Active waterproof heat dissipation structure and imaging device

Abstract

The utility model discloses an active waterproof heat dissipation structure and imaging equipment relates to electrical waterproof technical field, and the inside of main body shell is equipped with heating device and heat conduction assembly, and heat conduction assembly respectively with heating device and heat dissipation subassembly heat conduction contact, and the heat of heating device generates conduction to heat dissipation subassembly through heat conduction assembly, and heat dissipation subassembly spreads heat to the outside, heat dissipation subassembly partial structure is located main body shell inside, partial structure is located main body shell outside, and heat dissipation subassembly and main body shell keep sealed assembly, and ensure good waterproof dustproof performance. In a specific embodiment, through the characteristic of the phase change material of the encapsulation inside the heat pipe, the heat transfer is realized through the phase change, and the active heat dissipation is provided with the help of the heat dissipation fan, and the heat dissipation efficiency is effectively improved compared with the passive heat dissipation.

Description

Technical Field

[0001] This utility model relates to the field of electrical waterproofing technology, and more specifically to an active waterproofing and heat dissipation structure. This utility model also relates to an imaging device. Background Technology

[0002] Electronic devices are increasingly becoming more integrated and miniaturized, enabling more functions while reducing product size and bringing greater practicality. However, this high integration and miniaturization has led to a significant increase in power density. If the chip temperature is too high, performance and lifespan will drop significantly, making heat dissipation measures essential.

[0003] The equipment is divided into indoor and outdoor use. The outdoor environment is complex and harsh, not as simple and controllable as the indoor environment. In comparison, equipment used outdoors requires more protection to ensure normal operation and extend its lifespan. For example, when the equipment is used at the seaside, measures such as rain and corrosion protection must be taken, and even inert gas may be filled inside the equipment to protect the components. In this case, the internal component temperature rises, and outside air cannot enter for heat exchange. The heat dissipation by the main body of the equipment alone is far from enough, and a heat dissipation system is needed to quickly reduce the internal temperature.

[0004] Traditional heat dissipation structures involve setting up heat-conducting structures on the inner wall of the main body shell, relying on heat conduction to dissipate heat outward from the main body shell. This passive heat conduction method is inefficient.

[0005] For those skilled in the art, how to improve heat dissipation performance and develop a heat dissipation system with good sealing and protection performance is a technical problem that needs to be solved. Utility Model Content

[0006] The core of this invention is to provide an active waterproof heat dissipation structure that forms a good seal between the inner cavity of the shell and the outside environment, and achieves rapid heat conduction through heat pipes to improve heat dissipation efficiency. The specific solution is as follows:

[0007] An active waterproof heat dissipation structure includes a main shell with a heating element and a heat conduction component inside. The heat conduction component is in thermal contact with the heating element and the heat dissipation component. A portion of the heat dissipation component is located inside the main shell, and a portion is located outside the main shell. The heat dissipation component is sealed to the main shell. The heat generated by the heating element is conducted to the heat dissipation component through the heat conduction component, and the heat dissipation component dissipates the heat to the outside.

[0008] Optionally, the heat conduction component includes a heat-conducting plate, a heat pipe, and a heat-collecting plate. The heat-conducting plate is used to contact the heating device to conduct heat, and the heat pipe is connected to the heat-conducting plate and the heat-collecting plate respectively to conduct heat.

[0009] Optionally, the heat dissipation assembly includes a heat dissipation shell, heat dissipation fins, and a heat dissipation fan. The heat dissipation shell is sealed and assembled to the main body shell, and the heat dissipation fins and the heat dissipation fan are assembled inside the heat dissipation shell. The heat dissipation fins contact the heat collection plate to conduct heat.

[0010] The heat dissipation fins contact the heat collection plate; the heat dissipation fins and the heat dissipation shell are sealed together by a first sealing ring.

[0011] Optionally, the heat pipe has a capillary structure inside for filling phase change material.

[0012] Optionally, the heat sink includes a heat sink base and a cover plate. An air intake duct and an air exhaust duct are provided on the cover plate. The cooling fan is used to draw in air, so that the air enters from the air intake duct, passes through the heat sink fins, and is discharged from the air exhaust duct.

