Thermally conductive heat sink

Abstract

This utility model relates to the field of radiator technology, and more particularly to a heat dissipation device with graded heat conduction. The heat dissipation device includes a primary heat conduction component, multiple sets of secondary heat conduction components, multiple sets of tertiary heat conduction components, and multiple sets of heat dissipation components. The secondary heat conduction components abut against the primary heat conduction components, and the tertiary heat conduction components are arranged one-to-one with the secondary heat conduction components. The corresponding tertiary heat conduction components and secondary heat conduction components abut against each other on opposite sides along a first direction. The tertiary heat conduction components and secondary heat conduction components are arranged sequentially along a second direction. Each heat dissipation component has a first receiving groove arranged along the second direction, in which the secondary and tertiary heat conduction components are located. Each set of secondary heat conduction components contacts two adjacent sets of heat dissipation components on two sides along the first direction, and each set of tertiary heat conduction components contacts two adjacent sets of heat dissipation components on two sides along the first direction. This heat dissipation device improves heat dissipation power and expands its application range.

Description

Technical Field

[0001] This utility model relates to the field of radiator technology, and in particular to a heat dissipation device with graded heat conduction. Background Technology

[0002] Currently, due to the limitations of heat pipe manufacturing processes, the heat conduction effect of heat pipes decreases over long distances. This restricts commonly used heat dissipation devices to heat-conducting distances, making them suitable only for heat-generating components with lower power outputs and unable to meet the heat dissipation needs of heat-generating components with higher power outputs.

[0003] To solve the above problems, there is an urgent need to provide a heat dissipation device with graded heat conduction to address the issue of low heat dissipation power. Utility Model Content

[0004] The purpose of this invention is to propose a graded heat dissipation device to improve heat dissipation power, making it suitable for high-power heat dissipation conditions and expanding the applicability of the heat dissipation device.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] A heat dissipation device with graded heat conduction, comprising:

[0007] The primary heat-conducting component is constructed as a fixed heat-generating element;

[0008] Multiple sets of secondary heat-conducting components are arranged in parallel along a first direction, and the secondary heat-conducting components abut against the primary heat-conducting components.

[0009] Multiple sets of tertiary heat-conducting components are arranged parallel to each other along the first direction. Each tertiary heat-conducting component corresponds one-to-one with a secondary heat-conducting component, and the corresponding tertiary and secondary heat-conducting components abut against each other along opposite sides of the first direction. Furthermore, the tertiary and secondary heat-conducting components are arranged sequentially along a second direction.

[0010] Multiple sets of heat dissipation components are arranged in parallel along the first direction. Each heat dissipation component has a first receiving groove arranged along the second direction. The secondary heat conduction component and the tertiary heat conduction component are located in the first receiving groove. Each set of secondary heat conduction components contacts the heat dissipation components of the two adjacent sets on two sides along the first direction. Each set of tertiary heat conduction components contacts the heat dissipation components of the two adjacent sets on two sides along the first direction.

[0011] As an optional solution, the primary heat-conducting component includes:

[0012] The mounting plate is a heat spreader, and the heating element is mounted on the mounting plate.

[0013] As an optional embodiment, the mounting plate has a second receiving groove, and the primary heat-conducting assembly further includes:

[0014] Multiple primary heat-conducting components are arranged in parallel in the second receiving groove, with adjacent primary heat-conducting components in contact with each other, and the cross-sectional shape of each primary heat-conducting component is square.

[0015] As an optional embodiment, the secondary heat-conducting assembly includes multiple secondary heat-conducting elements, wherein the secondary heat-conducting elements include:

[0016] A secondary heat absorption section is provided, wherein the secondary heat absorption section is arranged along a third direction, and a plurality of the secondary heat absorption sections are arranged in parallel along a first direction, and the surfaces of two adjacent secondary heat absorption sections abut against each other;

[0017] Two secondary heat-conducting parts are connected to the two ends of the secondary heat-absorbing part, respectively. The secondary heat-conducting parts have a U-shaped structure, with the opening of the U-shaped secondary heat-conducting parts facing the secondary heat-absorbing part, and the secondary heat-conducting parts of multiple secondary heat-conducting components are arranged on the same plane.

