Middle frame assembly, back shell assembly and electronic device

Abstract

The application provides a middle frame assembly, a back shell assembly and an electronic device, and belongs to the technical field of electronic devices. The middle frame assembly comprises a middle frame, an electronic device, a circuit board, a heat spreading plate and a heat conduction layer. The middle frame comprises a first surface and a second surface arranged oppositely. The middle frame is provided with a receiving hole penetrating through the first surface and the second surface. The circuit board is arranged towards the first surface, and the electronic device is arranged on the surface of the circuit board facing the receiving hole. At least part of the heat spreading plate is arranged in the receiving hole, and the heat conduction layer is connected between the electronic device and the heat spreading plate. Therefore, the middle frame assembly provided by the application is applied to a tablet computer. The heat spreading plate for heat dissipation is arranged in the receiving hole of the middle frame, the overall thickness of the heat spreading plate and the middle frame is reduced, and thus the light and thin design requirement of the tablet computer is met.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a mid-frame assembly, a rear shell assembly, and an electronic device. Background Technology

[0002] Electronic devices (such as mobile phones and computers) are becoming increasingly prevalent in daily life. As the functions and performance of electronic devices continue to improve, the heat generated by these devices is also increasing, necessitating further improvements in their heat dissipation capabilities.

[0003] At the same time, the design of electronic devices must focus on making the products thinner and lighter to improve their competitiveness. In existing technologies, the structures used for heat dissipation in electronic devices are relatively thick, which does not meet the requirements for thinner and lighter designs. Utility Model Content

[0004] This application provides a mid-frame assembly, a rear shell assembly, and an electronic device, which aims to further reduce the thickness of the heat dissipation structure of the electronic device, thus facilitating the design of a thinner and lighter electronic device.

[0005] In a first aspect, embodiments of this application provide a mid-frame assembly, which includes a mid-frame, electronic components, a circuit board, a heat spreader, and a thermally conductive layer. The mid-frame includes a first surface and a second surface disposed opposite to each other, and a receiving hole is provided in the mid-frame, the receiving hole penetrating the first surface and the second surface. The circuit board is disposed facing the first surface, the electronic components are disposed on the surface of the circuit board facing the receiving hole, at least a portion of the heat spreader is disposed within the receiving hole, and the thermally conductive layer connects the electronic components and the heat spreader. Therefore, the mid-frame assembly provided in this application, when applied to a tablet computer, reduces the overall thickness of the heat spreader and the mid-frame by 0.15 mm to 0.3 mm by disposing the heat spreader for heat dissipation within the receiving hole of the mid-frame, thereby meeting the requirements for a thinner and lighter tablet computer design.

[0006] In an exemplary embodiment, a portion of the heat spreader protrudes beyond the second surface. That is, the height of the heat spreader is higher than the second surface of the middle frame. This protrusion of the heat spreader from the second surface facilitates heat dissipation.

[0007] In one possible implementation, the receiving hole includes a first sub-hole and a second sub-hole, which communicate with each other. The opening of the first sub-hole is located on the first surface, and the opening of the second sub-hole is located on the second surface. The diameter of the second sub-hole is larger than that of the first sub-hole, and at least a portion of the heat spreader is disposed within the second sub-hole. Dividing the receiving hole into a smaller-diameter first sub-hole and a larger-diameter second sub-hole, and disposing at least a portion of the heat spreader within the larger-diameter second sub-hole, increases the heat transfer area between the heat spreader and the middle frame. The larger-diameter second sub-hole can also accommodate a larger-sized heat spreader, resulting in a larger heat dissipation area, which is beneficial for heat dissipation. Furthermore, the smaller-diameter first sub-hole avoids reducing the structural strength of the middle frame due to the receiving hole in the middle frame.

[0008] In one possible implementation, the heat spreader includes a first heat spreader, a second heat spreader, and a third heat spreader. The first heat spreader is connected between the second and third heat spreaders and is disposed within the first and second sub-holes. At least a portion of the second and third heat spreaders are disposed within the second sub-holes. The placement of the first and second heat spreaders within the first and second sub-holes, and at least a portion of the second and third heat spreaders within the second sub-holes, increases the contact area between the heat spreader and the middle frame, facilitating heat dissipation from the heat spreader to the middle frame. Furthermore, the heat spreader has a height difference in its thickness direction, allowing it to adapt to middle frames of different heights and shapes, as well as electronic devices placed in different positions and with different structures. This also reduces the overall thickness of the heat spreader and the middle frame.

[0009] In an exemplary embodiment, the middle frame assembly further includes a heat transfer element disposed on the surface of the heat spreader facing away from the heat-conducting layer and the second surface of the middle frame. The heat spreader can transfer heat through direct contact with the middle frame. To improve the heat transfer efficiency between the heat spreader and the middle frame, the heat spreader can also transfer heat to the middle frame through the heat transfer element.

[0010] In one possible implementation, the mid-frame assembly further includes a battery and an adhesive backing, the adhesive backing being disposed on the first surface of the mid-frame, the battery being disposed on the surface of the adhesive backing facing away from the mid-frame, and the battery being fixed to the mid-frame by the adhesive backing.

[0011] In one possible implementation, the circuit board has mounting holes, and the mid-frame assembly further includes screws and a heat insulation ring. The screws are disposed within the mounting holes and are fixedly connected to both the circuit board and the mid-frame. The heat insulation ring is positioned between the circuit board and the screw head. The electronic device is fixedly connected to the circuit board, the screw is fixedly connected to the circuit board, and the screw is also fixedly connected to the mid-frame. Heat generated by the electronic device is conducted to the mid-frame through the circuit board and the screw. Due to the small contact area between the screw and the mid-frame, a high temperature occurs at the connection point. Therefore, to prevent localized high temperatures in the mid-frame, the heat insulation ring is placed between the circuit board and the screw.

[0012] In an exemplary embodiment, the circuit board has heat dissipation holes, which are spaced apart from the mounting holes. By creating these heat dissipation holes on the circuit board, the internal layer structure of the circuit board is exposed, which is beneficial for heat dissipation.

[0013] In an exemplary embodiment, the thickness of the heat spreader is 0.27 mm to 0.32 mm, the width of the heat spreader is 17 mm to 19 mm, and the length of the heat spreader is 80 mm to 100 mm.

[0014] In an exemplary embodiment, the combined thickness of the middle frame and the heat spreader is 0.75 mm to 1.1 mm.

[0015] In an exemplary embodiment, the depth of the receiving hole is 0.5 mm to 0.7 mm.

[0016] Secondly, embodiments of this application provide a back cover assembly, which includes a back cover, electronic components, a circuit board, a heat spreader, and a thermally conductive layer. The back cover includes an inner surface with an accommodating groove. At least a portion of the heat spreader is disposed within the accommodating groove. The circuit board faces the inner surface, and the electronic components are disposed on the surface of the circuit board facing the heat spreader. The thermally conductive layer connects the electronic components and the heat spreader. Therefore, the back cover assembly provided in this application, when applied to a tablet computer, reduces the overall thickness of the heat spreader and the back cover by 0.15 mm to 0.3 mm by distributing the heat spreader for heat dissipation within the accommodating groove of the back cover, thereby meeting the requirements for a thinner and lighter tablet computer design.