[0013] Optionally, the heat dissipation fins are arranged vertically, the air inlet duct is located in the lower region of the cover plate, and the air outlet duct is located in the upper region of the cover plate. The vertical position of the air inlet duct is lower than the bottom end of the heat dissipation fins, and the vertical position of the air outlet duct is higher than the top end of the heat dissipation fins.

[0014] Optionally, the radiator base is provided with a mounting flange, which contacts the inner surface of the main body housing and is fixed by screws;

[0015] A second sealing ring is provided between the mounting flange and the main housing;

[0016] The cover plate is provided with fixing holes for fixing to the outer surface of the main body shell by screws.

[0017] Optionally, at least two heat-conducting plates are provided, and the heat pipes leading out from different heat-conducting plates are alternately distributed on the heat-collecting plates.

[0018] Optionally, the heat pipe is welded or press-fitted to the heat-conducting plate and the heat-collecting plate.

[0019] Optionally, a fan bracket is fixedly mounted on the radiator base, and the cooling fan is mounted on the fan bracket;

[0020] The radiator base is equipped with a connector to connect wires to the internal control circuit of the device.

[0021] A temperature sensor is provided on the heating device or the heat-conducting plate, and the control circuit acquires the temperature signal from the temperature sensor and controls the cooling fan according to the temperature.

[0022] This utility model also provides an imaging device, including the active waterproof heat dissipation structure described in any one of the above claims.

[0023] This invention provides an active waterproof heat dissipation structure. The main body shell houses a heating element and a heat conduction component. The heat conduction component is in thermal contact with both the heating element and the heat dissipation component. Heat generated by the heating element is conducted to the heat dissipation component via the heat conduction component, which then dissipates the heat to the outside. Part of the heat dissipation component is located inside the main body shell, and part is located on the outside. The heat dissipation component is sealed to the main body shell to ensure good waterproof and dustproof performance. In one specific embodiment, the phase change material encapsulated inside the heat pipe utilizes its own properties to transfer and dissipate heat through phase changes, and an active cooling fan provides further cooling, effectively improving heat dissipation efficiency compared to passive cooling. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is an exploded view of the active waterproof heat dissipation structure of this utility model;

[0026] Figure 2 This is a partial cross-sectional view of the active waterproof heat dissipation structure of this utility model;

[0027] Figure 3 This is an exploded view of the heat conduction components;

[0028] Figure 4 This is an exploded view of the heat dissipation component.

[0029] The image includes:

[0030] Main body shell 1, heat conduction component 2, heat conduction plate 21, heat pipe 22, heat collection plate 23, heat dissipation component 3, heat dissipation shell 31, heat sink base 311, mounting flange 3111, cover plate 312, air intake duct 3121, air exhaust duct 3122, fixing hole 3123, fan bracket 313, connector 314, heat dissipation fins 32, cooling fan 33, first sealing ring 34, second sealing ring 35. Detailed Implementation

[0031] To enable those skilled in the art to better understand the technical solution of this utility model, the active waterproof heat dissipation structure of this utility model will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] Combination Figure 1 , Figure 2 As shown, this utility model provides an active waterproof heat dissipation structure, including a main shell 1, a heat conduction component 2, a heat dissipation component 3, etc., wherein the main shell 1 is a hollow shell structure, and the main shell 1 adopts a split assembly structure. The main shell 1 includes an upper cover 11 and a lower base plate 12. The upper cover 11 is provided with circumferential sidewalls. Figure 1 The middle part is a cylindrical side wall, and the upper part of the upper cover 11 is provided with a top plate; the lower bottom plate 12 is a bottom plate structure, and the lower bottom plate 12 and the upper cover 11 are spliced ​​and fixed to each other to form an internal cavity for placing devices.

[0033] The heating element and heat conduction component 2 are housed within the internal cavity of the main body shell 1, combined with Figure 1 As shown, the heating element is usually mounted on the circuit board 4. When the heating element on the circuit board 4 is working, it generates heat and needs to be dissipated to the outside to achieve cooling, so that the components inside the main body shell 1 are kept at a reasonable operating temperature.

