A kind of anti-overflow gas electroplating device

Abstract

This utility model relates to the field of electroplating production technology, specifically disclosing an anti-overflow electroplating device, including a base, an electroplating tank mounted on the surface of the base, and support frames symmetrically mounted on the surface of the base; a moving mechanism is provided on the surface of the support frames, and the moving mechanism includes: a cylinder mounted on the surface of the support frame, a sealing cover fixedly connected to the end of the output shaft of the cylinder, an electroplating rod embedded in the bottom of the sealing cover, an electroplating hanger sleeved on the surface of the electroplating rod, and a connecting plate fixedly connected to the surface of the sealing cover. This anti-overflow electroplating device, with its moving mechanism, facilitates sealing the electroplating tank to prevent gas leakage during the reaction. The cylinder drives the sealing cover to move up and down, and the sealing cover moves the workpiece downwards, facilitating the removal of parts. Simultaneously, when the sealing cover moves to the opening of the electroplating tank, it blocks the opening, improving the safety of the device.

Description

Technical Field

[0001] This utility model relates to the field of electroplating production technology, specifically to an electroplating device that prevents gas overflow. Background Technology

[0002] Electroplating is the process of depositing a thin layer of another metal or alloy onto the surface of certain metals using the principle of electrolysis. It utilizes electrolysis to attach a metal film to the surface of metal or other material parts, thereby preventing metal oxidation and improving wear resistance, conductivity, reflectivity, corrosion resistance, and aesthetics. During electroplating, the plating metal or other insoluble material acts as the anode, and the workpiece to be plated acts as the cathode. The cations of the plating metal are reduced on the surface of the workpiece to form the plating layer. To eliminate interference from other cations and ensure a uniform and firm plating layer, a solution containing plating metal cations is used as the electroplating solution to maintain a constant concentration of plating metal cations. The electroplating apparatus is the container that holds the electroplating solution and the workpiece to be plated during the electroplating process. It is the main site for the electroplating reaction, providing a stable DC power supply to the electroplating process. This allows metal ions in the electroplating solution to move directionally under the influence of an electric field and deposit on the cathode. However, most existing electroplating apparatuses are open-type designs, which can easily lead to the leakage of harmful gases during the reaction, making them inconvenient to use and potentially harmful to the user's health. Utility Model Content

[0003] The purpose of this invention is to provide an electroplating device that prevents gas overflow, thereby solving the problem mentioned in the background art that harmful gases easily overflow from the opening during the electroplating process, making it inconvenient to use and potentially harming the user's health.

[0004] To achieve the above objectives, the present invention provides the following technical solution: an electroplating device for preventing gas overflow, comprising a base, wherein an electroplating tank is installed on the surface of the base, and support frames are symmetrically installed on the surface of the base;

[0005] The support frame surface is provided with a moving mechanism, which includes: a cylinder mounted on the support frame surface, a sealing cover fixedly connected to the end of the cylinder's output shaft, an electroplating rod embedded in the bottom of the sealing cover, an electroplating fixture sleeved on the surface of the electroplating rod, a connecting plate fixedly connected to the surface of the sealing cover, a receiving plate connected to the end of the connecting plate, a sealing layer connected to the surface of the sealing cover, a horizontal plate mounted on the surface of the electroplating tank, a fan connected to the surface of the horizontal plate, a reaction chamber mounted on the surface of the horizontal plate, a filter box mounted on the top of the reaction chamber, and an activated carbon layer embedded inside the filter box.

[0006] Preferably, the electroplating tank is configured as a shell structure with a square opening, and the sealing cover is positioned corresponding to the electroplating tank, with the sealing layer disposed at the bottom of the sealing cover.

[0007] Using the above technical solution, the sealing cover moves downward, causing the sealing layer to move downward, so that the sealing cover moves to the opening of the electroplating tank.

[0008] Preferably, the bottom of the electroplating rod is configured as a cylindrical structure, and one side of the electroplating rod penetrates the top of the sealing cover. The electroplating rod and the electroplating hanger are connected by a snap-fit ​​connection, and the bottom of the electroplating hanger is configured as a hook shape.

[0009] Using the above technical solution, the electroplating rod is energized, and the electroplating rod transmits the power to the surface of the part.

[0010] Preferably, the receiving plate is disposed inside the electroplating tank, and the electroplating tank and the receiving plate are slidably connected, and the receiving plate is configured as a mesh structure.

[0011] Using the above technical solution, the receiving plate can support the bottom of the electroplating fixture and prevent parts from falling into the electroplating tank.

[0012] Preferably, the air inlet of the blower is connected to the electroplating tank, and the air outlet of the blower is connected to the surface of the reaction chamber.

