Degumming tool, cleaning device and wafer preparation system

Abstract

The application discloses a degumming tool, which comprises a bearing basket and a supporting assembly. The supporting assembly is arranged in the bearing basket, and the supporting assembly comprises at least three supporting rods arranged side by side, and two adjacent supporting rods form a supporting group. In the supporting group, a plurality of limiting grooves are arranged on the two sides of the two supporting rods, the limiting grooves are arranged at intervals along the length direction of the supporting rods, the limiting grooves on the two supporting rods correspond to each other, and the corresponding two limiting grooves form a supporting position. The spacing between the two adjacent supporting rods is adjustable. The spacing between the supporting rods is adjusted first, then the wafers adhered together are placed on the supporting assembly, and each wafer is placed on the corresponding supporting position. The bearing basket is placed in an ultrasonic cleaner for cleaning. Since the wafers are arranged at intervals on the supporting assembly, the cleaned glue falls on the bottom of the bearing basket and cannot adhere to the wafers, so that the degumming effect of cleaning can be improved. The application further discloses a cleaning device and a wafer preparation system.

Description

Technical Field

[0001] This application belongs to the field of auxiliary tooling technology, specifically relating to a debinding tooling and a wafer fabrication system. Background Technology

[0002] Currently, in the inner-circle dicing process (cutting crystal rods into wafers), to improve dicing efficiency, multiple wafers are usually arranged in parallel, and adjacent wafers are then glued together for dicing. After dicing, the wafers remain glued together, so cleaning and de-adhesive removal of the glued wafers is necessary. The traditional method involves directly placing the glued wafers in a cleaning solution within an ultrasonic cleaning tank for ultrasonic cleaning and de-adhesive removal. However, stacking wafers together causes the detached adhesive to adhere to the wafers below, resulting in poor cleaning and de-adhesive removal and consequently affecting wafer quality. Utility Model Content

[0003] The technical problem to be solved by this application is that the existing devices for cleaning and debinding wafers have poor cleaning and debinding effects. In order to solve this technical problem, a debinding tooling, a cleaning device and a wafer preparation system that can improve the cleaning and debinding effect are provided.

[0004] The technical solution proposed in this application is as follows:

[0005] A degumming fixture, comprising:

[0006] Support basket;

[0007] A support assembly is disposed within the bearing basket. The support assembly includes at least three support rods arranged side by side, and two adjacent support rods form a support group.

[0008] In the support assembly, multiple limiting grooves are provided on both sides of the two support rods facing each other. The multiple limiting grooves are arranged at intervals along the length direction of the support rods, and the limiting grooves on the two support rods correspond one to one. The two corresponding limiting grooves constitute a support position.

[0009] The support positions on two adjacent support groups correspond one-to-one;

[0010] The spacing between any two adjacent support rods is adjustable.

[0011] Using the aforementioned debonding fixture, the spacing between the support rods is first adjusted according to the wafer size. Then, the wafers that are stuck together are placed on the support assembly, with each wafer positioned on its corresponding support. Next, the carrier basket is placed in an ultrasonic cleaner for cleaning. Because the wafers are spaced apart on the support assembly, the adhesive after cleaning will fall to the bottom of the carrier basket and will not stick to the wafers, thus improving the cleaning and debonding effect and improving wafer quality. At the same time, the wafers that are stuck together are supported and fixed by their corresponding support positions, preventing them from falling off after separation and avoiding wafer damage.

[0012] Furthermore, the number of the support components is multiple sets.

[0013] Furthermore, each of the support rods is movably configured so that any two adjacent support rods can move closer to or further away from each other.

[0014] Furthermore, the degumming tool also includes a linkage assembly connected to the end of each of the support rods to enable all the support rods to move synchronously.

[0015] Furthermore, the linkage component is rotatably connected to the support basket, and the linkage component can connect to and separate from the end of the support rod during rotation.

[0016] Furthermore, the degumming fixture also includes a fixing component that can fix the linkage assembly relative to the carrying basket.

[0017] Furthermore, the number of linkage components is two sets, and the two sets of linkage components are respectively connected to both ends of the support rod.