[0034] The heat conduction component 2 makes thermal contact with both the heating element and the heat dissipation component 3. The heat conduction component 2 acts as a heat transfer path between the heating element and the heat dissipation component 3, and its high thermal conductivity ensures rapid heat transfer from the heating element to the heat dissipation component 3. A portion of the heat dissipation component 3 is located inside the main housing 1, and a portion is located outside the main housing 1. Contact with the external environment allows for heat dissipation. The contact points between the heat dissipation component 3 and the main housing 1 are sealed, and the connection between the heat dissipation component 3 and the main housing 1 is waterproof and dustproof.

[0035] When the heating element inside the main body shell 1 operates, it generates heat. This heat is conducted through the heat conduction component 2 to the heat dissipation component 3, which then dissipates the heat to the outside, achieving heat dissipation and cooling of the interior of the main body shell 1. The heat dissipation component 3 and the main body shell 1 are sealed together, achieving good heat dissipation performance while maintaining a good seal.

[0036] The heat conduction component 2 is disposed inside the main body shell 1. The heat conduction component 2 includes a heat-conducting plate 21, a heat pipe 22, and a heat collection plate 23, combined with... Figure 1 , Figure 3 As shown, the heat-conducting plate 21 is used to contact the heat-generating device to conduct heat. The heat-conducting plate 21 and the circuit board 4 are in close contact with each other. Thermal grease can be applied between the heat-conducting plate 21 and the circuit board to provide good heat conduction performance. The two ends of the heat pipe 22 are connected to the heat-conducting plate 21 and the heat-collecting plate 23, respectively, to conduct heat between the heat-conducting plate 21 and the heat-collecting plate 23. The heat-conducting plate 21 absorbs the heat from the heat-generating device and conducts the heat to the heat-collecting plate 23 through the heat pipe 22.

[0037] The bottom of the heat-conducting plate 21 can be fixedly installed on the lower base plate 12 of the main body shell 1, and the heat-conducting plate 21 is supported and positioned by the lower base plate 12. The main body shell 1 itself can be made of thermally conductive material, which can play a certain role in dissipating heat to the outside.

[0038] The interior of heat pipe 22 is a closed cavity with a capillary structure. It is filled with a phase change material (PCM). PCM is a substance that changes its state of matter while remaining at a constant temperature, providing latent heat. The process of this physical property change is called a phase change process, during which the PCM absorbs or releases a large amount of latent heat. The PCM inside heat pipe 22 is a gas-liquid PCM. The heat transfer within heat pipe 22 is achieved automatically through its own phase change, without the need for an additional actively driven structure.

[0039] Combination Figure 1 , Figure 4 As shown, the heat dissipation assembly 3 includes a heat dissipation shell 31, heat dissipation fins 32, and a heat dissipation fan 33. The heat dissipation shell 31 is sealed and assembled on the main body shell 1. A sealing ring can be provided between the heat dissipation shell 31 and the main body shell 1 to achieve a sealed assembly, sealing and filling the gap between the heat dissipation shell 31 and the main body shell 1, thus forming a waterproof and dustproof performance between the heat dissipation shell 31 and the main body shell 1.

[0040] The heat dissipation fins 32 and the cooling fan 33 are assembled inside the heat dissipation housing 31. The heat dissipation fins 32 have several parallel fin structures to increase the heat dissipation area. The surface of the fins is parallel to the airflow direction generated by the cooling fan 33, allowing the airflow to flow through the channels between the fins and contact the fins to achieve heat dissipation. The cooling fan 33 is used to provide active airflow to the heat dissipation fins 32, accelerating the flow speed between the air and the heat dissipation fins 32 and improving heat exchange efficiency.

[0041] A channel is formed through the side wall of the heat sink 31, through which the heat sink fins 32 contact the heat collector plate 23. Heat conduction occurs through the contact between the heat sink fins 32 and the heat collector plate 23. Thermal grease can be applied between the heat sink fins 32 and the heat collector plate 23 to improve heat conduction efficiency. A first sealing ring 34 forms a sealed assembly between the heat sink fins 32 and the heat sink 31, thus isolating the inner cavity of the main body shell 1 from the outside environment, providing waterproof and dustproof performance. Figure 2The area of ​​the heat dissipation fins 32 is larger than the area of ​​the through channel on the heat dissipation shell 31, while the area of ​​the heat collector plate 23 is smaller than the area of ​​the through channel. The heat dissipation fins 32 press against the surface of the heat dissipation shell 31, completely covering and blocking the through channel. A protrusion that mates with the through channel is provided on the back of the heat dissipation fins 32; this protrusion can be snapped into the through channel. The first sealing ring 34 is an annular sealing ring, and the surface of the heat dissipation shell 31 is fitted with the heat dissipation fins 32 to press the first sealing ring 34 into place. Figure 4 As shown, the edge of the heat dissipation fin 32 is provided with ear plates, and the ear plates are provided with several through holes for mounting bolts. The heat dissipation shell 31 is press-fitted and fixed to the heat dissipation shell 31 by bolts.