[0017] In an exemplary embodiment, a portion of the heat spreader protrudes beyond the inner surface, meaning the height of the heat spreader is higher than the inner surface. This protrusion of the heat spreader from the inner surface facilitates heat dissipation.

[0018] In one possible implementation, the receiving groove includes a first sub-groove and a second sub-groove, which communicate with each other. The opening of the first sub-groove is located on the inner surface, and the opening of the second sub-groove is located on the bottom wall of the first sub-groove. The sidewall of the first sub-groove is larger than that of the second sub-groove, and at least a portion of the heat spreader is disposed within the first sub-groove. Dividing the receiving groove into a first sub-groove with a larger sidewall size and a second sub-groove with a smaller sidewall size, and disposing at least a portion of the heat spreader within the first sub-groove with the larger sidewall size, increases the heat transfer area between the heat spreader and the rear shell. The first sub-groove with the larger sidewall size can also accommodate a larger heat spreader, resulting in a larger heat dissipation area, which is beneficial for heat dissipation. Furthermore, the smaller aperture of the second sub-groove prevents the receiving groove on the rear shell from reducing the structural strength of the rear shell.

[0019] In an exemplary embodiment, the heat spreader further includes a first heat spreader, a second heat spreader, and a third heat spreader. The first heat spreader is connected between the second and third heat spreaders. The first heat spreader is disposed within the first and second sub-slots, and at least a portion of the second and third heat spreaders are disposed within the first sub-slot. This increases the contact area between the heat spreader and the rear shell, which is beneficial for heat dissipation from the heat spreader to the rear shell. Moreover, by having a height difference in its thickness direction, the heat spreader can adapt to rear shells of different heights and shapes, as well as electronic devices placed in different positions and with different structures. This also reduces the overall thickness of the heat spreader and the rear shell.

[0020] In one possible implementation, the rear shell assembly further includes a heat transfer element disposed on the surface of the heat spreader facing away from the thermally conductive layer and on the inner surface of the rear shell. The heat spreader can transfer heat through direct contact with the rear shell; however, to improve the heat transfer efficiency between the heat spreader and the rear shell, the heat spreader can also transfer heat to the rear shell through the heat transfer element.

[0021] In one possible implementation, the circuit board has mounting holes, and the rear housing assembly further includes screws and a heat insulation ring. The screws are disposed within the mounting holes and are fixedly connected to both the circuit board and the rear housing. The heat insulation ring is disposed between the circuit board and the screw head. The electronic device is fixedly connected to the circuit board, the screw is fixedly connected to the circuit board, and the screw is also fixedly connected to the rear housing. Heat generated by the electronic device is conducted to the rear housing through the circuit board and the screw. Due to the small contact area between the screw and the rear housing, a high temperature occurs at the connection point. Therefore, to prevent localized high temperatures on the rear housing, the heat insulation ring is placed between the circuit board and the screw.

[0022] In an exemplary embodiment, the circuit board has heat dissipation holes, which are spaced apart from the mounting holes. By creating these heat dissipation holes on the circuit board, the internal layer structure of the circuit board is exposed, which is beneficial for heat dissipation.

[0023] In an exemplary embodiment, the heat transfer element has a clearance hole, the rear shell exposes the clearance hole, the screw passes through the clearance hole and is fixedly connected to the rear shell, and the screw is spaced apart from the hole wall of the clearance hole.

[0024] In an exemplary embodiment, the back cover assembly further includes a battery and an adhesive backing. The adhesive backing is disposed on the inner surface of the back cover, and the battery is disposed on the surface of the adhesive backing facing away from the back cover. The battery is connected to the heat transfer element. The heat generated by the battery during operation can also be transferred to the back cover through the heat transfer element, thereby achieving heat dissipation for the battery.

[0025] In an exemplary embodiment, the thickness of the heat spreader is 0.27 mm to 0.32 mm, the width of the heat spreader is 17 mm to 19 mm, and the length of the heat spreader is 80 mm to 100 mm.

[0026] In an exemplary embodiment, the combined thickness of the rear shell and the heat spreader is 0.75 mm to 1.1 mm.

[0027] In an exemplary embodiment, the depth of the receiving groove is 0.05 mm to 0.23 mm.

[0028] Thirdly, embodiments of this application also provide an electronic device, the electronic device including a rear shell and the aforementioned mid-frame assembly, wherein the mid-frame of the mid-frame assembly is connected to the rear shell. Alternatively, the electronic device includes a mid-frame and the aforementioned rear shell assembly, wherein the rear shell of the rear shell assembly is connected to the mid-frame.

[0029] In an exemplary embodiment, the electronic device is a tablet computer. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application or the background art, the accompanying drawings used in the embodiments of this application or the background art will be described below.

[0031] Figure 1 This is an exploded structural diagram of the electronic device disclosed in the embodiments of this application;

[0032] Figure 2 This is a top view of the mid-frame component disclosed in an embodiment of this application;

[0033] Figure 3 for Figure 2 The first cross-sectional view of the middle frame assembly along direction II is shown;

[0034] Figure 4 for Figure 3 A schematic diagram of the heat conduction path of the middle frame component is shown.

[0035] Figure 5 This is a schematic diagram of the heat conduction direction of the mid-frame assembly disclosed in an embodiment of this application;

[0036] Figure 6 for Figure 2 The second cross-sectional view of the middle frame assembly along direction II is shown;

[0037] Figure 7 for Figure 6 An enlarged schematic diagram of structure II shown;

[0038] Figure 8 This is a schematic diagram of the first layer structure of the rear shell assembly disclosed in an embodiment of this application;

[0039] Figure 9 for Figure 8 A schematic diagram of the heat conduction path of the rear shell assembly is shown.

[0040] Figure 10 This is a schematic diagram of the heat conduction direction of the rear shell assembly disclosed in an embodiment of this application;

[0041] Figure 11 This is a schematic diagram of the second layer structure of the rear shell assembly disclosed in the embodiments of this application;

[0042] Figure 12 for Figure 11 An enlarged schematic diagram of structure III is shown. Detailed Implementation

[0043] To facilitate understanding, the relevant technical terms involved in the embodiments of this application will first be explained and described.

[0044] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium. A fixed connection can be a direct fixed connection or an indirect fixed connection. For example, A and B are fixedly connected, and A and B can be directly fixedly connected or indirectly fixedly connected. A direct fixed connection between A and B means that A and B are in direct contact and fixedly connected, while an indirect fixed connection between A and B means that A and B are fixedly connected through an intermediate medium C.

[0045] In the embodiments of this application, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," and "fourth" may explicitly or implicitly include one or more of that feature.

[0046] Unless otherwise specified, the terms "connection" and "linkage" used in this application include both direct and indirect connections. Directional terms used in this application, such as "up," "down," "front," "back," "left," "right," "inner," and "outer," are merely for reference to the accompanying drawings. Therefore, the use of directional terms is for better and clearer explanation and understanding of this application, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0047] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0048] References or phrases such as "some embodiments" described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in some embodiments," "in other embodiments," "in still others," "in other still others," etc., appearing in different parts of this specification do not necessarily refer to the same embodiments, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized. The term "a plurality of" means at least two.