[0018] Furthermore, the bottom of the support basket is provided with multiple drainage holes.

[0019] A cleaning apparatus includes an ultrasonic cleaner and a degumming fixture as described above.

[0020] A wafer fabrication system includes a debinding fixture or cleaning device as described above.

[0021] In summary, the degumming fixture, cleaning apparatus, and wafer fabrication system provided in this application have at least the following advantages:

[0022] 1. Multiple wafers bonded together can be placed on corresponding support positions, and the wafers supported on the support positions are spaced apart from the bottom wall of the support basket, thereby ensuring that the adhesive removed during cleaning falls to the bottom of the support basket, preventing the adhesive from sticking to the wafers and improving the cleaning and adhesive removal effect. At the same time, all wafers are supported by corresponding support positions to prevent the wafers from separating and falling and being damaged after cleaning, thus improving the quality of the wafers.

[0023] 2. The spacing between adjacent support rods is adjustable, making it suitable for placing wafers of more sizes and improving applicability;

[0024] 3. All support rods are connected to the linkage assembly to achieve synchronous movement of the support rods and facilitate adjustment of the position of the support rods;

[0025] 4. The linkage component can be connected and separated from the support rod, which facilitates the replacement and maintenance of the support rod and the linkage component. Attached Figure Description

[0026] The accompanying drawings are provided to further understand this application and form part of the specification. They are used together with the embodiments of this application to explain this application and do not constitute a limitation thereof.

[0027] Figure 1 This is a schematic diagram of the structure of a degumming tool provided in one embodiment of this application;

[0028] Figure 2 for Figure 1 The diagram shows a structural schematic of the degumming fixture from another angle.

[0029] Label Explanation:

[0030] 110. Loading basket; 111. Drain hole; 112. Handle; 113. Strip hole; 120. Support rod; 121. Limiting groove; 130. Linkage assembly; 131. Connecting protrusion; 140. Hinge structure. Detailed Implementation

[0031] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0032] In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0035] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0036] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0037] To facilitate understanding of the technical solution of this application, the existing structure of bonded wafers is described below: Taking two wafers bonded together as an example, during inner circle cutting, the two crystal rods are arranged side by side with their sidewalls bonded together, thereby cutting both crystal rods simultaneously and improving production efficiency. After cutting, the circumferential sidewalls of the two wafers are also bonded together, that is, the two wafers are nearly tangent, and the tangential position is bonded together with adhesive.

[0038] On one hand, this application provides a cleaning apparatus, which includes an ultrasonic cleaner and a debonding fixture. The debonding fixture is used to hold wafers that are stuck together. The debonding fixture is then placed in the ultrasonic cleaner, and the ultrasonic cleaner cleans and debonds the wafers in the debonding fixture.

[0039] like Figure 1 and Figure 2 As shown, in one embodiment, the degumming fixture includes a support basket 110 and a support assembly. The support assembly is disposed within the support basket 110 and includes at least three support rods 120 arranged side by side. Two adjacent support rods 120 form a support group, as shown. Figure 1 The three support rods 120 arranged at intervals along the first direction have two adjacent sets of support rods 120, thus forming two support groups.

[0040] In the support assembly, multiple limiting grooves 121 are provided on both sides of the two support rods 120 facing each other. The multiple limiting grooves 121 are arranged at intervals along the length of the support rods 120, and the limiting grooves 121 on the two support rods 120 correspond one to one. The two corresponding limiting grooves 121 constitute a support position. Therefore, the multiple limiting grooves 121 on the two support rods 120 in the support assembly can form multiple support positions. Each support position can support the wafer and limit the wafer. That is, the wafer is placed on the two support rods 120 and locked in the limiting groove 121, thereby realizing the support and fixation of multiple wafers and improving the cleaning and degumming efficiency.

[0041] Furthermore, the support positions on adjacent support groups correspond one-to-one, allowing wafers that are bonded together to be placed on support positions in different support groups. For example Figure 1 The support component has two support groups, and the two corresponding support positions on the two support groups can support and limit the two wafers that are stuck together, thereby ensuring that the separated wafers are supported and limited after cleaning and debonding, and preventing the wafers from falling and being damaged.

