An eccentric half ball valve body processing cooling device
By designing a cooling device for the eccentric hemispherical valve body, and utilizing the circulating cooling system of the cooling box and refrigeration box, as well as semiconductor refrigeration chips, the problem of water temperature rise during the cooling process was solved, achieving efficient cooling and stable refrigeration, and improving the shaping effect of the valve body.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIAOZUO XINGPENG IND CO LTD
- Filing Date
- 2025-07-28
- Publication Date
- 2026-06-12
Smart Images

Figure CN224353392U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of valve body processing technology, and in particular to a cooling device for processing an eccentric hemispherical valve body. Background Technology
[0002] The eccentric hemispherical valve is a relatively new type of ball valve, featuring frictionless opening and closing, wear-resistant seals, and low opening and closing torque. It is widely used in applications requiring strict shut-off, such as petroleum, chemical, and urban water supply and drainage systems. The valve opens and closes by rotating an eccentric shaft by 90°, thus cutting off the medium. When the valve opens, the crankshaft rotates a small angle, causing the ball to leave the valve seat. The ball then rotates frictionlessly to the fully open position. When closing, the ball rotates first, then contacts the valve seat at the moment of closing, and finally the valve stem presses the ball firmly against the valve seat, achieving a seal.
[0003] In the prior art, during the processing of the eccentric hemispherical valve body, in order to ensure the shaping effect of the valve body, the heated valve body needs to be cooled. However, the water temperature will continue to rise during cooling, which will affect the cooling efficiency of the valve body. Utility Model Content
[0004] The purpose of this invention is to solve the problem in the prior art that in the processing of eccentric hemispherical valve bodies, in order to ensure the shaping effect of the valve body, it is necessary to cool the heated valve body, but the water temperature will continue to rise during cooling, which will affect the cooling efficiency of the valve body. Therefore, a cooling device for processing eccentric hemispherical valve bodies is proposed.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A cooling device for processing an eccentric hemispherical valve body includes a cooling box. A fixed frame is fixedly connected to the top of the cooling box. A fixed plate is fixedly connected to the inner wall of the top of the fixed frame. A hydraulic cylinder is fixedly connected to the upper surface of the fixed plate. A hanger is fixedly connected to the end of the piston rod of the hydraulic cylinder. A retrieval frame is fixedly connected to the bottom of the hanger. A refrigeration box is fixedly connected to the bottom side wall of the cooling box.
[0007] Preferably, the inner wall of the retrieval frame is provided with multiple cooling slots, and a support plate is fixedly connected to the side wall of the cooling box.
[0008] Preferably, a water pump is fixedly connected to the bottom side wall of the cooling box, and a return pipe is fixedly connected to the side wall of the water pump, the return pipe extending into the interior of the cooling box.
[0009] Preferably, a fixed frame is fixedly connected inside the refrigeration box, and a semiconductor refrigeration chip is fixedly connected to the inner wall of the fixed frame.
[0010] Preferably, a connecting platform is fixedly connected to the side wall of the refrigeration box, and a cooling fan is fixedly installed on the side of the connecting platform away from the refrigeration box.
[0011] Preferably, the semiconductor refrigeration chip is fixedly connected to a plurality of heat exchange fins on one side inside the refrigeration box, and the plurality of heat exchange fins are respectively provided with a plurality of turbulence holes.
[0012] Compared with the prior art, this utility model provides a cooling device for machining the body of an eccentric hemispherical valve, which has the following beneficial effects:
[0013] 1. The cooling device for the eccentric hemispherical valve body is equipped with a cooling box that is responsible for cooling the coolant. The cooling box has a fixed frame that holds a semiconductor cooling chip. When the semiconductor cooling chip is working, it generates a cooling effect. In order to recycle the coolant, the water pump on the bottom side wall of the cooling box is started to transport the coolant in the cooling box to the cooling box through the return pipe for cooling. The cooled coolant then flows back to the cooling box, forming a circulating cooling system to ensure subsequent cooling efficiency.
[0014] 2. The cooling device for the eccentric hemispherical valve body is designed to activate a hydraulic cylinder. The piston rod of the hydraulic cylinder extends, causing the hanger to move downwards. This allows the retrieval frame, along with the valve body, to be immersed in the coolant in the cooling tank. The multiple cooling slots on the inner wall of the retrieval frame allow the coolant to fully contact the valve body, improving cooling efficiency.
[0015] 3. The cooling device for the eccentric hemispherical valve body is activated by a cooling fan fixed on the connecting platform on the side wall of the refrigeration box when the semiconductor refrigeration chip is working. This can dissipate the heat generated by the semiconductor refrigeration chip in a timely manner, ensuring the stability of its cooling effect. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the structure of a cooling device for machining the body of an eccentric hemispherical valve proposed in this utility model;
[0017] Figure 2 This is a partial structural cross-sectional view of a cooling device for machining the body of an eccentric hemispherical valve proposed in this utility model;
[0018] Figure 3 for Figure 2 A magnified schematic diagram of part A in the middle section.
