Circuit board assembly, functional module and electronic device
By incorporating a grounding component within the circuit board and electrically connecting it to the electromagnetic shielding component, the problem of space occupation by the grounding pad on the circuit board is solved, achieving efficient space utilization and electromagnetic shielding of the circuit board.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BEIJING XIAOMI MOBILE SOFTWARE CO LTD
- Filing Date
- 2025-05-26
- Publication Date
- 2026-06-09
AI Technical Summary
The placement of grounding pads on the circuit board takes up a lot of space, affecting the space utilization of the circuit board.
A grounding component is installed inside the circuit board, and an electromagnetic shielding component is attached to the outer surface of the circuit board, so that the grounding component and the electromagnetic shielding component are electrically connected, reducing the need for additional grounding pads.
By combining internal grounding components with electromagnetic shielding components, grounding and electromagnetic shielding of functional devices are achieved, reducing space occupation and improving the space utilization rate of the circuit board.
Smart Images
Figure CN224343440U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board layout technology, and in particular to circuit board assemblies, functional modules and electronic devices. Background Technology
[0002] A circuit board is a connection structure used to conduct electricity between different devices, enabling them to work together to meet the user's functional requirements.
[0003] In related technologies, multiple grounding pads need to be arranged on the circuit board to achieve device grounding, and the presence of grounding pads causes the circuit board to occupy a lot of space. Utility Model Content
[0004] In view of this, this application provides a circuit board assembly, a functional module, and an electronic device to reduce space occupation.
[0005] Specifically, the following technical solutions are included:
[0006] A first aspect of this application provides a circuit board assembly, the circuit board assembly including a circuit board and an electromagnetic shielding component, wherein...
[0007] The circuit board includes a board body and a grounding component, wherein the grounding component is located within the board body;
[0008] The electromagnetic shielding component is attached to the outer surface of the plate, and the electromagnetic shielding component is in contact with and electrically connected to the grounding component.
[0009] In some possible implementations, one end of the grounding member extends from the body of the plate to the side of the plate, and the electromagnetic shielding member extends along the top surface of the plate to the side of the plate and contacts and is electrically connected to one end of the grounding member.
[0010] In some possible implementations, the circuit board includes at least two grounding elements, which are stacked along the thickness direction of the board body, and each grounding element is in contact with and electrically connected to the electromagnetic shielding element.
[0011] In some possible implementations, one end of each grounding element extends to the same side of the plate, and the electromagnetic shielding element covers the side of the plate where the grounding element is located and is in contact with and electrically connected to one end of the grounding element.
[0012] In some possible implementations, the electromagnetic shielding includes an extension that extends into the plate body and contacts and is electrically connected to the grounding element.
[0013] In some possible implementations, the plate includes a connecting groove, the extension is located within the connecting groove, and is in contact with and electrically connected to the grounding element.
[0014] In some possible implementations, the opening of the connecting groove is located on the top surface of the plate, a portion of the grounding member is located on the side wall and / or bottom wall of the connecting groove, and the extension fills the connecting groove.
[0015] In some possible implementations, the circuit board assembly includes functional devices located on one side of the board body, between the electromagnetic shield and the board body, and covered by the electromagnetic shield.
[0016] In some possible implementations, the plate includes a connecting groove, the opening of which is located on the same side of the plate as the functional device. The electromagnetic shield extends from the opening of the connecting groove to the bottom surface of the connecting groove and contacts and is electrically connected to the grounding member. The orthographic projection of the functional device on the plate is separated from the opening of the connecting groove.
[0017] In some possible implementations, the electromagnetic shielding element includes an electromagnetic shielding printed layer that extends from the surface of the plate to the surface of the grounding element.
[0018] A second aspect of this application provides a functional module, the functional module including the circuit board assembly as described in the above technical solutions.
[0019] A third aspect of this application provides an electronic device, the electronic device including a circuit board assembly as described in the above technical solutions and / or a functional module as described in the above technical solutions.
[0020] The beneficial effects of the technical solution provided in this application include at least the following: the board can be used to cooperate with functional devices to meet the user's functional requirements. The grounding component located inside the board can be used to ground the functional devices and also helps to improve the space utilization inside the board. The electromagnetic shielding component is in contact with and electrically connected to the grounding component, which can achieve electromagnetic shielding for the functional devices and also shield the board. Since the grounding component is located inside the board, it helps to reduce the need for additional grounding pads to ground the electromagnetic shielding component, thereby reducing the space occupied by this application. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0022] Figure 1A cross-sectional schematic diagram of a first type of circuit board assembly provided in an embodiment of this application;
[0023] Figure 2 A cross-sectional schematic diagram of a second type of circuit board assembly provided in an embodiment of this application;
[0024] Figure 3 This is a cross-sectional schematic diagram of a circuit board provided in an embodiment of this application.
