A chip package test structure

Abstract

This utility model relates to the field of chip manufacturing technology, specifically a chip packaging and testing structure, including a packaging performance testing device. The device has a testing chamber, and a mounting plate is fixedly installed at the entrance of the chamber. Two chip test holders for placing multiple chips are symmetrically slidably mounted on the mounting plate. A synchronization component is provided on the side of the mounting plate facing the testing chamber. Each chip test holder has a positioning component for pressing the chip, and the synchronization component has a trigger. By setting up the chip test holders, synchronization component, positioning component, and trigger, the synchronization component controls the two chip test holders to enter and exit the device sequentially, significantly improving the testing efficiency. Simultaneously, after the chip test holders enter the device, they automatically press the chip onto the probe holder, ensuring stable physical contact and uniform pressure between the chip and the probe, avoiding poor contact that may be caused by manual operation, and reducing test data fluctuations caused by contact errors.

Description

Technical Field

[0001] This utility model relates to the field of chip manufacturing technology, and in particular to a chip packaging and testing structure. Background Technology

[0002] Chip packaging and testing is a crucial step in ensuring chip performance and reliability, and guaranteeing the stability of the chip in practical applications.

[0003] A chip packaging and testing structure disclosed in Chinese Patent Publication No. CN220855084U uses four clamping blocks that move towards the center point of a placement stage to fix the chip on the stage, thus preventing the chip from moving during the packaging and testing process and affecting the packaging and testing results. This device can clamp and fix chips of different sizes to prevent movement during the packaging and testing process. However, according to chip packaging and testing structures and existing technologies in related fields, single-station transmission equipment can only process one group or one chip at a time. When chips enter the equipment for DC parameter, AC parameter, and functional testing, operators must wait for the current group of tests to be completed before loading and unloading the next group of chips. In batch testing scenarios, the accumulated waiting time is significant, resulting in low overall productivity. Utility Model Content

[0004] The purpose of this invention is to overcome the shortcomings of the prior art, solve the problems mentioned in the background art, and provide a chip packaging and testing structure.

[0005] The objective of this utility model is achieved through the following technical solution: a chip packaging test structure, including a packaging performance test device, wherein the packaging performance test device is provided with a test chamber for performing DC parameter testing, AC parameter testing, and functional testing on the chip, a mounting plate is fixedly installed at the entrance of the test chamber, and two chip test sockets for placing multiple chips are symmetrically slidably arranged on the mounting plate, and a synchronization component for controlling the two chip test sockets to alternately enter the test chamber is provided on the side of the mounting plate facing the test chamber; each of the two chip test sockets is provided with a positioning component for pressing the chip, and the synchronization component is provided with a trigger that causes the positioning component to press the chip after the chip test socket enters the test chamber.

[0006] Preferably, the chip test socket includes a sliding plate, the top of the sliding plate has a receiving groove, a plurality of probe holders are fixedly installed at equal intervals inside the receiving groove, a baffle is fixedly installed at one end of the sliding plate outside the test chamber, and a handle is fixedly installed on the side of the baffle away from the sliding plate.

[0007] Preferably, the synchronization component includes a fixed base fixedly mounted on the mounting plate, a splined shaft rotatably mounted on the fixed base, a gear inserted into the outer surface of the splined shaft, the gear being disposed between the two sliding plates, and sliding holes being provided on the mounting plate corresponding to the positions of the two sliding plates.

[0008] Preferably, racks are fixedly mounted on the side of each of the two sliding plates facing the gear, and both racks mesh with the gear.

[0009] Preferably, the positioning component includes a movable frame slidably disposed above the probe holder, wherein the movable frame is fixedly provided with a pressing member corresponding to the position of each probe holder, and the sliding plate is provided with an elastic component on the side near the movable frame.

[0010] Preferably, the actuating element is plugged into the spline shaft, the actuating element is disposed above the gear, the actuating element is elliptical in shape, and the position where the movable frame contacts the actuating element is an arc surface.