[0049] It is understood that the specific embodiments described herein are merely illustrative of related embodiments and not intended to limit the scope of the embodiments. Furthermore, it should be noted that, for ease of description, the accompanying drawings only show the parts relevant to the embodiments. It should be understood that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0050] The terms "parallel" and "perpendicular" are relative to the current technological level, not absolute mathematical definitions. Slight deviations are permissible; approximations of parallelism or perpendicularity are acceptable. For example, "A and B are parallel" means that A and B are parallel or approximately parallel, with the angle between them ranging from 0 to 5 degrees. Similarly, "A and B are perpendicular" means that A and B are perpendicular or approximately perpendicular, with the angle between them ranging from 85 to 95 degrees.

[0051] The embodiments of this application are described below with reference to the accompanying drawings.

[0052] This application provides an electronic device, which may include, but is not limited to, mobile phones, tablet computers, laptops, access network devices, cameras, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), wearable devices, virtual reality (VR) glasses or VR headsets, augmented reality (AR) glasses, AR headsets, in-vehicle devices, and other electronic devices.

[0053] In this embodiment, a tablet computer is used as an example for illustration.

[0054] Please see Figure 1 , Figure 1 This is an exploded view of the electronic device disclosed in an embodiment of this application. The electronic device 1 includes a display screen 10, a middle frame 20, and a rear cover 30. The middle frame 20 is disposed between the display screen 10 and the rear cover 30, and is fixedly connected to both the display screen 10 and the rear cover 30. The display screen 10 is used for image display, and the rear cover 30 is used to protect the electronic components inside the electronic device 1.

[0055] In one embodiment, the display screen 10 has a touch function. The display screen 10 can be an organic light-emitting diode (OLED) display screen, a liquid crystal display (LCD) display screen, or a micro light-emitting diode display (Micro LED) display screen. This application does not impose any specific limitations on this.

[0056] In other embodiments, the electronic device 1 may also include a front-facing camera module and / or a rear-facing camera.

[0057] like Figure 1 As shown in the embodiment of this application, the electronic device 1 further includes a circuit board 40 and a battery 50. The circuit board 40 is electrically connected to both the battery 50 and the display screen 10. The battery 50 supplies power to the circuit board 40, and the circuit board 40 provides electrical signals for display to the display screen 10. The circuit board 40 may be a printed circuit board (PCB), specifically a motherboard.

[0058] This application provides a mid-frame assembly, which includes the aforementioned mid-frame 20, circuit board 40, and battery 50. Please refer to... Figure 2 and Figure 3 , Figure 2 This is a top view of the mid-frame component disclosed in an embodiment of this application. Figure 3 for Figure 2 The diagram shows a first cross-sectional view of the mid-frame assembly along direction II. The mid-frame assembly 100 includes a mid-frame 20, electronic components 110, a circuit board 40, a heat spreader 120, and a thermally conductive layer 130. The mid-frame 20 is fixedly connected to the circuit board 40, the heat spreader 120 is fixedly connected to the mid-frame 20, the electronic components 110 are fixedly connected to the circuit board 40, and the thermally conductive layer 130 is fixedly connected between the electronic components 110 and the heat spreader 120. The electronic components 110 may be a system-on-a-chip (SoC), a power supply unit (transformer) of the SoC, or a charging module; this application does not impose specific limitations on this. The electronic components 110 generate heat during operation.

[0059] For ease of description, define Figure 2 The length direction of the middle frame 20 shown is the X-axis direction, the width direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are all perpendicular to each other. It is understood that the width direction of the middle frame 20 could also be the X-axis direction, and the length direction could be the Y-axis direction; this application does not impose a specific limitation on this.

[0060] In this embodiment, the middle frame 20 includes a first surface 21 and a second surface 22, which are disposed opposite to each other. The first surface 21 faces away from the Z-axis direction, and the second surface 22 faces the Z-axis direction. The middle frame 20 has a receiving hole 23 that penetrates both the first surface 21 and the second surface 22, and the axis of the receiving hole 23 is parallel to the Z-axis direction. The circuit board 40 is disposed facing the first surface 21, i.e., the circuit board 40 is disposed on the side of the first surface 21 facing away from the second surface 22, and the circuit board 40 is spaced apart from the first surface 21. The circuit board 40 is fixedly connected to the middle frame 20. An electronic device 110 is disposed on the surface of the circuit board 40 facing the receiving hole 23, and the electronic device 110 is fixedly connected to the circuit board 40. At least a portion of the heat spreader 120 is disposed within the receiving hole 23, and the heat spreader 120 is fixedly connected to the middle frame 20. The heat-conducting layer 130 is disposed between the electronic device 110 and the heat spreader 120, and the heat-conducting layer 130 is fixedly connected to the heat spreader 120 and the electronic device 110 respectively.

[0061] The electronic device 110 is electrically connected to the circuit board 40, and the electronic device 110 and the circuit board 40 transmit electrical signals to each other. The electronic device 110 generates heat during operation, which is conducted through the heat-conducting layer 130 to the heat spreader 120 for heat dissipation. The heat from the heat spreader 120 is then conducted to the middle frame 20, which is a large-area metal component with higher heat dissipation efficiency.

[0062] In an exemplary embodiment, the heat spreader 120 and the middle frame 20 can be fixed by means of skirt adhesive.

[0063] In an exemplary embodiment, the heat spreader 120 is a vacuum cavity with a fine structure on its inner wall, comprising a hot zone and a cold zone, with heat conducted between the hot and cold zones via a coolant. The coolant evaporates gas in the hot zone, the gas flows to the cold zone and condenses back into coolant, and the coolant flows back to the hot zone, thus achieving heat conduction in a continuous cycle.

[0064] Understandably, this application reduces the overall thickness of the heat dissipation plate 120 and the middle frame 20 by placing the heat dissipation heat dissipation plate 120 within the receiving hole 23 of the middle frame 20. The overall thickness of the heat dissipation plate 120 and the middle frame 20 is reduced by 0.15mm to 0.3mm, thereby meeting the requirements of the thinner and lighter design of the electronic device 1. Moreover, by providing a thermally conductive layer 130 between the electronic device 110 and the heat dissipation plate 120, the thermally conductive layer 130 improves the heat transfer efficiency between the electronic device 110 and the heat dissipation plate 120. More heat from the electronic device 110 is conducted to the heat dissipation plate 120, which is beneficial for heat dissipation of the electronic device 110. The heat from the heat dissipation plate 120 is also conducted to the middle frame 20 for heat dissipation. The middle frame 20 has a larger area and higher heat dissipation efficiency.

[0065] In an exemplary embodiment, the thermally conductive layer 130 is a thermal interface material (TIM), a thermally conductive gel, or a phase change thermally conductive film.

[0066] In an exemplary embodiment, the depth (dimension along the Z-axis) of the receiving hole 23 is 0.5 mm to 0.7 mm, for example, 0.5 mm, 0.51 mm, 0.55 mm, 0.58 mm, 0.6 mm, 0.64 mm, 0.67 mm, 0.7 mm, or other values. This application does not impose specific limitations on this.

