Heating type press die structure

Abstract

The utility model discloses a kind of heating type stamping die structures, including upper die holder and lower die holder, upper die holder is equipped with stamping module on, stamping module includes male die fixed plate, stamping male die, convex hull male die, stripper plate;Lower die holder is equipped with stacking module on, stacking module includes female die fixed plate, lower backing plate group, upper locking block, first elastic structure, heating coil, first cooling pipeline, lower locking block, second elastic structure and second cooling pipeline.The utility model adopts in-die stacking, heating and shaping, production efficiency and precision are very high.

Description

Technical Field

[0001] This utility model relates to the field of mold equipment technology, and in particular to a heated stamping die structure. Background Technology

[0002] Currently available self-adhesive chip molds require significant manpower and resources to re-clamp the chips after punching them out, followed by heating in a furnace to melt the adhesive layer and bond them together. This method not only results in high production costs but also poor product precision and consistency. For small chips, marking points need to be designed to distinguish the stacked chips. Furthermore, some chips require greater height, making it difficult to guarantee perpendicularity, parallelism, and other dimensional tolerances using marking points, especially for T-shaped chips exceeding 60mm in height. Therefore, a mold system for in-mold heating and curing of self-adhesive materials to simultaneously bond chips together during continuous stamping is urgently needed to form the finished chip. Utility Model Content

[0003] The purpose of this utility model is to design a heated stamping die structure to overcome the shortcomings of the above-mentioned technologies.

[0004] This utility model designs a heated stamping die structure, including an upper die base and a lower die base.

[0005] The upper die holder is provided with a stamping module, the stamping module comprising:

[0006] punch fixing plate;

[0007] A stamping punch, located on the punch fixing plate and used to stamp the strip to form iron chips;

[0008] A punch with a convex bulge is located on the punch fixing plate and has a convex bulge at its end. The convex bulge punches the iron chip to form bumps on the surface of the iron chip.

[0009] The stripper plate is located below the stamping punch and the punch with a convex shape.

[0010] The lower mold base is provided with a stacking module, the stacking module comprising:

[0011] Die fixing plate;

[0012] The lower pad assembly is located at the top of the lower mold base and between the lower mold base and the die fixing plate;

[0013] An upper locking block is installed inside the lower pad assembly and positions the iron chip.

[0014] The first elastic structure is provided in the lower pad assembly to provide elastic pressing on the upper locking block so that the upper locking block is tightly pressed against the peripheral wall of the iron chip;

[0015] The heating coil is disposed within the lower pad assembly and located around the upper locking block;

[0016] The first cooling pipe is installed inside the lower pad assembly;

[0017] The lower locking block is set inside the lower mold base via a locking seat and positions the iron chip.

[0018] The second elastic structure is disposed on the locking seat and forms an elastic pressing on the lower locking block;

[0019] The second cooling pipe is located inside the lower mold base.

[0020] Preferably, the upper die base is provided with at least two stamping modules, which are distributed at intervals along the material conveying direction, and the stacking modules on the lower die base are arranged in a one-to-one correspondence with the stamping modules.

[0021] Further optimization is achieved by including pad 1, pad 2, pad 3, pad 4 and pad 5 distributed from top to bottom. The upper locking block passes through pad 2, pad 3 and pad 4. Pad 1 and pad 5 are located at the upper and lower ends of the upper locking block, respectively. The heating coil is installed on pad 3. A first cooling pipe is provided inside pad 2, pad 3 and pad 4.

[0022] Further optimization involves providing a first elastic structure on both pad two and pad four.

[0023] In a further optimization, the first elastic structure includes a first radial through hole opened on pad two and pad four, a first base located in the first radial through hole, and a first spring located in the first radial through hole and abutting between the first base and the upper locking block.

[0024] Preferably, the second elastic structure includes a second radial through hole opened on the locking seat, a second base located in the second radial through hole, and a second spring located in the second radial through hole and abutting between the second base and the lower locking block.

[0025] Further optimization involves having multiple second elastic structures, which are evenly distributed along the height direction of the locking seat.

[0026] Preferably, the second cooling pipe passes through the lower mold base, the locking seat, and the lower locking block.