[0019] In the diagram: 1 Cooling box, 2 Fixing frame, 3 Fixing plate, 4 Hydraulic cylinder, 5 Hanger, 6 Retrieval frame, 7 Support plate, 8 Water pump, 9 Return pipe, 10 Refrigeration box, 11 Fixing frame, 12 Semiconductor cooling chip, 13 Heat exchange fins, 14 Connecting platform, 15 Cooling fan. Detailed Implementation
[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0021] Reference Figure 1-3 A cooling device for processing an eccentric hemispherical valve body includes a cooling box 1. A fixing frame 2 is fixedly connected to the top of the cooling box 1. A fixing plate 3 is fixedly connected to the inner wall of the top of the fixing frame 2. A hydraulic cylinder 4 is fixedly connected to the upper surface of the fixing plate 3. A hanger 5 is fixedly connected to the end of the piston rod of the hydraulic cylinder 4. A retrieval frame 6 is fixedly connected to the bottom of the hanger 5. A refrigeration box 10 is fixedly connected to the bottom side wall of the cooling box 1. Multiple cooling slots are opened on the inner wall of the retrieval frame 6. A support plate 7 is fixedly connected to the side wall of the cooling box 1. A water pump 8 is fixedly connected to the bottom side wall of the cooling box 1. A return pipe 9 is fixedly connected to the side wall of the water pump 8. The return pipe 9 extends into the interior of the refrigeration box 10.
[0022] A fixed frame 11 is fixedly connected inside the refrigeration box 10. A semiconductor cooling chip 12 is fixedly connected to the inner wall of the fixed frame 11. A connecting platform 14 is fixedly connected to the side wall of the refrigeration box 10. A cooling fan 15 is fixedly installed on the side of the connecting platform 14 away from the refrigeration box 10.
[0023] The cooling tank 1 serves as the main cooling space, containing coolant for cooling the valve body. The mounting bracket 2 provides support for the upper structure of the entire device, while the mounting plate 3 on the inner wall of its top is used to fix the hydraulic cylinder 4, ensuring the stability of the hydraulic cylinder 4 during operation.
[0024] When the eccentric hemispherical valve body needs to be cooled after processing, the valve body is placed in the retrieval frame 6, the hydraulic cylinder 4 is activated, the piston rod of the hydraulic cylinder 4 extends, driving the hanger 5 to move downward, so that the retrieval frame 6 together with the valve body is immersed in the coolant in the cooling tank 1. The multiple cooling slots on the inner wall of the retrieval frame 6 can allow the coolant to fully contact the valve body, improving the cooling efficiency.
[0025] During the cooling process, the cooling box 10 is responsible for cooling the coolant. The thermoelectric cooler 12 is fixed in the fixed frame 11 inside the cooling box 10. When the thermoelectric cooler 12 is working, it generates a cooling effect. In order to recycle the coolant, the water pump 8 on the bottom side wall of the cooling box 1 is started to transport the coolant in the cooling box 1 to the cooling box 10 through the return pipe 9 for cooling. The cooled coolant then flows back to the cooling box 1, forming a circulating cooling system for the coolant.
[0026] The cooling fan 15 fixed on the connecting platform 14 on the side wall of the cooling box 10 starts when the semiconductor cooling chip 12 is working, which can dissipate the heat generated by the semiconductor cooling chip 12 in a timely manner and ensure the stability of its cooling effect.
[0027] After cooling is complete, start hydraulic cylinder 4 to retract its piston rod, and use the hanger 5 to remove the retrieval frame 6 along with the cooled valve body from the cooling box 1. The tray 7 on the side wall of the cooling box 1 can be used to temporarily place the removed valve body for convenient subsequent operations.
[0028] To improve heat exchange efficiency, such as Figure 1-3 As shown, the semiconductor cooling chip 12 is fixedly connected to a plurality of heat exchange fins 13 on one side inside the cooling box 10, and the plurality of heat exchange fins 13 are provided with a plurality of turbulence holes.
[0029] Multiple heat exchange fins 13 increase the contact area with the coolant, while multiple turbulence holes in the heat exchange fins 13 enhance the flow disturbance of the coolant, improve heat exchange efficiency, and thus more effectively reduce the temperature of the coolant.
[0030] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A cooling device for machining an eccentric hemispherical valve body, comprising a cooling box (1), characterized in that: A fixed frame (2) is fixedly connected to the top of the cooling box (1), a fixed plate (3) is fixedly connected to the inner wall of the top of the fixed frame (2), a hydraulic cylinder (4) is fixedly connected to the upper surface of the fixed plate (3), a hanger (5) is fixedly connected to the piston rod end of the hydraulic cylinder (4), a retrieval frame (6) is fixedly connected to the bottom of the hanger (5), and a refrigeration box (10) is fixedly connected to the bottom side wall of the cooling box (1).
2. The eccentric hemispherical valve body machining cooling device according to claim 1, characterized in that: The inner wall of the retrieval frame (6) is provided with multiple cooling slots, and a support plate (7) is fixedly connected to the side wall of the cooling box (1).
3. The eccentric hemispherical valve body machining cooling device according to claim 1, characterized in that: A water pump (8) is fixedly connected to the bottom side wall of the cooling box (1), and a return pipe (9) is fixedly connected to the side wall of the water pump (8). The return pipe (9) extends into the interior of the cooling box (10).
4. The eccentric hemispherical valve body machining cooling device according to claim 1, characterized in that: The interior of the refrigeration box (10) is fixedly connected to a fixed frame (11), and the inner wall of the fixed frame (11) is fixedly connected to a semiconductor refrigeration chip (12).
5. The eccentric hemispherical valve body machining cooling device according to claim 1, characterized in that: A connecting platform (14) is fixedly connected to the side wall of the refrigeration box (10), and a cooling fan (15) is fixedly provided on the side of the connecting platform (14) away from the refrigeration box (10).
6. The eccentric hemispherical valve body machining cooling device according to claim 4, characterized in that: The semiconductor cooling chip (12) is fixedly connected to a plurality of heat exchange fins (13) on one side inside the cooling box (10), and the interior of the plurality of heat exchange fins (13) is provided with a plurality of turbulence holes.