Wave-soldering jig for circuit board
By designing a wave soldering fixture for circuit boards that includes a base plate, a first positioning component, a second positioning component, and a control component, the problem of not being able to adjust the positioning according to the size of the circuit board in the existing technology is solved, and precise positioning and efficient soldering of the circuit board are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU ECHICOM ELECTRONIC TECH CO LTD
- Filing Date
- 2025-06-17
- Publication Date
- 2026-06-09
AI Technical Summary
Existing wave soldering fixtures for circuit boards cannot be adjusted according to the size of the circuit board during positioning, resulting in welding deviations and affecting the welding effect.
The design incorporates a base plate, a first positioning component, a second positioning component, and a control component. Through manual operation and the cooperation of springs, adjustable positioning and clamping of the circuit board are achieved. The clamping plate is moved by the cooperation of tension springs and sliding plates. Combined with the thrust of the springs and the pushing of the positioning blocks, precise positioning of the circuit board is achieved.
It improves the accuracy and stability of circuit board soldering, and can adjust the position of the positioning mechanism according to the size of the circuit board to ensure soldering precision.
Smart Images

Figure CN224343484U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board technology, and in particular to a wave soldering fixture for circuit boards. Background Technology
[0002] A circuit board (usually referring to a printed circuit board, or PCB for short) is one of the fundamental components of electronic devices, used for mechanical support and connection of electronic components. It is typically composed of one or more layers of conductive material (such as copper) and covered with insulating material to ensure that electronic components interact with each other through electrical connections. Electronic components are usually mounted onto the circuit board by soldering.
[0003] Existing wave soldering fixtures for printed circuit boards (PCBs) have through holes and grooves on the substrate, and a PCB mounting clip is installed on the upper surface. The through holes are located at the mounting positions of through-hole components, allowing their leads to protrude from the back of the substrate. The grooves are located at the locations of surface-mount components, and their depth is the same as the thickness of the surface-mount components. This design prevents surface-mount components from falling off during wave soldering while still enabling the soldering of through-hole components on the PCB using existing wave soldering equipment.
[0004] However, existing circuit board clamps are inconvenient to adjust the positioning mechanism according to the size of the circuit boards when positioning them for wave soldering, due to the different sizes of the circuit boards. This can easily lead to wave soldering deviations and affect the soldering effect, so improvements are needed. Utility Model Content
[0005] To facilitate the positioning and clamping of circuit boards, this application provides a circuit board wave soldering fixture.
[0006] The wave soldering fixture for circuit boards provided in this application adopts the following technical solution:
[0007] A wave soldering fixture for circuit boards includes a base plate, a first positioning component on the left side of the base plate, a second positioning component on the top of the base plate, the second positioning component being mounted on the first positioning component, and a control component on the top of the base plate, the control component being mounted on the first positioning component and connected to the second positioning component.
[0008] By adopting the above technical solution, the operator manually drives the first positioning components on both sides to move away from each other, placing the circuit board on the base plate. Releasing the control of the first positioning components allows the two first positioning components to clamp the circuit board from the left and right sides. Subsequently, the operator uses control component 4 to drive the second positioning component to press the circuit board firmly against the base plate from above, completing the positioning and clamping of the circuit board. This facilitates adjustments to the positioning according to the size of the circuit board, improving the accuracy of circuit board soldering.
[0009] Optionally, the first positioning component includes sliding grooves formed on the left and right sides of the base plate. A tension spring is fixedly installed on the inner wall of each sliding groove, and a sliding plate is slidably connected to the inner wall of each tension spring. Two L-shaped plates are fixedly installed at the ends of the two sets of sliding plates that are far apart from each other. A sliding hole is formed on the inner wall of each L-shaped plate, and a sliding rod is slidably connected to the inner wall of each sliding hole. A clamping plate is fixedly installed at the ends of the two sliding rods that are far apart from each other, and a first spring is sleeved on the outer surface of each sliding rod.
[0010] By adopting the above technical solution, a tension spring can be provided to apply tension to the slide rod, and the tension of the tension spring can pull the slide plate and the L-shaped plate closer to each other, so that the L-shaped plate can drive the first clamping plate to move, and the first spring can apply a pushing force to the clamping plate, so that the clamping plate can clamp the circuit board.