[0025] The reference numerals in the figure indicate:
[0026] 1. Circuit board; 11. Board body; 1101. Connecting groove; 12. Grounding component;
[0027] 2. Electromagnetic shielding component; 21. Extension; 22. Electromagnetic shielding printed layer;
[0028] 3. Functional components.
[0029] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation
[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0031] In the embodiments of this application, directional terms such as "upper," "lower," and "side" are generally used in the following ways: Figure 1 The relative positions shown are based on the given information, and these directional terms are used only to more clearly describe the relationships between structures, not to describe absolute positions. Positions may change when the product is placed in different orientations; for example, "up" and "down" may be interchanged.
[0032] Unless otherwise defined, all technical terms used in the embodiments of this application have the same meaning as commonly understood by one of ordinary skill in the art.
[0033] To make the technical solutions and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0034] The first aspect of this application provides a circuit board assembly, such as Figure 1As shown, the circuit board assembly includes a circuit board 1 and an electromagnetic shielding component 2, wherein,
[0035] Circuit board 1 includes a board body 11 and a grounding component 12, with the grounding component 12 located inside the board body 11;
[0036] The electromagnetic shielding component 2 is attached to the outer surface of the plate 11, and the electromagnetic shielding component 2 is in contact with and electrically connected to the grounding component 12.
[0037] With the above arrangement, the board 11 can be used to cooperate with the functional device 3 to meet the user's functional requirements. The grounding component 12 located inside the board 11 can be used to ground the functional device 3, and also helps to improve the space utilization inside the board 11. The electromagnetic shielding component 2 is in contact with and electrically connected to the grounding component 12, which can realize the electromagnetic shielding of the functional device 3, and can also shield the board 11. Since the grounding component 12 is located inside the board 11, it helps to reduce the need for additional grounding pads to achieve the grounding of the electromagnetic shielding component 2, thereby reducing the space occupied by this application.
[0038] In related technologies, grounding pads are generally arranged on the same side of the circuit board as various functional devices 3 to facilitate grounding of functional devices 3 and shielding structures. Therefore, the grounding pad occupies space on the circuit board, forcing the board's length and width to be extended to accommodate it. This extended circuit board thus occupies more space. In this embodiment, since the grounding element 12 is located within the board body 11, the outer surface of the circuit board 1 does not need additional space for grounding functional devices 3 and shielding structures, thus reducing space occupancy.
[0039] In this embodiment of the application, the grounding element 12 can be arranged in the board body 11 in a stacked manner during the manufacturing process of the circuit board 1.
[0040] In this embodiment, the electromagnetic shielding component 2 is attached to the outer surface of the plate 11. The attachment can be achieved by forming connections with various positions on the outer surface of the plate 11, or by forming connections with a portion of the outer surface of the plate 11.
[0041] In this embodiment, the electromagnetic shielding component 2 can be a shielding cover, which is attached to the outer surface of the plate 11 by means of snap-fitting or other methods. The electromagnetic shielding component 2 can be completely and directly attached to the outer surface of the plate 11, or it can be partially attached to the surface of the intermediate component and partially and completely and directly attached to the outer surface of the plate 11.
[0042] In this embodiment of the application, the plate 11 generally has signal lines, which can be shielded by the electromagnetic shielding component 2.
[0043] In some embodiments of this application, such as Figure 1 As shown, one end of the grounding member 12 extends from inside the plate 11 to the side of the plate 11, and the electromagnetic shielding member 2 extends along the top surface of the plate 11 to the side of the plate 11, and contacts and is electrically connected to one end of the grounding member 12.
[0044] With the above arrangement, the top surface of the plate 11 can be used to arrange various functional devices 3, and cooperate with the functional devices 3 to meet the user's functional requirements. One end of the grounding member 12 extends to the side of the plate 11, which facilitates the contact between the electromagnetic shielding member 2 and it to achieve electrical connection.
[0045] In this embodiment of the application, one end of the grounding member 12 extends from inside the plate 11 to the side of the plate 11, which means that one end of the grounding member 12 can directly contact other components at the side of the plate 11.
[0046] In some embodiments of this application, such as Figure 1 As shown, the circuit board 1 includes at least two grounding components 12, which are stacked along the thickness direction of the board body 11. Each grounding component 12 is in contact with and electrically connected to the electromagnetic shielding component 2.
