PCB structure with BGA positioning and fool-proof effect

Abstract

The utility model discloses a kind of PCB structure with BGA positioning and prevent stupid effect, including PCB board main body and the BGA pad area of being set on the PCB board main body, multiple BGA pin pads are arrayed and distributed on the BGA pad area, it is characterized by: eight groups of positioning devices are further provided on the PCB board main body, each group of the positioning device is by two with the same size positioning pad of BGA pin pad and the silk screen of being set in the periphery of two positioning pads, eight groups of the positioning device are respectively set in the periphery of four corners of the BGA pad area, the relative position of one group of the positioning device and other seven groups of the positioning device is inconsistent.The utility model effectively solves the problem that existing BGA positioning mode is limited in space on high-density PCB board and lacks anti-stupid function.

Description

Technical Field

[0001] This utility model relates to the field of printed circuit board (PCB) technology, specifically to a PCB structure with BGA positioning and foolproof effect. Background Technology

[0002] In the manufacturing process of electronic devices, BGA packages are widely used in various electronic products due to their large number of pins, small pitch, and excellent electrical performance. However, as electronic products continue to develop towards miniaturization and high density, the pin pitch of BGAs is becoming smaller and smaller. Currently, BGAs with a pitch of 0.8 mm and below face many challenges during mounting.

[0003] like Figure 1 As shown, existing BGA positioning methods typically involve placing two circular positioning points on the diagonal of the BGA on the PCB. While these points can assist in BGA placement and alignment to some extent, they have significant drawbacks. Firstly, the circular positioning point pins are large, several times larger than the BGA pin pads, and require a large keep-away area around them to avoid interference with other traces or components. On high-density PCBs, space resources are extremely limited. These large positioning points and keep-away areas consume a significant amount of valuable routing space, and in some cases, there may not even be enough space to place the positioning points, thus affecting proper BGA placement. Secondly, traditional positioning points only provide basic positioning and lack foolproof functionality. If operators are negligent during placement, incorrect BGA placement orientation is still possible. This not only wastes time and money on rework but may also damage the BGA and PCB. Therefore, a new PCB structure is urgently needed to solve these problems. Utility Model Content

[0004] The purpose of this invention is to provide a PCB structure with BGA positioning and error prevention effects, so as to solve the problems of limited space and lack of error prevention function in existing BGA positioning methods on high-density PCB boards.

[0005] The technical solution of this utility model is as follows:

[0006] A PCB structure with BGA positioning and foolproof effect includes a PCB board body and a BGA pad area disposed on the PCB board body. The BGA pad area has multiple BGA pin pads arranged in an array. The PCB board body is also provided with eight sets of positioning devices. Each set of positioning devices consists of two positioning pads of the same size as the BGA pin pads and silkscreen markings disposed around the two positioning pads. The eight sets of positioning devices are respectively disposed at the four corners of the BGA pad area, and the relative position of one set of positioning devices is inconsistent with the other seven sets of positioning devices.

[0007] As a preferred embodiment of this utility model, each group of positioning devices is encapsulated as a whole on the PCB board body.

[0008] As a preferred embodiment of this utility model, in each group of positioning devices, the spacing between the two positioning pads is an integer multiple of the spacing between the BGA pin pads.

[0009] As a preferred embodiment of this utility model, in each group of positioning devices, the spacing between the two positioning pads is five times the spacing between the BGA pin pads.

[0010] As a preferred embodiment of this utility model, in each group of positioning devices, the spacing between the two positioning pads is four times the spacing between the BGA pin pads.

[0011] As a preferred embodiment of this utility model, in each group of positioning devices, the two positioning pads are respectively flush with the two rows of BGA pin pads.

[0012] In a preferred embodiment of this utility model, the first positioning pad of one group of positioning devices is flush with the third row of BGA pin pads located at a corresponding corner of the BGA pad area, and the first positioning pad of the other seven groups of positioning devices is flush with the second row of BGA pin pads located at a corresponding corner of the BGA pad area.

[0013] In a preferred embodiment of this utility model, the second positioning pad of one group of positioning devices is flush with the seventh row of BGA pin pads located at a corresponding corner of the BGA pad area, and the second positioning pad of the other seven groups of positioning devices is flush with the sixth row of BGA pin pads located at a corresponding corner of the BGA pad area.

[0014] As a preferred embodiment of this utility model, in each group of positioning devices, two positioning pads are evenly arranged within the silkscreen.

[0015] As a preferred embodiment of this utility model, the silkscreen is rectangular, and the long side of the silkscreen is parallel to the edge of the corresponding corner of the BGA pad area.