[0042] Furthermore, the spacing between any two adjacent support rods 120 is adjustable, thereby enabling support and positioning of wafers of different sizes. It should be explained that while two support rods 120 with a constant spacing can support wafers of multiple sizes, for wafers with significantly different sizes (e.g., a small spacing with an excessively large wafer size), unstable support may occur. In other words, the applicability of two support rods 120 with a constant spacing is limited. This embodiment, by adjusting the spacing between adjacent support rods 120, effectively expands the applicability range, improves the stability of supporting wafers of different sizes, and enhances overall applicability.

[0043] Using the aforementioned debonding fixture, the spacing between the support rods 120 is first adjusted according to the wafer size. Then, the wafers that are stuck together are placed on the support assembly, with each wafer positioned on its corresponding support. Next, the carrier basket 110 is placed in an ultrasonic cleaner for cleaning. Because the wafers are spaced apart on the support assembly, the adhesive after cleaning will fall to the bottom of the carrier basket 110 and will not stick to the wafers, thereby improving the cleaning and debonding effect and improving wafer quality. At the same time, the wafers that are stuck together are supported and fixed by their corresponding support positions, preventing them from falling off after separation and avoiding wafer damage.

[0044] In one embodiment, the bottom of the support basket 110 has multiple drainage holes 111. After being placed in an ultrasonic cleaner, the support basket 110 is immersed in the cleaning solution of the ultrasonic cleaner for ultrasonic cleaning. After cleaning, the support basket 110 is lifted, and the cleaning solution and any adhesive residue can be discharged through the drainage holes 111. Preferably, a support assembly is connected to the side wall of the support basket 110, so that the support assembly is spaced from the inner bottom wall of the support basket 110, preventing the wafer from contacting the inner bottom wall of the support basket 110.

[0045] In one embodiment, the carrying basket 110 is provided with handles 112 at opposite ends, and the handles 112 are rotatably connected to the carrying basket 110 to facilitate the handling and retrieval of the carrying basket 110. Specifically, the opposite ends of the carrying basket 110 are the two ends along the length direction of the support rod 120.

[0046] In one embodiment, the number of support components is multiple sets, and the multiple sets of support components are arranged at intervals along the first direction to further increase the number of wafers to be cleaned and improve cleaning efficiency.

[0047] For a scheme where the spacing between any two adjacent support rods 120 is adjustable, the following two embodiments can be referenced:

[0048] Example 1

[0049] Each support rod 120 is movably configured so that any two adjacent support rods 120 can move closer to or further away from each other, thereby adjusting the distance between adjacent support rods 120. Specifically, each support rod 120 can reciprocate along a first direction to adjust the distance between adjacent support rods 120 during the movement, thus making it suitable for supporting and fixing wafers of different sizes.

[0050] Example 2

[0051] The support assembly includes one fixed support rod 120 among its multiple support rods 120, while the remaining support rods 120 are movable. Preferably, one support rod 120 located at the edge of the multiple support rods 120 is fixed relative to the bearing basket 110, and the remaining support rods 120 can reciprocate along a first direction, thereby adjusting the spacing between adjacent support rods 120.

[0052] It should be noted that Example 1 is a preferred embodiment. Unless otherwise stated, Example 1 will be described below.

[0053] In one embodiment, for the movement of the support rod 120, slotted holes 113 can be formed on two opposite sidewalls within the support basket 110. The slotted holes 113 extend along a first direction, and both ends of each support rod 120 extend into the slotted holes 113 on the two sidewalls, thereby enabling the support rod 120 to reciprocate along the slotted holes 113. Specifically... Figure 1 In the embodiment shown, multiple strip holes 113 on each side wall can also be arranged vertically, so that the support rod 120 can be inserted into the corresponding strip hole 113 as needed to adjust the height of the support rod 120.