[0011] Optionally, the second positioning component includes two sets of perforated mounting plates installed on one side of the L-shaped plate close to each other. Each perforated mounting plate has a control rod slidably connected to its inner wall. Each control rod has a positioning block slidably installed at its bottom end. Each control rod has a second spring sleeved on its outer surface. The top ends of the two sets of control rods are jointly fixedly installed with two pressure plates.
[0012] By adopting the above technical solution, when no external force is applied, the second spring applies a downward pushing force to the positioning block, thereby enabling the positioning block to position the circuit board.
[0013] Optionally, two support blocks are fixedly installed on the upper surface of each L-shaped plate, and two rotating rods are rotatably installed on the side of the two support blocks that are close to each other through two bearings. A control plate is fixedly installed on the outer surface of each rotating rod.
[0014] By adopting the above technical solution, the operator presses down on the end of the control plate away from the pressure plate, and the control plate rotates around the positioning ring as an axis. The end of the control plate that is in contact with the pressure plate lifts up, driving the pressure plate to rise. At this time, the second spring is compressed.
[0015] Optionally, guide holes are provided on the opposite sides of the two L-shaped plates, and a guide rod is slidably installed on the inner wall of each guide hole. The opposite sides of the two sets of guide rods are fixedly installed on the opposite sides of the two clamping plates.
[0016] Optionally, connecting blocks are fixedly installed on the opposite sides of the two L-shaped plates, and an elastic band is fixedly installed on the upper surface of each connecting block. The top ends of the two elastic bands are respectively fixedly installed on the bottom surfaces of the two control plates.
[0017] By adopting the above technical solution, the elastic band can apply a downward pulling force to the end of the control plate away from the pressure plate, so that the control plate can control the posture of the pressure plate and prevent the control plate from rotating freely and detaching from the pressure plate.
[0018] Optionally, the bottom surface of the base plate has two through grooves, and the upper surface of the base plate has a storage groove.
[0019] Optionally, two positioning rings are fixedly installed on the outer surface of each of the rotating rods, and the two sets of positioning rings are fixedly installed on the front and back sides of the two control plates respectively.
[0020] In summary, this application includes at least one of the following beneficial technical effects:
[0021] 1. By using the tension spring, sliding plate, and L-shaped plate together, the L-shaped plate can push the clamping plate to move. The clamping plate and the first spring together can position circuit boards of different sizes. The second spring can push the pressure block to move, thereby repositioning the circuit board. This effectively improves the positioning effect of the circuit board, so that the position of the positioning mechanism can be adjusted according to the size of the circuit board, thus improving the accuracy of circuit board soldering.
[0022] 2. When the operator presses down on the end of the control plate away from the pressure plate, the control plate rotates around the positioning ring as an axis. The end of the control plate that is in contact with the pressure plate lifts up, driving the pressure plate to rise. At this time, the second spring is compressed.
[0023] 3. The elastic band can apply a downward pulling force to the end of the control plate away from the pressure plate, so that the control plate can control the posture of the pressure plate and prevent the control plate from rotating freely and detaching from the pressure plate. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the structure of a wave soldering fixture for circuit boards according to an embodiment of this application.
[0025] Figure 2 This is a schematic diagram of the structure of the first positioning component in an embodiment of this application.
[0026] Figure 3 This is a schematic diagram of the structure of the control component in an embodiment of this application.
[0027] Figure 4 This is a schematic diagram of the structure of the second positioning component in an embodiment of this application.
[0028] Explanation of reference numerals in the attached drawings: 1. Base plate; 101. Through groove; 102. Storage groove; 2. First positioning component; 201. Slide groove; 202. Slide plate; 203. L-shaped plate; 204. Slide rod; 205. Guide hole; 206. Tension spring; 207. First spring; 208. Clamping plate; 209. Slide hole; 3. Second positioning component; 301. Mounting plate with holes; 302. Control rod; 303. Pressure plate; 304. Second spring; 305. Positioning block; 4. Control component; 401. Support block; 402. Rotating rod; 403. Control piece; 404. Positioning ring; 405. Elastic band; 406. Connecting block. Detailed Implementation
[0029] The following is in conjunction with the appendix Figure 1-4 This application will be described in further detail.