[0027] Further optimization involves the upper and lower locking blocks each comprising three locking blocks, which are located in three directions around the iron chip and abut against the outer peripheral wall of the iron chip to position the stacked iron chips.

[0028] Further optimization involves using ceramic material for both the upper and lower locking blocks.

[0029] The technical advantages of this invention are as follows: The upper die base is equipped with a stamping punch and a convex punch. The stamping punch presses the strip into iron chips, and the convex punch presses protrusions onto the iron chips. Several iron chips with protrusions are spaced apart. When the iron chips are sequentially dropped into the upper locking block in the lower die base, they form a stack. The protruding iron chips act as separators, ensuring that each stack has a protruding iron chip at the bottom, thus creating a gap between adjacent stacks and preventing them from completely adhering. This prevents the adjacent stacks from sticking together after the adhesive melts, facilitating separation. A heating coil is located around the upper locking block to heat the iron chips stacked within it. The adhesive on the iron chips melts upon heating, causing the stacks to separate. The iron chips are bonded together, and then the bonded iron chips fall into the lower locking block. The lower locking block is equipped with cooling pipes to cool the iron chips, thereby cooling and shaping them. That is, the strip is directly heated and bonded inside the mold after punching, which ensures high precision and consistency of bonding. Unlike external mold heating process, the efficiency of internal mold heating depends entirely on the stamping speed of the stamping die. The mold integrating heating and cooling replaces the original clamping station, heating station, cooling station and other investments, reducing equipment purchase costs, space and labor costs. Using internal mold heating can eliminate the use of hydraulic cylinder head, further saving costs. Iron chips using internal mold heating do not need to be designed with snap points, and it is more convenient to adjust the perpendicularity, parallelism and other dimensional tolerances of the iron chips. Attached Figure Description

[0030] Figure 1 This is an overall structural diagram of the present invention;

[0031] Figure 2 This is a cross-sectional view of the lower pad assembly in this utility model;

[0032] Figure 3 This is a cross-sectional view of the lower mold base in this utility model;

[0033] Figure 4 This is a structural diagram of the iron chip and the stacked iron chips in this utility model;

[0034] Figure 5 This is a schematic diagram of the overall structure of multiple modules in this utility model.

[0035] In the diagram: 1. Upper die holder; 11. Stamping module; 111. Punch fixing plate; 112. Stamping punch; 113. Strip material; 114. Iron chip; 115. Thrust punch; 116. Thrust; 117. Thrust point; 118. Stripper plate; 119. First cooling pipe; 1110. First radial through hole; 1111. First base; 1112. First spring; 1113. Upper pad; 2. Lower die holder 21. Stacking module; 211. Die fixing plate; 212. Pad plate one; 213. Pad plate two; 214. Pad plate three; 215. Pad plate four; 216. Pad plate five; 217. Locking seat; 218. Upper locking block; 219. Heating coil; 2110. Lower locking block; 2111. Second cooling pipe; 2112. Second radial through hole; 2113. Second base; 2114. Second spring. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model are within the protection scope of the present utility model.

[0037] This utility model includes an upper die base 1 and a lower die base 2. The upper die base 1 is provided with a stamping module 11. The stamping module 11 includes a punch fixing plate 111 for fixing the punch. An upper pad 1113 is provided between the upper die base 1 and the punch fixing plate 111. In this embodiment, the punch includes a stamping punch 112 and a convex punch 115. The stamping punch 112 and the convex punch 115 are spaced apart along the conveying direction of the strip 113. The strip 113 is located below the punch and is conveyed in one direction. The strip 113 is a self-adhesive material, that is, the surface of the strip 113 has a layer of glue, which will melt after heating to form an adhesive surface. The stamping punch 112 is used to stamp the strip 113 to form an iron chip 114.

[0038] One end of the punch 115 is connected to the punch fixing plate 111 and the upper backing plate 1113. The other end face of the punch 115 is provided with a punch 116. The punch 116 punches the iron chip 114 to form bumps 117 on the surface of the iron chip 114. There are multiple punches 116, so that multiple bumps 117 are formed on the surface of the iron chip 114. The bumps 117 protrude downwards and are circular bumps with a height of about 0.1 mm and a diameter of 0.8 mm. The lower part of the punching punch 112 and the punch 115 is provided with a stripper plate 118 for unloading the iron chip 114 after punching the punch 116.