[0067] In an exemplary embodiment, the thickness (dimension along the Z-axis) of the heat spreader 120 is 0.27 mm to 0.32 mm, for example, 0.27 mm, 0.28 mm, 0.29 mm, 0.3 mm, 0.31 mm, 0.32 mm, or other values; this application does not impose specific limitations on this. The width (dimension along the Y-axis) of the heat spreader 120 is 17 mm to 19 mm, for example, 17 mm, 17.2 mm, 17.5 mm, 17.9 mm, 18 mm, 18.4 mm, 18.7 mm, 19 mm, or other values; this application does not impose specific limitations on this. The length (dimension along the X-axis) of the heat spreader 120 is 80 mm to 100 mm, for example, 80 mm, 81 mm, 85 mm, 87 mm, 90 mm, 94 mm, 98 mm, 100 mm, or other values; this application does not impose specific limitations on this.

[0068] In an exemplary embodiment, the thickness of the middle frame 20 and the heat spreader 120 (the dimension along the Z-axis) is 0.75 mm to 1.1 mm, for example, 0.75 mm, 0.8 mm, 0.87 mm, 0.92 mm, 0.95 mm, 1 mm, 1.02 mm, 1.05 mm, 1.1 mm, or other values. This application does not impose specific limitations on this.

[0069] In this embodiment, a portion of the heat spreader 120 protrudes from the second surface 22, meaning that the height of the heat spreader 120 in the Z-axis direction is higher than the second surface 22 of the middle frame 20. It is understood that the protrusion of a portion of the heat spreader 120 from the second surface 22 facilitates heat dissipation from the heat spreader 120.

[0070] like Figure 3 As shown in this embodiment, the receiving hole 23 is a stepped hole, including a first sub-hole 23a and a second sub-hole 23b, which are arranged along the Z-axis. The first sub-hole 23a and the second sub-hole 23b are connected, with the opening of the first sub-hole 23a located on the first surface 21 and the opening of the second sub-hole 23b located on the second surface 22. The central axis of the first sub-hole 23a coincides with the central axis of the second sub-hole 23b, and the diameter of the second sub-hole 23b is larger than the diameter of the first sub-hole 23a. At least a portion of the heat spreader 120 is disposed within the second sub-hole 23b. In other embodiments, a portion of the heat spreader 120 may be disposed within both the first sub-hole 23a and the second sub-hole 23b.

[0071] The heat spreader 120 can be transitionally fitted with the first sub-hole 23a and the second sub-hole 23b to increase the contact area between the heat spreader 120 and the middle frame 20, which is beneficial for the heat spreader 120 to dissipate heat to the middle frame 20.

[0072] Understandably, dividing the receiving hole 23 into a smaller first sub-hole 23a and a larger second sub-hole 23b, and placing at least part of the heat spreader 120 within the larger second sub-hole 23b, increases the heat transfer area between the heat spreader 120 and the middle frame 20. The larger second sub-hole 23b can also accommodate the larger heat spreader 120, resulting in a larger heat dissipation area, which is beneficial for heat dissipation. Moreover, the smaller first sub-hole 23a avoids reducing the structural strength of the middle frame 20 due to the receiving hole 23.

[0073] In this embodiment, the heat spreader 120 includes a first heat spreader 121, a second heat spreader 122, and a third heat spreader 123. The first heat spreader 121 is disposed between the second heat spreader 122 and the third heat spreader 123, and is fixedly connected to both the second heat spreader 122 and the third heat spreader 123. The first heat spreader 121 is disposed within a first sub-hole 23a and a second sub-hole 23b, and at least a portion of the second heat spreader 122 and at least a portion of the third heat spreader 123 are disposed within the second sub-hole 23b. A portion of the first heat spreader 121 protrudes from the second surface 22, a portion of the second heat spreader 122 protrudes from the second surface 22, and a portion of the third heat spreader 123 protrudes from the second surface 22. The first heat spreader 121 protrudes from the heat-conducting layer 130 relative to the second heat spreader 122 and the third heat spreader 123; that is, the heat spreader 120 has a height difference in its thickness direction.

[0074] It should be noted that, for ease of description, this application describes the heat spreader 120 as a first heat spreader 121, a second heat spreader 122, and a third heat spreader 123. In fact, the first heat spreader 121, the second heat spreader 122, and the third heat spreader 123 are a single unit, that is, the first heat spreader 121, the second heat spreader 122, and the third heat spreader 123 can actually be integrally formed.

[0075] Understandably, the first heat dissipation portion 121 is disposed within the first sub-hole 23a and the second sub-hole 23b, and at least a portion of the second heat dissipation portion 122 and at least a portion of the third heat dissipation portion 123 are disposed within the second sub-hole 23b, thereby increasing the contact area between the heat dissipation plate 120 and the middle frame 20, which is beneficial for the heat dissipation plate 120 to the middle frame 20. Moreover, by having a height difference in its thickness direction, the heat dissipation plate 120 can be adapted to middle frames 20 of different heights and shapes, as well as to electronic devices 110 placed in different positions and with different structures, and the overall thickness of the heat dissipation plate 120 and the middle frame 20 can also be reduced.

[0076] In this embodiment, the middle frame assembly 100 further includes a heat transfer element 140. The heat transfer element 140 is disposed on a portion of the surface of the heat spreader 120 facing away from the heat-conducting layer 130 and a portion of the second surface 22 of the middle frame 20. The heat transfer element 140 is fixedly connected to the heat spreader 120 and the middle frame 20, respectively. The heat transfer element 140 is used to conduct heat from the heat spreader 120 to the middle frame 20. The heat transfer element 140 can be T-shaped overall, with its horizontal portion connected to the heat spreader 120 and its vertical portion connected to the middle frame 20.

[0077] In an exemplary embodiment, the heat transfer element 140 can be a material with good thermal conductivity and low density, such as graphite sheet, copper film, or copper foil. The heat transfer element 140 is fixed to the middle frame 20 and the heat spreader 120 by adhesive bonding.

[0078] In an exemplary embodiment, the heat transfer element 140 is fixedly connected to the surfaces of the second heat-spreading section 122 and the third heat-spreading section 123 facing away from the circuit board 40, respectively. The heat transfer element 140 may be a graphite sheet. The heat transfer element 140 is a hollow frame structure, and the orthographic projection of the hollow part of the heat transfer element 140 in the Z-axis direction coincides with the orthographic projection of the first heat-spreading section 121 in the Z-axis direction.

[0079] Understandably, the heat spreader 120 can transfer heat through direct contact with the middle frame 20. To improve the heat transfer efficiency between the heat spreader 120 and the middle frame 20, the heat spreader 120 can also transfer heat to the middle frame 20 through the heat transfer element 140.

[0080] Please see Figure 2 , Figure 4 and Figure 5 , Figure 4 for Figure 3 The diagram shows the heat conduction path of the mid-frame component. Figure 5 This is a schematic diagram of the heat conduction direction of the mid-frame assembly disclosed in an embodiment of this application. Figure 2 , Figure 4 and Figure 5 The direction indicated by the middle arrow is the direction of heat conduction.

[0081] The heat generated by the electronic device 110 is conducted to the hot zone of the heat spreader 120 through the heat-conducting layer 130. The heat in the hot zone of the heat spreader 120 is conducted to the cold zone of the heat spreader 120 through phase change heat transfer. The heat in the cold zone of the heat spreader 120 is conducted to the middle frame 20 through radiation heat transfer and heat conduction. The heat in the cold zone of the heat spreader 120 is conducted to the middle frame 20 through the heat transfer element 140.