[0047] With the above arrangement, at least two grounding components 12 can contact the electromagnetic shielding component 2 from different positions, which helps to increase the contact area between the grounding component 12 and the electromagnetic shielding component 2, thus helping the grounding component 12 to meet the grounding requirements of the electromagnetic shielding component 2.
[0048] In the embodiments of this application, the number of grounding elements 12 can be 2, 3 or 4, or other numbers.
[0049] In the embodiments of this application, the contact positions between different grounding components 12 and electromagnetic shielding components 2 can be the same or different.
[0050] In some embodiments of this application, such as Figure 1 As shown, one end of each grounding element 12 extends to the same side of the plate 11. The electromagnetic shielding element 2 covers the surface of the plate 11 where the grounding element 12 is located, and is in contact with and electrically connected to one end of the grounding element 12.
[0051] With the above arrangement, the contact area between the electromagnetic shielding component 2 and the grounding component 12 can be increased with the number of grounding components 12. The increased contact area helps to meet the grounding requirements of the electromagnetic shielding component 2, thereby helping the electromagnetic shielding component 2 to achieve its electromagnetic shielding function.
[0052] In the embodiments of this application, each grounding element 12 extends to one end of the same side of the plate 11 to form an end face, so that when the electromagnetic shielding element 2 is covered, a sufficient contact area can be formed and electrically connected to the electromagnetic shielding element 2.
[0053] In some embodiments of this application, such as Figure 2 and Figure 3 As shown, the electromagnetic shielding component 2 includes an extension 21 that extends into the plate 11 and contacts and is electrically connected to the grounding component 12.
[0054] With the above arrangement, the extension 21 makes contact and electrical connection with the grounding member 12 inside the board body 11, which helps to avoid the connection position being located outside the board body 11, thus avoiding the circuit board assembly occupying too much space.
[0055] In some embodiments of this application, such as Figure 2 As shown, the plate 11 includes a connecting groove 1101, and the extension 21 is located in the connecting groove 1101 and is in contact with and electrically connected to the grounding member 12.
[0056] With the above arrangement, the connecting groove 1101 facilitates the exposure of the grounding member 12 located within the plate 11, allowing the extension 21 to make contact with the grounding member 12 by extending into the connecting groove 1101. In addition, the connecting groove 1101 also helps to limit the extension 21, making the position between the extension 21 and the grounding member 12 relatively fixed.
[0057] In some embodiments of this application, such as Figure 2 As shown, the opening of the connecting groove 1101 is located on the top surface of the plate 11, a part of the grounding member 12 is attached to the side wall and / or bottom wall of the connecting groove 1101, and the extension 21 fills the connecting groove 1101.
[0058] With the above arrangement, the top surface of the plate 11 can be used to arrange the functional components 3 to meet the user's functional requirements. At the same time, the electromagnetic shielding component 2 can cover the functional components 3 located on the top surface of the plate 11 to achieve its electromagnetic shielding function. By extending from the top surface of the plate 11 to and filling the connecting groove 1101, the electromagnetic shielding component 2 can achieve its electromagnetic shielding function.
[0059] In this embodiment, a portion of the grounding element 12 may be located only on the side wall of the connecting groove 1101, or only on the bottom wall of the connecting groove 1101. The grounding element 12 may also have two parts, one part being located on the side wall of the connecting groove 1101 and the other part being located on the bottom wall of the connecting groove 1101.
[0060] In some embodiments of this application, such as Figure 2 As shown, the circuit board assembly includes a functional device 3, which is located on one side of the board body 11. The functional device 3 is located between the electromagnetic shielding component 2 and the board body 11 and is covered by the electromagnetic shielding component 2.
[0061] With the above arrangement, the functional device 3 can cooperate with the board 11 to meet the user's functional requirements. The functional device 3 is covered by the electromagnetic shielding component 2, which helps to reduce the interference of electromagnetic waves generated by the functional device 3 during operation to other components.
[0062] In some embodiments of this application, such as Figure 2 As shown, the plate 11 includes a connecting groove 1101. The opening of the connecting groove 1101 and the functional device 3 are located on the same side of the plate 11. The electromagnetic shielding member 2 extends from the opening of the connecting groove 1101 to the bottom surface of the connecting groove 1101 and contacts and is electrically connected to the grounding member 12. The orthographic projection of the functional device 3 on the plate 11 is separated from the opening of the connecting groove 1101.
[0063] With the above arrangement, the electromagnetic shielding component 2 can be directly placed on one side of the board 11 to achieve electromagnetic shielding of the functional device 3, as well as contact and electrical connection with the grounding component 12. This helps to simplify the structural complexity of the electromagnetic shielding component 2, thereby simplifying the manufacturing difficulty of the circuit board assembly.
