Thermal conductive structure of a circuit board

Abstract

The utility model provides a kind of heat conduction structure of circuit board, including the heat conduction plate being arranged on circuit board and the heat dissipation plate being arranged on heat conduction plate, the through hole is opened in the circuit board, the bottom surface of the heat conduction plate is fixedly connected with the plug block of several through hole settings, the side surface of the plug block is equipped with the receiving slot, the first lock block is movably connected in the receiving slot.The utility model has the advantages of: first lock block is pressed into receiving slot, and plug block is inserted into through hole, when first lock block completely passes through through hole, first spring pushes first lock block to move, first lock block is clamped on the bottom surface of circuit board, realize the constraint of heat conduction plate vertical, and heat conduction plate is locked. Pull out pull rod, pull rod drives second lock block to move into movable slot, and heat dissipation plate is buckled on heat conduction plate, and pull rod is loosened, second spring pushes second lock block to be clamped into lock hole, and the locking of heat dissipation plate is realized. Without the tedious screw dismounting work, installation is quick and convenient.

Description

Technical Field

[0001] This utility model relates to the field of circuit board technology, and in particular to a heat-conducting structure for circuit boards. Background Technology

[0002] A circuit board (PCB) is a substrate used to connect and support electronic components. It consists of insulating materials, wires, and components. The wires on the PCB are laid out and connected according to specific circuit design requirements to achieve the circuit's function. With technological advancements and the miniaturization and digitalization of electronic products, PCBs are also developing towards higher density, higher precision, higher performance, miniaturization, thinner profiles, and lighter weight.

[0003] Circuit boards generate a significant amount of heat during operation. If this heat cannot be dissipated promptly, it can jeopardize the lifespan of the circuit board. Existing technologies utilize heat-conducting plates or heat sinks on the circuit board to assist in heat dissipation. However, these heat sinks and heat-conducting plates are fixed to the circuit board with several screws, resulting in inconvenient assembly and disassembly of the entire heat-conducting structure, reducing both initial installation convenience and subsequent maintenance ease of assembly and disassembly. Therefore, this paper proposes an improved heat-conducting structure for circuit boards. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this utility model is to propose a heat-conducting structure for circuit boards to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of the present invention provides a heat-conducting structure for a circuit board, including a heat-conducting plate disposed on the circuit board and a heat dissipation plate disposed on the heat-conducting plate. The circuit board has a plurality of through holes, and a plurality of inserts with through holes are fixedly connected to the bottom surface of the heat-conducting plate. A storage groove is provided on the side of the insert, and a first locking block is movably connected in the storage groove. A first spring is provided between the first locking block and the inner wall of the storage groove.

[0007] A number of heat dissipation fins are fixedly connected to the heat dissipation plate, and an installation plate is fixedly connected to the bottom surface of the heat dissipation plate. A lock hole is opened on the side of the heat conduction plate, and a movable groove is opened on the installation plate. A pull rod is inserted into the movable groove, and a second locking block is fixedly connected to the inner end of the pull rod. A second spring is provided between the second locking block and the inner wall of the movable groove.

[0008] Preferably, both the through hole and the insert block have a rectangular structure, and the insert block has a storage groove on both sides.

[0009] The above technical solution employs the following: The circuit board provides the foundation for related electronic components and circuits, and through-holes are formed on it to facilitate the installation of the heat-conducting plate. Both the through-holes and the inserts adopt a rectangular structure, allowing the through-holes to constrain the inserts and prevent displacement of the inserts and heat-conducting plate in other directions. Storage slots are formed on the inserts to provide storage space for the first locking block and the first spring.

[0010] Preferably, in any of the above solutions, the insert is located at the four corners of the heat-conducting plate, and a guide rod is fixedly connected inside the storage groove.

[0011] The above technical solution involves inserting the plug into the through hole, thus limiting the horizontal displacement of the heat-conducting plate. Positioning the plug at the four corners of the heat-conducting plate further balances the horizontal constraint effect, contributing to its stability.

[0012] Preferably, in any of the above solutions, the first spring and the first locking block are both sleeved on the guide rod inside the receiving groove, and the outer side of the first locking block and the side of the second locking block near the lock hole are both beveled.