[0018] As an optional embodiment, the secondary heat-conducting component includes:

[0019] A first extension tube, one end of which is connected to the secondary heat absorption section;

[0020] A bent tube, one end of which is connected to the other end of the first extension tube; and

[0021] The second extension tube is connected to the other end of the bent tube, and the first extension tube, the bent tube, and the second extension tube are connected in a U-shape.

[0022] As an optional solution, the cross-sectional shape of the secondary heat absorption section is square;

[0023] And / or, the cross-sectional shape of the first extension tube is square;

[0024] And / or, the cross-sectional shape of the bent tube is a flattened oval;

[0025] And / or, the cross-sectional shape of the second extension tube is a flattened oval.

[0026] As an optional solution, the three-stage heat conduction assembly includes multiple three-stage heat conduction elements, which are arranged coplanarly.

[0027] The three-stage heat-conducting component includes:

[0028] Two tertiary heat absorption sections are arranged collinearly along a third direction and spaced apart, and the two tertiary heat absorption sections are in surface-to-surface contact with the secondary heat conduction component;

[0029] The three-stage heat-conducting part has two ends connected to the ends of the two three-stage heat-absorbing parts that are close to each other. The three-stage heat-conducting part and the two three-stage heat-absorbing parts are connected in a U-shape and / or a square shape.

[0030] As an optional solution, the cross-sectional shape of the three-stage heat absorption section is square;

[0031] And / or, the cross-sectional shape of the three-stage heat-conducting part is a flattened circle.

[0032] As an optional solution, the heat dissipation component includes:

[0033] Multiple heat sinks are formed by stamping and riveting along the second direction.

[0034] As an alternative, it also includes:

[0035] A fixing plate is connected to the end face of the third-level heat-conducting component that is opposite to the first-level heat-conducting component.

[0036] The beneficial effects of this utility model are as follows:

[0037] This utility model provides a heat dissipation device with graded heat conduction. The heat dissipation device includes a primary heat conduction component, multiple sets of secondary heat conduction components, multiple sets of tertiary heat conduction components, and multiple sets of heat dissipation components. The primary heat conduction component is configured as a fixed heat-generating element. The multiple sets of secondary heat conduction components are arranged parallel to each other along a first direction and abut against the primary heat conduction component. The multiple sets of tertiary heat conduction components are arranged parallel to each other along the first direction and are arranged in a one-to-one correspondence with the secondary heat conduction components. The corresponding tertiary heat conduction components and secondary heat conduction components abut against each other along opposite sides along the first direction. The tertiary heat conduction components and secondary heat conduction components are arranged sequentially along a second direction. The multiple sets of heat dissipation components are arranged parallel to each other along the first direction. Each heat dissipation component has a first receiving groove arranged along the second direction. The secondary heat conduction components and tertiary heat conduction components are located in the first receiving groove. The two sides of each secondary heat conduction component along the first direction are in contact with the two adjacent sets of heat dissipation components, and the two sides of each tertiary heat conduction component along the first direction are in contact with the two adjacent sets of heat dissipation components. The heat dissipation device uses a two-stage and a three-stage heat conduction component arranged sequentially in the second direction. This increases the heat conduction distance along the second direction, thereby improving the heat dissipation power and making it suitable for high-power heat dissipation requirements, thus expanding the applicability of the heat dissipation device. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of this utility model, the drawings used in the description of the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the content of the embodiments of this utility model and these drawings without creative effort.

[0039] Figure 1 This is a schematic diagram of the heat dissipation device provided in an embodiment of the present invention;

[0040] Figure 2 This is a partial structural schematic diagram of the heat dissipation device provided in an embodiment of the present utility model;

[0041] Figure 3 This is a schematic diagram of the heat dissipation component provided in an embodiment of the present invention.

