A polishing device for chip packaging processing

Abstract

The utility model relates to chip packaging processing technical field provides a kind of grinding device for chip packaging processing, including base, the top of base is fixed with polishing structure, the top of base is fixed with reciprocating structure under the polishing structure, the reciprocating structure includes the reciprocating screw rod of being set in the top of base.The utility model is provided with reciprocating structure, under the action of reciprocating screw rod, mobile seat reciprocating movement will be driven, mobile seat will drive shunt seat reciprocating movement, simultaneously, shunt seat will drive slide in the outside of slide rail top to move, under the action of slide, avoid mobile seat to rotate with reciprocating screw rod, shunt seat after moving will drive chip body reciprocating movement in the bottom end of polishing roller, to ensure the uniformity of polishing and improve polishing efficiency, realize the function that the device is convenient to improve polishing uniformity, to improve the working efficiency of the chip packaging processing grinding device when using.

Description

Technical Field

[0001] This utility model relates to the field of chip packaging and processing technology, and in particular to a grinding device for chip packaging and processing. Background Technology

[0002] Chip packaging is a crucial step in integrating a manufactured wafer into individual chips through physical protection and electrical connections into a practical electronic component. To remove surface defects of semiconductor chips or packaged integrated blocks, the chips need to be polished, hence the use of a chip packaging polishing device.

[0003] To address this, patent CN218363749U discloses a grinding device for semiconductor chip processing, comprising a base plate. A dual-axis motor is fixedly mounted on the upper end of the base plate via a first mounting bracket. Rotating rods are fixedly mounted on both ends of the dual-axis motor, and mounting plates are fixedly mounted on the other ends of the two rotating rods. Grinding discs are fixedly mounted on the side walls of the mounting plates. Symmetrical first connecting blocks are fixedly mounted on the upper side walls of the base plate at both ends of the dual-axis motor. A lead screw is rotatably mounted between the two first connecting blocks. The dual-axis motor directly drives the rotation of the two grinding discs, and symmetrical semiconductor chips are positioned at both ends. By rotating one dual-axis motor, two semiconductor chips are ground simultaneously, which improves grinding efficiency and speeds up processing compared to the previous method of grinding only one semiconductor chip at a time.

[0004] Although the aforementioned semiconductor chip processing grinding device improves grinding efficiency and speeds up processing compared to the previous method of grinding only one semiconductor chip at a time, it is difficult to improve grinding uniformity and reduce uneven grinding, thus hindering the improvement of grinding efficiency. Utility Model Content

[0005] The purpose of this invention is to provide a grinding device for chip packaging processing, which solves the problem that existing grinding devices for chip packaging processing are inconvenient to improve the uniformity of grinding.

[0006] To solve the above-mentioned technical problems, this utility model provides the following technical solution: a grinding device for chip packaging processing, including a base;

[0007] A grinding structure is fixed to the top of the base, and a reciprocating structure is fixed to the top of the base below the grinding structure. The reciprocating structure includes a reciprocating lead screw set at the top of the base. A movable seat is threaded to the outer side of the reciprocating lead screw. Slide rails are fixed to the top of the bases on both sides of the reciprocating lead screw, and slide seats are slidably connected to the outer side of the top of the slide rails.

[0008] The top of the reciprocating structure is fixed with a current shunt, and the top of the current shunt is provided with a chip body;

[0009] An adsorption structure is installed on one side of the flow divider.

[0010] When using this device, the reciprocating structure facilitates improved polishing uniformity, thereby increasing the working efficiency of the chip packaging polishing device; the adsorption structure facilitates fixation, thus improving the applicability of the chip packaging polishing device; and the polishing structure facilitates polishing, thus enhancing the ease of use of the chip packaging polishing device.

[0011] Preferably, a support plate is fixed to the top of each end of the base of the reciprocating screw, and a drive motor is installed on the outer wall of the support plate at one end of the reciprocating screw. Under the action of the reciprocating screw, the moving seat will move back and forth, the moving seat will drive the diverter seat to move back and forth, and the diverter seat will drive the slide to move on the outer side of the top of the slide rail.