[0013] The above technical solution involves pressing the first locking block into the receiving slot during heat-conducting plate installation, and inserting the plug into the through hole. When the first locking block fully passes through the through hole, the first spring pushes the first locking block to move, locking it onto the bottom surface of the circuit board and thus vertically constraining the heat-conducting plate and locking it in place. The corresponding surfaces of the first and second locking blocks are beveled, simplifying the installation process and making it faster. A guide rod is installed within the receiving slot, and the first spring and first locking block are fitted onto the guide rod. The guide rod constrains both components, preventing displacement in other directions.

[0014] Preferably, in any of the above embodiments, the heat sink has several through holes, and the heat conduction plate has heat conduction strips fixedly connected to the through holes.

[0015] The above technical solution involves a heat sink that dissipates heat conducted by the heat-conducting plate, thereby cooling the circuit board. By creating through holes and installing heat-conducting strips, heat can be transferred more quickly and evenly from the heat-conducting plate to the heat sink, thus improving heat dissipation efficiency.

[0016] Preferably, in any of the above schemes, the outer side of the first lock block and the side of the second lock block near the lock hole are both arc-shaped, and there are several movable grooves that are evenly arranged on the mounting plate.

[0017] The above technical solution works as follows: When installing the heat sink, pulling the lever outward causes the second locking block to move into the movable slot, securing the heat sink onto the heat-conducting plate. Releasing the lever causes the second spring to push the second locking block into the locking hole, thus locking the heat sink. One side of the second locking block has an arc-shaped surface, so when installing the heat sink, there is no need to pull the lever; simply fastening the heat sink completes the installation.

[0018] Preferably, in any of the above embodiments, the second spring is sleeved on the outside of the pull rod, and a handle is fixedly connected to the outer end of the pull rod.

[0019] By adopting the above technical solution, the second spring is sleeved on the outside of the pull rod, which can prevent the second spring from deforming in other directions. A pull handle is provided at the outer end of the pull rod to facilitate the operator to pull the rod.

[0020] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0021] 1. The heat-conducting structure of this circuit board, through the inclusion of through holes, inserts, a first locking block, a first spring, a mounting plate, a pull rod, a second locking block, and a second spring, allows for easy installation. During installation, the first locking block is pressed into the receiving slot, and the insert is aligned with the through hole and inserted. When the first locking block fully passes through the through hole, the first spring pushes the first locking block to move, locking it onto the bottom surface of the circuit board and vertically constraining the heat-conducting plate, thus locking it in place. Pulling the pull rod outwards moves the second locking block into the movable slot, securing the heat sink onto the heat-conducting plate. Releasing the pull rod causes the second spring to push the second locking block into the locking hole, locking the heat sink in place. This eliminates the need for tedious screw removal and installation, making installation quick and convenient.

[0022] 2. The heat-conducting structure of this circuit board features beveled surfaces on the corresponding surfaces of the first and second locking blocks, simplifying installation and making it quicker. A guide rod is installed within the storage slot, and the first spring and first locking block are fitted onto the guide rod, which constrains them and prevents displacement in other directions. By creating through holes and installing heat-conducting strips, heat from the heat-conducting plate can be transferred to the heat sink more quickly and evenly, thus improving heat dissipation efficiency. The second spring is fitted onto the outside of the pull rod to prevent deformation in other directions. A handle is provided at the outer end of the pull rod for easy operation.

[0023] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0024] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0025] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0026] Figure 2 This is a cross-sectional structural diagram of the present invention;

[0027] Figure 3 For the present utility model Figure 2 Schematic diagram of the structure at point A;

[0028] Figure 4 For the present utility model Figure 2 A schematic diagram of the structure at point B.

[0029] In the diagram: 1-Circuit board, 2-Through hole, 3-Heat conduction plate, 4-Insertion block, 5-Storage slot, 6-First locking block, 7-First spring, 8-Heat dissipation plate, 9-Heat dissipation fins, 10-Mounting plate, 11-Locking hole, 12-Moving slot, 13-Pull rod, 14-Second locking block, 15-Second spring. Detailed Implementation

[0030] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0031] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0032] like Figures 1-4 As shown, this utility model includes a heat-conducting plate 3 and a heat dissipation plate 8 disposed on the heat-conducting plate 3. The circuit board 1 has several through holes 2. Several inserts 4 through the through holes 2 are fixedly connected to the bottom surface of the heat-conducting plate 3. A storage groove 5 is provided on the side of the insert 4. A first locking block 6 is movably connected in the storage groove 5. A first spring 7 is provided between the first locking block 6 and the inner wall of the storage groove 5.