[0039] The lower mold base 2 is provided with a stacking module 21, which includes a die fixing plate 211. A lower pad assembly is provided between the lower mold base 2 and the die fixing plate 211. In this embodiment, the lower pad assembly includes pad one 212, pad two 213, pad three 214, pad four 215, and pad five 216. Pad one 212, pad two 213, pad three 214, pad four 215, and pad five 216 are stacked sequentially from top to bottom. The die fixing plate 211 is located on top of pad one 212, and pad five 216 is located on top of the lower mold base 2. The five pads, namely pad 212, pad 213, pad 214, pad 215 and pad 216, have mounting holes in the middle. The mounting holes penetrate the five pads. An upper locking block 218 is installed in the mounting holes. In this embodiment, the upper locking block 218 is located in the mounting holes of pad 213, pad 324 and pad 425. Pad 212 and pad 216 are located at the upper and lower ends of the upper locking block 218, respectively. The iron chip 114 is dropped into the mounting hole of pad 212 and then falls into the upper locking block 218.

[0040] The upper locking block 218 consists of at least three locking blocks, forming a channel for stacking iron chips 114. After being unloaded, the iron chips 114 fall into the channel in sequence. The three locking blocks are located in three directions of the iron chips 114 and abut against the peripheral wall of the iron chips 114, so that the iron chips 114 can be stacked in sequence along the height direction.

[0041] A heating coil 219 is provided around the upper locking block 218. The heating coil 219 is installed inside the pad 214 and is arranged around the upper locking block 218. The heating coil 219 is electrically controlled to engage the upper locking block 218. The upper locking block 218 abuts against the iron chip 114. Through solid heat conduction and air heat conduction, the iron chip 114 is heated, causing the adhesive on the surface of the iron chip 114 to melt, thereby forming an adhesive between adjacent iron chips 114. A thermometer is provided on the heating coil 219 to monitor the heating temperature of the heating coil 219.

[0042] Furthermore, since the upper locking block 218 has a certain height, the heating coil 219 is evenly arranged along the height direction of the upper locking block 218, so that the upper locking block 218 can be heated evenly, thereby making the iron chip 114 inside the upper locking block 218 heat evenly; the lower pad assembly is equipped with a temperature sensor to sense the temperature of the iron chip 114, and the constant temperature effect of the heating area is achieved by adjusting the current of the heating coil 219.

[0043] The lower pad assembly is provided with a first elastic structure, which includes a first radial through hole 1110 opened on the second pad 213 and the fourth pad 215. The first radial through hole 1110 communicates with the mounting hole. The first radial through hole 1110 is provided with a first base 1111 and a first spring 1112. One end of the first spring 1112 abuts against the first base 1111, and the other end extends into the mounting hole and abuts against the peripheral wall of the upper locking block 218. The first spring 1112 elastically presses the upper locking block 218, thereby locking the upper locking block 218. This elastic locking is adjustable, so the upper locking block 218 can be used for iron chip 114 of different sizes, and the elastic buffer can avoid damage to the surface of the iron chip 114. Pad 213 and Pad 4 are located at the top and bottom of the upper locking block 218, respectively. Therefore, the corresponding first elastic structures press against the top and bottom of the upper locking block 218, making the locking force of the upper locking block 218 more uniform and stable.

[0044] The lower pad assembly is equipped with a first cooling pipe 119. In this embodiment, the second pad 213, the third pad 214, and the fourth pad 215 are all equipped with the first cooling pipe 119. The second pad 213, the third pad 214, and the fourth pad 215 are interconnected to form the first cooling pipe 119. The first cooling pipe 119 on each pad extends to the upper locking block 218, thereby adjusting the temperature of the upper locking block 218 to be too high or too low, so that the temperature of the upper locking block 218 can be quickly adjusted to the required temperature. Furthermore, the second pad 213 and the fourth pad 215 are located at both ends of the upper locking block 218, thus allowing the entire assembly to be cooled. The heating area of ​​the upper locking block 218 is insulated from both the top and bottom to prevent the pads 1 212, 213, 4 215 or 5 216 from overheating. This would cause the iron chip 114 that has not yet entered the upper locking block 218 to be preheated, affecting the temperature of the iron chip 114 entering the upper locking block 218. Also, after being heated and stacked and shaped by the upper locking block 218, when the iron chip 114 comes out of the upper locking block 218 and passes through the pad 5 216, the pad 5 216, which is too hot, will reheat the iron chip 114, causing the glue on the iron chip 114 to melt again after shaping. At the same time, it can quickly cool down the mold and prevent the mold from deforming due to heat.

