A PCB heating head based on using highly automatic temperature regulation
The PCB heating head with automatic temperature adjustment uses a stepper motor and limit sensor to achieve automatic control of temperature and pressure, which solves the problems of cumbersome operation and unstable pressure in the existing technology, and improves heating efficiency and pressure stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SUZHOU OKK ELECTRONICS CO LTD
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-19
AI Technical Summary
Existing PCB board heating devices require manual or simple mechanical adjustments to the heating power to control the temperature, which is cumbersome and results in unstable pressure.
The PCB heating head with automatic temperature adjustment uses a stepper motor to drive the lead screw and limit sensor in conjunction with the heating tube and fan to achieve automatic temperature and pressure control. The automatic adjustment of temperature and pressure is achieved by the sliding of the lifting plate and the sliding frame.
It simplifies the operation process, improves heating efficiency, maintains pressure stability, and prevents PCB board damage due to uneven temperature.
Smart Images

Figure CN224385790U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of PCB board processing technology, and in particular to a PCB board heating head that automatically adjusts temperature based on usage height. Background Technology
[0002] In the PCB manufacturing process, uniform and appropriate heating of the PCB board is crucial, as it directly affects the quality and performance of the PCB board. In practical applications, PCB board heating devices with pressure regulation functions typically require the following technologies:
[0003] 1. Heating mechanism: Heating elements such as ceramic heating elements and infrared heating tubes are commonly used to enable the PCB board to quickly reach the required heating temperature;
[0004] 2. Pressure application mechanism: For example, using cylinders, electric actuators, etc. Cylinders can provide stable pressure through compressed air, while electric actuators can achieve precise pressure control by motor drive, applying appropriate pressure to the PCB board placed in the heating area;
[0005] 3. Temperature control mechanism: Equipped with a high-precision temperature sensor and intelligent temperature controller. The temperature sensor monitors the temperature of the PCB board or heating area in real time and feeds back the temperature data to the intelligent temperature controller.
[0006] Existing PCB heating devices typically heat the PCB first, and then apply fixed pressure to the PCB manually or through simple mechanical structures. During the heating process, if the temperature is found to be unsatisfactory, the heating power needs to be manually adjusted, which is quite cumbersome. Utility Model Content
[0007] To address the shortcomings of existing technologies, this utility model provides a PCB board heating head based on automatic temperature adjustment, which solves the technical problem that existing PCB board heating devices generally heat the PCB board first, and then apply fixed pressure to the PCB board manually or through a simple mechanical structure. During the heating process, if the temperature is found to be unsatisfactory, the heating power needs to be manually adjusted, which is a relatively cumbersome operation.
[0008] To achieve the above objectives, this utility model provides the following technical solution:
[0009] A PCB board heating head based on height-based automatic temperature adjustment includes a base, an X-axis assembly mounted on the base, a Y-axis assembly mounted on the X-axis assembly, a support plate mounted on the Y-axis assembly, a sliding frame slidably mounted on the support plate, a heating tube assembly for heating fixedly mounted on the sliding frame, a fan for cooling fixedly mounted on the sliding frame, a first stepper motor fixedly mounted on the sliding frame, a first lead screw fixedly mounted on the output shaft of the first stepper motor, a lifting plate threaded onto the first lead screw, an air guide pipe fixedly mounted on the lifting plate, an upper limit sensor for limiting the rising height fixedly mounted on the sliding frame, a lower limit sensor for limiting the falling height fixedly mounted on the sliding frame, and the air guide pipe slidably connected to the sliding frame, the air guide pipe passing through the middle of the heating tube assembly.
[0010] Preferably, a connecting pipe is fixedly installed on the air duct.
[0011] Preferably, a second stepper motor is fixedly installed on the support plate.
[0012] Preferably, a coupling is fixedly installed on the output shaft of the second stepper motor.
[0013] Preferably, a second lead screw is fixedly installed on the coupling.
[0014] Preferably, the second lead screw is threadedly connected to the sliding frame.
[0015] Compared with the prior art, the present invention has the following beneficial effects:
[0016] 1. In this process, the control system drives the first stepper motor. When the first stepper motor starts, it will drive the first lead screw to rotate. Since the first lead screw is threadedly connected to the lifting plate, it will drive the lifting plate to slide up and down. When the lifting plate drives the air duct downward, it will trigger the lower limit sensor. After the lower limit sensor is triggered, the control system will start the heating tube assembly. The heating tube assembly will heat the air passing through the air duct, so that the air duct sprays out high-temperature air to heat the PCB board. When the lifting plate drives the air duct upward, it will trigger the upper limit sensor. After the upper limit sensor is triggered, the control system will start the fan. The fan will dissipate heat from the heating tube assembly, so that the temperature of the air sprayed out of the air duct decreases, thereby reducing the temperature of the PCB board. The automatic temperature control is achieved by the up and down sliding of the lifting plate, which simplifies the operation process and improves the heating effect.
