Laser internal circuit board shockproof buffer structure

Abstract

The utility model relates to the technical field of shock -proof buffer structure, and disclose a kind of laser internal circuit board shock -proof buffer structure, including connecting strip, the left side of the connecting strip is provided with shock -proof buffer mechanism, the top of the connecting strip is provided with limiting mechanism.The laser internal circuit board shock -proof buffer structure, through the aluminium foil layer and silicon rubber layer of staggered laminated distribution, energy generated by vibration can be absorbed, and then realize the shock -proof buffer of circuit board, simultaneously utilize the characteristics that aluminium foil layer can provide high heat conduction path, can be discharged in the cooperation of heat conduction channel formed by strip-shaped radiating groove and honeycomb radiating groove, the energy of circuit board heat emission, while solve the limitation of existing rubber shock pad, no heat insulation phenomenon generated by poor heat conductivity occurs, the heat of circuit board cannot be accumulated, and then avoid the material accelerated aging of shock -proof buffer structure due to long-term high temperature, ensure that under long time use, shock -proof buffer effect will not be reduced.

Description

Technical Field

[0001] This utility model relates to the field of shock-absorbing and buffering structure technology, specifically a shock-absorbing and buffering structure for the internal circuit board of a laser. Background Technology

[0002] The circuit board of the dual-wavelength picosecond laser is its core control and drive component, responsible for realizing functions such as laser pulse generation, wavelength switching / synchronization, and stability control. As a high-precision electronic system, the shock-absorbing structure design of the circuit board of the dual-wavelength picosecond laser is crucial. By using the shock-absorbing structure, the impact of vibration on the circuit board can be reduced.

[0003] In existing technologies, rubber damping pads are typically used to provide shock absorption for circuit boards. These pads are placed between the circuit board and the housing to provide shock absorption. However, in actual use, due to the poor thermal conductivity of rubber, heat insulation occurs, which hinders heat dissipation from the circuit board. Long-term high temperatures accelerate material aging, reducing the shock absorption effect of the rubber damping pads. Therefore, it is necessary to improve the shock absorption structure of the internal circuit board of a laser to solve the above problems. Utility Model Content

[0004] The purpose of this invention is to provide a shock-absorbing and buffering structure for the internal circuit board of a laser, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a shock-absorbing and buffering structure for an internal circuit board of a laser, comprising a connecting strip, a shock-absorbing and buffering mechanism on the left side of the connecting strip, and a limiting mechanism on the top of the connecting strip.

[0006] Preferably, the shock-absorbing and buffering mechanism includes an aluminum foil layer, which is fixedly installed on the left side of the connecting strip. A silicone rubber layer is fixedly installed at the bottom of the aluminum foil layer, and a honeycomb inner aluminum foil is fixedly installed inside the aluminum foil layer.

[0007] Preferably, the aluminum foil layer and the silicone rubber layer are in an interlaced laminated structure, with the lamination direction perpendicular to the vibration transmission path. Each aluminum foil layer has a thickness of 0.1 mm, and each silicone rubber layer has a thickness of 1 mm. The interface between the aluminum foil layer and the silicone rubber layer is provided with serrated microgrooves.

[0008] Preferably, both the aluminum foil layer and the silicone rubber layer have strip-shaped heat dissipation grooves and honeycomb-shaped heat dissipation grooves inside, and the honeycomb-shaped inner aluminum foil is embedded inside the aluminum foil layer. The honeycomb unit has a regular hexagonal structure with a side length of 3mm and a honeycomb wall thickness of 0.05mm.

[0009] Preferably, the honeycomb-shaped inner aluminum foil is fixed to the honeycomb-shaped heat dissipation groove of the aluminum foil layer by laser welding, and its exposed surface is covered with a nano-alumina ceramic coating.

[0010] Preferably, the limiting mechanism includes a storage strip, which is fixedly installed on the top of the connecting strip. A rubber plug is provided inside the storage strip, and a stop bar is fixedly installed on the top of the rubber plug.

[0011] Preferably, the storage strip has a plug hole inside, and the rubber plug is interference-fitted with the plug hole inside the storage strip.

