Capacitor pin welding structure and capacitor

Abstract

The utility model relates to a kind of capacitor pin welding structure and capacitor in capacitor technology field, including capacitor core, insulating piece and spray gold particle layer, the capacitor core is wound along a axis and presents columnar structure, the both ends of capacitor core are equipped with strip-shaped metal pin, capacitor core is hollow structure at axis, the both ends of insulating piece are inlaid at capacitor core axis, the end portion of insulating piece away from capacitor core is equipped with the outwardly extending limiting convex disc, there is a gap between the end portion of limiting convex disc and capacitor core, one end of metal pin is inlaid and fixed in the gap between limiting convex disc and capacitor core, the spray gold particle layer is respectively set in the both ends of capacitor core, the cross section height of spray gold particle layer and the height of the gap between limiting convex disc and capacitor core are consistent, when welding and fixing, the connecting strength between metal pin and spray gold particle layer can be enhanced by limiting convex disc, improve the welding stability of metal pin.

Description

Technical Field

[0001] This utility model relates to the field of capacitor technology, and in particular to a capacitor lead welding structure and a capacitor. Background Technology

[0002] A capacitor consists of two conductors placed close together, with a non-conductive insulating dielectric layer in between. When a voltage is applied between the two plates of a capacitor, it stores electrical charge. The capacitance of a capacitor is numerically equal to the ratio of the charge on one of the conducting plates to the voltage between the two plates.

[0003] The existing invention patent application with publication number CN114334451A discloses a metallized film capacitor, which includes a capacitor core and an insulating core rod. The capacitor core is alternately wound around the insulating core rod in the length direction via multiple base films and multiple metallized films. The width of the metallized film in the perpendicular direction of the length direction is smaller than that of the base film, such that one end of the base film and the metallized film are aligned, and the other end has a margin area not covered by the metallized film. The margin area is distributed at both ends of the capacitor core. Two gold-plated electrodes are respectively disposed at both ends of the capacitor core. The gold-plated electrodes are electrically connected to the end of the metallized film away from the margin area.

[0004] However, the existing capacitor core has a small soldering contact area between the metal leads and the gold-plated particle layer, resulting in an unstable soldering structure. Therefore, there is an urgent need to develop a capacitor lead soldering structure and capacitor to meet practical application requirements. Utility Model Content

[0005] The purpose of this invention is to provide a capacitor pin welding structure and a capacitor to solve the above-mentioned defects.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0007] A capacitor lead welding structure includes a capacitor core, an insulating component, and a gold-plated particle layer. The capacitor core is wound into a columnar structure along an axis, and both ends of the capacitor core are provided with elongated metal leads. The capacitor core is hollow at the axis. The insulating component is embedded at both ends of the capacitor core axis. The end of the insulating component away from the capacitor core is provided with an outwardly extending limiting protrusion. A gap is left between the limiting protrusion and the end of the capacitor core. One end of the metal lead is embedded and fixed in the gap between the limiting protrusion and the capacitor core. The gold-plated particle layer is respectively disposed at both ends of the capacitor core, and the cross-sectional height of the gold-plated particle layer is consistent with the height of the gap between the limiting protrusion and the capacitor core.

[0008] In the above description, as a further embodiment, the end of the metal pin near the capacitor core is a ring-shaped hollow structure, and the end of the insulating part away from the limiting protrusion passes through the ring and is inserted and fixed to the axis of the capacitor core end face. The ring of the metal pin is clamped between the capacitor core end face and the limiting protrusion.

[0009] A capacitor includes a capacitor core, metal leads, and the aforementioned insulating components. Gold-plated particle layers are respectively disposed at both ends of the capacitor core, and a welding structure is formed between the gold-plated particle layers and the metal leads. The surface of the columnar electrode core is also provided with an outer plastic wrapping layer, and the end of the metal lead away from the electrode core is exposed to the outside.

[0010] In the above description, as a further solution, when the capacitor core is flattened, the first metal foil, the first insulating layer, the metallized film, the second metal foil, and the second insulating layer are stacked in sequence, and one end of the first insulating layer extends outward as a reserved adhesive section. The reserved adhesive section is folded towards the bottom surface of the second insulating layer, and the first insulating layer is connected to the second insulating layer through the reserved adhesive section. The first metal foil, the first insulating layer, the metallized film, the second metal foil, and the second insulating layer are wound together near the reserved adhesive section to form a columnar structure.

[0011] In the above description, as a further embodiment, the metallization film includes a first metallization film and a second metallization film. Both the first metallization film and the second metallization film are composed of a vapor-deposited electrode and a metallization thin film, and the first metallization film and the second metallization film are stacked one on top of the other.

