A silicon wafer screening conveyor

Abstract

This utility model provides a silicon wafer screening and conveying device, belonging to silicon wafer manufacturing. It includes a fragment detection module, a thickness detection module, a foreign material rejection module, a receiving box, and an air blowing module arranged along a segmented conveyor line. The conveying speeds of each segment of the segmented conveyor line may be the same or different; when the conveying speeds are different, the conveying speed increases progressively from upstream to downstream. This silicon wafer screening and conveying device integrates functions such as air blowing, defect detection, thickness detection, and material rejection, ensuring the yield of subsequent wafer insertion. Furthermore, the segmented conveyor design allows for flexible control of the conveying speed, ensuring process cycle time, improving work efficiency, and facilitating its widespread application in silicon wafer inspection and manufacturing.

Description

Technical Field

[0001] This utility model belongs to the field of silicon wafer manufacturing, and specifically relates to a silicon wafer screening and conveying device. Background Technology

[0002] In the manufacturing process of photovoltaic silicon wafers, after wafer slicing, cleaning and wafer insertion are required. Before wafer insertion, wafers must be transported, a process that can result in uncontrollable fragmentation due to water droplets and transport collisions. Furthermore, current methods for wafer stacking inspection rely on optical inspection, which is ineffective and often leads to missed detections. Therefore, it is necessary to improve existing wafer transport methods to avoid problems such as multi-layer wafer stacking and water accumulation. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, this utility model provides a silicon wafer screening and conveying device, which can solve the above problems.

[0004] A silicon wafer screening and conveying device includes a fragment detection module, a thickness detection module, a foreign material rejection module, a receiving box, and an air blowing module arranged along a segmented transmission line; the fragment detection module and the thickness detection module are arranged upstream of the foreign material rejection module, and the receiving box is arranged downstream of the foreign material rejection module; the air blowing module is arranged upstream and / or downstream of the foreign material rejection module.

[0005] Furthermore, the transmission speeds of each segment of the segmented transmission line may be the same or different. When the transmission speeds are different, the transmission speed increases progressively from upstream to downstream.

[0006] Furthermore, the fragment detection module includes a camera frame, a camera mounting plate assembly, a camera, a light source mounting plate assembly, a detection light source, a light source adjustment assembly, a light source baffle assembly, a light source baffle adjustment assembly, and a reflector assembly. The camera is mounted on top of the camera frame via the camera mounting plate assembly. The detection light source is mounted below the camera via the light source mounting plate assembly. The light source adjustment assembly is located at the light source mounting plate assembly and the detection light source, and is used to adjust the height and projection angle of the detection light source. The light source baffle assembly is mounted below and outside the detection light source via the light source baffle adjustment assembly, and its front-to-back distance is adjustable under the adjustment of the light source baffle adjustment assembly. The reflector assembly is mounted below the light source baffle assembly, and a detection inlet is formed between the upper end face of the reflector assembly and the lower end face of the light source baffle assembly.

[0007] Furthermore, the thickness detection module is arranged along the segmented transmission line and is used to detect the thickness of the silicon wafer transported on the segmented transmission line.

[0008] Furthermore, the foreign material rejection module adopts a mechanical swing type or a top suction material selection type structure. When the mechanical swing type structure is adopted, the receiving box is arranged below the end of the swing rejection flow line to receive the material; when the top suction material selection type structure is adopted, a top suction flow line is set above the rejection station, and the receiving box is set below the end of the top suction flow line.

[0009] Furthermore, the air blowing module is laterally mounted across the segmented transmission line, including an air blowing adapter and a lateral air blowing assembly. The lateral air blowing assembly is installed to the top and / or bottom of the segmented transmission line via the air blowing adapter.

[0010] Furthermore, a slicing module is set at the upstream end of the segmented transmission line. The slicing module slices the debonded and cleaned silicon wafers from the silicon wafer basket and transmits them one by one to the segmented transmission line.

[0011] Furthermore, a water collection tank is set around the segmented transmission line to collect water droplets blown off the silicon wafer.

[0012] Furthermore, a wafer insertion module is provided at the downstream end of the segmented transmission line for inserting defect-free horizontally transmitted silicon wafers one by one into the silicon wafer basket.