[0042] In use, the heat-generating components on circuit board 4 generate heat, which is sequentially conducted through heat-conducting plate 21, heat pipe 22, and heat collector plate 23 to the heat dissipation fins 32. The cooling fan 33 creates airflow to the heat dissipation fins 32 for active cooling. Compared to traditional passive cooling, heat is transferred more quickly through phase-change medium conduction, and the heat exchange area and airflow velocity are increased by the heat dissipation fins 32 and cooling fan 33, resulting in higher heat dissipation efficiency. A seal is maintained between the heat dissipation fins 32 and the heat sink 31, and between the heat sink 31 and the main outer casing 1, providing excellent waterproof and dustproof protection.

[0043] Based on the above solution, the main body of the heat dissipation shell 31 of this utility model is embedded in the main body shell 1, and the heat dissipation shell 31 occupies a part of the internal space of the main body shell 1. The outer surface of the heat dissipation shell 31 is attached to the outer surface of the main body shell 1, and the heat dissipation shell 31 is roughly flush with the outer surface of the main body shell 1, without any protruding parts.

[0044] Combination Figure 4 As shown, the heat sink 31 includes a heat sink base 311 and a cover plate 312. The heat sink base 311 and the cover plate 312 together form an internal cavity for mounting the heat sink fins 32 and the cooling fan 33. The cover plate 312 has an intake duct 3121 and an exhaust duct 3122, which adopt a grid structure, forming multiple narrow array channels. The cooling fan 33 draws in air, allowing it to enter through the intake duct 3121, pass through the heat sink fins 32, and exit through the exhaust duct 3122. The airflow carries away heat from the heat sink fins 32 as it passes through them. Figure 4 As shown, the air intake duct 3121 is located in the lower region of the cover plate 312, and the air outlet duct 3122 is located in the upper region of the cover plate 312. The air intake duct 3121 and the air outlet duct 3122 are located near the two ends of the cover plate 312, respectively.

[0045] Combination Figure 4As shown, the heat dissipation fins 32 provided by this utility model are arranged vertically, that is, the parallel fins of the heat dissipation fins 32 are arranged vertically and parallelly at intervals. The airflow flows in a direction parallel to the fins and exchanges heat with the fins. The vertical position of the air inlet and outlet is not limited; it can be bottom inlet and top outlet or top inlet and bottom outlet. In one embodiment, the vertical position of the air inlet duct 3121 is lower than the bottom position of the heat dissipation fins 32, and the vertical position of the air outlet duct 3122 is higher than the top position of the heat dissipation fins 32. Figure 4 The intake duct 3121 draws in airflow, and the cooling fan 33 is located above the heat sink fins 32. Airflow enters the heat sink 31 from the intake duct 3121 in the lower part of the cover plate 312 and exits from the heat sink 31 from the exhaust duct 3122 in the upper part of the cover plate 312. The airflow flows upwards across the entire heat sink fins 32, facilitating thorough heat exchange. Alternatively, the heat sink fins 32 can be cooled by blowing air, in which case the positions of the intake and exhaust ducts 3121 and 3122 are reversed. Since the cooling fan 33 is an electrical component and comes into contact with the external environment through the intake and exhaust ducts 3121 and 3122, its placement above the heat sink fins 32 provides a degree of waterproofing.

[0046] Combination Figure 2 , Figure 4 As shown, a mounting flange 3111 is provided on the radiator base 311. The outer ring size of the mounting flange 3111 is larger than the through channel provided on the radiator base 311. The mounting flange 3111 contacts the inner surface of the main body shell 1, and several threaded holes are provided on the mounting flange 3111. It is fixed by screws, and the radiator base 311 is installed from the inside of the main body shell 1.

