Lift-rotary arm wafer handling device

Abstract

The utility model relates to a kind of lifting rotary arm wafer carrying device, including wafer fixed plate, wafer lifting assembly is connected on the wafer fixed plate, wafer rotating assembly is connected on the wafer lifting assembly, carrying telescopic material taking assembly is connected on the wafer rotating assembly, supporting plate is connected on the carrying telescopic material taking assembly, carrying vacuum suction assembly is connected on the supporting plate, the utility model can improve work efficiency.

Description

Technical Field

[0001] This utility model relates to a lifting and rotating arm wafer handling device. Background Technology

[0002] With the development of the semiconductor industry, especially the miniaturization of die size and the trend towards high integration and miniaturization in semiconductor packaging, many high-requirement packaging processes have begun to use stealth dicing. This involves completely separating the wafers or chips with attached films along predetermined lines to obtain individual units. Simultaneously, it's crucial to ensure that the dies within the wafer can be separated with the required gaps. Currently, most products on the market use manual operation with mother-daughter rings for film expansion to separate the dies, resulting in low efficiency and failing to meet automation requirements. This necessitates high-precision equipment and strict process control. Furthermore, miniaturization of the equipment reduces workshop space requirements, necessitating wafer handling between different workstations within a small space. This requires the ability to handle wafers with steel rings between workstations of varying heights, angles, and distances. To address these issues, a wafer handling device with a lifting and rotating arm needs to be developed for convenient subsequent operations. Utility Model Content

[0003] To solve the above-mentioned technical problems, the purpose of this utility model is to provide a lifting and rotating arm wafer handling device.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A lifting and rotating arm wafer handling device includes a wafer fixing plate, a wafer lifting assembly connected to the wafer fixing plate, a wafer rotating assembly connected to the wafer lifting assembly, a handling telescopic picking assembly connected to the wafer rotating assembly, a support plate connected to the handling telescopic picking assembly, and a handling vacuum adsorption assembly connected to the support plate.

[0006] The wafer rotation assembly includes a wafer rotation backplate, a mounted bearing connected to the wafer rotation backplate, a rotating shaft connected to the mounted bearing via a bearing, a sensor plate that rotates synchronously with the rotating shaft connected to the rotating shaft, a sensor sheet metal connected to the wafer rotation backplate, a sensor that senses and cooperates with the sensor plate connected to the sensor sheet metal, a motor mounting plate connected to the wafer rotation backplate, a motor connected to the motor mounting plate, the rotating shaft of the motor connected to a first synchronous pulley, a bearing mounting seat connected to the wafer rotation backplate, a rotating shaft connected between the bearing mounting seats via a bearing, a second synchronous pulley opposite to the first synchronous pulley connected to the lower end of the rotating shaft, a first synchronous belt connected between the second synchronous pulley and the first synchronous pulley, a third synchronous pulley synchronized with the second synchronous pulley connected to the upper part of the rotating shaft, a fourth synchronous pulley opposite to the third synchronous pulley connected to the rotating shaft, and a second synchronous belt connected between the fourth synchronous pulley and the third synchronous pulley.

[0007] Preferably, in the aforementioned lifting and rotating arm wafer handling device, the handling vacuum adsorption assembly includes an arm support, an air circuit plate connected above the arm support, the air circuit plate being connected to a handling telescopic material handling assembly via a connecting block, arm plates being connected to the left and right sides of the arm support via sliding plates, a pressure plate being connected above the arm plate, a vacuum connector being connected to the pressure plate, and a vacuum suction cup for adsorbing wafers being connected to the vacuum connector.

[0008] Preferably, in the aforementioned lifting and rotating arm wafer handling device, the handling telescopic material handling assembly includes a telescopic bracket, a telescopic guide rail connected to one side of the telescopic bracket, a slider connected to the telescopic guide rail, a sliding arm connected to the slider, a front cylinder bracket and a rear cylinder bracket connected to the front and rear sides of the other side of the telescopic bracket respectively, a telescopic cylinder connected between the front cylinder bracket and the rear cylinder bracket, the drive shaft of the telescopic cylinder passing through the front cylinder bracket and connected to one end of a connecting bracket, and the other end of the connecting bracket connected to the sliding arm.