[0030] This application discloses a wave soldering fixture for circuit boards. (Refer to...) Figure 1 A wave soldering fixture for circuit boards includes a base plate 1 with two through slots 101 formed along its thickness. First positioning components 2 are symmetrically arranged on the left and right sides of the base plate 1, and a second positioning component 3 is positioned above the base plate 1, mounted on the first positioning components 2. A control component 4 is also positioned above the base plate 1, mounted on the first positioning components 2 and connected to the second positioning components 3. A receiving groove 102 is also formed on the upper surface of the base plate 1 to avoid electronic components already installed on the circuit board.
[0031] The operator manually drives the two first positioning components 2 apart, placing the circuit board on the base plate 1. Releasing the control of the first positioning components 2 allows them to clamp the circuit board from both sides. The operator then uses the control component 4 to drive the second positioning component 3 to press the circuit board firmly against the base plate 1 from above, completing the positioning and clamping of the circuit board. The operator can then solder the bottom surface of the circuit board through the through slot 101. This allows for adjustments to the positioning according to the size of the circuit board, improving the accuracy of the soldering.
[0032] Reference Figure 2 and Figure 3 The first positioning component 2 includes slide grooves 201 on the left and right sides of the base plate 1. Each slide groove 201 has a tension spring 206 fixedly installed on its inner wall. Each tension spring 206 has a slide plate 202 slidably connected to its inner wall. Two L-shaped plates 203 are fixedly installed at the ends of the two sets of slide plates 202 that are far apart from each other.
[0033] Reference Figure 1 and Figure 4The inner wall of the L-shaped plate 203 is provided with sliding holes 209. Each sliding hole 209 is slidably connected to a sliding rod 204. Each sliding rod 204 has a clamping plate 208 fixedly installed at the ends that are far apart from each other. Each sliding rod 204 has a first spring 207 sleeved on its outer surface.
[0034] The tension spring 206 can apply a pulling force to the slide bar 204, and the tension spring 206 can pull the slide plate 202 and the L-shaped plate 203 closer to each other, so that the L-shaped plate 203 can drive the first clamping plate 208 to move. The first spring 207 can apply a pushing force to the clamping plate 208, so that the clamping plate 208 can clamp the circuit board.
[0035] Reference Figure 2 and Figure 3 Two L-shaped plates 203 each have guide holes 205 on their opposite sides. Each guide hole 205 has a guide rod 210 slidably installed on its inner wall. The two sets of guide rods 210 are fixedly installed on their opposite sides to the opposite sides of the two clamping plates 208.
[0036] The clamping plate 208 can be positioned through the guide hole 205 and the guide rod 210 to prevent the clamping plate 208 from sliding.
[0037] Reference Figure 2 and Figure 4 The second positioning component 3 includes two sets of perforated mounting plates 301 installed on one side of the L-shaped plate 203 close to each other. Each perforated mounting plate 301 has a control rod 302 slidably connected to its inner wall. Each control rod 302 has a positioning block 305 slidably installed at its bottom end. Each control rod 302 has a second spring 304 sleeved on its outer surface. The top ends of the two sets of control rods 302 are fixedly installed with two pressure plates 303.
[0038] When not subjected to external force, the second spring 304 applies a downward pushing force to the positioning block 305, thereby enabling the positioning block 305 to position the circuit board.
[0039] Reference Figure 3 and Figure 4 Each L-shaped plate 203 has two support blocks 401 fixedly installed on its upper surface. Two rotating rods 402 are rotatably mounted on the side of the two support blocks 401 that are close to each other via two bearings. A control plate 403 is fixedly installed on the outer surface of each rotating rod 402. Two positioning rings 404 are fixedly installed on the outer surface of each rotating rod 402. The side of the two sets of positioning rings 404 that are close to each other are fixedly installed to the front and back of the two control plates 403, respectively.
[0040] When the operator presses down on the end of the control plate 403 away from the pressure plate 303, the control plate 403 rotates around the positioning ring 404 as an axis. The end of the control plate 403 that is in contact with the pressure plate 303 is lifted, driving the pressure plate 303 to rise. At this time, the second spring 304 is compressed.
[0041] Reference Figure 4 Two L-shaped plates 203 are fixedly installed with connecting blocks 406 on their opposite sides. Each connecting block 406 has an elastic band 405 fixedly installed on its upper surface. The top ends of the two elastic bands 405 are fixedly installed with the bottom surfaces of the two control plates 403 respectively.