[0013] Compared with the prior art, the beneficial effects of this utility model are as follows: The silicon wafer screening and conveying device of this application integrates functions such as air blowing, defect detection, thickness detection, and rejection screening, which ensures the yield of subsequent wafer insertion. Secondly, the transport flow design adopts a segmented design, which can flexibly control the conveying speed, ensure the process cycle, improve work efficiency, and facilitate its promotion and application in the fields of silicon wafer inspection and production processing. Attached Figure Description

[0014] Figure 1 and Figure 2 These are schematic diagrams of the silicon wafer screening and conveying device of this utility model from different perspectives;

[0015] Figure 3 This is a schematic diagram of the fragmentation detection module;

[0016] Figure 4 Schematic diagram of two horizontally arranged air blowing components;

[0017] Figure 5 A schematic diagram of a silicon wafer screening and conveying device that includes a slicing module;

[0018] Figure 6 This is a schematic diagram of a silicon wafer screening and conveying device that includes a water collection tank and a wafer insertion module.

[0019] In the picture,

[0020] 100. Segmented transmission line;

[0021] 200. Fragmentation detection module; 210. Camera stand; 220. Camera mounting plate assembly; 230. Camera; 240. Light source mounting plate assembly; 250. Detection light source; 260. Light source adjustment assembly; 261. Light source height adjustment slider unit; 262. Light source angle adjustment unit; 270. Light source baffle assembly; 280. Light source baffle adjustment assembly; 290. Reflector assembly;

[0022] 300. Thickness detection module;

[0023] 400. Foreign Material Removal Module;

[0024] 500. Receiving box;

[0025] 600. Air blowing module; 610. Air blowing adapter; 620. Horizontal air blowing assembly;

[0026] 700, Slicing Module;

[0027] 800. Water collection tank;

[0028] 900, Insert Module. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0030] A silicon wafer screening and conveying device, see Figures 1-6 It includes a fragment detection module 200, a thickness detection module 300, a foreign material rejection module 400, a receiving box 500, and an air blowing module 600 arranged along the segmented transmission line 100.

[0031] Arrangement: The fragment detection module 200 and the thickness detection module 300 are arranged upstream of the foreign material rejection module 400 to reject stacked wafers, fragments, and defective wafers; the receiving box 500 is arranged downstream of the foreign material rejection module 400 to receive foreign materials rejected by the foreign material rejection module 400; the air blowing module 600 is arranged upstream and / or downstream of the foreign material rejection module 400 to blow away water droplets on the surface of the silicon wafer.

[0032] The segmented transmission line 100 has segments with the same or different transmission speeds. When the transmission speeds are different, the transmission speed increases gradually from upstream to downstream.

[0033] The purpose of this design is to lengthen the spacing between subsequent silicon wafers, ensuring the effective intercalation of later wafers and preventing collisions and breakage between silicon wafers due to insufficient processing time.

[0034] The fragment detection module 200 includes a camera frame 210, a camera mounting plate assembly 220, a camera 230, a light source mounting plate assembly 240, a detection light source 250, a light source adjustment assembly 260, a light source baffle assembly 270, a light source baffle adjustment assembly 280, and a reflector assembly 290.

[0035] Specifically, camera 230 is mounted on top of camera bracket 210 via camera mounting plate assembly 220; detection light source 250 is mounted below camera 230 via light source mounting plate assembly 240; the light source adjustment assembly 260 is located at the light source mounting plate assembly 240 and detection light source 250, and is used to adjust the height and projection angle of detection light source 250; the light source baffle assembly 270 is mounted below and outside of detection light source 250 via light source baffle adjustment assembly 280, and its front-to-back distance is adjustable under the adjustment of light source baffle adjustment assembly 280; the reflector assembly 290 is mounted below the light source baffle assembly 270, and a detection feed port is formed between the upper end face of reflector assembly 290 and the lower end face of light source baffle assembly 270.

[0036] The light source adjustment assembly 260 includes a light source height adjustment slider unit 261 and a light source angle adjustment unit 262. The light source baffle adjustment assembly 280 uses a front and rear adjustment slider unit.

[0037] The thickness detection module 300 is set along the segmented transmission line 100 to detect the thickness of the silicon wafers transported on the segmented transmission line 100, thereby determining whether there is a stacking situation.

[0038] It is preferably located at the longitudinal centerline of the transmission line downstream of the fragment detection module 200. Alternatively, it can be located upstream of the fragment detection module 200.

[0039] The thickness gauge of the thickness detection module 300 can be a conventional one in the field. The detected thickness data is compared with the standard thickness stored in the controller to determine whether there are multiple stacked pieces, such as two or three pieces. If stacking is detected, the foreign material rejection module 400 will reject the material. If stacking occurs continuously, the machine will be stopped for maintenance.

[0040] The foreign material rejection module 400 adopts either a mechanical swing-type or a top-suction material selection type structure. When a mechanical swing-type structure is adopted, the receiving box 500 is arranged below the end of the swing rejection flow line to receive the material. When a top-suction material selection type structure is adopted, a top-suction flow line is set above the rejection station, and the receiving box 500 is set below the end of the top-suction flow line. The mechanical swing-type structure is as disclosed in our company's patent CN213558494U, while the top-suction material selection type structure is as disclosed in our company's patent CN114733795A.