[0033] A number of heat dissipation fins 9 are fixedly connected to the heat dissipation plate 8. A mounting plate 10 is fixedly connected to the bottom surface of the heat dissipation plate 8. A lock hole 11 is opened on the side of the heat conduction plate 3. A movable groove 12 is opened on the mounting plate 10. A pull rod 13 is inserted into the movable groove 12. A second locking block 14 is fixedly connected to the inner end of the pull rod 13. A second spring 15 is provided between the second locking block 14 and the inner wall of the movable groove 12.

[0034] Example 1: Both the through hole 2 and the plug 4 adopt a rectangular structure, and storage slots 5 are provided on both sides of the plug 4. The circuit board 1 provides the foundation for related electronic components and circuits, and the through hole 2 is provided on it to provide conditions for the installation of the heat-conducting plate 3. The through hole 2 and the plug 4 both adopt a rectangular structure, so that the through hole 2 can constrain the plug 4 and prevent the plug 4 and the heat-conducting plate 3 from displacing in other directions. The storage slots 5 are provided on the plug 4 to provide storage space for the first locking block 6 and the first spring 7.

[0035] Insert 4 is inserted into through hole 2, thus restricting the horizontal displacement of heat conduction plate 3. Positioning insert 4 at the four corners of heat conduction plate 3 further balances the horizontal constraint effect on heat conduction plate 3, contributing to its stability. Guide rods are fixedly connected to the four corners of heat conduction plate 3, and insert 4 is positioned therein.

[0036] Example 2: The first spring 7 and the first locking block 6 are both sleeved on the guide rod inside the receiving groove 5. The outer side of the first locking block 6 and the side of the second locking block 14 near the lock hole 11 are both beveled. When installing the heat-conducting plate 3, the first locking block 6 is pressed into the receiving groove 5, and the insert 4 is aligned with the through hole 2 and inserted. When the first locking block 6 completely passes through the through hole 2, the first spring 7 pushes the first locking block 6 to move, and the first locking block 6 is locked onto the bottom surface of the circuit board 1, thereby achieving vertical constraint on the heat-conducting plate 3 and locking the heat-conducting plate 3. The beveled surfaces of the first locking block 6 and the second locking block 14 simplify the installation operation and make the installation faster. A guide rod is set in the receiving groove 5, and the first spring 7 and the first locking block 6 are sleeved on the guide rod. The guide rod can constrain the two and prevent them from displacing in other directions.

[0037] The heat sink 8 has several through holes, and heat-conducting strips are fixedly connected to the heat-conducting plate 3 and inserted into the through holes. The heat sink 8 is used to dissipate the heat conducted by the heat-conducting plate 3, thereby achieving heat dissipation for the circuit board 1. By opening through holes and setting heat-conducting strips, the heat on the heat-conducting plate 3 can be conducted to the heat sink 8 more quickly and evenly, thus improving the heat dissipation efficiency.

[0038] Example 3: The outer side of the first locking block 6 and the side of the second locking block 14 near the lock hole 11 both adopt arc-shaped surfaces. Several movable slots 12 are evenly distributed on the mounting plate 10. When installing the heat sink 8, pulling the pull rod 13 outwards causes the second locking block 14 to move into the movable slot 12, securing the heat sink 8 onto the heat-conducting plate 3. Releasing the pull rod 13 causes the second spring 15 to push the second locking block 14 into the lock hole 11, thus locking the heat sink 8. Since one side of the second locking block 14 adopts an arc-shaped surface, when installing the heat sink 8, it is not necessary to pull the pull rod 13; simply engaging the heat sink 8 is sufficient to complete the installation.

[0039] The second spring 15 is sleeved on the outside of the pull rod 13, and a handle is fixedly connected to the outer end of the pull rod 13. Sleeving the second spring 15 on the outside of the pull rod 13 can prevent the second spring 15 from deforming in other directions. The handle is provided at the outer end of the pull rod 13 to facilitate the operation of the pull rod 13 by the staff.

[0040] The working principle of this utility model is as follows:

[0041] S1. Press the first locking block 6 into the storage slot 5 and insert the plug 4 into the through hole 2. When the first locking block 6 completely passes through the through hole 2, the first spring 7 pushes the first locking block 6 to move. The first locking block 6 is stuck on the bottom surface of the circuit board 1 to achieve vertical constraint on the heat conduction plate 3 and lock the heat conduction plate 3.