[0013] Using the above technical solution, the fan drives the air inside the electroplating tank into the interior of the reaction chamber.

[0014] Preferably, a pipe connects the reaction chamber and the filter chamber, and an exhaust pipe is connected to the surface of the filter chamber.

[0015] Using the above technical solution, the gas inside the reaction chamber enters the filter chamber, is filtered inside the filter chamber, and is discharged through the exhaust pipe of the filter chamber.

[0016] Compared with the prior art, the beneficial effects of this utility model are: the anti-overflow electroplating device:

[0017] 1. A moving mechanism is provided to facilitate sealing of the electroplating tank and prevent gas leakage during the reaction. The cylinder drives the sealing cover to move up and down, and the sealing cover drives the workpiece to move down, which facilitates the removal of the parts. At the same time, when the reaction sealing cover moves to the opening of the electroplating tank, it blocks the opening of the electroplating tank and improves the safety of the device.

[0018] 2. A reaction chamber and a filter chamber are set up. A fan drives the gas into the reaction chamber, so that the gas comes into contact with the solution inside the reaction chamber, removing acidic or alkaline substances from the gas. Then the gas enters the filter chamber and undergoes secondary filtration through an activated carbon layer to improve the filtration effect. Attached Figure Description

[0019] Figure 1This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a three-dimensional structural diagram of the reaction chamber of this utility model.

[0021] Figure 3 This is a three-dimensional structural diagram of the mounting plate of this utility model;

[0022] Figure 4 This is a three-dimensional structural diagram of the electroplating rod installation of this utility model;

[0023] Figure 5 This is a three-dimensional structural diagram of the activated carbon layer installation of this utility model.

[0024] In the diagram: 10, base; 20, electroplating tank; 30, support frame;

[0025] 40. Cylinder; 401. Sealing cover; 402. Electroplating rod; 404. Electroplating fixture; 405. Connecting plate; 406. Receiving plate; 407. Sealing layer;

[0026] 50. Horizontal plate; 501. Reaction chamber; 502. Filter chamber; 503. Fan; 504. Activated carbon layer. Detailed Implementation

[0027] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0028] Please see Figure 1-5 This utility model provides a technical solution: an electroplating device for preventing gas overflow, including a base 10, an electroplating tank 20, a support frame 30, a cylinder 40, a sealing cover 401, an electroplating rod 402, an electroplating hanger 404, a connecting plate 405, a receiving plate 406, a sealing layer 407, a horizontal plate 50, a reaction box 501, a filter box 502, a fan 503, and an activated carbon layer 504;

[0029] This electroplating apparatus facilitates the handling and placement of parts while preventing gas leakage. The specific implementation method is as follows:

[0030] An electroplating tank 20 is mounted on the surface of the base 10, and a support frame 30 is symmetrically mounted on the surface of the base 10. A moving mechanism is provided on the surface of the support frame 30, and the moving mechanism includes: a cylinder 40 mounted on the surface of the support frame 30, a sealing cover 401 fixedly connected to the end of the output shaft of the cylinder 40, an electroplating rod 402 embedded in the bottom of the sealing cover 401, an electroplating hanger 404 sleeved on the surface of the electroplating rod 402, a connecting plate 405 fixedly connected to the surface of the sealing cover 401, and a receiving plate 406 connected to the end of the connecting plate 405. The surface of the sealing cover 401 is connected to... The electroplating tank 20 is equipped with a sealing layer 407 and is designed as a shell structure with a square opening. The sealing cover 401 is positioned corresponding to the electroplating tank 20. The sealing layer 407 is located at the bottom of the sealing cover 401. The bottom of the electroplating rod 402 is designed as a cylindrical structure, and one side of the electroplating rod 402 penetrates through the top of the sealing cover 401. The electroplating rod 402 and the electroplating hanger 404 are connected by a snap-fit ​​connection. The bottom of the electroplating hanger 404 is designed as a hook shape. The receiving plate 406 is located inside the electroplating tank 20 and is connected to the electroplating tank 20 by a sliding connection. The receiving plate 406 is designed as a mesh structure.