[0041] The air blowing module 600 is laterally mounted across the segmented transmission line 100, and includes an air blowing adapter 610 and a lateral air blowing assembly 620. The lateral air blowing assembly 620 is installed to the top and / or bottom of the segmented transmission line 100 via the air blowing adapter 610. See also Figure 4 This is an example of two horizontal air blowing components 620 arranged symmetrically, one above the other.

[0042] In a specific example, an air blowing module 600 is provided in the thickness detection module 300 and the foreign material rejection module 400, and another air blowing module 600 is also provided downstream of the foreign material rejection module 400 near the discharge flow line. The air blowing modules 600 are arranged along the conveying flow line, blowing vertically or obliquely onto the silicon wafer surface. Horizontal air blowing assemblies 620, preferably air knife structures, are symmetrically arranged above and below the silicon wafer conveying flow line.

[0043] Further, see Figure 5 A slicing module 700 is provided at the upstream end of the segmented transmission line 100. The slicing module 700 slices the debonded and cleaned silicon wafers from the silicon wafer basket and transmits them one by one to the segmented transmission line 100.

[0044] Further, see Figure 6 A water collection tank 800 is provided around the outer periphery of the segmented transmission line 100 to collect water droplets blown off the silicon wafer. Furthermore, a wafer insertion module 900 is provided at the downstream end of the segmented transmission line 100 to insert defect-free, horizontally transported silicon wafers one by one into the wafer basket.

[0045] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and not to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A silicon wafer screening and conveying device, characterized in that: It includes a fragment detection module (200), a thickness detection module (300), a foreign material rejection module (400), a receiving box (500), and an air blowing module (600) arranged along the segmented transmission line (100). The fragment detection module (200) and the thickness detection module (300) are arranged upstream of the foreign material rejection module (400), and the receiving box (500) is arranged downstream of the foreign material rejection module (400); The air blowing module (600) is located upstream and / or downstream of the foreign material rejection module (400).

2. The silicon wafer screening and conveying device according to claim 1, characterized in that: The transmission speeds of each segment of the segmented transmission line (100) may be the same or different. When the transmission speeds are different, the transmission speed increases gradually from upstream to downstream.

3. The silicon wafer screening and conveying device according to claim 1, characterized in that: The fragment detection module (200) includes a camera mount (210), a camera (230), and a detection light source (250); the camera (230) is mounted on top of the camera mount (210) via a camera mounting plate assembly (220); the detection light source (250) is mounted below the camera (230) via a light source mounting plate assembly (240), and the height and projection angle of the detection light source (250) are adjustable; a light source baffle assembly (270) is installed on the outer side below the detection light source (250), and a reflector assembly (290) is installed below the light source baffle assembly (270), and a detection feed port is formed between the upper end face of the reflector assembly (290) and the lower end face of the light source baffle assembly (270).

4. The silicon wafer screening and conveying device according to claim 1, characterized in that: The thickness detection module (300) is arranged along the segmented transmission line (100) and is used to detect the thickness of the silicon wafer transported on the segmented transmission line (100).

5. The silicon wafer screening and conveying device according to claim 1, characterized in that: The foreign material rejection module (400) adopts a mechanical swing type or a top suction material selection type structure. When the mechanical swing type structure is adopted, the receiving box (500) is arranged below the end of the swing rejection flow line to receive the material. When the top suction material selection type structure is adopted, a top suction flow line is set above the rejection station, and the receiving box (500) is set below the end of the top suction flow line.

6. The silicon wafer screening and conveying device according to claim 1, characterized in that: The air blowing module (600) is horizontally mounted across the segmented transmission line (100) and includes an air blowing adapter (610) and a horizontal air blowing assembly (620). The horizontal air blowing assembly (620) is installed to the top and / or bottom of the segmented transmission line (100) via the air blowing adapter (610).

7. The silicon wafer screening and conveying device according to claim 1, characterized in that: A slicing module (700) is set at the upstream end of the segmented transmission line (100). The slicing module (700) slices the debonded and cleaned silicon wafers from the silicon wafer basket and transmits them one by one to the segmented transmission line (100).

8. The silicon wafer screening and conveying device according to claim 1, characterized in that: A water collection tank (800) is provided on the outer periphery of the segmented transmission line (100) to receive water droplets blown off the silicon wafer.

9. The silicon wafer screening and conveying device according to claim 1, characterized in that: A wafer insertion module (900) is provided at the downstream end of the segmented transmission line (100) for inserting defect-free horizontally transmitted silicon wafers one by one into the silicon wafer basket.

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