[0016] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0017] 1. By setting eight sets of positioning devices around the four corners of the BGA pad area, and setting a set of positioning devices with different relative positions in one corner, a unique foolproof layout is formed. This allows operators to easily determine whether the BGA is placed in the correct orientation by observing the relative position relationship of the positioning devices through the silkscreen, which greatly reduces the probability of placement errors caused by incorrect orientation.

[0018] 2. By setting the size of the positioning pad to be the same as that of the BGA pin pad, compared with the traditional circular positioning point (the PIN size is several times larger than the BGA pin pad), there is no need to set a large keep-out area around it. This can minimize the impact of the positioning pad on the BGA traces, save valuable space resources for the PCB board when routing at high density, and improve the rationality and utilization of the PCB board layout. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural diagram of an existing BGA positioning method;

[0021] Figure 2 This is a schematic diagram of a PCB structure with BGA positioning and error-proofing effect in one embodiment of the present invention.

[0022] In the diagram,

[0023] 1. PCB board body; 2. BGA pad area; 3. BGA pin pads; 4. Positioning device; 41. Positioning pads; 42. Silkscreen. Detailed Implementation

[0024] To make the technical problem to be solved, the technical solution, and the beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be noted that similar reference numerals and letters in the following drawings indicate similar items; therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings. It is also declared that the embodiments described below are only for explaining this utility model and are not intended to limit this utility model.

[0025] It should be noted that the terms "installation," "setting," "connection," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly defined. Indications of orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used in the application's product, or the orientation or positional relationship commonly understood by those skilled in the art, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. "A plurality" means two or more, unless otherwise explicitly defined.

[0026] Please see Figure 2This utility model provides a PCB structure with BGA positioning and foolproof effect, including a PCB board body 1 and a BGA pad area 2 disposed on the PCB board body 1. Multiple BGA pin pads 3 are arrayed on the BGA pad area 2. Eight sets of positioning devices 4 are also disposed on the PCB board body 1. Each set of positioning devices 4 consists of two positioning pads 41 of the same size as the BGA pin pads 3 and silkscreen markings 42 disposed around the two positioning pads 41. The eight sets of positioning devices 4 are respectively disposed at the four corners of the BGA pad area 2, with one set of positioning devices 4 having a different relative position than the other seven sets, forming a unique foolproof layout. The two positioning pads 41 of the positioning device 4 provide precise positioning references for BGA mounting. By setting the size of the positioning pads 41 to be the same as the size of the BGA pin pads 3, compared to traditional circular positioning points (where the pin size is several times larger than the BGA pin pads 3), there is no need to set a large containment area around them. This minimizes the impact of the positioning pads 41 on the BGA traces, saving valuable space resources for high-density routing on the PCB board and improving the layout rationality and utilization rate of the PCB board. The silkscreen 42 on the positioning device 4 facilitates observation of the relative position of each group of positioning devices 4. When mounting BGAs, operators can easily determine whether the BGA placement orientation is correct by observing the relative positional relationship of the positioning devices 4 through the silkscreen 42, greatly reducing the probability of mounting errors caused by incorrect orientation and providing a significant foolproof effect.

[0027] In one embodiment, each positioning device 4 is encapsulated as a whole on the PCB board body 1. The overall encapsulation method simplifies the PCB board manufacturing process. During production, there is no need to install and debug each part of the positioning device 4 separately, reducing assembly steps and time, and improving production efficiency.

[0028] In one embodiment, in each group of positioning devices 4, the spacing between the two positioning pads 41 is an integer multiple of the spacing between the BGA pin pads 3, and the two positioning pads 41 are respectively flush with two rows of BGA pin pads 3. The spacing multiple of the positioning pads 41 can be flexibly adjusted according to different BGA pin spacings. Figure 2As shown, in this embodiment, the spacing between the two positioning pads 41 of each group of positioning devices 4 is five times the spacing of the BGA pin pads 3. Of course, in other embodiments, the spacing between the two positioning pads 41 of each group of positioning devices 4 may also be two, three, four, six, or a larger multiple of the spacing of the BGA pin pads 3; this invention does not impose any limitations on this. By making the spacing of the positioning pads 41 an integer multiple of the spacing of the BGA pin pads 3, and aligning it with the BGA pin pads of a specific row, a clear and precise positioning reference is provided for BGA mounting. When mounting BGAs, operators can more intuitively and accurately align the BGA pins with the corresponding pads, greatly improving the accuracy of BGA mounting, reducing mounting deviations, and contributing to improved performance and quality of electronic products.

