A circuit board and radio frequency device

Abstract

The utility model provides a kind of circuit board and radio frequency device, circuit board includes: board ontology is equipped with jumper area, first connection area and second connection area;Coupling line is set to board ontology, coupling line is equipped with multiple, multiple coupling lines are spaced distribution, and the one end of each coupling line is arranged in first connection area;Lightning protection wire is set to board ontology, one end of lightning protection wire is arranged in second connection area, lightning protection wire and coupling line are mutually isolated and mutually not intercommunicate;And, high voltage capacitor element is connected to lightning protection wire and located in second connection area, high voltage capacitor element is between lightning protection wire and coupling line, and high voltage capacitor element ground is set. Bypass ground high voltage capacitor influences high-frequency interference signal on nearby coupling line, reduces the signal interference between each coupling line, improves isolation index, to improve anti-interference ability, satisfy complex communication scene under high performance demand.

Description

Technical Field

[0001] This utility model relates to the field of communication device technology, and in particular to a circuit board and a radio frequency device. Background Technology

[0002] Microstrip couplers, as a key radio frequency (RF) device, are widely used in RF and microwave communication systems, primarily involving microwave engineering, RF circuit design, and the innovation and application of microstrip line technology. By achieving signal coupling and isolation within a microstrip line structure, microstrip couplers can efficiently perform functions such as signal splitting, monitoring, and power distribution, making them an indispensable component of modern communication systems.

[0003] In related technologies, to optimize circuit board routing, the coupled lines on the circuit board are arranged in a concentrated manner, specifically by placing one end of each coupled line in the jumper solder joint area. However, due to the small distance between the coupled lines, signal interference is easily generated, making it difficult to meet the high-performance requirements of complex communication scenarios. Utility Model Content

[0004] The technical problem to be solved by this utility model is to provide a circuit board and radio frequency device, which aims to solve the problem of signal interference between the coupling lines on the circuit board in related technologies.

[0005] To solve the above-mentioned technical problems, the first aspect of this utility model provides a circuit board, comprising:

[0006] The board body has a jumper area, a first connection area and a second connection area. The first connection area and the second connection area are both located in the jumper area, and the first jumper area is located on one side of the second jumper area. The first jumper area and the second jumper area are distributed at intervals.

[0007] A coupling line is provided on the plate body. Multiple coupling lines are provided and distributed at intervals. One end of each coupling line is arranged in the first connection area.

[0008] A lightning protection wire is installed on the plate body, with one end of the lightning protection wire located within the second connection area. The lightning protection wire and the coupling wire are isolated from each other and are not connected.

[0009] A high-voltage capacitor element is connected to the lightning protection wire and located in the second connection area. The high-voltage capacitor element is located between the lightning protection wire and the coupling wire, and the high-voltage capacitor element is grounded.

[0010] Optionally, the circuit board further includes a first solder joint, which is disposed on the board body and located in the first connection area. Multiple first solder joints are provided, and the multiple first solder joints are connected one-to-one with the multiple coupling lines.

[0011] Optionally, the coupling line includes:

[0012] A first inner layer segment is disposed within the plate body; and...

[0013] The first microstrip segment is disposed on the surface of the board body and connected to the first inner layer segment, and the first solder joint is connected to the end of the first microstrip segment away from the first inner layer segment.

[0014] Optionally, the circuit board further includes a second solder joint, which is disposed on the board body and located in the second connection area, and is connected to the lightning protection wire.

[0015] Optionally, multiple lightning protection wires are provided, which are distributed at intervals, and one end of each lightning protection wire is arranged in the second connection area;

[0016] The high-voltage capacitor element is provided in multiple ways, and the multiple high-voltage capacitor elements are connected one-to-one to the multiple lightning protection lines;

[0017] The second welding point is provided in multiple ways, and each of the multiple second welding points is connected to one of the multiple lightning protection wires.

[0018] Optionally, the lightning protection wire includes:

[0019] A second inner layer segment is disposed within the plate body; and

[0020] The second microstrip segment is disposed on the surface of the board body and connected to the second inner layer segment, and the second solder joint is connected to the end of the second microstrip segment away from the second inner layer segment.

[0021] Optionally, one end of the high-voltage capacitor element is connected to the second microstrip segment, and the other end is grounded.

[0022] Optionally, the board body is a multilayer board, the coupling line is located in the inner layer of the board body, and / or the coupling line is located in the surface layer of the board body;

[0023] The lightning protection wire is located in the inner layer of the plate body, and / or the lightning protection wire is located in the surface layer of the plate body.

[0024] Optionally, the withstand voltage of the high-voltage capacitor element is greater than the operating voltage of the circuit board.

[0025] The second aspect of this utility model provides a radio frequency device, including the circuit board as described in any one of the above-mentioned embodiments.

