Substrates and electronic devices

Abstract

The utility model provides a kind of substrate and electronic equipment, it is related to the technical field of semiconductor, can reduce the probability that glass substrate will appear crack, improve the yield of substrate.Glass substrate is included in the substrate;Metal adhesion layer is located on glass substrate, and the thickness of metal adhesion layer is 100nm-200nm;Metal functional layer is located on metal adhesion layer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to substrates and electronic devices. Background Technology

[0002] During the substrate manufacturing process, a metal attachment layer needs to be formed on the glass substrate, and then a metal functional layer needs to be formed on the metal attachment layer. After a series of processes, the substrate can be reflow soldered.

[0003] However, after reflow soldering the substrate, cracks will appear in the glass substrate, which will reduce the yield of the substrate. Utility Model Content

[0004] This invention provides a substrate and an electronic device that can reduce the risk of cracks in glass substrates and improve the yield of substrates.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] In a first aspect, a substrate is provided, comprising: a glass substrate; a metal attachment layer located on the glass substrate, the thickness of the metal attachment layer being 50nm-500nm; and a metal functional layer located on the metal attachment layer.

[0007] Thus, the substrate includes a glass substrate, a metal attachment layer on the glass substrate, and a metal functional layer on the metal attachment layer. Since the thickness of the metal attachment layer is 100nm-200nm, the relatively large thickness of the metal attachment layer can disperse the stress on the glass substrate, reduce stress concentration on the glass substrate, thereby alleviating the stress on the glass substrate and reducing the risk of cracking of the glass substrate. At the same time, since the thickness of the metal attachment layer is relatively large, it can provide sufficient bonding force for the glass substrate and the metal functional layer, reducing the risk of warping of the metal attachment layer, thereby improving the yield of the substrate.

[0008] In conjunction with the first aspect, in one embodiment of the first aspect, the metal functional layer includes a metal seed layer and an electroplated metal layer, wherein the metal seed layer is located between the metal attachment layer and the electroplated metal layer.

[0009] In conjunction with the first aspect, in one embodiment of the first aspect, the thickness of the metal seed layer is 10 μm-15 μm.

[0010] Thus, the thinner metal seed layer of the substrate can reduce the stress on the glass substrate, further reducing the risk of cracks in the glass substrate.

[0011] In conjunction with the first aspect, in one embodiment of the first aspect, the substrate further includes: an antioxidant layer located on the metal functional layer.

[0012] When the metal functional layer is exposed to high temperature, it will be oxidized to form oxides, which will reduce the bonding force between the metal functional layer and the metal adhesion layer. Since the substrate also includes an anti-oxidation layer on the metal functional layer, the anti-oxidation layer can reduce the degree of oxidation of the metal functional layer, thereby increasing the bonding force between the metal functional layer and the metal adhesion layer.

[0013] In conjunction with the first aspect, in one embodiment of the first aspect, the thickness of the antioxidant layer is 5nm-10nm.

[0014] In conjunction with the first aspect, in one embodiment of the first aspect, the antioxidant layer is TiN.

[0015] In conjunction with the first aspect, in one embodiment of the first aspect, the metal functional layer includes multiple conductive lines, and the substrate further includes a coupling agent layer covering the conductive lines and the gaps between adjacent conductive lines.

[0016] Thus, since coupling agents can establish molecular bridges between the interfaces of two materials with different properties, they can increase the stability of the connection between the metal functional layer and the metal attachment layer.

[0017] In conjunction with the first aspect, in one embodiment of the first aspect, the material of the metal adhesion layer is Ti.

[0018] In conjunction with the first aspect, in one embodiment of the first aspect, the material of the metal functional layer is Cu.

[0019] In a second aspect, an electronic device is provided, which includes the substrate provided in the first aspect and any embodiment thereof.

[0020] The technical effects brought about by the second aspect can be referred to the technical effects brought about by the different implementation methods of the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0021] Figure 1 A schematic diagram of the structure of a substrate provided for an embodiment of this utility model;

[0022] Figure 2 This is a schematic diagram of another substrate provided for an embodiment of the present invention.

[0023] Reference numerals: Substrate-10, Glass substrate-101, Metal adhesion layer-102, Metal functional layer-103, Metal seed layer-1031, Electroplated metal layer-1032, Coupling agent layer-104, Antioxidant layer-105. Detailed Implementation

[0024] In the description of this utility model, unless otherwise stated, "a plurality of" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be single or multiple.

[0025] In this embodiment of the invention, the terms "exemplary" or "for example" are used to indicate that something is being described as an example, illustration, or description. Any embodiment or design described as "exemplary" or "for example" in this embodiment of the invention should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a concrete manner for ease of understanding.

[0026] It is understood that the term "embodiment" used throughout the specification means that a specific feature, structure, or characteristic related to an embodiment is included in at least one embodiment of the present invention. Therefore, the various embodiments throughout the specification do not necessarily refer to the same embodiment. Furthermore, these specific features, structures, or characteristics can be combined in any suitable manner in one or more embodiments.