[0012] In the above description, as a further embodiment, the vapor deposition electrode has a blank area on one side of the metallized film, and the first metallized film and the second metallized film have a symmetrical structure on the horizontal plane. The side of the first metallized film away from the blank area is electrically connected to the same side of the second metal foil, and the side of the second metallized film away from the blank area is electrically connected to the same side of the first metal foil.

[0013] In the above description, as a further embodiment, the first metal foil and the second metallization film form the first conductive region, and the second metal foil and the first metallization film form the second conductive region, with the first conductive region and the second conductive region having an interleaved structure.

[0014] In the above description, as a further embodiment, the first metal foil and the second metallized film are both electrically connected through a gold-plated particle layer.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows: the end of the insulating part is provided with an outwardly extending limiting protrusion, and there is a gap between the limiting protrusion and the end of the capacitor core. This gap can be used to clamp and fix the end of the metal pin. When the gold spraying particle layer is sprayed on the end face of the capacitor core, the thickness of the gold spraying particle layer is determined by the height of this gap. During welding and fixing, the limiting protrusion can enhance the connection strength between the metal pin and the gold spraying particle layer, and improve the welding stability of the metal pin. Attached Figure Description

[0016] Figure 1 This is an exploded view of the capacitor pin welding structure described in this embodiment;

[0017] Figure 2 This is a cross-sectional view of a capacitor pin welding structure as described in this embodiment;

[0018] Figure 3 This is a three-dimensional structural diagram of a capacitor as described in this embodiment;

[0019] Figure 4 This is a schematic cross-sectional view of the capacitor after it has been unwound and is wound along the winding direction, as described in this embodiment.

[0020] Figure 5 This is a schematic cross-sectional view of the capacitor after it has been unfolded, as described in this embodiment.

[0021] In the figure: 1-first insulating layer, 11-reserved adhesive section, 2-first metal foil, 3-first metallization film, 31-evaporated electrode, 32-metallization film, 4-second metallization film, 5-second metal foil, 6-second insulating layer, 7-gold spray particle layer, 8-metal pin, 81-ring portion, 9-outer plastic wrapping layer, 10-capacitor core, 101-insulating component, 1011-limiting protrusion. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.

[0023] For this embodiment, please refer to Figures 1-2The specific implementation of the capacitor pin welding structure includes a capacitor core 10, an insulating component 101, and a gold-plated particle layer 7. The capacitor core 10 is wound into a columnar structure along an axis. Both ends of the capacitor core 10 are provided with long strip-shaped metal pins 8. The capacitor core 10 is hollow at the axis. The insulating component 101 is embedded at both ends of the capacitor core 10 along the axis. The end of the insulating component 101 away from the capacitor core 10 is provided with an outwardly extending limiting protrusion 1011. A gap is left between the limiting protrusion 1011 and the end of the capacitor core 10. One end of the metal pin 8 is embedded and fixed in the gap between the limiting protrusion 1011 and the capacitor core 10. The gold-plated particle layer 7 is respectively disposed at both ends of the capacitor core 10. The cross-sectional height of the gold-plated particle layer 7 is consistent with the height of the gap between the limiting protrusion 1011 and the capacitor core 10.

[0024] Specifically, such as Figure 2 As shown, the end of the metal pin 8 near the capacitor core 10 is a ring-shaped hollow structure collar portion 81. The end of the insulating member 101 away from the limiting protrusion 1011 passes through the collar portion 81 and is inserted and fixed to the axis of the end face of the capacitor core 10. The collar portion 81 of the metal pin 8 is clamped between the end face of the capacitor core 10 and the limiting protrusion 1011.

[0025] An outwardly extending limiting protrusion 1011 is provided at the end of the insulating member 101, and a gap is left between the limiting protrusion 1011 and the end of the capacitor core 10. This gap can be used to clamp and fix the end of the metal pin 8. When the gold spraying particle layer 7 is sprayed on the end face of the capacitor core 10, the thickness of the gold spraying particle layer 7 is determined by the height of this gap. During welding and fixing, the limiting protrusion 1011 can enhance the connection strength between the metal pin 8 and the gold spraying particle layer 7, and improve the welding stability of the metal pin 8.

[0026] Please see Figures 2-5 The capacitor specifically implemented includes a capacitor core 10, metal leads 8 and the aforementioned insulating component 101. Gold-plated particle layers 7 are respectively disposed at both ends of the capacitor core 10, and a welding structure is formed between the gold-plated particle layers 7 and the metal leads 8. The surface of the columnar electrode core is also provided with an outer plastic wrapping layer 9, and the end of the metal lead 8 away from the electrode core is exposed to the outside.