[0012] Preferably, one end of the reciprocating lead screw extends to the outside of the support plate and is fixedly connected to the output end of the drive motor. The top end of the movable seat is fixedly connected to the bottom end of the distributor seat, and the top end of the slide is fixedly connected to the bottom end of the distributor seat. Under the action of the slide, the movable seat is prevented from rotating with the reciprocating lead screw. The moved distributor seat will drive the chip body to reciprocate at the bottom end of the grinding roller, thereby ensuring the uniformity of grinding and improving grinding efficiency.

[0013] Preferably, the adsorption structure includes a blower, an air inlet, a fixed frame, a dustproof net, and a movable plate. The blower is installed on one side of the distribution seat. Air inlets are evenly distributed throughout the top of the distribution seat. A fixed frame is installed on the top of each air inlet. A dustproof net is fixed to the bottom of each fixed frame. A movable plate is fixed to the top of each fixed frame. By moving the fixed frame with the movable plate, the dustproof net is moved to the outside of the distribution seat for cleaning. The dustproof net and protective net prevent impurities from entering the blower.

[0014] Preferably, a protective mesh is fixed to the output end of the blower, and the input end of the blower is connected to one side of the distributor. Under the action of the blower and the air inlet, the chip body is fixed to the top of the distributor, preventing displacement of the chip body during polishing.

[0015] Preferably, the polishing structure includes a bracket, an electric push rod, a slide rod, a fixing frame, a polishing motor, and a polishing roller. The bracket is fixed to the top of the base, and the electric push rod passes through the top of the bracket. The fixing frame is fixed to the bottom of the electric push rod. Slide rods pass through the interior of the bracket on both sides of the electric push rod. A polishing roller is provided at the bottom of the fixing frame, and a polishing motor is installed on the outer wall of the fixing frame at one end of the polishing roller. Under the action of the slide rod, the stability of the fixing frame during movement is enhanced. After the fixing frame moves, it drives the polishing roller to press against the top of the chip body.

[0016] Preferably, the slide rod and the bracket form a sliding structure, with the bottom end of the slide rod fixedly connected to the top end of the fixed frame, and one end of the polishing roller extending to the outside of the fixed frame and fixedly connected to the output end of the polishing motor. Under the action of the polishing roller, the top end of the chip body is polished.

[0017] The present invention provides a grinding device for chip packaging processing, the advantages of which are:

[0018] By incorporating a reciprocating structure, the reciprocating screw drives the moving seat to reciprocate, which in turn drives the flow divider to reciprocate. Simultaneously, the flow divider drives the slide to move on the outer side of the top of the slide rail. Under the action of the slide, the moving seat is prevented from rotating with the reciprocating screw. The moved flow divider then drives the chip body to reciprocate at the bottom of the grinding roller, thereby ensuring the uniformity of grinding and improving grinding efficiency. This device facilitates the improvement of grinding uniformity, thus enhancing the working efficiency of the grinding device used for chip packaging.

[0019] By incorporating an adsorption structure and moving the fixed frame via a movable plate, the dustproof net is moved to the outside of the distribution seat for cleaning. The dustproof net and protective net prevent impurities from entering the blower. The blower and air inlet together fix the chip body to the top of the distribution seat, preventing displacement during polishing. This design facilitates easy fixing and improves the applicability of the chip packaging polishing device.

[0020] By incorporating a grinding structure, the stability of the mounting bracket during movement is enhanced by the action of the sliding rod. After movement, the mounting bracket drives the grinding roller to press against the top of the chip body. Under the action of the grinding roller, the top of the chip body is ground, thus realizing the function of easy grinding and improving the convenience of using the grinding device for chip packaging. Attached Figure Description

[0021] Figure 1 This is a three-dimensional structural schematic diagram of the present invention;

[0022] Figure 2This is a three-dimensional structural schematic diagram of the grinding structure of this utility model, showing the front cross-section.

[0023] Figure 3 This is a three-dimensional structural schematic diagram of the reciprocating structure of this utility model, shown in the front cross-section.

[0024] Figure 4 This is a three-dimensional structural diagram of the adsorption structure of this utility model;

[0025] Figure 5 This is a side view cross-sectional three-dimensional structural schematic diagram of the present invention.