[0011] Preferably, the sliding plate has a movable groove corresponding to the position of the movable frame, the elastic component includes a receiving hole formed on the sliding plate, one end of the receiving hole is connected to the movable groove, the end of the receiving hole away from the movable groove is threaded with a stud, and an elastic element is installed in the receiving hole between the stud and the movable frame.

[0012] Beneficial effects:

[0013] This chip packaging test structure, by setting up chip test sockets, synchronization components, positioning components, and triggers, uses the synchronization components to control two chip test sockets to enter and exit the equipment sequentially, avoiding the waiting time of traditional single-station equipment and significantly improving the equipment's testing efficiency. At the same time, after the chip test sockets enter the equipment, they can automatically press the chip onto the probe socket, ensuring stable physical contact and uniform pressure between the chip and the probe, avoiding poor contact that may be caused by manual operation, and reducing test data fluctuations caused by contact errors. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the overall structure of the device of this utility model;

[0016] Figure 2 This is a first-view structural schematic diagram of the mounting plate of this utility model;

[0017] Figure 3 This is a second-view structural schematic diagram of the mounting plate of this utility model;

[0018] Figure 4 This is a schematic diagram of the first working state of the two chip test sockets of this utility model;

[0019] Figure 5 This is a schematic diagram of the second working state of the two chip test sockets of this utility model;

[0020] Figure 6 This is a schematic diagram of the structure of the chip test socket of this utility model;

[0021] Figure 7 This is a partial cross-sectional view of the sliding plate of this utility model;

[0022] Figure 8 This utility model Figure 7 Enlarged structural diagram at point A;

[0023] Figure 9 This is a schematic diagram of the structure of the synchronization component of this utility model;

[0024] Figure 10 This is a schematic diagram showing the disassembled structure of the synchronization component of this utility model.

[0025] In the diagram: 1. Packaging performance testing equipment; 101. Test chamber; 2. Mounting plate; 3. Chip test socket; 301. Sliding plate; 3011. Rack; 3012. Movable slot; 302. Receiving slot; 303. Probe holder; 304. Baffle; 305. Handle; 4. Synchronization assembly; 401. Fixed base; 402. Splined shaft; 403. Gear; 5. Positioning assembly; 501. Movable frame; 502. Pressing component; 6. Actuating component; 7. Elastic component; 701. Receiving hole; 702. Stud; 703. Elastic component. Detailed Implementation

[0026] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0027] Additional aspects and advantages of this invention will be further set forth in the description which follows in conjunction with the accompanying drawings, and in part will be obvious from the description or may be learned by practice of the invention.

[0028] like Figures 1 to 10 As shown, a chip packaging test structure includes a packaging performance test device 1. The packaging performance test device 1 is equipped with a test chamber 101 for performing DC parameter testing, AC parameter testing, and functional testing on the chip. A mounting plate 2 is fixedly installed at the entrance of the test chamber 101. Two chip test sockets 3 for placing multiple chips are symmetrically slidably arranged on the mounting plate 2. A synchronization component 4 for controlling the two chip test sockets 3 to alternately enter the test chamber 101 is provided on the side of the mounting plate 2 facing the test chamber 101. Each chip test socket 3 is equipped with a positioning component 5 for pressing the chip. The synchronization component 4 is equipped with a trigger 6 that causes the positioning component 5 to press the chip after the chip test socket 3 enters the test chamber 101.

[0029] like Figure 1 , Figure 2 and Figure 6 As shown, the chip test socket 3 includes a sliding plate 301. A receiving groove 302 is provided on the top of the sliding plate 301. Multiple probe seats 303 are fixedly installed at equal intervals inside the receiving groove 302. A baffle 304 is fixedly installed at one end of the sliding plate 301 located outside the test chamber 101. A handle 305 is fixedly installed on the side of the baffle 304 away from the sliding plate 301.