[0009] Preferably, in the aforementioned lifting and rotating arm wafer handling device, a telescopic guard plate is connected to the outer side of the telescopic bracket.

[0010] Preferably, in the aforementioned lifting and rotating arm wafer handling device, the telescopic bracket is connected to an extension connecting section that is connected to the wafer rotating assembly. The telescopic bracket and the extension connecting section are integrally formed and are L-shaped.

[0011] Preferably, in the aforementioned lifting and rotating arm wafer handling device, there are two sensor plates, which are staggered vertically by an angle of 180°. There are two sensors, which are arranged vertically, and each sensor plate corresponds to each sensor.

[0012] Preferably, in the wafer handling device with a lifting and rotating arm, the wafer lifting assembly includes a wafer adjustment plate, a vertical lifting back plate connected to the wafer adjustment plate, a lifting guide rail connected to one side of the lifting back plate, a slider fixing block slidably connected to the lifting guide rail, a first buffer fixing plate connected to the top of the slider fixing block, a cylinder mounting sheet metal connected to the other side of the lifting back plate, a lifting cylinder connected to the cylinder mounting sheet metal, the drive shaft of the lifting cylinder being connected to the first buffer fixing plate via a floating joint, and a buffer being connected to the first buffer fixing plate for buffer contact with the top of the lifting back plate.

[0013] Preferably, in the aforementioned lifting and rotating arm wafer handling device, a buffer bracket is connected to the back of the lifting back plate, a second buffer fixing plate is connected to the buffer bracket, and a buffer for sliding contact with the slider fixing block is connected to the second buffer fixing plate.

[0014] Preferably, in the wafer handling device with lifting and rotating arm, an adjusting base is connected around the wafer adjusting plate, and adjusting bolts for adjusting the wafer adjusting plate are connected to the adjusting base.

[0015] Preferably, in the aforementioned lifting and rotating arm wafer handling device, the wafer adjustment plate has a supporting sheet metal connected to its side.

[0016] By means of the above solution, this utility model has at least the following advantages:

[0017] 1. This utility model enables wafer handling in small spaces, facilitating subsequent processes.

[0018] 2. This utility model can realize the lifting function, realize high and low transportation, and facilitate the transportation of wafers at different work stations.

[0019] 3. This utility model contains a two-stage synchronous wheel structure, which can rotate the swing arm and realize the handling at different angles, making it convenient for wafers to be handled at different workstations.

[0020] 4. This utility model has telescopic and adsorption functions, which can realize the transportation and adsorption of different distances, and facilitate subsequent operations.

[0021] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of this utility model;

[0024] Figure 2 This is a schematic diagram of the structure of the vacuum adsorption assembly for handling according to this utility model;

[0025] Figure 3 This is a schematic diagram of the internal structure of the material handling and telescopic material handling assembly of this utility model;

[0026] Figure 4 This is a schematic diagram of the structure of the telescopic material handling assembly of this utility model;

[0027] Figure 5 This is a schematic diagram of the structure of the wafer rotation assembly of this utility model;

[0028] Figure 6 This is a schematic diagram of the structure of the wafer lifting assembly of this utility model. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] like Figures 1 to 6 As shown, a lifting and rotating arm wafer handling device includes a wafer fixing plate, a wafer lifting assembly 5 connected to the wafer fixing plate, a wafer rotating assembly 4 connected to the wafer lifting assembly 5, a handling telescopic picking assembly 3 connected to the wafer rotating assembly 4, a support plate 2 connected to the handling telescopic picking assembly 3, and a handling vacuum adsorption assembly 1 connected to the support plate 2.