[0026] Compared with related technologies, the circuit board and radio frequency device of this utility model have the following advantages: by setting a high-voltage capacitor element on the lightning protection line near the coupling line, and the high-voltage capacitor element is located between the lightning protection line and the coupling line, and the high-voltage capacitor element is grounded, a bypass grounding high-voltage capacitor is formed, which affects the high-frequency interference signal on the nearby coupling line, reduces the signal interference between each coupling line, improves the isolation index, and thus improves the anti-interference capability to meet the high-performance requirements of complex communication scenarios. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the circuit board provided in an embodiment of the present invention.

[0029] In the accompanying drawings, the reference numerals represent: 1. Board body; 11. Jumper area; 12. First connection area; 13. Second connection area; 2. Coupler line; 21. First inner layer segment; 22. First microstrip segment; 3. Lightning protection line; 31. Second inner layer segment; 32. Second microstrip segment; 4. High voltage capacitor element; 5. First solder joint; 6. Second solder joint. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model. All other embodiments obtained by those skilled in the art based on the embodiments of this utility model without inventive effort are within the scope of protection of this utility model.

[0031] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "circumferential", "radial", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0032] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" or "several" means two or more, unless otherwise explicitly specified.

[0033] Example:

[0034] This utility model provides a radio frequency device, including a circuit board, wherein the radio frequency device can be a microstrip coupler.

[0035] Please see Figure 1 The circuit board includes a board body 1, coupling lines 2, lightning protection lines 3, and high-voltage capacitor components 4. The board body 1 has a jumper area 11, a first connection area 12, and a second connection area 13. The first connection area 12 and the second connection area 13 are both located within the jumper area 11, and the first jumper area 11 is located on one side of the second jumper area 11. The first jumper area 11 and the second jumper area 11 are distributed alternately. The coupling lines 2 are located on the board body 1, and there are multiple coupling lines 2. The multiple coupling lines 2 are distributed alternately, and one end of each coupling line 2 is arranged in the first connection area 12. The lightning protection line 3 is located on the board body 1, and one end of the lightning protection line 3 is arranged in the second connection area 13. The lightning protection line 3 and the coupling lines 2 are isolated from each other and are not connected. The high-voltage capacitor component 4 is connected to the lightning protection line 3 and located in the second connection area 13. The high-voltage capacitor component 4 is located between the lightning protection line 3 and the coupling line 2, and the high-voltage capacitor component 4 is grounded.

[0036] By setting a high-voltage capacitor element 4 on the lightning protection line 3 near the coupling line 2, and placing the high-voltage capacitor element 4 between the lightning protection line 3 and the coupling line 2, and grounding the high-voltage capacitor element 4, a bypass grounding high-voltage capacitor is formed, which affects the high-frequency interference signal on the nearby coupling line 2, reduces the signal interference between each coupling line 2, improves the isolation index, and thus improves the anti-interference capability to meet the high-performance requirements of complex communication scenarios.

[0037] It should be noted that, for radio frequency signals, in the small space within the jumper area 11, the signals between each coupling line 2 will interfere with each other. Therefore, by setting a high-voltage capacitor element 4 on the nearby lightning protection line 3, the mutual interference of coupling signals on the coupling lines 2 can be suppressed, and the isolation can be improved.

[0038] Please see Figure 1 The circuit board also includes first solder joints 5, which are disposed on the board body 1 and located in the first connection area 12. Multiple first solder joints 5 are provided, and each first solder joint 5 is connected to a corresponding number of coupling lines 2, thereby allowing the coupling lines 2 to be connected to jumpers through the first solder joints 5, transmitting signals from one circuit to another. Furthermore, the multiple first solder joints 5 and the multiple coupling lines 2 are all arranged within the first connection area 12, which reduces wiring difficulty.

[0039] Depending on actual needs, in a specific example, there may be three coupling lines 2 and three first solder points 5. The three first solder points 5 are respectively connected to one end of the three coupling lines 2 located in the first connection area 12.

[0040] Please see Figure 1 The coupling line 2 includes a first inner layer segment 21 and a first microstrip segment 22. The first inner layer segment 21 is disposed inside the board body 1. The first microstrip segment 22 is disposed on the surface of the board body 1 and connected to the first inner layer segment 21. The first solder joint 5 is connected to the end of the first microstrip segment 22 away from the first inner layer segment 21, thereby concentrating one end of multiple coupling lines 2 on the surface of the board body 1, which can realize efficient signal transmission and reduce electromagnetic interference.

[0041] Please see Figure 1 The circuit board also includes a second solder joint 6, which is disposed on the board body 1 and located in the second connection area 13. The second solder joint 6 is connected to the lightning protection line 3, so that the coupling line 2 is connected to the jumper through the second solder joint 6. The connection status of the lightning protection line 3 can be controlled by the jumper, thereby enabling or disabling the lightning protection function when needed, improving the adaptability and reliability of the circuit.