[0027] It is understood that some optional features in the embodiments of this utility model can be implemented independently in certain scenarios without relying on other features, such as the current solution on which they are based, to solve the corresponding technical problems and achieve the corresponding effects. Alternatively, they can be combined with other features as needed in certain scenarios. Correspondingly, the device given in the embodiments of this utility model can also implement these features or functions, which will not be elaborated here.

[0028] In this utility model, unless otherwise specified, the same or similar parts between the various embodiments can be referred to each other. In the various embodiments and implementation methods of this utility model, unless otherwise specified or logically conflicting, the terminology and / or descriptions between different embodiments and between the implementation methods of different embodiments are consistent and can be mutually referenced. The technical features in different embodiments and between the implementation methods of different embodiments can be combined according to their inherent logical relationships to form new embodiments, implementation methods, implementation methods, or implementation approaches. The following embodiments of this utility model do not constitute a limitation on the scope of protection of this utility model.

[0029] During the substrate manufacturing process, a metal attachment layer (e.g., Ti) needs to be formed on the glass substrate. The thickness of the metal attachment layer is usually 50 nm. Then, a metal functional layer (e.g., Cu) is formed on the metal attachment layer. The thickness of the metal functional layer is usually 27 μm. After a series of processes, the substrate can be reflow soldered.

[0030] Reflow soldering is a key process in electronics manufacturing used to solder and mount electronic components onto the surface of a substrate. Solder paste and electronic components are placed on the surface of the substrate, and the solder paste on the substrate surface is melted by heating to achieve the connection between the electronic components and the substrate.

[0031] However, due to the different coefficients of thermal expansion of each layer of the substrate, the coefficient of thermal expansion of the metal functional layer is much greater than that of the glass substrate. After reflow soldering the substrate, the difference in shrinkage during cooling of each layer causes the stress on the glass substrate to exceed the tensile strength of the glass substrate, resulting in cracks in the glass substrate and thus reducing the yield of the substrate.

[0032] To address the above problems, this utility model provides a substrate. Figure 1 A schematic diagram of the structure of a substrate provided for an embodiment of this utility model, as shown below. Figure 1 As shown, the substrate 10 includes: a glass substrate 101, a metal adhesion layer 102 located on the glass substrate 101, the thickness L1 of the metal adhesion layer 102 being 50nm-500nm, and a metal functional layer 103 located on the metal adhesion layer 102.

[0033] The glass substrate 101 can be borosilicate glass, etc., and this invention does not impose specific limitations on the specific material of the glass substrate 101. Preferably, the glass substrate 101 is borosilicate glass, and the coefficient of thermal expansion of borosilicate glass is ≈3.3×10⁻⁶. - / ℃.

[0034] The metal adhesion layer 102 is made of Ti. The coefficient of thermal expansion of Ti is approximately 8.6 × 10⁻⁶. - / ℃. Due to Ti's strong oxidizing properties, Ti readily reacts with oxygen in the glass to form Ti-O bonds (titanium-oxygen bonds). This chemical bond is stronger than the physical adsorption between ordinary metals and glass, significantly improving adhesion. Ti acts as a bridge, tightly connecting the inert glass surface to the subsequent metal functional layer 103.

[0035] For example, the thickness of the metal adhesion layer 102 can be 50nm, 60nm, 80nm, 100nm, 110nm, 120nm, 130nm, 140nm, 150nm, 160nm, 170nm, 180nm, 190nm, 200nm, 500nm, etc. Preferably, the thickness L1 of the metal adhesion layer 102 is 100nm-200nm.

[0036] The material of the metal functional layer 103 can be Cu, Ag, etc., and this invention does not impose specific limitations on the specific material of the metal functional layer 103. Preferably, the metal functional layer 103 is Cu, and the coefficient of thermal expansion of Cu is ≈17×10⁻⁶. - / ℃.

[0037] Thus, the substrate 10 includes a glass substrate 101, a metal adhesion layer 102 on the glass substrate 101, and a metal functional layer 103 on the metal adhesion layer 102. Since the thickness of the metal adhesion layer 102 is 50nm-500nm, the relatively large thickness of the metal adhesion layer 102 can disperse the stress on the glass substrate 101, reduce the stress concentration on the glass substrate 101, thereby alleviating the stress on the glass substrate 101 and reducing the risk of cracking in the glass substrate 101. At the same time, since the thickness of the metal adhesion layer 102 is relatively large, it can provide sufficient bonding force for the glass substrate 101 and the metal functional layer 103, reducing the risk of warping of the metal adhesion layer 102, thereby improving the yield of the substrate 10.

[0038] like Figure 1 As shown, the metal functional layer 103 includes a metal seed layer 1031 and an electroplated metal layer 1032, with the metal seed layer 1031 located between the metal adhesion layer 102 and the electroplated metal layer 1032.

[0039] The deposition of the metal seed layer 1031 on the metal attachment layer 102 can promote the uniform growth of subsequent metal electroplating, mainly providing conductivity and nucleation sites to ensure high-quality metal deposition.