[0047] Combination Figure 2 A second sealing ring 35 is provided between the mounting flange 3111 and the main body shell 1. The inner surface of the main body shell 1 and the mounting flange 3111 together clamp the second sealing ring 35. The second sealing ring 35 is annular and forms a seal at the connection between the main body shell 1 and the radiator base 311, thereby improving the sealing performance.

[0048] Combination Figure 4 As shown, the cover plate 312 is provided with several fixing holes 3123, which are located at the edge of the cover plate 312 and are spaced apart, for fixing to the outer surface of the main body shell 1 by screws. Figure 2 As shown, the screws of the cover plate 312 pass through the cover plate 312, the main body shell 1, and the radiator base 311 in sequence, and are finally tightened onto the radiator base 311. The inner surface of the cover plate 312 contacts the main body shell 1, achieving relative fixation. Since the cover plate 312 is provided with an air intake duct 3121 and an air exhaust duct 3122, the inner cavity of the radiator base 311 can communicate with the outside, so the cover plate 312 does not need to be sealed.

[0049] At least two heat-conducting plates 21 are provided, and heat pipes 22 leading from different heat-conducting plates 21 are alternately distributed on the heat-collecting plate 23. Figure 3 As shown, two heat-conducting plates 21 are displayed, each contacting a different heat source on the circuit board. Multiple heat pipes 22 extend from each heat-conducting plate 21, and the different heat pipes 22 are alternately distributed on the heat-collecting plate 23 to achieve uniform heat transfer between the different heat-conducting plates 21. The heat pipes 22 can undergo plastic deformation, and their shape can be changed according to the internal space of the main body shell 1.

[0050] Specifically, the heat pipe 22 is connected to the heat-conducting plate 21 and the heat-collecting plate 23 by welding or pressing, combined with Figure 3 As shown, slots for embedding heat pipes 22 are provided on the heat-conducting plate 21 and the heat-collecting plate 23 respectively. The slots have a larger contact area than the flat contact, which is beneficial to the conduction of heat.

[0051] Combination Figure 4 As shown, the heatsink base 311 is fixedly mounted with a fan bracket 313, which can be fixed to the heatsink base 311 with screws. The cooling fan 33 is mounted on the fan bracket 313 and supported by the fan bracket 313.

[0052] Combination Figure 4 As shown, a connector 314 is installed on the heat sink base 311 to connect wires to the internal control circuit of the device, providing power to the cooling fan 33. The connector 314 is provided with an annular pressure plate, which forms a sealed contact with the heat sink base 311 to ensure waterproof and dustproof performance.

[0053] A temperature sensor is installed on the heat-generating device or heat-conducting plate 21. The control circuit obtains the temperature signal from the temperature sensor and controls the cooling fan 33 according to the temperature. The temperature sensor obtains the temperature signal and sends it to the fan control circuit to control the cooling fan 33 to turn on and off, or adjust the speed and adjust the airflow through the heat dissipation fins 32 to form active heat dissipation.

[0054] The main body shell 1 of this utility model plays a protective and isolating role for its internal components. The heat conduction component 2 is installed inside the main body shell 1 and is responsible for conducting the temperature of one or more high-temperature components and concentrating the temperature. The heat is dissipated by contacting the heat dissipation component 3 installed on the main body shell 1 to achieve the cooling function. Furthermore, the heat dissipation component and the shell are sealed to meet the protection requirements.

[0055] Two sealing rings isolate the inside and outside of the equipment, providing waterproof and other protective functions. The cooling fan 33 is a waterproof fan, which is installed on the fan bracket 313 and then fixed inside the heat sink 311, located above or below the heat sink fins, with the airflow direction either downward or upward; the connector 314 is installed on the heat sink 311 to connect the wires to the internal control circuit of the equipment.

[0056] The cover plate 312 is installed on the outside of the heat sink 311 to prevent external debris from being drawn into the fan, protect the fan from running normally, and at the same time allow the airflow to form a complete airflow channel, improving heat dissipation efficiency.

[0057] The heat dissipation structure of this utility model is flexible and adaptable to heat sources in different installation positions. It has low thermal resistance and high heat transfer efficiency, is suitable for equipment with high sealing requirements, has a compact structure, and is easy to maintain.