[0030] like Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 9 As shown, the synchronization component 4 includes a fixed base 401 fixedly mounted on the mounting plate 2. A splined shaft 402 is rotatably mounted on the fixed base 401. A gear 403 is inserted into the outer surface of the splined shaft 402. The gear 403 is positioned between two sliding plates 301. The mounting plate 2 has sliding holes corresponding to the positions of the two sliding plates 301. The fixed base 401 has a rotating hole at the bottom end of the splined shaft 402. The splined shaft 402 is connected to the rotating hole via a bearing. By utilizing the aforementioned bearing, the friction force during the rotation of the splined shaft 402 can be reduced, thereby improving the stability of the splined shaft 402 during rotation. A rack 3011 is fixedly mounted on the side of each sliding plate 301 facing the gear 403, and both racks 3011 mesh with the gear 403. Figures 2 to 6As shown, when one of the sliding plates 301 enters the test chamber 101, the other sliding plate 301 automatically slides to the outside of the packaging performance testing equipment 1 by utilizing the cooperation between the rack 3011 and the gear 403. Thus, the synchronization component 4 controls the two sliding plates 301 to enter and exit the equipment in sequence. When one sliding plate 301 is performing DC parameter, AC parameter and functional tests inside the equipment, the other sliding plate 301 outside can simultaneously complete the removal of the tested chip and the placement of the new chip, avoiding the waiting time of traditional single-station equipment and greatly improving the equipment testing efficiency.

[0031] like Figure 2 , Figure 3 , Figure 6 , Figure 7 and Figure 8 As shown, the positioning component 5 includes a movable frame 501 slidably disposed above the probe holder 303. A pressing member 502 is fixedly provided on the movable frame 501 corresponding to the position of each probe holder 303. The bottom end of the pressing member 502 away from the movable frame 501 has a beveled surface. The outer surface of the pressing member 502 is covered with a rubber layer, which can both prevent scratching the chip and improve the friction between the pressing member and the chip and the flexible pressing effect on the chip. A spring component 7 is provided on the side of the sliding plate 301 near the movable frame 501. An actuating member 6 is plugged into and connected to the spline shaft 402. Part 6 is positioned above gear 403. The actuating part 6 is elliptical in shape, and the contact point between the movable frame 501 and the actuating part 6 is an arc surface. A movable groove 3012 is provided on the sliding plate 301 corresponding to the position of the movable frame 501. The elastic component 7 includes a receiving hole 701 on the sliding plate 301. One end of the receiving hole 701 communicates with the movable groove 3012, and a stud 702 is threaded to the end of the receiving hole 701 away from the movable groove 3012. An elastic element 703 (spring) is installed between the stud 702 and the movable frame 501 in the receiving hole 701. Figures 2 to 9 As shown, after the sliding plate 301 enters the equipment, the gear 403 can control the rotation of the touch element 6 through the spline shaft 402, thereby causing the touch element 6 to push the movable frame 501, so that the multiple pressing parts 502 on the movable frame 501 automatically press the chip onto the probe holder 303, ensuring stable physical contact and uniform pressure between the chip and the probe, avoiding poor contact that may be caused by manual operation, and reducing test data fluctuations caused by contact errors. By using the threaded engagement between the stud 702 and the receiving hole 701, the stud 702 can be removed to replace the elastic element 703, thereby ensuring that the elastic element 703 can always maintain its elasticity. When the movable frame 501 is no longer pushed, the elastic element 703 can cause the movable frame 501 to reset, so that the multiple pressing parts 502 no longer press the chip, making it easier for the staff to remove the chip.

[0032] The work process is as follows:

[0033] S1: As Figures 1 to 3 As shown, in use, multiple chips are sequentially placed into multiple probe holders 303, and then the sliding plate 301, which has been filled with chips, is pushed into the test chamber 101.

[0034] S2: As Figures 1 to 5 As shown, when one of the sliding plates 301 enters the test chamber 101, the other sliding plate 301 automatically slides to the outside of the packaging performance test equipment 1 by utilizing the cooperation between the rack 3011 and the gear 403.