[0045] The lower mold base 2 is provided with a lower locking block 2110. The lower mold base 2 is provided with an installation groove. The installation groove is provided with a lower locking seat 217. The lower locking seat 217 is provided with a lower locking block 2110. The structure and working principle of the lower locking block 2110 are the same as those of the upper locking block 218. The locking seat 217 is provided with a second elastic structure that elastically locks the lower locking block 2110. The structure and working principle of the second elastic structure are basically the same as those of the first elastic structure. In this embodiment, the second elastic structure includes a second radial through hole 2112 opened on the locking seat 217, a second base 2113 located in the second radial through hole 2112, and a second spring 2114 located in the second radial through hole 2112 and abutting between the second base 2113 and the lower locking block 2110. There are multiple second elastic structures, which are evenly distributed along the height direction of the locking seat 217, so that the lower locking block 2110 is subjected to uniform and stable force.

[0046] The lower mold base 2 is provided with a second cooling pipe 2111. The second cooling pipe 2111 forms a circulation after passing through the lower mold base 2, the locking seat 217 and the lower locking block 2110. Of course, the second cooling pipe 2111 in the lower mold base 2, the locking seat 217 and the lower locking block 2110 can form a circulation route independently, so that each part is cooled down individually, thereby accelerating the cooling or achieving local cooling.

[0047] Furthermore, both the upper locking block 218 and the lower locking block 2110 include three locking blocks. The three locking blocks are located in three directions around the iron chip 114 and abut against the outer peripheral wall of the iron chip 114. The opposing surfaces of the three locking blocks form a channel in the height direction. After the iron chip 114 enters the channel, it forms a stack, thereby achieving positioning of the stacked iron chips 114.

[0048] Furthermore, both the upper locking block 218 and the lower locking block 2110 are made of ceramic material, generally ceramic with a certain degree of elasticity, because the heating coil 219 generates a magnetic field when heated, and ceramic has good magnetic insulation properties, a high coefficient of thermal expansion, and high wear resistance.

[0049] It should be noted that the heating coil 219 is externally connected to a control cabinet, which has the following functions: 1. When the punch officially starts stamping, the control cabinet controls the heating coil 219 to heat up and preheat the upper locking block 218 to reach the required temperature. The control cabinet simultaneously displays the corresponding current, voltage, and power for real-time monitoring; 2. The heating coil 219 is linked to the stamping equipment of the corresponding iron chip 114 through the control cabinet, and has two operating modes: manual control and automatic control; 3. Temperature and flow rate display of the coolant in the first cooling pipe 119; 4. Temperature and flow rate display of the coolant in the second cooling pipe 2111; 5. Automatic protection function: heating automatically stops when the temperature exceeds a fixed threshold or after stamping stops.

[0050] The entire workflow is as follows: the strip 113 is conveyed forward, the stamping punch 112 stamps the strip 113 to form iron chips 114, and the embossing punch 115 stamps and packages the iron chips 114, forming protrusions 117 on the lower surface of the iron chips 114. This stamping and packaging step can be determined according to the number of stacked iron chips 114. For example, if the preset number of stacked iron chips 114 is N, then every N-1 iron chips 114, the Nth iron chip 114 is packaged, with the packaged iron chip 114 as the boundary. Then, the iron chips 114 fall into the lower pad of the lower die base 2, that is, into the upper locking block 218. The upper locking block 218 is preheated before this. The iron chips 114 are stacked sequentially in the upper locking block 218, and the heating coil 219 of the upper locking block 218 continues to heat, causing the glue on the surface of the iron chips 114 to melt. The adhesive is melted, which causes the stacked iron chips 114 to bond together. It should be noted that each stack has the packaged iron chip 114 as the bottom, so that the adjacent stacks are separated by a certain gap through the protrusions 117, so that the iron chips 114 between the adjacent stacks will not be completely attached. In this way, after the adhesive melts, the adjacent stacks will not stick together, making it easy to separate. The bonded stacked iron chips 114 are dropped into the lower locking block 2110 of the lower mold base 2. The lower mold base 2, the locking seat 217 and the lower locking block 2110 are all equipped with a second cooling pipe 2111 to quickly cool the lower mold base 2, the locking seat 217 and the lower locking block 2110, thereby quickly cooling the iron chips 114 in the lower locking block 2110, so that the adhesive between the iron chips 114 solidifies quickly, thus forming a multi-layer iron chip 114 finished product.