[0058] This utility model also provides an imaging device, which includes the aforementioned active waterproof heat dissipation structure. This imaging device can achieve the technical effects achieved by the aforementioned active waterproof heat dissipation structure. Other structures of the imaging device are described in the prior art and will not be repeated here.

[0059] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An active waterproof heat dissipation structure, characterized in that, The device includes a main shell (1), inside which a heating device and a heat conduction component (2) are provided. The heat conduction component (2) is in thermal contact with the heating device and the heat dissipation component (3) respectively. Part of the heat dissipation component (3) is located inside the main shell (1) and part is located outside the main shell (1). The heat dissipation component (3) is sealed to the main shell (1). The heat generated by the heating device is conducted to the heat dissipation component (3) through the heat conduction component (2), and the heat dissipation component (3) dissipates the heat to the outside.

2. The active waterproof heat dissipation structure according to claim 1, characterized in that, The heat conduction component (2) includes a heat conduction plate (21), a heat pipe (22) and a heat collection plate (23). The heat conduction plate (21) is used to contact the heat-generating device to conduct heat. The heat pipe (22) is connected to the heat conduction plate (21) and the heat collection plate (23) respectively to conduct heat.

3. The active waterproof heat dissipation structure according to claim 2, characterized in that, The heat dissipation assembly (3) includes a heat dissipation shell (31), heat dissipation fins (32), and a heat dissipation fan (33). The heat dissipation shell (31) is sealed and assembled to the main body shell (1). The heat dissipation fins (32) and the heat dissipation fan (33) are assembled inside the heat dissipation shell (31). The heat dissipation fins (32) contact the heat collection plate (23) to conduct heat. The heat dissipation fins (32) contact the heat collection plate (23); the heat dissipation fins (32) and the heat dissipation shell (31) are sealed together by a first sealing ring (34).

4. The active waterproof heat dissipation structure according to claim 2, characterized in that, The heat pipe (22) has a capillary structure inside for filling phase change material.

5. The active waterproof heat dissipation structure according to claim 4, characterized in that, The heat sink (31) includes a heat sink base (311) and a cover plate (312). An air intake duct (3121) and an air exhaust duct (3122) are provided on the cover plate (312). The cooling fan (33) is used to draw in air, so that the air enters from the air intake duct (3121), passes through the heat sink fins (32), and is discharged from the air exhaust duct (3122).

6. The active waterproof heat dissipation structure according to claim 5, characterized in that, The heat dissipation fins (32) are arranged vertically. The air intake duct (3121) is located in the lower region of the cover plate (312). The air exhaust duct (3122) is located in the upper region of the cover plate (312). The vertical position of the air intake duct (3121) is lower than the bottom of the heat dissipation fins (32), and the vertical position of the air exhaust duct (3122) is higher than the top of the heat dissipation fins (32).

7. The active waterproof heat dissipation structure according to claim 5, characterized in that, The radiator base (311) is provided with a mounting flange (3111), which contacts the inner surface of the main body shell (1) and is fixed by screws; A second sealing ring (35) is provided between the mounting flange (3111) and the main body shell (1). The cover plate (312) is provided with fixing holes (3123) for fixing to the outer surface of the main body shell (1) by screws.

8. The active waterproof heat dissipation structure according to claim 2, characterized in that, At least two heat-conducting plates (21) are provided, and the heat pipes (22) led out from different heat-conducting plates (21) are alternately distributed on the heat-collecting plate (23).

9. The active waterproof heat dissipation structure according to claim 7, characterized in that, The heat pipe (22) is connected to the heat-conducting plate (21) and the heat-collecting plate (23) by welding or pressing.

10. The active waterproof heat dissipation structure according to claim 3, characterized in that, The radiator base (311) is fixedly mounted with a fan bracket (313), and the cooling fan (33) is mounted on the fan bracket (313). A connector (314) is installed on the heat sink base (311) to connect wires to the internal control circuit of the device; A temperature sensor is provided on the heating device or the heat-conducting plate (21), and the control circuit obtains the temperature signal of the temperature sensor and controls the cooling fan (33) according to the temperature.

11. An imaging device, characterized in that, Includes the active waterproof heat dissipation structure as described in any one of claims 1 to 10.

Images