[0012] Compared with the prior art, this utility model provides a shock-absorbing and buffering structure for the internal circuit board of a laser, which has the following beneficial effects:

[0013] 1. The shock-absorbing structure of the laser's internal circuit board, through its designed shock-absorbing mechanism, absorbs the energy generated by vibration during use through the staggered layering of aluminum foil and silicone rubber, thus achieving shock absorption for the circuit board. Simultaneously, utilizing the high thermal conductivity of the aluminum foil layer, the energy dissipated by the circuit board is expelled through the combined heat dissipation channels formed by the strip-shaped and honeycomb-shaped heat dissipation grooves. This overcomes the limitations of existing rubber shock-absorbing pads, preventing heat insulation issues caused by poor thermal conductivity. Heat does not accumulate on the circuit board, thus avoiding accelerated aging of the shock-absorbing structure due to prolonged high temperatures, ensuring that the shock-absorbing effect does not diminish even after long-term use.

[0014] 2. The shock-absorbing structure of the internal circuit board of the laser, through the setting of the limiting mechanism, allows the baffle to limit the circuit during use by the interference fit between the rubber plug and the plug hole, thereby allowing the circuit board to be stored, thus realizing the function of storing the circuit. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the appearance and structure of this utility model;

[0017] Figure 2 This is an exploded view of the external structure of the shock-absorbing and buffering mechanism of this utility model;

[0018] Figure 3 This is a schematic diagram of the external structure of the limiting mechanism of this utility model;

[0019] Figure 4 This is an exploded view of the limiting mechanism of this utility model.

[0020] In the diagram: 1. Connecting strip; 2. Shock-absorbing and buffering mechanism; 21. Aluminum foil layer; 22. Silicone rubber layer; 23. Honeycomb inner aluminum foil; 3. Limiting mechanism; 31. Storage strip; 32. Rubber plug; 33. Stop bar. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] Example:

[0024] Please see Figure 1-2 This utility model provides a technical solution: a shock-absorbing and buffering structure for the internal circuit board of a laser, including a connecting strip 1, a shock-absorbing and buffering mechanism 2 on the left side of the connecting strip 1, and a limiting mechanism 3 on the top of the connecting strip 1.

[0025] Furthermore, the shock-absorbing mechanism 2 includes an aluminum foil layer 21, which is fixedly installed on the left side of the connecting strip 1. A silicone rubber layer 22 is fixedly installed at the bottom of the aluminum foil layer 21, and a honeycomb inner aluminum foil 23 is fixedly installed inside the aluminum foil layer 21. Through the shock-absorbing mechanism 2, the vibration inside the laser can be suppressed to achieve shock absorption. The aluminum foil layer 21 provides a high thermal conductivity path, the silicone rubber layer 22 absorbs vibration energy, and the honeycomb inner aluminum foil 23 enhances bending stiffness. This can improve the heat dissipation efficiency of the circuit board while ensuring shock absorption.

[0026] Furthermore, the aluminum foil layer 21 and the silicone rubber layer 22 are in an interlaced laminated structure, with the lamination direction perpendicular to the vibration transmission path. Each aluminum foil layer 21 is 0.1 mm thick, and each silicone rubber layer 22 is 1 mm thick. A serrated microgroove is provided at the interface between the aluminum foil layer 21 and the silicone rubber layer 22. The interlaced laminated structure combined with the serrated microgroove design can improve the interlayer bonding strength, effectively suppress the risk of delamination, and at the same time expand the wide frequency damping range.

[0027] Furthermore, both the aluminum foil layer 21 and the silicone rubber layer 22 have strip-shaped heat dissipation grooves and honeycomb-shaped heat dissipation grooves inside. The honeycomb-shaped inner aluminum foil 23 is embedded inside the aluminum foil layer 21. The honeycomb unit has a regular hexagonal structure with a side length of 3mm and a honeycomb wall thickness of 0.05mm. The regular hexagonal honeycomb structure can increase the heat dissipation area and, together with the strip-shaped heat dissipation grooves, form multiple heat conduction channels, which can dissipate the heat from the circuit board and reduce the temperature of the circuit board.

[0028] Furthermore, the honeycomb inner aluminum foil 23 is fixed to the inside of the honeycomb heat dissipation groove of the aluminum foil layer 21 by laser welding, and its exposed surface is covered with a nano-alumina ceramic coating. Laser welding ensures the connection strength of the honeycomb structure, and the nano-alumina coating improves corrosion resistance and radiative heat dissipation efficiency, extending service life.