[0054] In one embodiment, the degumming fixture further includes a linkage assembly 130, which is connected to the end of each support rod 120 to enable synchronous movement of all support rods 120. Specifically, the end of the support rod 120 extends out of the support basket 110 through the slotted hole 113, and the linkage assembly 130 is disposed outside the support basket 110 and connected to the end of the support rod 120. Preferably, there are two sets of linkage assemblies 130, with each set connected to one end of a support rod 120.

[0055] Specifically Figure 1 In the process of adjusting the position of the support rod 120, one of the support rods 120 can be pulled to move along the first direction. Under the action of the two sets of linkage components 130, the two ends of the remaining support rod 120 will also move synchronously, thereby facilitating the adjustment of the distance between two adjacent support rods 120.

[0056] It should be noted that in this embodiment, the linkage component 130 can be a scissor structure, which is connected to the ends of all support rods 120 simultaneously, thereby enabling the support rods 120 to move synchronously. Additionally, in embodiment 2, the scissor structure has a fixed end, and one support rod 120 located at the edge is connected to the fixed end of the scissor structure. Both the support rod 120 and the fixed end are fixed relative to the bearing basket 110, and the remaining support rods 120 move synchronously under the action of the scissor structure.

[0057] In one embodiment, the linkage component 130 is rotatably connected to the support basket 110, and the linkage component 130 can be connected to and separated from the end of the support rod 120 during rotation, thereby achieving synchronous movement of all support rods 120 when connected; and when the linkage component 130 is separated from the support rod 120, it facilitates the replacement and maintenance of the support rod 120 and the linkage component 130.

[0058] Furthermore, one end of the linkage component 130 is rotatably connected to the support basket 110 via a hinge structure 140, and the linkage component 130 can rotate around a vertical axis. Multiple docking holes are provided on one side of the linkage component 130. During the rotation of the linkage component 130, the end of the support rod 120 can be inserted into the docking holes, thereby achieving connection with the linkage component 130.

[0059] Understandably, multiple mating holes are arranged at intervals along the extension and retraction direction of the linkage assembly 130. Before connecting to the end of the support rod 120, the position of the support rod 120 needs to be adjusted, or the linkage assembly 130 needs to be lengthened or shortened, to ensure that the end of the support rod 120 can be inserted into the mating hole. Therefore, the spacing between adjacent mating holes can also be adjusted during the extension and retraction of the linkage assembly 130. It should be further noted that the number of mating holes is preferably greater than the number of support rods 120 to facilitate the insertion of the support rods 120 into the mating holes.

[0060] Specifically Figure 1 In the embodiment shown, a plurality of docking protrusions 131 are provided on one side of the linkage component 130. The plurality of docking protrusions 131 are arranged at intervals along the extension and retraction direction of the linkage component 130. Each docking protrusion 131 has a docking hole for connecting with the end of the support rod 120 through the docking protrusion 131.

[0061] In one embodiment, the degumming fixture further includes a fixing member that can fix the linkage component 130 relative to the support basket 110. Thus, after the linkage component 130 rotates to connect with the support rod 120, the fixing member can fix the linkage component 130 relative to the support basket 110. It should be explained that in this embodiment, fixing the linkage component 130 relative to the support basket 110 means restricting the rotation of the linkage component 130 relative to the support basket 110. The extension and retraction of the linkage component 130 itself is not considered movement relative to the support basket 110. That is, after the linkage component 130 is fixed relative to the support basket 110, the extension and retraction of the linkage component 130 itself can still occur, so as to achieve synchronous movement of all support rods 120.

[0062] Optionally, the fastener can be located at the hinge structure 140, connected to the hinge via a threaded connection. When tightened, the fastener presses and fixes the two moving parts of the hinge structure 140, thereby restricting the rotation of the linkage component 130. Alternatively, the fastener can be located at the end of the linkage component 130 connected to the support basket 110. This end of the linkage component 130 will not extend or retract. When the linkage component 130 rotates to the position connected to the support rod 120, the fastener connects to the outer wall of the support basket 110, thereby fixing the linkage component 130. Of course, other methods can be used to fix the linkage component 130 relative to the support basket 110; no limitation is made here.