[0042] The elastic band 405 can apply a downward pulling force to the end of the control piece 403 away from the pressure plate 303, so that the control piece 403 can control the posture of the pressure plate 303 and prevent the control piece 403 from rotating freely and detaching from the pressure plate 303.
[0043] The implementation principle of a circuit board wave soldering fixture according to an embodiment of this application is as follows: During use, two L-shaped plates 203 are pulled away from each other, and then the circuit board is placed on the base plate 1. Then, the control plate 403 is pressed down while the L-shaped plates 203 are released. Under the action of the tension spring 206 and the sliding plate 202, the sliding plate 202 can drive the L-shaped plate 203 to move, so that the L-shaped plate 203 can push the first spring 207 and the first clamping plate 208 to clamp the circuit board. Then, the control plate 403 is released, and the control plate 403 can move the positioning block 305 downward through the elastic force of the second spring 304, and then the circuit board is positioned on the circuit board. This device can position the circuit board and wave soldering can be performed on the circuit board through the through slot 101.
[0044] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A wave soldering fixture for circuit boards, comprising a base plate (1), characterized in that: The base plate (1) has a first positioning component (2) on its left side and a second positioning component (3) on its upper side. The second positioning component (3) is mounted on the first positioning component (2). The base plate (1) has a control component (4) on its upper side. The control component (4) is mounted on the first positioning component (2) and is connected to the second positioning component (3).
2. The wave soldering fixture for circuit boards according to claim 1, characterized in that: The first positioning component (2) includes slide grooves (201) on the left and right sides of the base plate (1). Each slide groove (201) has a tension spring (206) fixedly installed on its inner wall. Each tension spring (206) has a slide plate (202) slidably connected to its inner wall. Two L-shaped plates (203) are fixedly installed at the ends of the two sets of slide plates (202) that are far apart from each other. Each L-shaped plate (203) has a sliding hole (209) on its inner wall. Each sliding hole (209) has a slide rod (204) slidably connected to its inner wall. Each slide rod (204) has a clamp plate (208) fixedly installed at the ends of the two slide rods (204) that are far apart from each other. Each slide rod (204) has a first spring (207) sleeved on its outer surface.
3. The wave soldering fixture for circuit boards according to claim 2, characterized in that: The second positioning component (3) includes two sets of perforated mounting plates (301) installed on one side of the L-shaped plate (203) close to each other. Each perforated mounting plate (301) has a control rod (302) slidably connected to its inner wall. Each control rod (302) has a positioning block (305) slidably installed at its bottom end. Each control rod (302) has a second spring (304) sleeved on its outer surface. The top ends of the two sets of control rods (302) are fixedly installed with two pressure plates (303).
4. A wave soldering fixture for circuit boards according to claim 3, characterized in that: Two support blocks (401) are fixedly installed on the upper surface of each L-shaped plate (203). Two rotating rods (402) are rotatably installed on the side of the two support blocks (401) that are close to each other through two bearings. A control plate (403) is fixedly installed on the outer surface of each rotating rod (402).
5. A wave soldering fixture for circuit boards according to claim 2, characterized in that: Each of the two L-shaped plates (203) has a guide hole (205) on one side away from each other. A guide rod (210) is slidably installed on the inner wall of each guide hole (205). The two sets of guide rods (210) are fixedly installed on the side of each other that is close to each other and on the side of each of the two clamping plates (208) that is far away from each other.
6. A wave soldering fixture for circuit boards according to claim 4, characterized in that: A connecting block (406) is fixedly installed on one side of each of the two L-shaped plates (203) that are far apart from each other. An elastic band (405) is fixedly installed on the upper surface of each connecting block (406). The top ends of the two elastic bands (405) are fixedly installed on the bottom surfaces of the two control plates (403).
7. A wave soldering fixture for circuit boards according to claim 1, characterized in that: The bottom surface of the base plate (1) has two through grooves (101), and the upper surface of the base plate (1) has a storage groove (102).
8. A wave soldering fixture for circuit boards according to claim 4, characterized in that: Two positioning rings (404) are fixedly installed on the outer surface of each of the rotating rods (402). The two sets of positioning rings (404) are fixedly installed on the front and back sides of the two control plates (403) respectively.