[0082] This application uses the heat-conducting layer 130, heat-spreading plate 120, heat transfer component 140 and middle frame 20 to transfer and dissipate heat, thereby improving the heat dissipation efficiency of the middle frame assembly 100 and meeting the heat dissipation requirements of the electronic device 1.

[0083] In an exemplary embodiment, the mid-frame assembly 100 further includes an adhesive backing 150, which is disposed on the first surface 21 of the mid-frame 20. The battery 50 is disposed on the surface of the adhesive backing 150 facing away from the mid-frame 20. The adhesive backing 150 is fixedly connected to both the mid-frame 20 and the battery 50, i.e., the battery 50 is fixed to the mid-frame 20 by the adhesive backing 150. The number of batteries 50 can be one, with one battery 50 surrounding the periphery of the circuit board 40, or the number of batteries 50 can be multiple.

[0084] Understandably, the battery 50 is disposed on one side of the first surface 21 of the middle frame 20, so that the second surface 22 of the middle frame 20 can be provided with a larger area heat transfer element 140, and the larger area heat transfer element 140 is beneficial to conduct heat to the middle frame 20.

[0085] In an exemplary embodiment, the circuit board 40 has a mounting hole 40a that extends through the circuit board 40 along the Z-axis. The mid-frame assembly 100 also includes a screw 160, which is disposed within the mounting hole 40a and connected to the mid-frame 20. The screw 160 is fixedly connected to both the circuit board 40 and the mid-frame 20, and the circuit board 40 is fixedly connected to the mid-frame 20 via the screw 160. The screw 160 includes a nut, which is located on the side of the circuit board 40 facing away from the mid-frame 20. In other embodiments, the circuit board 40 can also be fixed to the mid-frame 20 by a snap-fit ​​mechanism.

[0086] In an exemplary embodiment, the circuit board 40 has heat dissipation holes 40b that penetrate the circuit board 40 along the Z-axis direction, and the heat dissipation holes 40b are spaced apart from the mounting holes 40a. It can be understood that by creating heat dissipation holes 40b on the circuit board 40, the internal layer structure of the circuit board 40 is exposed, which is beneficial for heat dissipation of the circuit board 40.

[0087] In an exemplary embodiment, the mid-frame assembly 100 further includes a shielding member 180, which surrounds the periphery of the electronic device 110 and is spaced apart from the electronic device 110. The shielding member 180 is located between the mid-frame 20 and the circuit board 40, and is fixedly connected to both the mid-frame 20 and the circuit board 40.

[0088] Understandably, the operation of the electronic device 110 will be affected by electromagnetic interference (EMI). Therefore, a shield 180 is provided around the electronic device 110 to isolate electromagnetic interference and prevent electromagnetic interference from affecting the electronic device 110.

[0089] Please see Figure 6 , Figure 6 for Figure 2 The second cross-sectional view of the middle frame assembly along direction II is shown. Figure 6 The shown mid-frame component and Figure 3 The difference in the shown mid-frame assembly is that the mid-frame assembly 100 also includes a thermal insulation ring 170. Figure 6 The shown mid-frame component and Figure 3 For a description of the identical structures among the shown mid-frame components, please refer to [link / reference]. Figure 3 The description of the mid-frame component shown will not be repeated here.

[0090] Please see Figure 6 and Figure 7 , Figure 7 for Figure 6 The diagram shows an enlarged view of structure II. The middle frame assembly 100 also includes a heat insulation ring 170, which is disposed between the circuit board 40 and the screw 160. Specifically, the heat insulation ring 170 is disposed between the nut of the screw 160 and the circuit board 40.

[0091] Understandably, the electronic device 110 is fixedly connected to the circuit board 40, and the screw 160 is also fixedly connected to the circuit board 40 and the middle frame 20. The heat generated by the electronic device 110 is conducted to the middle frame 20 through the circuit board 40 and the screw 160. Because the contact area between the screw 160 and the middle frame 20 is small, a high temperature occurs at the connection point. Therefore, to prevent localized high temperatures in the middle frame 20, a heat insulation ring 170 is provided between the circuit board 40 and the screw 160.

[0092] In summary, the electronic device 1 provided in this application includes a mid-frame assembly 100, which includes a mid-frame 20, an electronic device 110, a circuit board 40, a heat spreader 120, and a thermally conductive layer 130. The mid-frame 20 includes a first surface 21 and a second surface 22 disposed opposite to each other. The mid-frame 20 has a receiving hole 23 that penetrates the first surface 21 and the second surface 22. The circuit board 40 is disposed facing the first surface 21, and the electronic device 110 is disposed on the surface of the circuit board 40 facing the receiving hole 23. At least a portion of the heat spreader 120 is disposed within the receiving hole 23, and the thermally conductive layer 130 connects the electronic device 110 and the heat spreader 120. Therefore, the mid-frame assembly 100 provided in this application is applied to a tablet computer. By setting the heat dissipation heat dissipation plate 120 in the receiving hole 23 of the mid-frame 20, the overall thickness of the heat dissipation plate 120 and the mid-frame 20 is reduced. The overall thickness of the heat dissipation plate 120 and the mid-frame 20 is reduced by 0.15mm to 0.3mm, thereby meeting the requirements of the tablet computer's thin and light design.

[0093] This application embodiment also provides a rear cover assembly, which includes the aforementioned rear cover 30, circuit board 40, and battery 50. Please refer to... Figure 8 , Figure 8 This is a schematic diagram of the first layer structure of the rear shell assembly disclosed in this application. The rear shell assembly 200 includes a rear shell 30, an electronic device 110, a circuit board 40, a heat spreader 120, and a heat-conducting layer 130. The rear shell 30 is fixedly connected to the circuit board 40, the electronic device 110 is fixedly connected to the circuit board 40, the heat spreader 120 is fixedly connected to the rear shell 30, and the heat-conducting layer 130 is fixedly connected between the electronic device 110 and the heat spreader 120.

[0094] For ease of description, define Figure 8 The length direction of the rear shell 30 shown is the X-axis direction, the width direction is the Y-axis direction, and the thickness direction is the Z-axis direction. The X-axis, Y-axis, and Z-axis directions are all perpendicular to each other. Alternatively, the width direction of the rear shell 30 can be the X-axis direction, and the length direction can be the Y-axis direction; this application does not impose a specific limitation on this.

[0095] In this embodiment, the rear shell 30 includes an inner surface 31 and an outer surface 32, which are disposed opposite to each other. The inner surface 31 faces the Z-axis direction, and the outer surface 32 faces away from the Z-axis direction. The inner surface 31 is located inside the electronic device 1, and the outer surface 32 is located outside the electronic device 1. The user can contact the outer surface 32 when using the electronic device 1.

[0096] The inner surface 31 of the rear shell 30 has a receiving groove 33, the depth direction of which is parallel to the Z-axis. The circuit board 40 is positioned facing the inner surface 31, i.e., on the side of the inner surface 31 opposite to the outer surface 32, and spaced apart from the inner surface 31. The circuit board 40 is fixedly connected to the rear shell 30. At least a portion of the heat spreader 120 is disposed within the receiving groove 33 and is fixedly connected to the rear shell 30. A thermally conductive layer 130 is disposed between the electronic device 110 and the heat spreader 120, and is fixedly connected to both the electronic device 110 and the heat spreader 120. The heat spreader 120 and the rear shell 30 can be fixed using a skirt adhesive.