[0040] The electroplated metal layer 1032 is deposited on the metal seed layer 1031 by electroplating, which can increase the thickness of the metal functional layer 103.

[0041] The thickness L2 of the metal seed layer 1031 is 10μm-15μm. For example, the thickness of the metal seed layer 1031 can be 10μm, 11μm, 12μm, 13μm, 14μm, or 15μm. Thus, compared to existing solutions, the metal seed layer 1031 of the substrate 10 provided by this invention has a smaller thickness, which can reduce the stress on the glass substrate 101 and further reduce the risk of cracking in the glass substrate 101.

[0042] like Figure 1 As shown in Figure a, the metal functional layer 103 includes multiple conductive lines. The substrate 10 also includes a coupling agent layer 104, which covers the conductive lines and the gaps between adjacent conductive lines. Thus, since the coupling agent can establish molecular bridges between the interfaces of two materials with different properties, the connection stability between the metal functional layer 103 and the metal adhesion layer 102 can be increased.

[0043] The coupling agent layer 104 can be a silane coupling agent, etc. Of course, the coupling agent layer 104 can also be other types of coupling agents, and this utility model does not impose specific limitations on it. Preferably, the coupling agent layer 104 is a silane coupling agent.

[0044] In some embodiments, such as Figure 1 As shown in b, the substrate 10 may also be without the coupling agent layer 104.

[0045] Figure 2 A schematic diagram of another substrate provided for an embodiment of this utility model is shown below. Figure 2 As shown, the substrate 10 also includes an anti-oxidation layer 105 located on the metal functional layer 103. The metal functional layer 103 will be oxidized to form oxides after being exposed to high temperature. Taking Cu as an example, Cu is oxidized to form CuO or CuO, which reduces the bonding force between the metal functional layer 103 and the metal adhesion layer 102. Since the substrate 10 also includes an anti-oxidation layer 105 located on the metal functional layer 103, the anti-oxidation layer 105 can reduce the degree of oxidation of the metal functional layer 103, thereby increasing the bonding force between the metal functional layer 103 and the metal adhesion layer 102.

[0046] The thickness L3 of the antioxidant layer 105 is 5nm-10nm. For example, the thickness of the antioxidant layer 105 can be 5nm, 6nm, 7nm, 8nm, 9nm, or 10nm.

[0047] The antioxidant layer 105 can be TiN, etc. Of course, the antioxidant layer 105 can also be other antioxidant materials, and this utility model does not impose specific limitations on it. Preferably, the antioxidant layer 105 is TiN.

[0048] This application also provides an electronic device, including a substrate 10. The substrate 10 is manufactured using any of the substrate 10 manufacturing methods provided in the above-described embodiments. The substrate 10 can be a packaging substrate, a chip, a passive device (inductor, capacitor, resistor), etc. The substrate 10 provided in this application is applicable to common electronic devices on the market. For example, the electronic device can be a terminal device such as some consumer electronics products (computers, etc.), communication electronic products, medical devices, automotive electronics, and smart electronic products. The electronic device can also be a semi-finished device, etc., and no specific limitation is made here.

[0049] The above embodiments are for illustrating the implementation schemes disclosed in this application and should not be construed as limiting this application. Furthermore, various modifications listed herein, as well as variations in the methods and compositions used in the application, will be apparent to those skilled in the art without departing from the scope and spirit of this application. Although this application has been specifically described in conjunction with various specific preferred embodiments, it should be understood that this application should not be limited to these specific embodiments. In fact, various modifications as described above, which are obvious to those skilled in the art, to obtain the application should be included within the scope of this application.

Claims

1. A substrate, characterized in that, The substrate includes: Glass substrate; A metal adhesion layer is located on the glass substrate, and the thickness of the metal adhesion layer is 50 nm - 500 nm; A metal functional layer is located on the metal attachment layer.

2. The substrate according to claim 1, characterized in that, The metal functional layer includes a metal seed layer and an electroplated metal layer, wherein the metal seed layer is located between the metal attachment layer and the electroplated metal layer.

3. The substrate according to claim 2, characterized in that, The thickness of the metal seed layer is 10 micrometers to 15 micrometers.

4. The substrate according to claim 1, characterized in that, The substrate further includes: An antioxidant layer is located on the metal functional layer.

5. The substrate according to claim 4, characterized in that, The thickness of the antioxidant layer is 5nm-10nm.

6. The substrate according to claim 4, characterized in that, The antioxidant layer is TiN.

7. The substrate according to claim 1, characterized in that, The metal functional layer includes multiple conductive lines, and the substrate further includes: A coupling agent layer covers the conductive lines and the gaps between adjacent conductive lines.

8. The substrate according to any one of claims 1-7, characterized in that, The material of the metal adhesion layer is Ti.

9. The substrate according to any one of claims 1-7, characterized in that, The material of the metal functional layer is Cu.

10. An electronic device, characterized in that, The electronic device includes the substrate as described in any one of claims 1-9.

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