[0032] Furthermore, regarding the rotation of the vacuum adsorption assembly 1, the wafer rotation assembly 4 includes a wafer rotation backplate 401. A mounted bearing 402 is connected to the wafer rotation backplate 401. A rotating shaft 403 is connected to the mounted bearing 402 via a bearing. A sensor plate 404, rotating synchronously with the rotating shaft 403, is connected to the rotating shaft 403. A sensor sheet metal 405 is connected to the wafer rotation backplate 401. A sensor 406, which senses and cooperates with the sensor plate 404, is connected to the sensor sheet metal 405. A motor mounting plate 407 is connected to the wafer rotation backplate 401. A motor 408 is connected to the motor mounting plate 407. The rotating shaft of the motor 408 is connected to the... A first synchronous pulley 409 is connected to the first synchronous pulley 409. A bearing mounting base 410 is connected to the wafer rotating backplate 401. A rotating shaft 411 is connected between the bearing mounting bases 410 via bearings. A second synchronous pulley 412, which is opposite to the first synchronous pulley 409, is connected to the lower end of the rotating shaft 411. A first synchronous belt 413 is connected between the second synchronous pulley 412 and the first synchronous pulley 409. A third synchronous pulley 414, which is synchronized with the second synchronous pulley 412, is connected to the upper part of the rotating shaft 411. A fourth synchronous pulley 415, which is opposite to the third synchronous pulley 414, is connected to the rotating shaft 403. A second synchronous belt 416 is connected between the fourth synchronous pulley 415 and the third synchronous pulley 414.

[0033] The sensor plate 404 consists of two pieces, which are staggered vertically by an angle of 180°. The sensor 406 consists of two pieces, which are arranged vertically, with each sensor plate 404 corresponding to each sensor 406. The positions of the two sensor plates are adjustable to accommodate different angle ranges. In this invention, a range of 0° to 180° is used, meaning that each sensor plate needs to rotate 180° to contact its corresponding sensor. This increases the rotation range, allowing for operation over a wider area.

[0034] Furthermore, regarding the adsorption structure of the product, the handling vacuum adsorption assembly 1 includes an arm support 105. An air passage plate 104 is connected above the arm support 105. The air passage plate 104 is connected to the handling telescopic material handling assembly 3 via a connecting block. Arm plates 102 are connected to both the left and right sides of the arm support 105 via sliding plates 103. A pressure plate 101 is connected above the arm plate 102. A vacuum connector 107 is connected to the pressure plate 101. A vacuum chuck 106 for adsorbing wafers is connected to the vacuum connector 107.

[0035] Furthermore, the product can be moved forward and backward in a telescopic manner. The telescopic material handling assembly 3 includes a telescopic bracket 303. A telescopic guide rail 309 is connected to one side of the telescopic bracket 303. A slider 308 is connected to the telescopic guide rail 309. A sliding arm 301 is connected to the slider 308. A front cylinder bracket 304 and a rear cylinder bracket 305 are connected to the front and rear sides of the other side of the telescopic bracket 303, respectively. A telescopic cylinder 307 is connected between the front cylinder bracket 304 and the rear cylinder bracket 305. The drive shaft of the telescopic cylinder 307 passes through the front cylinder bracket 304 and is connected to one end of a connecting bracket 306. The other end of the connecting bracket 306 is connected to the sliding arm 301.

[0036] The telescopic bracket 303 is connected to an extension connecting section that is connected to the wafer rotation assembly 4. The telescopic bracket 303 and the extension connecting section are integrally formed and have an L-shaped structure. The angle between them is greater than 90° and is about 100°. The extension connecting section is provided with a connecting hole. Through the connection of the connecting hole to the rotating shaft, the telescopic material handling assembly can rotate synchronously with the wafer rotation assembly.

[0037] The telescopic bracket 303 is connected to a telescopic guard plate 302 on its outer side.

[0038] This utility model can realize the lifting and lowering of products. The wafer lifting assembly 5 includes a wafer adjustment plate 513. A vertical lifting back plate 511 is connected to the wafer adjustment plate 513. A lifting guide rail 508 is connected to one side of the lifting back plate 511. A slider fixing block 505 is slidably connected to the lifting guide rail 508. A first buffer fixing plate 503 is connected to the top of the slider fixing block 505. A cylinder mounting sheet metal 507 is connected to the other side of the lifting back plate 511. A lifting cylinder 506 is connected to the cylinder mounting sheet metal 507. The drive shaft of the lifting cylinder 506 is connected to the first buffer fixing plate 503 through a floating joint 504. A buffer 501 is connected to the first buffer fixing plate 503 to buffer contact the top of the lifting back plate 511.