[0026] The following are the annotations in the diagram: 1. Base; 2. Reciprocating structure; 201. Reciprocating lead screw; 202. Moving seat; 203. Slide rail; 204. Slide block; 205. Drive motor; 206. Support plate; 3. Diverter seat; 4. Chip body; 5. Adsorption structure; 501. Blower; 502. Air inlet; 503. Fixing frame; 504. Dustproof net; 505. Moving plate; 6. Grinding structure; 601. Bracket; 602. Electric push rod; 603. Slide rod; 604. Fixing frame; 605. Grinding motor; 606. Grinding roller. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figures 1-5 This utility model provides a grinding device for chip packaging processing, including a base 1. A grinding structure 6 is fixed to the top of the base 1. The grinding structure 6 includes a bracket 601, an electric push rod 602, a slide rod 603, a fixing frame 604, a grinding motor 605, and a grinding roller 606. The bracket 601 is fixed to the top of the base 1. The electric push rod 602 passes through the top of the bracket 601. The fixing frame 604 is fixed to the bottom of the electric push rod 602. Slide rods 603 pass through the interior of the bracket 601 on both sides of the electric push rod 602. A grinding roller 606 is provided at the bottom of the fixing frame 604. A grinding motor 605 is installed on the outer wall of the fixing frame 604 at one end of the grinding roller 606. The slide rod 603 and the bracket 601 form a sliding structure. The bottom end of the slide rod 603 is fixedly connected to the top of the fixing frame 604. One end of the grinding roller 606 extends to the outside of the fixing frame 604 and is fixedly connected to the output end of the grinding motor 605.

[0029] Reference Figure 1 and Figure 2As shown, the electric push rod 602 is activated, which drives the fixed frame 604 to move up and down. The fixed frame 604 drives the slide rod 603 to move inside the bracket 601. Under the action of the slide rod 603, the stability of the fixed frame 604 during movement is enhanced. After the fixed frame 604 moves, it drives the polishing roller 606 to press on the top of the chip body 4. The polishing motor 605 is activated, which drives the polishing roller 606 to rotate. Under the action of the polishing roller 606, the top of the chip body 4 is polished.

[0030] A reciprocating structure 2 is fixed to the top of the base 1 below the grinding structure 6. The reciprocating structure 2 includes a reciprocating screw 201 set at the top of the base 1. A movable seat 202 is threaded to the outer side of the reciprocating screw 201. A slide rail 203 is fixed to the top of the base 1 on both sides of the reciprocating screw 201. A slide seat 204 is slidably connected to the outer side of the top of the slide rail 203. A support plate 206 is fixed to the top of the base 1 at both ends of the reciprocating screw 201. A drive motor 205 is installed on the outer wall of the support plate 206 at one end of the reciprocating screw 201. One end of the reciprocating screw 201 extends to the outside of the support plate 206 and is fixedly connected to the output end of the drive motor 205. The top of the movable seat 202 is fixedly connected to the bottom of the diverter seat 3. The top of the slide seat 204 is fixedly connected to the bottom of the diverter seat 3.

[0031] Reference Figure 3 and Figure 5 As shown, when the drive motor 205 is started, the drive motor 205 drives the reciprocating screw 201 to rotate. The reciprocating screw 201 drives the moving seat 202 to move back and forth. The moving seat 202 drives the diverter seat 3 to move back and forth. At the same time, the diverter seat 3 drives the slide 204 to move on the outer side of the top of the slide rail 203. Under the action of the slide 204, the moving seat 202 is prevented from rotating with the reciprocating screw 201. After moving, the diverter seat 3 drives the chip body 4 to move back and forth at the bottom of the grinding roller 606, thereby ensuring the uniformity of grinding and improving grinding efficiency.