[0063] In one embodiment, the debonding fixture further includes a locking member connected to the linkage assembly 130, which locks the linkage assembly 130, thereby fixing all the support rods 120 relatively. For example, the locking member may be connected to the end of the linkage assembly 130 away from the hinge structure 140, and the locking member may be detachably connected to the support basket 110. After the linkage assembly 130 is connected to the support rods 120, connecting the locking member to the support basket 110 restricts the telescopic movement of the linkage assembly 130 and fixes all the telescopic rods. Specifically, multiple threaded holes can be opened on the outer wall of the support basket 110. The locking member is rotatably connected to the linkage assembly 130. After the position of the support rods 120 is adjusted, the locking member is threaded into the corresponding threaded hole to lock the linkage assembly 130.

[0064] In other embodiments, a damping structure can be provided at the connection between the support rod 120 and the carrying basket 110 or on the linkage assembly 130 to limit the movement of the support rod 120 to a certain extent and ensure that the support rod 120 remains fixed during the cleaning process. When the position needs to be adjusted, an external force is applied to make the support rod 120 and the linkage assembly 130 overcome the damping and move.

[0065] On the other hand, this application also provides a wafer fabrication system, which includes the debinding fixture or cleaning device described in the above embodiments.

[0066] In summary, the degumming fixture, cleaning apparatus, and wafer fabrication system provided in this application have at least the following advantages:

[0067] 1. Multiple wafers bonded together can be placed on corresponding support positions, and the wafers supported on the support positions are spaced apart from the bottom wall of the carrier basket 110, thereby ensuring that the adhesive removed during cleaning falls into the bottom of the carrier basket 110, preventing the adhesive from sticking to the wafers and improving the cleaning and adhesive removal effect. At the same time, all wafers are supported by corresponding support positions, preventing the wafers from separating and falling and being damaged after cleaning, thus improving the quality of the wafers.

[0068] 2. The spacing between adjacent support rods 120 is adjustable, thus accommodating the placement of wafers of more sizes and improving applicability;

[0069] 3. All support rods 120 are connected to the linkage assembly 130 to achieve synchronous movement of the support rods 120 and facilitate adjustment of the position of the support rods 120;

[0070] 4. The linkage component 130 can be connected and separated from the support rod 120, which facilitates the replacement and maintenance of the support rod 120 and the linkage component 130.

[0071] Although embodiments of this application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A degumming tool, characterized in that, include: Support basket; A support assembly is disposed within the bearing basket. The support assembly includes at least three support rods arranged side by side, and two adjacent support rods form a support group. In the support assembly, multiple limiting grooves are provided on both sides of the two support rods facing each other. The multiple limiting grooves are arranged at intervals along the length direction of the support rods, and the limiting grooves on the two support rods correspond one to one. The two corresponding limiting grooves constitute a support position. The support positions on two adjacent support groups correspond one-to-one; The spacing between any two adjacent support rods is adjustable.

2. The degumming fixture according to claim 1, characterized in that, The number of support components is multiple.

3. The degumming fixture according to claim 1, characterized in that, Each of the support rods is movably configured so that any two adjacent support rods can move closer to or further away from each other.

4. The degumming fixture according to claim 2, characterized in that, It also includes a linkage component, which is connected to the end of each of the support rods to enable all the support rods to move synchronously.

5. The degumming fixture according to claim 4, characterized in that, The linkage component is rotatably connected to the support basket, and the linkage component can connect to and separate from the end of the support rod during rotation.

6. The degumming fixture according to claim 5, characterized in that, It also includes a fastener that can fix the linkage component relative to the carrying basket.

7. The degumming fixture according to claim 4, characterized in that, The number of linkage components is two sets, and the two sets of linkage components are respectively connected to both ends of the support rod.

8. The degumming fixture according to claim 1, characterized in that, The bottom of the support basket has multiple drainage holes.

9. A cleaning device, characterized in that, Includes an ultrasonic cleaner and the degumming fixture as described in any one of claims 1-8.

10. A wafer fabrication system, characterized in that, Includes the degumming fixture as described in any one of claims 1-8 or the cleaning device as described in claim 9.

Images