[0017] Second, after the second stepper motor starts, it can drive the second lead screw to rotate through the coupling. Since the second lead screw is threadedly connected to the sliding frame, it will cause the sliding frame to slide up and down. Under the control of the control system, when the lifting plate slides down, the sliding frame will rise to the same height, and when the lifting plate rises, the sliding frame will fall to the same height to compensate for the sliding distance, so that the height of the air guide pipe relative to the PCB board is always consistent. This avoids the air guide pipe from crushing the PCB board or causing insufficient pressure due to sliding up and down, thus achieving the effect of maintaining pressure stability. Attached Figure Description
[0018] The above description is only an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, the preferred embodiments of this utility model are described in detail below with reference to the accompanying drawings.
[0019] Figure 1 This is a structural diagram of the base of this utility model;
[0020] Figure 2 This is a structural diagram of the support plate of this utility model;
[0021] Figure 3 This is a structural diagram of the sliding frame of this utility model;
[0022] Figure 4 This is a structural diagram of the heating tube assembly of this utility model;
[0023] Figure 5 This utility model Figure 3 Enlarged structural diagram at point A.
[0024] Legend: 1. Base; 2. X-axis assembly; 3. Y-axis assembly; 4. Support plate; 5. Sliding frame; 6. Heating tube assembly; 7. Fan; 8. Lifting plate; 9. Air guide pipe; 11. First stepper motor; 12. First lead screw; 13. Upper limit sensor; 14. Lower limit sensor; 15. Connecting pipe; 16. Second stepper motor; 17. Second lead screw; 18. Coupling. Detailed Implementation
[0025] This application provides a PCB board heating head with automatically adjustable temperature based on height, effectively solving the technical problem of existing PCB board heating devices. These devices typically heat the PCB board first, then apply fixed pressure manually or through simple mechanical structures. During heating, if the temperature is found to be unsatisfactory, manual adjustment of the heating power is required, making the operation cumbersome. In this process, the control system drives the first stepper motor. When the first stepper motor starts, it rotates the first lead screw. Since the first lead screw is threadedly connected to the lifting plate, it causes the lifting plate to slide up and down. When the lifting plate slides the air duct downwards, it triggers the lower limit sensor. After the lower limit sensor is triggered, the control system activates the heating tube assembly. The heating tube assembly heats the air passing through the air duct, causing the air duct to spray high-temperature air to heat the PCB board. When the lifting plate... When the air duct slides upward, it triggers the upper limit sensor. Once triggered, the control system starts the fan, which dissipates heat from the heating element assembly, lowering the temperature of the air ejected from the air duct and consequently reducing the temperature of the PCB board. Automatic temperature control is achieved through the up-and-down sliding of the lifting plate, simplifying the operation and improving heating efficiency. After the second stepper motor starts, it drives the second lead screw to rotate via a coupling. Since the second lead screw is threadedly connected to the sliding frame, it causes the sliding frame to slide up and down. Under the control of the system, when the lifting plate slides down, the sliding frame rises to the same height; when the lifting plate rises, the sliding frame falls to the same height, compensating for the sliding distance and ensuring that the height of the air duct relative to the PCB board remains consistent. This prevents the air duct from crushing the PCB board or causing insufficient pressure due to the up-and-down sliding, thus maintaining pressure stability.
[0026] Example
[0027] like Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, the technical solution in this application embodiment effectively solves the problem of existing PCB board heating devices, which generally involve first heating the PCB board and then applying fixed pressure to the PCB board manually or through a simple mechanical structure. During the heating process, if the temperature is found to be unsatisfactory, the heating power needs to be manually adjusted, which is a rather cumbersome technical problem. The overall approach is as follows:
[0028] To address the problems existing in the prior art, this utility model provides a PCB board heating head based on height-automatic temperature adjustment, including a base 1, an X-axis assembly 2 mounted on the base 1, a Y-axis assembly 3 mounted on the X-axis assembly 2, a support plate 4 mounted on the Y-axis assembly 3, a sliding frame 5 slidably mounted on the support plate 4, and a heating tube assembly 6 for heating fixedly mounted on the sliding frame 5.
[0029] A fan 7 for heat dissipation is fixedly installed on the sliding frame 5. A first stepper motor 11 is fixedly installed on the sliding frame 5. A first lead screw 12 is fixedly installed on the output shaft of the first stepper motor 11. A lifting plate 8 is threaded onto the first lead screw 12. An air guide pipe 9 is fixedly installed on the lifting plate 8. An upper limit sensor 13 for limiting the upward height is fixedly installed on the sliding frame 5. A lower limit sensor 14 for limiting the downward height is fixedly installed on the sliding frame 5.
