Thermal conductive structure of a circuit board
By setting rectangular through holes and insert structures on the circuit board, combined with locking blocks and spring designs, the heat conduction plate and heat sink can be quickly locked and unlocked, solving the problem of inconvenient disassembly and assembly of the heat conduction structure on the circuit board, and improving heat dissipation efficiency and installation convenience.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN HUAFU EXPRESS CIRCUIT CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-16
AI Technical Summary
The existing heat-conducting structure of the circuit board is inconvenient to disassemble and assemble, which affects the efficiency of installation and maintenance, and the heat dissipation effect is poor.
The design employs a rectangular through-hole and insert block structure, combined with the design of the first and second locking blocks and springs, to achieve quick locking and unlocking of the heat conduction plate and heat dissipation plate. The heat dissipation efficiency is improved through the through-hole and heat conduction strip.
It enables quick installation and removal of heat conduction plates and heat sinks, improving heat dissipation efficiency, simplifying the operation process, and enhancing the heat dissipation effect.
Smart Images

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