[0029] Please see Figure 2 In one embodiment, the first positioning pad 41 of one set of positioning devices 4 is flush with the third row of BGA pin pads 3 located at a corner of the BGA pad area 2, and the second positioning pad 41 is flush with the seventh row of BGA pin pads 3 located at a corner of the BGA pad area 2. The first positioning pad 41 of the other seven sets of positioning devices 4 is flush with the second row of BGA pin pads 3 located at a corner of the BGA pad area 2, and the second positioning pad 41 is flush with the sixth row of BGA pin pads 3 located at a corner of the BGA pad area 2. By setting one set of positioning devices 4 with different alignment positions from the other seven sets of positioning pads 41, a unique foolproof layout is formed. When mounting BGAs, operators can more clearly and quickly determine whether the BGA placement orientation is correct by the difference in the alignment positions of the positioning pads 41. Even if negligence occurs during operation, it can be detected and corrected in time, effectively avoiding rework and losses caused by incorrect BGA mounting orientation.

[0030] Please see Figure 2 In one embodiment, in each group of positioning devices 4, two positioning pads 41 are evenly disposed within the silkscreen 42. This even distribution within the silkscreen 42 helps ensure the consistency and stability of the relative positions of the positioning pads 41. Whether during PCB manufacturing or subsequent use and maintenance, this layout ensures that the relative positional relationship between the two positioning pads 41 remains unchanged, thus providing a reliable basis for precise BGA positioning and improving the accuracy and reliability of positioning.

[0031] Please see Figure 2In one embodiment, the silkscreen 42 is rectangular, and the long side of the silkscreen 42 is parallel to the edge of a corresponding corner of the BGA pad area 2. This arrangement provides clear visual guidance for the operator. When mounting the BGA, the operator can easily and quickly observe the relative positional relationship of each group of positioning devices 4 based on the direction and position of the silkscreen 42, thereby easily determining whether the BGA placement orientation is correct. This improves visual identification during the mounting process and reduces mounting errors caused by incorrect orientation judgment.

[0032] It should be understood that those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

[0033] The present utility model patent has been described above with reference to the accompanying drawings. Obviously, the implementation of the present utility model patent is not limited to the above-described manner. Any improvements made by adopting the inventive concept and technical solution of the present utility model patent, or the direct application of the inventive concept and technical solution of the present utility model patent to other occasions without modification, are all within the protection scope of the present utility model.

Claims

1. A PCB structure with BGA positioning and error-proofing effects, characterized in that, The device includes a PCB board body and a BGA pad area disposed on the PCB board body. The BGA pad area has multiple BGA pin pads arranged in an array. The device is characterized in that: the PCB board body is also provided with eight sets of positioning devices. Each set of positioning devices consists of two positioning pads of the same size as the BGA pin pads and silkscreen markings disposed around the two positioning pads. The eight sets of positioning devices are respectively disposed at the four corners of the BGA pad area, and the relative position of one set of positioning devices is inconsistent with the other seven sets of positioning devices.

2. The PCB structure with BGA positioning and error-proofing effect according to claim 1, characterized in that, Each of the positioning devices is encapsulated as a whole on the PCB board body.

3. The PCB structure with BGA positioning and error-proofing effect according to claim 1, characterized in that, In each set of positioning devices, the spacing between the two positioning pads is an integer multiple of the spacing between the BGA pin pads.

4. The PCB structure with BGA positioning and error-proofing effect according to claim 3, characterized in that, In each set of positioning devices, the spacing between the two positioning pads is five times the spacing between the BGA pin pads.

5. The PCB structure with BGA positioning and error-proofing effect according to claim 3, characterized in that, In each set of positioning devices, the spacing between the two positioning pads is four times the spacing between the BGA pin pads.

6. The PCB structure with BGA positioning and error-proofing effect according to claim 1, characterized in that, In each group of positioning devices, the two positioning pads are respectively flush with the two rows of BGA pin pads.

7. The PCB structure with BGA positioning and error-proofing effect according to claim 1, characterized in that, The first positioning pad of one group of positioning devices is flush with the third row of BGA pin pads located at the corresponding corner of the BGA pad area, while the first positioning pad of the other seven groups of positioning devices is flush with the second row of BGA pin pads located at the corresponding corner of the BGA pad area.

8. The PCB structure with BGA positioning and error-proofing effect according to claim 7, characterized in that, The second positioning pad of one group of positioning devices is flush with the seventh row of BGA pin pads located at a corresponding corner of the BGA pad area, while the second positioning pad of the other seven groups of positioning devices is flush with the sixth row of BGA pin pads located at a corresponding corner of the BGA pad area.

9. The PCB structure with BGA positioning and error-proofing effect according to claim 1, characterized in that, In each group of positioning devices, two positioning pads are evenly arranged within the silkscreen.

10. The PCB structure with BGA positioning and error-proofing effect according to claim 1, characterized in that, The silkscreen is rectangular, and the long side of the silkscreen is parallel to the edge of the corresponding corner of the BGA pad area.

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