[0030] The air guide pipe 9 and the sliding frame 5 are slidably connected. The air guide pipe 9 passes through the middle of the heating tube group 6. A connecting pipe 15 is fixedly installed on the air guide pipe 9. A second stepper motor 16 is fixedly installed on the support plate 4. A coupling 18 is fixedly installed on the output shaft of the second stepper motor 16. A second lead screw 17 is fixedly installed on the coupling 18. The second lead screw 17 is threadedly connected to the sliding frame 5.
[0031] Base 1: As the foundational component of the entire PCB board heating head based on automatic temperature adjustment using height, it provides a mounting base for other components and supports the structure of the entire heating head;
[0032] X-axis assembly 2: Mounted on base 1, it serves to connect base 1 with other components and further supports and fixes the components subsequently installed on it;
[0033] Y-axis assembly 3: Installed on X-axis assembly 2, it is also a component connection and support structure, playing a connecting role in the entire heating head architecture, making all components form an organic whole;
[0034] Support plate 4: Installed on the Y-axis assembly 3, it provides a sliding track for the sliding frame 5, allowing the sliding frame 5 to slide up and down on it, so as to adjust the position of the heating head in different working states;
[0035] Sliding frame 5: Slidingly mounted on support plate 4, it is the mounting carrier for multiple key components. It is fixedly mounted with heating tube assembly 6, cooling fan 7, upper limit sensor 13 to limit the rising height, lower limit sensor 14 to limit the falling height, and first step motor 11 related to height adjustment, etc. At the same time, it plays an important role in pressure stability adjustment through threaded connection with second lead screw 17.
[0036] Heating tube assembly 6: Fixedly installed on the sliding frame 5, used to heat the air passing through the air guide tube 9, so that the air guide tube 9 can spray high-temperature air to heat the PCB board, and is the core component to realize the PCB board heating function.
[0037] Fan 7: Fixedly installed on sliding frame 5, it is started when the heating tube group 6 needs to be cooled down, to dissipate heat from the heating tube group 6, thereby reducing the temperature of the air ejected from the air guide pipe 9 and realizing the control of PCB board temperature.
[0038] Lifting plate 8: It is threaded onto the first lead screw 12 and slides up and down under the drive of the first lead screw 12, thereby driving the air guide pipe 9 to move up and down. By triggering the upper limit sensor 13 and the lower limit sensor 14, the heating tube group 6 is heated and the fan 7 is cooled, respectively, so as to realize the automatic control of the heating temperature of the PCB board.
[0039] Air duct 9: It is fixedly installed on the lifting plate 8, slidably connected to the sliding frame 5 and passes through the middle of the heating tube group 6. On the one hand, it serves as an air channel, allowing the air injected by the air supply mechanism through the connecting pipe 15 to be sprayed onto the PCB board.
[0040] The first stepper motor 11 is fixedly installed on the sliding frame 5. Its output shaft is connected to the first lead screw 12. Under the drive of the control system, the first lead screw 12 is rotated, thereby realizing the up and down sliding of the lifting plate 8, thereby controlling the position of the air guide pipe 9 and achieving the purpose of automatic temperature adjustment.
[0041] First lead screw 12: It is fixedly installed on the output shaft of the first stepper motor 11 and threadedly connected to the lifting plate 8. When the first stepper motor 11 drives it to rotate, the lifting plate 8 can slide up and down due to the thread transmission principle. It is a transmission component in the process of realizing automatic temperature regulation.
[0042] Upper limit sensor 13: Fixedly installed on the sliding bracket 5, used to limit the upward sliding height of the air guide pipe 9. When the air guide pipe 9 slides upward and triggers the upper limit sensor 13, the control system starts the fan 7 to dissipate heat from the heating tube group 6 and reduce the heating temperature of the PCB board.
[0043] Lower limit sensor 14: Fixedly installed on the sliding frame 5, used to limit the downward sliding height of the air guide tube 9. When the air guide tube 9 slides downward and triggers the lower limit sensor 14, the control system starts the heating tube group 6 to heat the air passing through the air guide tube 9 and heat up the PCB board.
[0044] Connecting pipe 15: Fixedly installed on the air guide pipe 9, used to connect air supply mechanisms such as air pumps, so that the air supply mechanisms can inject air into the air guide pipe 9 to provide an air source for heating the PCB board;
[0045] The second stepper motor 16 is fixedly mounted on the support plate 4. After starting, it drives the second lead screw 17 to rotate through the coupling 18, playing a driving role in maintaining pressure stability.