[0031] The part is placed at the end of the electroplating rack 404. After the part is formed, the cylinder 40 is activated. The output shaft of the cylinder 40 pushes the sealing cover 401 downward, causing the sealing cover 401 to move the electroplating rod 402 downward. The electroplating rod 402, through the electroplating rack 404, moves the part downward, bringing it into the electroplating tank 20. At this time, the sealing cover 401 moves the connecting plate 405 downward, causing the connecting plate 405 to move the supporting plate 406 downward. The supporting plate 406 moves downward inside the electroplating tank 20, supporting the part and preventing it from falling out. When the electroplating rack 404 falls off and the part is completely moved to the electroplating tank 20, the bottom of the sealing cover 401 is made to fit against the surface of the electroplating tank 20, blocking the opening of the electroplating tank 20. At this time, the sealing layer 407 blocks the gap between the sealing cover 401 and the electroplating tank 20, sealing the opening of the electroplating tank 20 to prevent gas from escaping from the electroplating tank 20 during the reaction. After the part has finished reacting, the cylinder 40 is started. The output shaft of the cylinder 40 drives the sealing cover 401 to move upward, causing the sealing cover 401 to drive the electroplating rack 404 to move upward. The electroplating rack 404 then removes the part from the surface.

[0032] This electroplating apparatus can purify gases. The specific implementation method is as follows:

[0033] A horizontal plate 50 is installed on the surface of the electroplating tank 20, and a fan 503 is connected to the surface of the horizontal plate 50. A reaction chamber 501 is installed on the surface of the horizontal plate 50, and a filter box 502 is installed on the top of the reaction chamber 501. An activated carbon layer 504 is embedded inside the filter box 502. The air inlet of the fan 503 is connected to the electroplating tank 20, and the air outlet of the fan 503 is connected to the surface of the reaction chamber 501. A pipe is connected between the reaction chamber 501 and the filter box 502, and an exhaust pipe is connected to the surface of the filter box 502.

[0034] When the parts are electroplated, gas is generated inside the electroplating tank 20. The blower 503 is started, and the blower 503 drives the gas inside the electroplating tank 20 into the reaction chamber 501. The gas combines with the reagents inside the reaction chamber 501, which can cause the air to react with the reagents and remove acidic or alkaline substances from the air. Then, the gas generated by the reaction in the reaction chamber 501 enters the interior of the filter chamber 502, so that the gas comes into contact with the activated carbon layer 504. The activated carbon layer 504 performs secondary filtration of the air.

[0035] Working principle: When using this anti-overflow electroplating device, a cylinder 40, a sealing cover 401, a connecting plate 405, and a receiving plate 406 are provided to facilitate the handling and placement of parts, while preventing gas overflow. A filter box 502, a fan 503, and an activated carbon layer 504 are also provided to purify the gas, increasing the overall practicality.

[0036] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An anti-overflow electroplating device, comprising a base (10), wherein an electroplating tank (20) is mounted on the surface of the base (10), and support frames (30) are symmetrically mounted on the surface of the base (10). Its features are: The support frame (30) is provided with a moving mechanism, which includes: a cylinder (40) mounted on the surface of the support frame (30), a sealing cover (401) fixedly connected to the end of the output shaft of the cylinder (40), an electroplating rod (402) embedded in the bottom of the sealing cover (401), an electroplating fixture (404) sleeved on the surface of the electroplating rod (402), and a connecting plate (405) fixedly connected to the surface of the sealing cover (401). (405) has a receiving plate (406) connected to its end, a sealing layer (407) connected to the surface of the sealing cover (401), a horizontal plate (50) installed on the surface of the electroplating tank (20), and a fan (503) connected to the surface of the horizontal plate (50), a reaction box (501) installed on the surface of the horizontal plate (50), and a filter box (502) installed on the top of the reaction box (501), and an activated carbon layer (504) embedded inside the filter box (502).

2. The electroplating device for preventing gas overflow according to claim 1, characterized in that: The electroplating tank (20) is configured as a shell structure with a square opening, and the sealing cover (401) is positioned corresponding to the electroplating tank (20). The sealing layer (407) is located at the bottom of the sealing cover (401).

3. The electroplating device for preventing gas overflow according to claim 1, characterized in that: The bottom of the electroplating rod (402) is set as a cylindrical structure, and one side of the electroplating rod (402) penetrates the top of the sealing cover (401). The electroplating rod (402) and the electroplating hanger (404) are connected by a snap-fit ​​connection. The bottom of the electroplating hanger (404) is set as a hook shape.

4. The electroplating device for preventing gas overflow according to claim 1, characterized in that: The receiving plate (406) is disposed inside the electroplating tank (20), and the electroplating tank (20) and the receiving plate (406) are slidably connected. The receiving plate (406) is configured as a mesh structure.

5. The electroplating device for preventing gas overflow according to claim 1, characterized in that: The air inlet of the blower (503) is connected to the electroplating tank (20), and the air outlet of the blower (503) is connected to the surface of the reaction chamber (501).

6. The electroplating device for preventing gas overflow according to claim 1, characterized in that: A pipe is connected between the reaction chamber (501) and the filter chamber (502), and an exhaust pipe is connected to the surface of the filter chamber (502).

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