[0051] It should be noted that most commercially available in-mold heating molds suffer from inadequate cooling measures, leading to a rapid temperature increase after a period of operation. This heat is then conducted to the corresponding mold, making production difficult to continue. Alternatively, the iron chip 114 may emerge from the mold at a persistently high temperature, hindering subsequent processes and resulting in low production efficiency. In contrast, this invention adds a second cooling pipe 2111 to the lower mold base 2, locking seat 217, and lower locking block 2110 after heating. If only a cooling pipe is provided on the lower mold base 2 to cool the iron chip 114... While the temperature is high, the cooling effect is not ideal. If the heated iron chips 114 are not cooled in time, the following problems will occur: 1. Uncooled iron chips 114 lose the locking effect of the upper locking block 218, and the adhesive layer between the iron chips 114 may separate due to insufficient cooling and curing, resulting in scrap; 2. Uncooled iron chips 114, without the support of the upper locking block 218, may cause dimensional defects due to thermal expansion and contraction; 3. Overheated iron chips 114 may cause harm to subsequent testing equipment or personnel. Therefore, a second cooling pipe 2111 is designed to achieve rapid cooling of the iron chips 114, improving production speed and accuracy.

[0052] In addition, the lower locking block 2110 is made of elastic ceramic. It is fixed within the locking seat 217 and is movable. The front side of the lower locking block 2110 abuts against the iron chip 114, while the rear side has a second elastic structure, allowing for flexible adjustment of the locking tightness according to the thermal expansion and contraction of the iron chip 114. A second cooling pipe 2111 is designed on the lower locking block 2110. After heating, the iron chip 114 passes through the cooling structure, and a large amount of heat is conducted to the lower locking block 2110 upon contact with it. At this time, the coolant controlled by an external water chiller quickly removes the heat through the second cooling pipe 2111, achieving rapid cooling of the iron chip 114. Simultaneously, a second cooling pipe 2111 is also provided on the locking seat 217 to further enhance the cooling effect on the iron chip 114. A temperature sensor is installed near the second cooling pipe 2111 to monitor temperature changes in real time.

[0053] It should be noted that the entire surface of the self-adhesive material strip 113 is covered with adhesive, and the strength of the iron chip 114 can be guaranteed when the adhesive has cured to more than 50%.

[0054] Based on the characteristics of self-adhesive materials, the surface adhesive layer needs to be less than 2 micrometers. If the adhesive layer is too thick, it will cause adhesive overflow. The heating temperature needs to reach 180-300℃ for the adhesive layer on the material surface to melt and bond together. It takes 1 minute for the reaction to take place. When the self-adhesive material melts and reacts, a pressure of 1 to 3 MPa needs to be applied to it. According to calculations, this is converted into the back pressure of the locking block on the side of the iron chip 114, which can replace the pneumatic cylinder or hydraulic cylinder at the bottom of the mold.

[0055] In another embodiment, the upper die holder 1 is provided with at least two stamping modules 11, which are spaced apart along the conveying direction of the strip 113. The stacking modules 21 on the lower die holder 2 are arranged in a one-to-one correspondence with the stamping modules 11, such as... Figure 5 The diagram shows four stamping modules 11. Correspondingly, there are also four stacking modules 21 and four stamping modules 11 on the lower die base 2. That is, four independent sub-dies are formed on the upper die base 1 and the lower die base 2 respectively. Each sub-die on the upper die base 1 has a stamping punch 112 and a convex punch 115. Each sub-die on the lower die base 2 has a lower pad assembly and upper and lower locking blocks 2110, so that the corresponding upper and lower sub-dies can be stamped and stacked for heating independently. A certain distance is formed between the sub-dies in the same die base, so that when multiple sub-dies work at the same time, the magnetic field generated by electromagnetic heating is avoided, which would cause mutual interference and reduce the production accuracy of the iron chip 114.