[0097] Understandably, this application reduces the overall thickness of the heat dissipation plate 120 and the rear shell 30 by placing the heat dissipation heat dissipation plate 120 within the receiving groove 33 of the rear shell 30. The overall thickness of the heat dissipation plate 120 and the rear shell 30 is reduced by 0.15mm to 0.3mm, thereby meeting the requirements of the thinner and lighter design of the electronic device 1. Moreover, by providing a heat-conducting layer 130 between the electronic device 110 and the heat dissipation plate 120, the heat-conducting layer 130 improves the heat transfer efficiency between the electronic device 110 and the heat dissipation plate 120. More heat from the electronic device 110 is conducted to the heat dissipation plate 120, which is beneficial for heat dissipation of the electronic device 110. The heat from the heat dissipation plate 120 is also conducted to the rear shell 30 for heat dissipation. The rear shell 30 has a larger area and higher heat dissipation efficiency.

[0098] Please refer to Table 1, which compares the temperatures at different locations with and without the heat-conducting layer 130. Table 1 shows that without the heat-conducting layer 130, the temperature of the display screen 10 is 41.1℃, and the temperature of the back cover 30 is 38.3℃. The temperature difference between the display screen 10 and the back cover 30 is large, and the back cover 30 has a large temperature margin, resulting in an unreasonable thermal resistance distribution for the electronic device 1. With the heat-conducting layer 130, the temperature of the display screen 10 is 40.2℃, and the temperature of the back cover 30 is 39.7℃. The temperature of the display screen 10 decreases by 0.9℃, while the temperature of the back cover 30 increases by 1.3℃. The temperature difference between the display screen 10 and the back cover 30 decreases, and the thermal resistance distribution for the electronic device 1 is more reasonable. Without the heat-conducting layer 130, the temperature of the electronic device 110 is 86°C. With the heat-conducting layer 130, the temperature of the electronic device 110 is 78°C, which is 8°C lower. Therefore, the heat-conducting layer 130 can significantly reduce the temperature of the electronic device 110, which is beneficial for heat dissipation.

[0099] Table 1. Temperature comparison at different locations with and without a heat-conducting layer.

[0100] No thermal conductive layer There is a thermally conductive layer Ambient temperature (°C) 25 25 Total power consumption (W) 7.05 7.04 Display screen temperature (°C) 41.1 40.2 Temperature of the rear shell (°C) 38.3 39.7 Temperature (°C) of electronic devices 86 78

[0101] In an exemplary embodiment, the depth of the receiving groove is 0.05 mm to 0.23 mm, for example, 0.05 mm, 0.08 mm, 0.1 mm, 0.12 mm, 0.15 mm, 0.19 mm, 0.2 mm, 0.21 mm, 0.23 mm, or other values. This application does not impose specific limitations on this.

[0102] In an exemplary embodiment, the thickness (dimension along the Z-axis) of the rear shell 30 and the heat spreader 120 is 0.75 mm to 1.1 mm, for example, 0.75 mm, 0.8 mm, 0.87 mm, 0.92 mm, 0.95 mm, 1 mm, 1.02 mm, 1.05 mm, 1.1 mm, or other values. This application does not impose specific limitations on these values.

[0103] In this embodiment, a portion of the heat spreader 120 protrudes from the inner surface 31, meaning that the height of the heat spreader 120 in the Z-axis direction is higher than that of the inner surface 31. It is understood that the protrusion of the portion of the heat spreader 120 from the inner surface 31 facilitates heat dissipation from the heat spreader 120.

[0104] like Figure 8As shown in this embodiment, the receiving groove 33 is a stepped groove, including a first sub-groove 33a and a second sub-groove 33b, which are arranged along the Z-axis. The first sub-groove 33a and the second sub-groove 33b are connected. The opening of the first sub-groove 33a is formed on the inner surface 31, and the opening of the second sub-groove 33b is formed on a portion of the bottom wall of the first sub-groove 33a. The side wall of the first sub-groove 33a is larger than the side wall of the second sub-groove 33b, that is, the orthographic projection of the inner wall of the second sub-groove 33b in the Z-axis direction is located within the orthographic projection of the inner wall of the first sub-groove 33a in the Z-axis direction. At least a portion of the heat spreader 120 is disposed within the first sub-groove 33a. In other embodiments, a portion of the heat spreader 120 may be disposed within both the first sub-groove 33a and the second sub-groove 33b.

[0105] The heat spreader 120 can be transitionally fitted with the side wall of the first sub-slot 33a and the side wall of the second sub-slot 33b to increase the contact area between the heat spreader 120 and the rear shell 30, which is beneficial for the heat spreader 120 to dissipate heat to the rear shell 30.

[0106] Understandably, dividing the receiving groove 33 into a first sub-groove 33a with a larger sidewall size and a second sub-groove 33b with a smaller sidewall size, and placing at least part of the heat spreader 120 within the first sub-groove 33a with the larger sidewall size, increases the heat transfer area between the heat spreader 120 and the rear shell 30. The first sub-groove 33a with the larger sidewall size can also accommodate the larger heat spreader 120, resulting in a larger heat dissipation area, which is beneficial for heat dissipation. Moreover, the second sub-groove 33b with the smaller aperture can prevent the receiving groove 33 in the rear shell 30 from reducing the structural strength of the rear shell 30.

[0107] In this embodiment, the heat spreader 120 includes a first heat spreader 121, a second heat spreader 122, and a third heat spreader 123. The first heat spreader 121 is disposed between the second heat spreader 122 and the third heat spreader 123, and is fixedly connected to both the second heat spreader 122 and the third heat spreader 123. The first heat spreader 121 is disposed within a first sub-groove 33a and a second sub-groove 33b, and at least a portion of the second heat spreader 122 and at least a portion of the third heat spreader 123 are disposed within the first sub-groove 33a. A portion of the first heat spreader 121 protrudes from the inner surface 31, a portion of the second heat spreader 122 protrudes from the inner surface 31, and a portion of the third heat spreader 123 protrudes from the inner surface 31. The first heat spreader 121 protrudes from the heat-conducting layer 130 relative to the second heat spreader 122 and the third heat spreader 123; that is, the heat spreader 120 has a height difference in its thickness direction.

[0108] Understandably, the first heat dissipation portion 121 is disposed within the first sub-slot 33a and the second sub-slot 33b, and at least a portion of the second heat dissipation portion 122 and at least a portion of the third heat dissipation portion 123 are disposed within the first sub-slot 33a, thereby increasing the contact area between the heat dissipation plate 120 and the rear shell 30, which is beneficial for the heat dissipation plate 120 to the rear shell 30. Moreover, by having a height difference in its thickness direction, the heat dissipation plate 120 can be adapted to rear shells 30 of different heights and shapes, as well as to electronic devices 110 placed in different positions and with different structures, and the overall thickness of the heat dissipation plate 120 and the rear shell 30 can also be reduced.

[0109] In this embodiment, the rear shell assembly further includes a heat transfer element 140. The heat transfer element 140 is disposed on a portion of the surface of the heat spreader 120 facing away from the heat-conducting layer 130 and a portion of the inner surface 31 of the rear shell 30. The heat transfer element 140 is fixedly connected to both the heat spreader 120 and the rear shell 30. The heat transfer element 140 is used to conduct heat from the heat spreader 120 to the rear shell 30. The heat transfer element 140 can be T-shaped overall, with its horizontal portion connected to the heat spreader 120 and its vertical portion connected to the middle frame 20.