[0039] A buffer bracket is connected to the back of the lifting back plate 511, and a second buffer fixing plate 502 is connected to the buffer bracket. A buffer 501 for sliding contact with the slider fixing block 505 is connected to the second buffer fixing plate 502, which can reduce the impact force caused by rising or falling, and make the product more stable during operation.

[0040] Furthermore, an adjustment fixing seat 509 is connected around the wafer adjustment plate 513. The adjustment fixing seat 509 is connected to an adjustment bolt 510 for adjusting the wafer adjustment plate 513, which can be fine-tuned to achieve more precise installation.

[0041] The wafer adjustment plate 513 described in this utility model has a supporting sheet metal 512 connected to its side.

[0042] The working principle of this utility model is as follows:

[0043] When wafer lifting and handling is required, the lifting cylinder in the wafer lifting assembly extends, causing the first buffer fixing plate to extend, which in turn causes the slider fixing block to extend. The wafer rotating back plate in the wafer rotating assembly on the slider fixing block also extends, thereby causing the entire wafer rotating assembly to move upward. After reaching the position, the lifting cylinder in the wafer lifting assembly retracts, causing the first buffer fixing plate to retract, which in turn causes the slider fixing block to retract. The wafer rotating back plate in the wafer rotating assembly on the slider fixing block retracts, and the entire wafer rotating assembly moves downward, completing the lifting and handling motion. At the same time, the vacuum suction cup in the vacuum adsorption assembly adsorbs the wafer with the steel ring, completing the lifting and handling.

[0044] When wafer rotation and handling are required, the motor in the wafer rotation assembly is activated, which drives the first synchronous wheel to rotate. The rotation of the first synchronous belt drives the first synchronous wheel to rotate, which in turn drives the rotation shaft to rotate. The rotation shaft then drives the third synchronous wheel to rotate, which in turn drives the fourth synchronous wheel to rotate via the second synchronous belt. This rotation drives the shaft to rotate, which in turn drives the support in the telescopic material handling assembly to rotate, and drives the vacuum adsorption assembly to rotate, thus completing the handling operation of the wafer with steel ring at different angles.

[0045] When wafers need to be moved between workstations at different distances, the telescopic cylinder in the telescopic material handling assembly extends or retracts, which in turn causes the sliding arm to extend or retract, and the vacuum suction assembly connected to the support plate to extend or retract. At the same time, the vacuum suction cup of the vacuum suction assembly picks up the wafers with steel rings as needed, thus completing the wafer handling operation with steel rings at different positions.

[0046] This invention enables wafer handling in confined spaces, facilitating subsequent processes. It features a lifting function, allowing for high-low transport of wafers at different workstations. Incorporating a two-stage synchronous wheel structure, the rotating arm allows for transport at various angles, further simplifying wafer handling across different workstations. It also possesses telescopic and suction functions, enabling transport and suction over varying distances, further enhancing subsequent operations.

[0047] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0048] In the description of this application, it should be noted that the terms "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0049] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or vertical, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0050] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of the present utility model, and these improvements and modifications should also be considered within the protection scope of the present utility model.

Claims

1. A wafer handling device with a lifting and rotating arm, characterized in that: The device includes a wafer fixing plate, a wafer lifting assembly (5) connected to the wafer fixing plate, a wafer rotating assembly (4) connected to the wafer lifting assembly (5), a conveying telescopic material picking assembly (3) connected to the wafer rotating assembly (4), a support plate (2) connected to the conveying telescopic material picking assembly (3), and a conveying vacuum adsorption assembly (1) connected to the support plate (2). The wafer rotation assembly (4) includes a wafer rotation backplate (401), a mounted bearing (402) connected to the wafer rotation backplate (401), a rotating shaft (403) connected to the mounted bearing (402) via a bearing, a sensor chip (404) that rotates synchronously with the rotating shaft (403) connected to the rotating shaft (403), a sensor sheet metal (405) connected to the wafer rotation backplate (401), a sensor (406) that senses and cooperates with the sensor chip (404) connected to the sensor sheet metal (405), a motor mounting plate (407) connected to the wafer rotation backplate (401), a motor (408) connected to the motor mounting plate (407), and the rotating shaft of the motor (408) connected to a first synchronous pulley (409). The wafer rotating backplate (401) is connected to a bearing mounting base (410), and the bearing mounting bases (410) are connected to a rotating shaft (411) via bearings. The lower end of the rotating shaft (411) is connected to a second synchronous pulley (412) opposite to the first synchronous pulley (409). A first synchronous belt (413) is connected between the second synchronous pulley (412) and the first synchronous pulley (409). A third synchronous pulley (414) synchronized with the second synchronous pulley (412) is connected above the rotating shaft (411). A fourth synchronous pulley (415) opposite to the third synchronous pulley (414) is connected to the rotating shaft (403), and a second synchronous belt (416) is connected between the fourth synchronous pulley (415) and the third synchronous pulley (414).