[0042] Please see Figure 1 Multiple lightning protection wires 3 are provided, spaced apart, with one end of each wire 3 located within the second connection area 13. Multiple second solder points 6 are provided, each corresponding to one of the multiple lightning protection wires 3. These multiple lightning protection wires 3 can disperse the lightning current to different paths, preventing damage to any single line due to overload and ensuring the lightning current is safely guided to the ground. Multiple high-voltage capacitor elements 4 are provided, each corresponding to one of the multiple lightning protection wires 3, which can improve the suppression of coupling signals interfering with each other on the coupling line 2, further enhancing isolation.

[0043] Please see Figure 1 The lightning protection wire 3 includes a second inner layer segment 31 and a second microstrip segment 32. The second inner layer segment 31 is disposed inside the board body 1. The second microstrip segment 32 is disposed on the surface of the board body 1 and connected to the second inner layer segment 31. The second solder joint 6 is connected to the end of the second microstrip segment 32 away from the second inner layer segment 31, thereby concentrating one end of the lightning protection wire 3 on the surface of the board body 1, making it convenient for the lightning protection wire 3 to be connected to the jumper wire through the second solder joint 6.

[0044] One end of the high-voltage capacitor element 4 is connected to the second microstrip segment 32, and the other end is grounded, thereby suppressing interference between the coupling lines 2.

[0045] In some embodiments, the board body 1 is a multilayer board, the coupling line 2 is located in the inner layer of the board body 1, and / or, the coupling line 2 is located in the surface layer of the board body 1; the lightning protection line 3 is located in the inner layer of the board body 1, and / or, the lightning protection line 3 is located in the surface layer of the board body 1. For example:

[0046] There are three coupling lines 2 and two lightning protection lines 3. The board body 1 is at least a four-layer board. Both coupling lines 2 and lightning protection lines 3 jump from the inner layer to the surface layer and are then connected to their respective solder joints.

[0047] The high-voltage capacitor 4 has a withstand voltage greater than the operating voltage of the circuit board, thus ensuring that the protection circuit is protected from damage by lightning overvoltage. Specifically, the high-voltage capacitor 4 can withstand voltages up to 630V and above.

[0048] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A circuit board, characterized in that, include: The board body is provided with a jumper area, a first connection area and a second connection area. The first connection area and the second connection area are both located in the jumper area, and the first connection area is located on one side of the second connection area. The first connection area and the second connection area are distributed at intervals. A coupling line is provided on the plate body. Multiple coupling lines are provided and distributed at intervals. One end of each coupling line is arranged in the first connection area. A lightning protection wire is installed on the plate body, with one end of the lightning protection wire located within the second connection area. The lightning protection wire and the coupling wire are isolated from each other and are not connected. A high-voltage capacitor element is connected to the lightning protection wire and located in the second connection area. The high-voltage capacitor element is located between the lightning protection wire and the coupling wire, and the high-voltage capacitor element is grounded.

2. The circuit board according to claim 1, characterized in that, The circuit board further includes a first solder joint, which is disposed on the board body and located in the first connection area. There are multiple first solder joints, and each of the multiple first solder joints is connected to a corresponding multiple coupling lines.

3. The circuit board according to claim 2, characterized in that, The coupling line includes: A first inner layer segment is disposed within the plate body; and... The first microstrip segment is disposed on the surface of the board body and connected to the first inner layer segment, and the first solder joint is connected to the end of the first microstrip segment away from the first inner layer segment.

4. The circuit board according to claim 1, characterized in that, The circuit board further includes a second solder joint, which is disposed on the board body and located in the second connection area, and is connected to the lightning protection wire.

5. The circuit board according to claim 4, characterized in that, The lightning protection wire is provided in multiple ways, and the multiple lightning protection wires are distributed at intervals, with one end of each lightning protection wire arranged in the second connection area; The high-voltage capacitor element is provided in multiple ways, and the multiple high-voltage capacitor elements are connected one-to-one to the multiple lightning protection lines; The second welding point is provided in multiple ways, and each of the multiple second welding points is connected to one of the multiple lightning protection wires.

6. The circuit board according to claim 4, characterized in that, The lightning protection wire includes: A second inner layer segment is disposed within the plate body; and The second microstrip segment is disposed on the surface of the board body and connected to the second inner layer segment, and the second solder joint is connected to the end of the second microstrip segment away from the second inner layer segment.

7. The circuit board according to claim 6, characterized in that, One end of the high-voltage capacitor element is connected to the second microstrip segment, and the other end is grounded.

8. The circuit board according to claim 1, characterized in that, The board body is a multilayer board, and the coupling line is located in the inner layer of the board body, and / or the coupling line is located in the surface layer of the board body; The lightning protection wire is located in the inner layer of the plate body, and / or the lightning protection wire is located in the surface layer of the plate body.

9. The circuit board according to claim 1, characterized in that, The withstand voltage of the high-voltage capacitor element is greater than the operating voltage of the circuit board.

10. A radio frequency device, characterized in that, The circuit board includes any one of claims 1-9.

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