[0035] S3: As Figure 1 As shown, the chip inside the test chamber 101 is subjected to DC parameter testing, AC parameter testing, and functional testing using the packaging performance testing equipment 1.

[0036] S4: As Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 9 As shown above, the synchronization component 4 controls the two sliding plates 301 to enter and exit the equipment in sequence. When one sliding plate 301 is performing DC parameter, AC parameter and functional tests inside the equipment, the other sliding plate 301 outside can simultaneously complete the removal of the tested chip and the placement of the new chip, avoiding the waiting time of traditional single-station equipment and greatly improving the equipment testing efficiency.

[0037] S5: As Figure 1 , Figure 2 , Figure 4 , Figure 5 , Figure 6 and Figure 9 As shown, after the sliding plate 301 enters the device, the gear 403 can control the rotation of the touch element 6 through the spline shaft 402, thereby causing the touch element 6 to push the movable frame 501, so that the multiple pressing parts 502 on the movable frame 501 automatically press the chip onto the probe holder 303, ensuring stable physical contact and uniform pressure between the chip and the probe, avoiding poor contact that may be caused by manual operation, and reducing the fluctuation of test data caused by contact error.

[0038] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A chip packaging test structure, characterized in that: The package includes a packaging performance testing device (1), which is provided with a test chamber (101) for performing DC parameter testing, AC parameter testing and functional testing on the chip. A mounting plate (2) is fixedly installed at the entrance of the test chamber (101). Two chip test sockets (3) for placing multiple chips are symmetrically slidably provided on the mounting plate (2). A synchronization component (4) for controlling the two chip test sockets (3) to alternately enter the test chamber (101) is provided on the side of the mounting plate (2) facing the test chamber (101). Both chip test sockets (3) are provided with positioning components (5) for pressing the chip, and the synchronization component (4) is provided with a trigger (6) that causes the positioning component (5) to press the chip after the chip test socket (3) enters the test chamber (101).

2. The chip packaging test structure according to claim 1, characterized in that: The chip test socket (3) includes a sliding plate (301), and a receiving groove (302) is provided on the top of the sliding plate (301). Multiple probe holders (303) are fixedly installed at equal intervals inside the receiving groove (302). A baffle (304) is fixedly installed at one end of the sliding plate (301) located outside the test chamber (101). A handle (305) is fixedly installed on the side of the baffle (304) away from the sliding plate (301).

3. The chip packaging test structure according to claim 2, characterized in that: The synchronization component (4) includes a fixed base (401) fixedly mounted on the mounting plate (2). A spline shaft (402) is rotatably mounted on the fixed base (401). A gear (403) is inserted into the outer surface of the spline shaft (402). The gear (403) is disposed between the two sliding plates (301). The mounting plate (2) has sliding holes at positions corresponding to the two sliding plates (301).

4. The chip packaging test structure according to claim 3, characterized in that: Both sliding plates (301) have racks (3011) fixedly installed on the side facing the gear (403), and both racks (3011) mesh with the gear (403).

5. The chip packaging test structure according to claim 4, characterized in that: The positioning component (5) includes a movable frame (501) that is slidably disposed above the probe holder (303). The movable frame (501) is fixedly provided with a pressing member (502) at the position corresponding to each probe holder (303). The sliding plate (301) is provided with an elastic component (7) on the side near the movable frame (501).

6. The chip packaging test structure according to claim 5, characterized in that: The actuator (6) is plugged into the spline shaft (402). The actuator (6) is located above the gear (403). The actuator (6) is elliptical in shape. The position where the movable frame (501) contacts the actuator (6) is an arc surface.

7. The chip packaging test structure according to claim 6, characterized in that: The sliding plate (301) has a movable groove (3012) corresponding to the position of the movable frame (501). The elastic component (7) includes a receiving hole (701) on the sliding plate (301). One end of the receiving hole (701) is connected to the movable groove (3012). A stud (702) is threaded to the end of the receiving hole (701) away from the movable groove (3012). An elastic element (703) is installed between the stud (702) and the movable frame (501) in the receiving hole (701).

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