[0056] This utility model is not limited to the above-described preferred embodiments. Anyone can derive other forms of products under the guidance of this utility model. However, regardless of any changes made in their shape or structure, any technical solution that is the same as or similar to this application falls within the protection scope of this utility model.

Claims

1. A heated stamping die structure, characterized in that, Includes an upper mold base (1) and a lower mold base (2), The upper die holder (1) is provided with a stamping module (11), the stamping module (11) comprising: Punch fixing plate (111); A stamping punch (112) is located on the punch fixing plate (111) and is used to stamp the strip (113) to form an iron chip (114); A punch (115) is located on the punch fixing plate (111) and has a punch (116) at its end. The punch (116) punches the iron chip (114) to form bumps (117) on the surface of the iron chip (114). The stripper plate (118) is located below the stamping punch (112) and the convex punch (115); The lower mold base (2) is provided with a stacking module (21), the stacking module (21) comprising: Die fixing plate (211); The lower pad assembly is located at the top of the lower mold base (2) and between the lower mold base (2) and the die fixing plate (211); The upper locking block (218) is disposed in the lower pad assembly and positions the iron chip (114); The first elastic structure is provided in the lower pad assembly to provide elastic pressing on the upper locking block (218) so that the upper locking block (218) presses tightly against the peripheral wall of the iron chip (114); Heating coil (219) is disposed in the lower pad assembly and located around the upper locking block (218); The first cooling pipe (119) is installed in the lower pad assembly; The lower locking block (2110) is set in the lower mold base (2) through the locking seat (217) and positions the iron chip (114); The second elastic structure is disposed on the locking seat (217) and forms an elastic pressing on the lower locking block (2110); The second cooling pipe (2111) is located inside the lower mold base (2).

2. The heated stamping die structure according to claim 1, characterized in that, The upper die base (1) is provided with at least two stamping modules (11), and the at least two stamping modules (11) are distributed at intervals along the conveying direction of the strip (113). The stacking modules (21) on the lower die base (2) are arranged in a one-to-one correspondence with the stamping modules (11).

3. The heated stamping die structure according to claim 2, characterized in that, The lower pad assembly includes pad 1 (212), pad 2 (213), pad 3 (214), pad 4 (215) and pad 5 (216) distributed from top to bottom. The upper locking block (218) passes through pad 2 (213), pad 3 (214) and pad 4 (215). Pad 1 (212) and pad 5 (216) are located at the upper and lower ends of the upper locking block (218) respectively. The heating coil (219) is installed on pad 3 (214). A first cooling pipe (119) is provided in pad 2 (213), pad 3 (214) and pad 4 (215).

4. The heated stamping die structure according to claim 3, characterized in that, Both pad two (213) and pad four (215) are provided with a first elastic structure.

5. The heated stamping die structure according to claim 4, characterized in that, The first elastic structure includes a first radial through hole (1110) opened on the second pad (213) and the fourth pad (215), a first base (1111) located in the first radial through hole (1110), and a first spring (1112) located in the first radial through hole (1110) and abutting between the first base (1111) and the upper locking block (218).

6. The heated stamping die structure according to claim 1, characterized in that, The second elastic structure includes a second radial through hole (2112) opened on the locking seat (217), a second base (2113) located in the second radial through hole (2112), and a second spring (2114) located in the second radial through hole (2112) and abutting between the second base (2113) and the lower locking block (2110).

7. The heated stamping die structure according to claim 6, characterized in that, The second elastic structure is multiple and is evenly distributed along the height direction of the locking seat (217).

8. The heated stamping die structure according to claim 1, characterized in that, The second cooling pipe (2111) passes through the lower mold base (2), the locking seat (217) and the lower locking block (2110).

9. The heated stamping die structure according to claim 2, characterized in that, Both the upper locking block (218) and the lower locking block (2110) include three locking blocks, which are located in three directions around the iron chip (114) and abut against the outer peripheral wall of the iron chip (114) to position the stacked iron chips (114).

10. The heated stamping die structure according to claim 9, characterized in that, Both the upper locking block (218) and the lower locking block (2110) are made of ceramic material.

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