone, and it also has a high heat dissipation area, which can quickly dissipate the heat generated by the core heat-generating components in the phone, resulting in better heat dissipation performance. In addition, the microchannel structure has a small volume and will not occupy much of the internal space of the phone.

[0022] Other additional advantages and beneficial effects of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this invention. Attached Figure Description

[0023] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0024] Figure 1 This is a schematic diagram of the structure of this utility model;

[0025] Figure 2 This is a schematic diagram of the isometric structure of the heat conduction mechanism in this utility model;

[0026] Figure 3 This utility model Figure 1 Enlarged structural diagram at point A in the diagram;

[0027] Figure 4 This utility model Figure 2 A magnified structural diagram at point B in the diagram.

[0028] In the diagram: 1. Back cover body; 11. No. 1 ventilation micropore; 12. Through groove; 13. Reserved threaded hole; 2. Heat conduction mechanism; 21. Metal heat conduction plate; 211. Microchannel; 22. Upper graphene heat dissipation film; 23. Lower graphene heat dissipation film; 3. Dustproof sheet; 31. No. 2 ventilation micropore; 32. Fixing hole. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] Please see Figures 1-4 The present invention provides the following technical solution: a 5G mobile phone body structure with heat dissipation channel, including a back cover body 1 and a heat conduction mechanism 2, the heat conduction mechanism 2 being fixed to the inner wall of the back cover body 1, and the heat conduction mechanism 2 including: a metal heat conduction plate 21.

[0031] Furthermore, by Figure 1 and Figure 2As shown, in this embodiment, the metal heat-conducting plate 21 is fixed to the inner wall of the back cover body 1, and multiple microchannels 211 evenly distributed along its length are processed inside the metal heat-conducting plate 21. A first-order ventilated microhole 11 communicating with the microchannels 211 is processed on the side of the back cover body 1. With this solution, during use, the metal heat-conducting plate 21 is fixed inside the back cover body 1, corresponding to the position of the core heat-generating element of the phone, such as the CPU. When the phone is running under high load, the generated heat can be conducted to the metal heat-conducting plate 21. The heat is conducted to the back cover body 1 and simultaneously discharged through the microchannel 211 and the first ventilation microhole 11. Through the heat conduction mechanism 2, the metal heat conduction plate 21 is a copper plate with a microchannel 211 structure. The microchannel 211 structure can prevent foreign objects from entering the phone. On the other hand, the microchannel 211 structure has a high heat dissipation area, which can quickly dissipate the heat generated by the core heat-generating components in the phone, and has better heat dissipation performance. In addition, the microchannel 211 structure has a small volume and will not occupy much of the inner space of the phone.

[0032] Optionally, by Figure 1 and Figure 2 As shown, in this embodiment, the metal heat-conducting plate 21 is a copper plate with a thickness of 0.1mm-0.3mm, such as 0.1mm, 0.2mm or 0.3mm. It is relatively thin and light, and will not take up much space inside the phone. In addition, the copper plate has better thermal conductivity, which helps to quickly dissipate the heat generated by the core heat-generating components inside the phone.

[0033] It should be noted that the above solution is only an exemplary solution of this utility model and is not intended to limit this utility model. In addition to having better thermal conductivity, it also needs to have a small volume for use in mobile phones. In other available embodiments, if there is enough space, the metal heat-conducting plate 21 can also be designed to other sizes.

[0034] Optionally, by Figure 1 and Figure 2 As shown in this embodiment, the microchannel 211 is a rectangular hole with a side length of 0.08mm-0.28mm, such as 0.08mm, 0.18mm or 0.28mm. The use of rectangular holes in the microchannel 211 results in a more compact arrangement between adjacent microchannels 211 and higher heat transfer efficiency.

[0035] Preferably, by Figure 1 , Figure 2 and Figure 4 As shown in this embodiment, the heat conduction mechanism 2 further includes an upper graphene heat dissipation film 22, which is bonded and fixed to the top surface of the metal heat conduction plate 21. With the above solution, the design of the upper graphene heat dissipation film 22 can absorb heat more quickly and effectively during use, greatly improving the heat dissipation efficiency.

[0036] In addition, the graphene heat dissipation film 22 is fixed by adhesive, and users who have some knowledge of disassembling the main body 1 of the mobile phone back cover can replace the graphene heat dissipation film 22 themselves, which reduces the difficulty and cost of replacement.

[0037] Preferably, by Figure 1 , Figure 2 and Figure 4 As shown in this embodiment, the heat conduction mechanism 2 further includes a lower graphene heat dissipation film 23. The lower graphene heat dissipation film 23 is bonded and fixed to the bottom surface of the metal heat conduction plate 21 and bonded and fixed inside the back cover body 1. With the above solution, when in use, the design of the lower graphene heat dissipation film 23 can absorb heat more quickly and effectively, conduct the heat to the back cover body 1 and dissipate it, greatly improving the heat dissipation efficiency.

[0038] In addition, the lower graphene heat dissipation film 23 is fixed by adhesive, and users who have some knowledge of disassembling the main body 1 of the mobile phone back cover can replace the lower graphene heat dissipation film 23 by themselves, which reduces the difficulty and cost of replacement, and also makes it easier to clean or replace the metal heat conduction plate 21.