[0064] In some embodiments of this application, such as Figure 2 As shown, the electromagnetic shielding component 2 includes an electromagnetic shielding printed layer 22, which extends from the surface of the plate 11 to the surface of the grounding component 12.
[0065] With the above arrangement, the electromagnetic shielding printed layer 22 is relatively thin, which helps to reduce the space occupied. The electromagnetic shielding printed layer 22 can be sprayed onto the plate 11 by printing, extending from the surface of the plate 11 to the surface of the grounding component 12, thus achieving grounding of the electromagnetic shielding component 2.
[0066] In this embodiment, the electromagnetic shielding printed layer 22 can be formed by printing conductive ink on the outer surface of the plate 11, so that the electromagnetic shielding printed layer 22 can form a common shield with the plate 11.
[0067] A second aspect of this application provides a functional module, which includes a circuit board assembly as described above.
[0068] With the above arrangement, this application adopts the circuit board assembly of the above embodiment, and therefore has the same technical effect as the above embodiment, which will not be repeated here.
[0069] In the embodiments of this application, the functional module can be a camera module, a power supply module, a sound generation module, or other functional modules.
[0070] A third aspect of this application provides an electronic device, which includes a circuit board assembly as described above and / or a functional module as described above.
[0071] With the above arrangement, this application adopts the functional modules and / or circuit board assemblies of the above embodiments, and therefore has the same technical effects as the above embodiments, which will not be repeated here.
[0072] In this application embodiment, the electronic device can be a smartphone, tablet computer, smartwatch, or other similar product.
[0073] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.
[0074] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the application disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.
[0075] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
Claims
1. A circuit board assembly, characterized in that, The circuit board assembly includes a circuit board (1) and an electromagnetic shielding component (2), wherein, The circuit board (1) includes a board body (11) and a grounding component (12), wherein the grounding component (12) is located inside the board body (11); The electromagnetic shielding component (2) is attached to the outer surface of the plate (11), and the electromagnetic shielding component (2) is in contact with and electrically connected to the grounding component (12).
2. The circuit board assembly according to claim 1, characterized in that, One end of the grounding member (12) extends from inside the plate (11) to the side of the plate (11), and the electromagnetic shielding member (2) extends along the top surface of the plate (11) to the side of the plate (11) and contacts and is electrically connected to one end of the grounding member (12).
3. The circuit board assembly according to claim 2, characterized in that, The circuit board (1) includes at least two grounding components (12), which are stacked along the thickness direction of the board body (11), and each grounding component (12) is in contact with and electrically connected to the electromagnetic shielding component (2).
4. The circuit board assembly according to claim 3, characterized in that, One end of each grounding element (12) extends to the same side of the plate (11), and the electromagnetic shield (2) covers the side of the plate (11) where the grounding element (12) is located, and is in contact with and electrically connected to one end of the grounding element (12).
5. The circuit board assembly according to claim 1, characterized in that, The electromagnetic shielding component (2) includes an extension (21) that extends into the plate (11) and contacts and is electrically connected to the grounding component (12).
6. The circuit board assembly according to claim 5, characterized in that, The plate (11) includes a connecting groove (1101), and the extension (21) is located in the connecting groove (1101) and is in contact with and electrically connected to the grounding member (12).
7. The circuit board assembly according to claim 6, characterized in that, The opening of the connecting groove (1101) is located on the top surface of the plate (11), a part of the grounding member (12) is attached to the side wall and / or bottom wall of the connecting groove (1101), and the extension (21) fills the connecting groove (1101).
8. The circuit board assembly according to claim 1, characterized in that, The circuit board assembly includes a functional device (3), which is located on one side of the board body (11) and between the electromagnetic shield (2) and the board body (11), and is covered by the electromagnetic shield (2).
9. The circuit board assembly according to claim 8, characterized in that, The plate (11) includes a connecting groove (1101), the opening of the connecting groove (1101) and the functional device (3) are located on the same side of the plate (11), the electromagnetic shield (2) extends from the opening of the connecting groove (1101) to the bottom surface of the connecting groove (1101), and contacts and is electrically connected to the grounding device (12), the orthographic projection of the functional device (3) on the plate (11) is separated from the opening of the connecting groove (1101).
10. The circuit board assembly according to claim 1, characterized in that, The electromagnetic shielding component (2) includes an electromagnetic shielding printed layer (22) that extends from the surface of the plate (11) to the surface of the grounding component (12).
11. A functional module, characterized in that, The functional module includes the circuit board assembly as described in any one of claims 1 to 10.
12. An electronic device, characterized in that, The electronic device includes a circuit board assembly as described in any one of claims 1 to 10 or a functional module as described in claim 11.