[0032] A diverter seat 3 is fixed at the top of the reciprocating structure 2. A chip body 4 is set at the top of the diverter seat 3. An adsorption structure 5 is installed on one side of the diverter seat 3. The adsorption structure 5 includes a blower 501, an air inlet 502, a fixed frame 503, a dustproof net 504, and a moving plate 505. The blower 501 is installed on one side of the diverter seat 3. The air inlets 502 are evenly distributed through the top of the diverter seat 3. A fixed frame 503 is set at the top of each air inlet 502. A dustproof net 504 is fixed at the bottom of each fixed frame 503. A moving plate 505 is fixed at the top of each fixed frame 503. A protective net is fixed at the output end of the blower 501. The input end of the blower 501 is connected to one side of the diverter seat 3.

[0033] Reference Figure 4 and Figure 5As shown, the chip body 4 is placed on top of the air inlet 502 and the distributor 3. The blower 501 is started. Under the action of the dustproof net 504 and the protective net, impurities are prevented from entering the interior of the blower 501. Under the action of the blower 501 and the air inlet 502, the chip body 4 is fixed on top of the distributor 3, preventing the chip body 4 from shifting during polishing. The fixed frame 503 is moved by the moving plate 505, so that the dustproof net 504 is moved to the outside of the distributor 3 for cleaning.

[0034] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A polishing apparatus for chip packaging processing, comprising a base (1); Its features are: A grinding structure (6) is fixed to the top of the base (1), and a reciprocating structure (2) is fixed to the top of the base (1) below the grinding structure (6). The reciprocating structure (2) includes a reciprocating screw (201) set at the top of the base (1). A movable seat (202) is threaded to the outer side of the reciprocating screw (201). A slide rail (203) is fixed to the top of the base (1) on both sides of the reciprocating screw (201). A slide seat (204) is slidably connected to the outer side of the top of the slide rail (203). The top of the reciprocating structure (2) is fixed with a current shunt (3), and the top of the current shunt (3) is provided with a chip body (4); An adsorption structure (5) is installed on one side of the flow divider (3).

2. The polishing apparatus for chip packaging processing according to claim 1, characterized in that: The top of the base (1) at both ends of the reciprocating screw (201) is fixed with a support plate (206), and a drive motor (205) is installed on the outer wall of the support plate (206) at one end of the reciprocating screw (201).

3. The polishing apparatus for chip packaging processing according to claim 2, characterized in that: One end of the reciprocating lead screw (201) extends to the outside of the support plate (206) and is fixedly connected to the output end of the drive motor (205). The top end of the moving seat (202) is fixedly connected to the bottom end of the diverter seat (3), and the top end of the slide (204) is fixedly connected to the bottom end of the diverter seat (3).

4. The polishing apparatus for chip packaging processing according to claim 1, characterized in that: The adsorption structure (5) includes a blower (501), an air inlet (502), a fixed frame (503), a dustproof net (504), and a movable plate (505). The blower (501) is installed on one side of the diverter seat (3). The top of the diverter seat (3) is uniformly perforated by the air inlet (502). The top of the air inlet (502) is provided with a fixed frame (503). The bottom of the fixed frame (503) is fixed with a dustproof net (504). The top of the fixed frame (503) is fixed with a movable plate (505).

5. The polishing apparatus for chip packaging processing according to claim 4, characterized in that: The output end of the blower (501) is fixed with a protective net, and the input end of the blower (501) is connected to one side of the distributor (3).

6. The polishing apparatus for chip packaging processing according to claim 1, characterized in that: The grinding structure (6) includes a bracket (601), an electric push rod (602), a slide rod (603), a fixing frame (604), a grinding motor (605), and a grinding roller (606). The bracket (601) is fixed to the top of the base (1). The electric push rod (602) passes through the top of the bracket (601). The fixing frame (604) is fixed to the bottom of the electric push rod (602). The slide rod (603) passes through the interior of the bracket (601) on both sides of the electric push rod (602). The grinding roller (606) is provided at the bottom of the fixing frame (604). The grinding motor (605) is installed on the outer wall of the fixing frame (604) at one end of the grinding roller (606).

7. The polishing apparatus for chip packaging processing according to claim 6, characterized in that: The slide rod (603) and the bracket (601) form a sliding structure. The bottom end of the slide rod (603) is fixedly connected to the top end of the fixed frame (604). One end of the grinding roller (606) extends to the outside of the fixed frame (604) and is fixedly connected to the output end of the grinding motor (605).

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