[0039] Optionally, by Figure 1 , Figure 2 and Figure 4 As shown in this embodiment, the upper graphene heat dissipation film 22 and the lower graphene heat dissipation film 23 have the same thickness, both ranging from 2μm to 20μm, such as 2μm, 11μm or 20μm. They are relatively thin and do not take up much space inside the phone.

[0040] Optionally, by Figures 1-3 As shown, this embodiment also includes: a dustproof sheet 3, on which a second ventilation micro-hole 31 is processed, and through grooves 12 are processed on both sides of the back cover body 1. The dustproof sheet 3 is fixed to the side of the back cover body 1 at the position corresponding to the through groove 12. After adopting the above solution, when in use, the design of the through groove 12 further increases the air guiding channel, and the external heat dissipation air can enter the mobile phone from the through groove 12 to generate heat exchange, which further improves the heat dissipation efficiency. The dustproof sheet 3 is used to prevent external dust and other foreign objects from entering the mobile phone.

[0041] Optionally, by Figures 1-3 As shown in this embodiment, a fixing hole 32 is also machined on the dustproof sheet 3, and a reserved threaded hole 13 corresponding to the fixing hole 32 is machined on the back cover body 1. The dustproof sheet 3 is fixed to the side of the back cover body 1 with screws. With the above solution, the dustproof sheet 3 is fixed with screws during use. While ensuring the stability of the dustproof sheet 3, it is also convenient to disassemble, clean or replace the dustproof sheet 3.

[0042] Components not described in detail in this article are existing technologies.

[0043] The working principle and usage process of this utility model: When in use, the metal heat-conducting plate 21 of the mobile phone back cover body 1 is fixed inside the back cover body 1 and corresponds to the position of the core heating element of the mobile phone. When the mobile phone is running under high load, the heat generated can be conducted to the metal heat-conducting plate 21 and then to the back cover body 1, and is simultaneously discharged from the microchannel 211 and the first ventilation microhole 11.

[0044] This utility model features a heat-conducting mechanism 2 and a metal heat-conducting plate 21 made of copper plate with a microchannel 211 structure. The microchannel 211 structure can prevent foreign objects from entering the phone and has a high heat dissipation area, which can quickly dissipate the heat generated by the core heat-generating components in the phone, resulting in better heat dissipation performance. In addition, the microchannel 211 structure has a small volume and will not occupy much internal space of the phone.

[0045] In another aspect of this utility model, the design of the upper graphene heat dissipation film 22 and the lower graphene heat dissipation film 23 can absorb heat more quickly and effectively, conduct the heat to the back cover body 1 and dissipate it, thus greatly improving the heat dissipation efficiency.

[0046] In addition, the design of the through slot 12 further increases the airflow channel, allowing external cooling air to enter the phone through the through slot 12 to generate heat exchange, further improving heat dissipation efficiency. The dustproof sheet 3 is used to prevent external dust and other foreign objects from entering the phone.

[0047] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A 5G mobile phone body structure with a heat dissipation channel, comprising a back cover body (1), characterized in that, It also includes a heat-conducting mechanism (2), which is fixed to the inner wall of the rear cover body (1), and the heat-conducting mechanism (2) includes: A metal heat-conducting plate (21) is fixed to the inner wall of the back cover body (1), and a plurality of microchannels (211) are processed in the metal heat-conducting plate (21) and are equally spaced along its length. A first ventilation microhole (11) communicating with the microchannels (211) is processed on the side of the back cover body (1).

2. The 5G mobile phone body structure with heat dissipation channel according to claim 1, characterized in that: The metal heat-conducting plate (21) is a copper plate with a thickness of 0.1mm-0.3mm.

3. The 5G mobile phone body structure with heat dissipation channel according to claim 1, characterized in that: The microchannel (211) is a rectangular hole with a side length of 0.08mm-0.28mm.

4. The 5G mobile phone body structure with heat dissipation channel according to claim 1, characterized in that: The heat conduction mechanism (2) also includes: The upper graphene heat dissipation film (22) is bonded and fixed to the top surface of the metal heat-conducting plate (21).

5. The 5G mobile phone body structure with heat dissipation channel according to claim 4, characterized in that: The heat conduction mechanism (2) also includes: The lower graphene heat dissipation film (23) is bonded and fixed to the bottom surface of the metal heat-conducting plate (21) and bonded and fixed inside the back cover body (1).

6. The 5G mobile phone body structure with heat dissipation channel according to claim 5, characterized in that: The upper graphene heat dissipation film (22) and the lower graphene heat dissipation film (23) have the same thickness, both ranging from 2μm to 20μm.

7. The 5G mobile phone body structure with heat dissipation channel according to claim 1, characterized in that: Also includes: The dustproof sheet (3) has two ventilation micro-holes (31) processed on it, and through grooves (12) are processed on both sides of the back cover body (1). The dustproof sheet (3) is fixed to the side of the back cover body (1) at the position corresponding to the through groove (12).

8. The 5G mobile phone body structure with heat dissipation channel according to claim 7, characterized in that: A fixing hole (32) is also machined on the dustproof sheet (3), and a reserved threaded hole (13) corresponding to the fixing hole (32) is machined on the back cover body (1). The dustproof sheet (3) is fixed to the side of the back cover body (1) with screws.

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