[0110] Understandably, the heat spreader 120 can transfer heat through direct contact with the rear shell 30. To improve the heat transfer efficiency between the heat spreader 120 and the rear shell 30, the heat spreader 120 can also transfer heat to the rear shell 30 through the heat transfer element 140.

[0111] Please see Figure 9 and Figure 10 , Figure 9 for Figure 8 The diagram shows the heat conduction path of the rear shell assembly. Figure 10 This is a schematic diagram of the heat conduction direction of the rear shell assembly disclosed in an embodiment of this application. Figure 9 and Figure 10 The direction indicated by the middle arrow is the direction of heat conduction.

[0112] The heat generated by the electronic device 110 is conducted to the hot zone of the heat spreader 120 through the heat-conducting layer 130. The heat in the hot zone of the heat spreader 120 is conducted to the cold zone of the heat spreader 120 through phase change heat transfer. The heat in the cold zone of the heat spreader 120 is conducted to the rear shell 30 through radiation heat transfer and heat conduction. The heat in the cold zone of the heat spreader 120 is conducted to the rear shell 30 through the heat transfer element 140.

[0113] In an exemplary embodiment, the rear housing assembly 200 further includes an adhesive backing 150, which is disposed on the inner surface 31 of the rear housing 30. The battery 50 is disposed on the surface of the adhesive backing 150 facing away from the rear housing 30. The adhesive backing 150 is fixedly connected to both the rear housing 30 and the battery 50, i.e., the battery 50 is fixed to the rear housing 30 by the adhesive backing 150. The battery 50 is connected to the heat transfer element 140.

[0114] Understandably, the battery 50 is connected to the heat transfer element 140, and the heat generated by the battery 50 during operation can also be transferred to the rear shell 30 through the heat transfer element 140, thereby achieving heat dissipation for the battery 50.

[0115] In an exemplary embodiment, the circuit board 40 has a mounting hole 40a that extends through the circuit board 40 along the Z-axis. The rear housing assembly 200 also includes a screw 160, which is disposed within the mounting hole 40a and connected to the rear housing 30. The screw 160 is fixedly connected to both the circuit board 40 and the rear housing 30, and the circuit board 40 is fixedly connected to the rear housing 30 via the screw 160. The screw 160 includes a nut, which is located on the side of the circuit board 40 facing away from the rear housing 30. In other embodiments, the circuit board 40 can also be fixed to the rear housing 30 by a snap-fit ​​mechanism.

[0116] In an exemplary embodiment, the number of mounting holes 40a can be multiple, such as 2, 4, 6, 10, or other numbers, and this application does not impose a specific limitation on this. The number of screws 160 is the same as the number of mounting holes 40a, with one screw 160 being fitted into one mounting hole 40a.

[0117] In an exemplary embodiment, the circuit board 40 has a heat dissipation hole 40b that extends through the circuit board 40 along the Z-axis and is spaced apart from the mounting hole 40a. It can be understood that by creating the heat dissipation hole 40b on the circuit board 40, the internal layer structure of the circuit board 40 is exposed, which is beneficial for heat dissipation.

[0118] The number of heat dissipation holes 40b can be multiple, such as 2, 5, 7, 10 or other numbers, and this application does not impose a specific limitation on this.

[0119] In an exemplary embodiment, the heat transfer element 140 has a clearance hole 140a, the rear shell 30 is exposed through the clearance hole 140a, the screw 160 passes through the clearance hole 140a and is fixedly connected to the rear shell 30, and the screw 160 is spaced apart from the hole wall of the clearance hole 140a.

[0120] The number of clearance holes 140a is the same as the number of screws 160, with one screw 160 passing through one clearance hole 140a.

[0121] In an exemplary embodiment, the rear shell assembly 200 further includes conductive foam 190, which is disposed between the circuit board 40 and the heat spreader 120. The conductive foam 190 is fixedly connected to both the circuit board 40 and the heat spreader 120, and surrounds the electronic device 110, with a gap between the conductive foam 190 and the electronic device 110. The circuit board 40 is grounded through the conductive foam 190.

[0122] Understandably, grounding the circuit board 40 via the conductive foam 190 can provide a stable reference potential for the devices on the circuit board 40 and reduce electromagnetic interference.

[0123] Please see Figure 11 , Figure 11 This is a schematic diagram of the second layer structure of the rear shell assembly disclosed in the embodiments of this application. Figure 11 The rear shell assembly shown is Figure 8 The difference in the rear shell assembly shown is that the rear shell assembly 200 also includes a heat insulation ring 170. Figure 11 The rear shell assembly shown is Figure 8 For a description of the identical structures among the rear shell components shown, please refer to [link / reference]. Figure 8 The description of the rear shell assembly shown will not be repeated here.

[0124] Please see Figure 11 and Figure 12 , Figure 12 for Figure 11 The diagram shows an enlarged view of structure III. The rear housing assembly 200 also includes a heat insulation ring 170, which is disposed between the circuit board 40 and the screw 160. Specifically, the heat insulation ring 170 is disposed between the nut of the screw 160 and the circuit board 40.

[0125] Understandably, the electronic device 110 is fixedly connected to the circuit board 40, and the screw 160 is also fixedly connected to the circuit board 40 and the rear housing 30. The heat generated by the electronic device 110 is conducted to the rear housing 30 through the circuit board 40 and the screw 160. Because the contact area between the screw 160 and the rear housing 30 is small, the connection point between them experiences high temperatures. Therefore, to prevent localized high temperatures in the rear housing 30, a heat insulation ring 170 is installed between the circuit board 40 and the screw 160.

[0126] Please refer to Table 2, which compares the temperatures at the connection between the rear shell 30 and the screw with and without the heat insulation ring 170. Without the heat insulation ring 170, the temperature at the connection between the rear shell 30 and the screw 160 is 40.1℃. With the heat insulation ring 170, the temperature at the connection between the rear shell 30 and the screw 160 is 39.0℃. Therefore, by installing the heat insulation ring 170, the temperature at the connection between the shell 30 and the screw 160 is reduced by 1.1℃, preventing localized high temperatures in the rear shell 30.

[0127] Table 2. Temperature comparison at the rear shell and screw connection with and without a heat insulation ring.

[0128] No heat insulation ring With heat insulation ring Ambient temperature(℃) 25 25 Total power consumption (W) 7.05 7.04 Temperature at the junction of the rear housing and the screws (°C) 40.1 39.0

[0129] In an exemplary embodiment, the back cover 30 is made of leather or plastic. The back cover 30 can be formed by stamping, computerized numerical control (CNC) process or injection molding process.