[0042] S2. Pull the lever 13 outward. The lever 13 drives the second locking block 14 to move into the movable groove 12, and the heat sink 8 is fastened onto the heat conduction plate 3. Release the lever 13. The second spring 15 pushes the second locking block 14 into the lock hole 11 to lock the heat sink 8.

[0043] S3. The heat generated by the circuit board 1 during operation is conducted to the heat sink 8 through the heat conduction plate 3, and the heat sink 8 dissipates the heat outward.

[0044] Compared with the prior art, the present invention has the following advantages:

[0045] 1. The heat-conducting structure of this circuit board, through the inclusion of a through hole 2, a plug 4, a first locking block 6, a first spring 7, a mounting plate 10, a pull rod 13, a second locking block 14, and a second spring 15, allows for easy installation. During installation, the first locking block 6 is pressed into the receiving groove 5, and the plug 4 is inserted into the through hole 2. When the first locking block 6 fully passes through the through hole 2, the first spring 7 pushes the first locking block 6 to move, locking it against the bottom surface of the circuit board 1 and thus vertically constraining the heat-conducting plate 3, locking it in place. Pulling the pull rod 13 outward causes the second locking block 14 to move into the movable groove 12, securing the heat sink 8 onto the heat-conducting plate 3. Releasing the pull rod 13 allows the second spring 15 to push the second locking block 14 into the locking hole 11, locking the heat sink 8 in place. This eliminates the need for tedious screw removal and installation, making installation quick and convenient.

[0046] 2. The heat-conducting structure of this circuit board features beveled surfaces on the corresponding sides of the first locking block 6 and the second locking block 14, simplifying installation and making it quicker. A guide rod is installed within the receiving slot 5, onto which the first spring 7 and the first locking block 6 are fitted. The guide rod constrains both, preventing displacement in other directions. By creating through holes and installing heat-conducting strips, heat from the heat-conducting plate 3 can be transferred to the heat sink 8 more quickly and evenly, thus improving heat dissipation efficiency. The second spring 15 is fitted onto the outside of the pull rod 13 to prevent deformation in other directions. A handle is provided at the outer end of the pull rod 13 for easy operation.

Claims

1. A heat-conducting structure for a circuit board, comprising a heat-conducting plate (3) disposed on the circuit board (1) and a heat-dissipating plate (8) disposed on the heat-conducting plate (3); characterized in that, The circuit board (1) has several through holes (2), and the bottom surface of the heat-conducting plate (3) is fixedly connected with several through holes (2) and inserts (4). The side of the inserts (4) has a storage groove (5), and a first locking block (6) is movably connected in the storage groove (5). A first spring (7) is provided between the first locking block (6) and the inner wall of the storage groove (5). A plurality of heat dissipation fins (9) are fixedly connected to the heat dissipation plate (8). An installation plate (10) is fixedly connected to the bottom surface of the heat dissipation plate (8). A lock hole (11) is provided on the side of the heat conduction plate (3). A movable groove (12) is provided on the installation plate (10). A pull rod (13) is inserted into the movable groove (12). A second locking block (14) is fixedly connected to the inner end of the pull rod (13). A second spring (15) is provided between the second locking block (14) and the inner wall of the movable groove (12).

2. The heat-conducting structure of a circuit board as described in claim 1, characterized in that: Both the through hole (2) and the insert (4) adopt a rectangular structure, and the insert (4) has a storage groove (5) on both sides.

3. The heat-conducting structure of a circuit board as described in claim 2, characterized in that: The insert (4) is located at the four corners of the heat-conducting plate (3), and a guide rod is fixedly connected inside the storage groove (5).

4. The heat-conducting structure of a circuit board as described in claim 3, characterized in that: The first spring (7) and the first locking block (6) are both sleeved on the guide rod in the receiving groove (5). The outer side of the first locking block (6) and the side of the second locking block (14) near the lock hole (11) are both beveled.

5. The heat-conducting structure of a circuit board as described in claim 4, characterized in that: The heat sink (8) has several through holes, and the heat conduction plate (3) has heat conduction strips inserted into the through holes.

6. The heat-conducting structure of a circuit board as described in claim 3, characterized in that: The outer side of the first locking block (6) and the side of the second locking block (14) near the lock hole (11) are both arc-shaped. There are several movable grooves (12) and they are evenly arranged on the mounting plate (10).

7. The heat-conducting structure of a circuit board as described in claim 6, characterized in that: The second spring (15) is sleeved on the outside of the pull rod (13), and the outer end of the pull rod (13) is fixedly connected to a handle.

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