[0029] Please see Figure 3-4 Furthermore, the limiting mechanism 3 includes a storage strip 31, which is fixedly installed on the top of the connecting strip 1. A rubber plug 32 is provided inside the storage strip 31, and a stop strip 33 is fixedly installed on the top of the rubber plug 32. Through the limiting mechanism 3, the wiring connected to the installed circuit board can be stored and placed inside the storage strip 31.

[0030] Furthermore, the storage strip 31 has a plug hole inside, and the rubber plug 32 is interference-fitted with the plug hole inside the storage strip 31. Through the interference fit, the contact pressure between the rubber plug 32 and the plug hole is uniform, which prevents loosening due to long-term vibration, and at the same time, the baffle 33 can limit the circuit.

[0031] In actual operation, when this device is used, the interleaved aluminum foil layer 21 and silicone rubber layer 22 can absorb the energy generated by vibration, thereby achieving shock absorption and cushioning of the circuit board. At the same time, the aluminum foil layer 21 provides a high thermal conductivity path, and with the cooperation of the heat conduction channels formed by the strip heat dissipation groove and the honeycomb heat dissipation groove, the energy dissipated by the heat generated by the circuit board can be discharged. This also solves the limitations of existing rubber shock-absorbing pads, and there will be no heat insulation phenomenon caused by poor thermal conductivity. The heat of the circuit board will not accumulate, thus avoiding the accelerated aging of the material due to long-term high temperature in the shock-absorbing structure. This ensures that the shock absorption and cushioning effect will not decrease under long-term use. By interfering with the rubber plug 32 and the plug hole, the rubber plug 32 is inserted into the plug hole, so that the baffle 33 can limit the circuit, thereby allowing the circuit of the circuit board to be stored, thus realizing the function of storing the circuit.

[0032] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

Claims

1. A shock-absorbing and buffering structure for an internal circuit board of a laser, comprising a connecting strip (1), characterized in that: A shock-absorbing buffer mechanism (2) is provided on the left side of the connecting strip (1), and a limit mechanism (3) is provided on the top of the connecting strip (1). The shock-absorbing and buffering mechanism (2) includes an aluminum foil layer (21), which is fixedly installed on the left side of the connecting strip (1). A silicone rubber layer (22) is fixedly installed at the bottom of the aluminum foil layer (21), and a honeycomb inner aluminum foil (23) is fixedly installed inside the aluminum foil layer (21).

2. The shock-absorbing and buffering structure for an internal circuit board of a laser according to claim 1, characterized in that: The aluminum foil layer (21) and the silicone rubber layer (22) are in an interleaved laminated structure, with the lamination direction perpendicular to the vibration transmission path. Each layer of the aluminum foil layer (21) is 0.1 mm thick, and each layer of the silicone rubber layer (22) is 1 mm thick. A serrated microgroove is provided on the interface between the aluminum foil layer (21) and the silicone rubber layer (22).

3. The shock-absorbing and buffering structure for an internal circuit board of a laser according to claim 1, characterized in that: Both the aluminum foil layer (21) and the silicone rubber layer (22) have strip-shaped heat dissipation grooves and honeycomb-shaped heat dissipation grooves inside. The honeycomb-shaped inner aluminum foil (23) is embedded inside the aluminum foil layer (21). The honeycomb unit is a regular hexagonal structure with a side length of 3mm and a honeycomb wall thickness of 0.05mm.

4. The shock-absorbing and buffering structure for an internal circuit board of a laser according to claim 1, characterized in that: The honeycomb inner aluminum foil (23) is fixed inside the honeycomb heat dissipation groove of the aluminum foil layer (21) by laser welding, and its exposed surface is covered with a nano-alumina ceramic coating.

5. The shock-absorbing and buffering structure for an internal circuit board of a laser according to claim 1, characterized in that: The limiting mechanism (3) includes a storage strip (31), which is fixedly installed on the top of the connecting strip (1). A rubber plug (32) is provided inside the storage strip (31), and a stop strip (33) is fixedly installed on the top of the rubber plug (32).

6. The shock-absorbing and buffering structure for an internal circuit board of a laser according to claim 5, characterized in that: The storage strip (31) has a plug hole inside, and the rubber plug (32) is interference-fitted with the plug hole inside the storage strip (31).

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