2. The lifting and rotating arm wafer handling device according to claim 1, characterized in that: The vacuum adsorption assembly (1) includes an arm support (105), an air passage plate (104) is connected above the arm support (105), the air passage plate (104) is connected to the telescopic material handling assembly (3) via a connecting block, arm plates (102) are connected to the left and right sides of the arm support (105) via sliding plates (103), a pressure plate (101) is connected above the arm plate (102), a vacuum connector (107) is connected to the pressure plate (101), and a vacuum chuck (106) for adsorbing wafers is connected to the vacuum connector (107).

3. The lifting and rotating arm wafer handling device according to claim 1, characterized in that: The telescopic material handling assembly (3) includes a telescopic bracket (303). A telescopic guide rail (309) is connected to one side of the telescopic bracket (303). A slider (308) is connected to the telescopic guide rail (309). A sliding arm (301) is connected to the slider (308). A front cylinder bracket (304) and a rear cylinder bracket (305) are connected to the front and rear sides of the other side of the telescopic bracket (303), respectively. A telescopic cylinder (307) is connected between the front cylinder bracket (304) and the rear cylinder bracket (305). The drive shaft of the telescopic cylinder (307) passes through the front cylinder bracket (304) and is connected to one end of a connecting bracket (306). The other end of the connecting bracket (306) is connected to the sliding arm (301).

4. The lifting and rotating arm wafer handling device according to claim 3, characterized in that: The telescopic bracket (303) is connected to a telescopic guard plate (302) on its outer side.

5. The lifting and rotating arm wafer handling device according to claim 4, characterized in that: The telescopic bracket (303) is connected to an extension connecting section that is connected to the wafer rotation assembly (4). The telescopic bracket (303) and the extension connecting section are integrally formed and have an L-shaped structure.

6. The lifting and rotating arm wafer handling device according to claim 1, characterized in that: The sensor sheet (404) has two pieces, which are staggered vertically by an angle of 180°. The sensor (406) has two pieces, which are arranged vertically, and each sensor sheet (404) corresponds to each sensor (406).

7. The wafer handling device with lifting and rotating arm according to claim 1, characterized in that: The wafer lifting assembly (5) includes a wafer adjustment plate (513), on which a vertical lifting back plate (511) is connected. A lifting guide rail (508) is connected to one side of the lifting back plate (511), and a slider fixing block (505) is slidably connected to the lifting guide rail (508). A first buffer fixing plate (503) is connected to the top of the slider fixing block (505). A cylinder mounting sheet metal (507) is connected to the other side of the lifting back plate (511), and a lifting cylinder (506) is connected to the cylinder mounting sheet metal (507). The drive shaft of the lifting cylinder (506) is connected to the first buffer fixing plate (503) through a floating joint (504). A buffer (501) that makes buffer contact with the top of the lifting back plate (511) is connected to the first buffer fixing plate (503).

8. The lifting and rotating arm wafer handling device according to claim 7, characterized in that: A buffer bracket is connected to the back of the lifting back plate (511), and a second buffer fixing plate (502) is connected to the buffer bracket. A buffer (501) for sliding contact with the slider fixing block (505) is connected to the second buffer fixing plate (502).

9. The lifting and rotating arm wafer handling device according to claim 7, characterized in that: An adjustment fixture (509) is connected around the wafer adjustment plate (513), and an adjustment bolt (510) for adjusting the wafer adjustment plate (513) is connected to the adjustment fixture (509).

10. The lifting and rotating arm wafer handling device according to claim 7, characterized in that: The wafer adjustment plate (513) is connected to a support sheet metal (512) on its side.

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