[0046] The second lead screw 17 is fixedly installed on the coupling 18 and threadedly connected to the sliding frame 5. When the second stepper motor 16 drives it to rotate through the coupling 18, it causes the sliding frame 5 to slide up and down, compensating for the position change of the air guide pipe 9 caused by the sliding of the lifting plate 8, maintaining the air guide pipe 9 at the same height relative to the PCB board, and ensuring pressure stability.
[0047] Coupling 18: Fixedly installed on the output shaft of the second stepper motor 16, it transmits the power of the second stepper motor 16 to the second lead screw 17, causing the second lead screw 17 to rotate. It is a power transmission component in the process of realizing pressure stability adjustment.
[0048] Working principle:
[0049] The first step involves connecting the connecting pipe 15 to the power supply mechanism, such as the air pump. During operation, the air supply mechanism injects air into the air guide tube 9 through the connecting pipe 15, and then sprays it onto the PCB board through the air guide tube 9. During this process, the control system drives the first stepper motor 11. When the first stepper motor 11 starts, it drives the first lead screw 12 to rotate. Since the first lead screw 12 is threadedly connected to the lifting plate 8, it will cause the lifting plate 8 to slide up and down. When the lifting plate 8 drives the air guide tube 9 to slide downwards, it will trigger the lower limit sensor 14. After the lower limit sensor 14 is triggered... The control system will activate the heating tube assembly 6, which will heat the air passing through the air duct 9, causing the air duct 9 to spray high-temperature air to heat the PCB board. When the lifting plate 8 moves the air duct 9 upward, it will trigger the upper limit sensor 13. After the upper limit sensor 13 is triggered, the control system will activate the fan 7, which will dissipate heat from the heating tube assembly 6, lowering the temperature of the air sprayed from the air duct 9, thereby reducing the temperature of the PCB board. The automatic temperature control is achieved by the up-and-down movement of the lifting plate 8, which simplifies the operation process and improves the heating effect.
[0050] In the second step, after the second stepper motor 16 starts, it can drive the second lead screw 17 to rotate through the coupling 18. Since the second lead screw 17 is threadedly connected to the sliding frame 5, it will cause the sliding frame 5 to slide up and down. Under the control of the control system, when the lifting plate 8 slides down, the sliding frame 5 will rise to the same height, and when the lifting plate 8 rises, the sliding frame 5 will fall to the same height to compensate for the sliding distance, so that the height of the air guide pipe 9 relative to the PCB board is always consistent, avoiding the air guide pipe 9 from crushing the PCB board or causing insufficient pressure due to sliding up and down, thus achieving the effect of maintaining pressure stability.
[0051] Finally, it should be noted that the above embodiments are merely examples for clearly illustrating the present invention and are not intended to limit the implementation. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively list all possible implementations here. However, obvious variations or modifications derived therefrom are still within the protection scope of this invention.
Claims
1. A PCB heating head based on using highly automatic temperature adjustment, comprising a base (1), an X-axis assembly (2) is installed on the base (1), a Y-axis assembly (3) is installed on the X-axis assembly (2), and a support plate (4) is installed on the Y-axis assembly (3), characterized in that, A sliding frame (5) is slidably mounted on the support plate (4). A heating tube assembly (6) for heating is fixedly mounted on the sliding frame (5). A fan (7) for heat dissipation is fixedly mounted on the sliding frame (5). A first stepper motor (11) is fixedly mounted on the sliding frame (5). A first lead screw (12) is fixedly mounted on the output shaft of the first stepper motor (11). A lifting plate (8) is threaded onto the first lead screw (12). An air guide pipe (9) is fixedly mounted on the lifting plate (8). An upper limit sensor (13) for limiting the upward height is fixedly mounted on the sliding frame (5). A lower limit sensor (14) for limiting the downward height is fixedly mounted on the sliding frame (5).
2. The PCB board heating head based on height-automatic temperature adjustment as described in claim 1, characterized in that, The air guide tube (9) and the sliding frame (5) are slidably connected.
3. A PCB board heating head based on height-automatic temperature adjustment as described in claim 1, characterized in that, The air duct (9) passes through the middle of the heating tube assembly (6).
4. A PCB board heating head based on height-automatic temperature adjustment as described in claim 1, characterized in that, A connecting pipe (15) is fixedly installed on the air duct (9).
5. A PCB board heating head based on height-automatic temperature adjustment as described in claim 1, characterized in that, A second stepper motor (16) is fixedly installed on the support plate (4).
6. A PCB board heating head based on height-automatic temperature adjustment as described in claim 5, characterized in that, A coupling (18) is fixedly installed on the output shaft of the second stepper motor (16).
7. A PCB board heating head based on height-automatic temperature adjustment as described in claim 6, characterized in that, A second lead screw (17) is fixedly installed on the coupling (18).
8. A PCB board heating head based on height-automatic temperature adjustment as described in claim 7, characterized in that, The second lead screw (17) is threadedly connected to the sliding frame (5).