[0027] like Figure 4-5As shown, when the capacitor core 10 is flattened, the first metal foil 2, the first insulating layer 1, the metallized film, the second metal foil 5, and the second insulating layer 6 are stacked in sequence. One end of the first insulating layer 1 extends outward to form a reserved adhesive section 11. The reserved adhesive section 11 is folded towards the bottom surface of the second insulating layer 6. The first insulating layer 1 is connected to the second insulating layer 6 through the reserved adhesive section 11. The first metal foil 2, the first insulating layer 1, the metallized film, the second metal foil 5, and the second insulating layer 6 are wound together in a columnar structure near the reserved adhesive section 11. The metallized film includes a first metallized film 3 and a second metallized film 4. Both the first metallized film 3 and the second metallized film 4 are composed of a vapor-deposited electrode 31 and a metallized thin film 32. The first metallized film 3 and the second metallized film 4 are stacked vertically.

[0028] Specifically, the first metal foil 2 and the second metallized film 4 are connected by a gold-sprayed particle layer 7.

[0029] The vapor-deposited electrode 31 has a blank area on one side of the metallized film 32. The first metallized film 3 and the second metallized film 4 are symmetrical in the horizontal plane. The side of the first metallized film 3 away from the blank area is electrically connected to the same side of the second metal foil 5. The side of the second metallized film 4 away from the blank area is electrically connected to the same side of the first metal foil 2. The first metal foil 2 and the second metallized film 4 form the first conductive area, and the second metal foil 5 and the first metallized film 3 form the second conductive area. The first and second conductive areas are staggered. The metal pin 8 near the first conductive area is connected to the positive terminal of the power supply, and the metal pin 8 near the second conductive area is connected to the negative terminal of the power supply. This allows the first conductive area to acquire positive charge and the second conductive area to acquire negative charge. The staggered structure between the first and second conductive areas allows for faster charging and discharging speeds through the staggered induced magnetic field.

[0030] The above description, in conjunction with specific preferred embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, various simple deductions or substitutions can be made without departing from the concept of the present invention, and all such modifications and substitutions should be considered within the scope of protection of the present invention.

Claims

1. A capacitor lead soldering structure, characterized in that, include: The capacitor core is wound into a columnar structure along an axis, and both ends of the capacitor core are provided with long strip-shaped metal leads. The capacitor core is hollow at the axis. An insulating component is embedded at both ends of the capacitor core axis. The end of the insulating component away from the capacitor core is provided with an outwardly extending limiting protrusion. A gap is left between the limiting protrusion and the end of the capacitor core. One end of the metal pin is embedded and fixed in the gap between the limiting protrusion and the capacitor core. A gold-plated particle layer is disposed at both ends of the capacitor core, and the cross-sectional height of the gold-plated particle layer is consistent with the height of the gap between the limiting protrusion and the capacitor core.

2. The capacitor lead soldering structure according to claim 1, characterized in that: The end of the metal pin near the capacitor core is a ring-shaped hollow structure. The end of the insulating component away from the limiting cam passes through the ring and is inserted and fixed to the axis of the capacitor core end face. The ring of the metal pin is clamped between the capacitor core end face and the limiting cam.

3. A capacitor, characterized in that: The device includes a capacitor core, metal leads, and an insulating component as described in any one of claims 1-2. Gold-plated particle layers are respectively disposed at both ends of the capacitor core, and a welding structure is formed between the gold-plated particle layers and the metal leads. The surface of the columnar electrode core is also provided with an outer plastic wrapping layer, and the end of the metal lead away from the electrode core is exposed to the outside.

4. A capacitor according to claim 3, characterized in that: When the capacitor core is flattened, the first metal foil, the first insulating layer, the metallized film, the second metal foil, and the second insulating layer are stacked in sequence. One end of the first insulating layer extends outward as a reserved adhesive section. The reserved adhesive section is folded towards the bottom surface of the second insulating layer. The first insulating layer is connected to the second insulating layer through the reserved adhesive section. The first metal foil, the first insulating layer, the metallized film, the second metal foil, and the second insulating layer are wound together at one end near the reserved adhesive section to form a columnar structure.

5. A capacitor according to claim 4, characterized in that: The metallization film includes a first metallization film and a second metallization film. Both the first metallization film and the second metallization film are composed of vapor-deposited electrodes and metallization films. The first metallization film and the second metallization film are stacked one on top of the other.

6. A capacitor according to claim 5, characterized in that: The vapor deposition electrode has a blank area on one side of the metallized film, and the first metallized film and the second metallized film are symmetrical in the horizontal plane. The side of the first metallized film away from the blank area is electrically connected to the same side of the second metal foil, and the side of the second metallized film away from the blank area is electrically connected to the same side of the first metal foil.

7. A capacitor according to claim 6, characterized in that: The first metal foil and the second metallization film form a first conductive region, and the second metal foil and the first metallization film form a second conductive region. The first conductive region and the second conductive region have an interleaved structure.

8. A capacitor according to claim 7, characterized in that: The first metal foil and the second metallized film are connected by a gold-sprayed particle layer.

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