[0130] In summary, the electronic device 1 provided in this embodiment includes a back cover assembly 200, which includes a back cover 30, electronic components 110, a circuit board 40, a heat spreader 120, and a heat-conducting layer 130. The back cover 30 includes an inner surface 31, and an accommodating groove 33 is formed on the inner surface 31. At least a portion of the heat spreader 120 is disposed within the accommodating groove 33. The circuit board 40 is disposed facing the inner surface 31, and the electronic components 110 are disposed on the surface of the circuit board 40 facing the heat spreader 120. The heat-conducting layer 130 connects the electronic components 110 and the heat spreader 120. Therefore, the back cover assembly 200 provided in this application is applied to a tablet computer. By distributing the heat spreader 120 for heat dissipation within the accommodating groove 33 of the back cover 30, the overall thickness of the heat spreader 120 and the back cover 30 is reduced by 0.15 mm to 0.3 mm, thereby meeting the requirements for a thinner and lighter tablet computer design.

[0131] It should be understood that the application of this application is not limited to the examples above. Those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims. Those skilled in the art can understand that implementing all or part of the processes of the above embodiments and making equivalent changes according to the claims of this application still fall within the scope of this application.

Claims

1. A mid-frame component, characterized in that, The device includes a mid-frame, electronic components, a circuit board, a heat spreader, and a thermally conductive layer. The mid-frame includes a first surface and a second surface disposed opposite to each other. The mid-frame has a receiving hole that penetrates the first surface and the second surface. The circuit board is disposed facing the first surface. The electronic components are disposed on the surface of the circuit board facing the receiving hole. At least a portion of the heat spreader is disposed within the receiving hole. The thermally conductive layer connects the electronic components and the heat spreader.

2. The mid-frame assembly as described in claim 1, characterized in that, Part of the heat spreader protrudes from the second surface.

3. The mid-frame assembly as described in claim 1, characterized in that, The receiving hole includes a first sub-hole and a second sub-hole, the first sub-hole and the second sub-hole are connected, the opening of the first sub-hole is opened on the first surface, the opening of the second sub-hole is opened on the second surface, the diameter of the second sub-hole is larger than the diameter of the first sub-hole, and at least part of the heat spreader is disposed in the second sub-hole.

4. The mid-frame assembly as described in claim 3, characterized in that, The heat spreader includes a first heat spreader, a second heat spreader, and a third heat spreader. The first heat spreader is connected between the second heat spreader and the third heat spreader. The first heat spreader is disposed in the first sub-hole and the second sub-hole. At least a portion of the second heat spreader and at least a portion of the third heat spreader are disposed in the second sub-hole.

5. The mid-frame assembly as described in any one of claims 1-4, characterized in that, The mid-frame assembly further includes a heat transfer element disposed on the surface of the heat spreader opposite to the heat-conducting layer and the second surface of the mid-frame.

6. The mid-frame assembly as described in any one of claims 1-4, characterized in that, The mid-frame assembly further includes a battery and an adhesive backing, the adhesive backing being disposed on the first surface of the mid-frame, and the battery being disposed on the surface of the adhesive backing facing away from the mid-frame.

7. The mid-frame assembly as described in any one of claims 1-4, characterized in that, The circuit board has mounting holes, and the middle frame assembly also includes screws and a heat insulation ring. The screws are disposed in the mounting holes and are fixedly connected to the circuit board and the middle frame respectively. The heat insulation ring is disposed between the circuit board and the screw nut.

8. The mid-frame assembly as described in claim 7, characterized in that, The circuit board has heat dissipation holes, which are spaced apart from the mounting holes.

9. The mid-frame assembly as described in any one of claims 1-4, characterized in that, The heat spreader has a thickness of 0.27 mm to 0.32 mm, a width of 17 mm to 19 mm, and a length of 80 mm to 100 mm.

10. The mid-frame assembly as described in any one of claims 1-4, characterized in that, The combined thickness of the middle frame and the heat spreader is 0.75 mm to 1.1 mm.

11. The mid-frame assembly as described in any one of claims 1-4, characterized in that, The depth of the receiving hole is 0.5 mm to 0.7 mm.

12. A rear shell assembly, characterized in that, The device includes a back cover, electronic components, a circuit board, a heat spreader, and a thermal conductive layer. The back cover includes an inner surface with a receiving groove. At least a portion of the heat spreader is disposed within the receiving groove. The circuit board is disposed facing the inner surface. The electronic components are disposed on the surface of the circuit board facing the heat spreader. The thermal conductive layer connects the electronic components and the heat spreader.

13. The rear shell assembly as claimed in claim 12, characterized in that, Part of the heat spreader protrudes from the inner surface.

14. The rear shell assembly as claimed in claim 12, characterized in that, The receiving groove includes a first sub-groove and a second sub-groove, the first sub-groove and the second sub-groove are connected, the opening of the first sub-groove is opened on the inner surface, the opening of the second sub-groove is opened on the bottom wall of the first sub-groove, the size of the side wall of the first sub-groove is larger than the size of the side wall of the second sub-groove, and at least part of the heat spreader is disposed in the first sub-groove.

15. The rear shell assembly as claimed in claim 14, characterized in that, The heat spreader further includes a first heat spreader, a second heat spreader, and a third heat spreader. The first heat spreader is connected between the second heat spreader and the third heat spreader. The first heat spreader is disposed in the first sub-slot and the second sub-slot. At least a portion of the second heat spreader and at least a portion of the third heat spreader are disposed in the first sub-slot.

16. The rear shell assembly as claimed in any one of claims 12-15, characterized in that, The rear shell assembly further includes a heat transfer element disposed on the surface of the heat spreader opposite to the heat-conducting layer and on the inner surface of the rear shell.

17. The rear shell assembly as claimed in claim 16, characterized in that, The circuit board has mounting holes, and the rear shell assembly also includes screws and a heat insulation ring. The screws are disposed in the mounting holes and are fixedly connected to the circuit board and the rear shell respectively. The heat insulation ring is disposed between the circuit board and the screw nut.

18. The rear shell assembly as claimed in claim 17, characterized in that, The circuit board has heat dissipation holes, which are spaced apart from the mounting holes.

19. The rear shell assembly as claimed in claim 17, characterized in that, The heat transfer element has a clearance hole, the rear shell is exposed through the clearance hole, the screw passes through the clearance hole and is fixedly connected to the rear shell, and the screw is spaced apart from the hole wall of the clearance hole.

20. The rear shell assembly as claimed in claim 16, characterized in that, The rear housing assembly also includes a battery and an adhesive backing. The adhesive backing is disposed on the inner surface of the rear housing, and the battery is disposed on the surface of the adhesive backing facing away from the rear housing. The battery is connected to the heat transfer element.

21. The rear shell assembly as claimed in any one of claims 12-15, characterized in that, The heat spreader has a thickness of 0.27 mm to 0.32 mm, a width of 17 mm to 19 mm, and a length of 80 mm to 100 mm.

22. The rear shell assembly as claimed in any one of claims 12-15, characterized in that, The combined thickness of the rear shell and the heat spreader is 0.75 mm to 1.1 mm.

23. The rear shell assembly as claimed in any one of claims 12-15, characterized in that, The depth of the receiving groove is 0.05 mm to 0.23 mm.

24. An electronic device, characterized in that, It includes a rear shell and a mid-frame assembly as described in any one of claims 1-11, wherein the mid-frame of the mid-frame assembly is connected to the rear shell; or it includes a mid-frame and a rear shell assembly as described in any one of claims 12-23, wherein the rear shell of the rear shell assembly is connected to the mid-frame.

25. The electronic device as claimed in claim 24, characterized in that, The electronic device is a tablet computer.

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