[0042] The markings in the image are as follows:

[0043] 100 - Primary thermal conductive component; 110 - Mounting plate; 120 - Primary thermal conductive element;

[0044] 200 - Secondary heat-conducting component; 210 - Secondary heat-conducting element; 211 - Secondary heat-absorbing part; 212 - Secondary heat-conducting part; 2121 - First extension tube; 2122 - Bending tube; 2123 - Second extension tube;

[0045] 300 - Three-stage thermal conductive component; 310 - Three-stage thermal conductive element; 311 - Three-stage heat absorption section; 312 - Three-stage thermal conductive section;

[0046] 400 - Heat dissipation assembly; 410 - First receiving slot; 420 - Heat sink;

[0047] 500-Fixed plate. Detailed Implementation

[0048] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only partial structures relevant to the present invention, not the complete structure.

[0049] In the description of this utility model, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the connection of the internal structures of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0050] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0051] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are only used for distinction in description and have no special meaning.

[0052] like Figure 1 As shown, this embodiment provides a heat dissipation device with graded heat conduction. The heat dissipation device includes a primary heat conduction component 100, which is configured as a fixed heat-generating element. The heat-generating element can be a stage light, LED light, CPU, high-heat components, or other heat-generating structures.

[0053] As an optional option, please see Figure 1 and Figure 2 The primary heat-conducting component 100 includes a mounting plate 110, which is a heat spreader plate, and the heating element is mounted on the mounting plate 110. The heat spreader plate has high heat absorption and conduction performance, which is beneficial for rapid heat absorption and conduction from the heating element. At the same time, the heat spreader plate has a temperature uniformity effect. Even if different parts of the heating element generate different amounts of heat, the heat spreader plate can maintain a uniform temperature, preventing deformation of the heat spreader plate due to uneven heat distribution, which helps to improve the structural stability of the primary heat-conducting component 100.

[0054] The mounting plate 110 has a second receiving groove, and the primary heat conduction component 100 also includes a plurality of primary heat conduction elements 120. The plurality of primary heat conduction elements 120 are arranged in parallel in the second receiving groove, and two adjacent primary heat conduction elements 120 are in contact with each other. The primary heat conduction elements 120 are conducive to further improving the heat absorption and heat conduction efficiency of the primary heat conduction component 100.

[0055] Furthermore, the cross-sectional shape of the primary heat-conducting element 120 is square, thereby increasing the contact area between two adjacent primary heat-conducting elements 120, reducing thermal resistance, and improving the temperature uniformity of the primary heat-conducting assembly 100. Simultaneously, the surface of the primary heat-conducting element 120 with the heating element is planar, which further increases the contact area between the primary heat-conducting element 120 and the heating element, reduces thermal resistance, and results in higher thermal conductivity.

[0056] Optionally, the primary heat-conducting component 120 is a heat pipe. The heat pipe utilizes capillary action to conduct and dissipate heat. Moreover, the heat pipe's heat absorption, conduction, and dissipation technologies are mature, which helps to ensure the heat dissipation effect of the heat dissipation device, and the cost is relatively low.

[0057] Optionally, such as Figure 1 and Figure 2 As shown, the heat dissipation device also includes multiple sets of secondary heat conduction components 200, multiple sets of tertiary heat conduction components 300, and multiple sets of heat dissipation components 400. Multiple sets of secondary heat-conducting components 200 are arranged in parallel along the X direction (first direction), and the secondary heat-conducting components 200 abut against the primary heat-conducting components 100. Multiple sets of tertiary heat-conducting components 300 are arranged in parallel along the X direction, and the tertiary heat-conducting components 300 are arranged in a one-to-one correspondence with the secondary heat-conducting components 200. The corresponding tertiary heat-conducting components 300 and the secondary heat-conducting components 200 abut against each other on opposite sides along the X direction. The tertiary heat-conducting components 300 and the secondary heat-conducting components 200 are arranged sequentially along the Z direction (second direction). Multiple sets of heat dissipation components 400 are arranged in parallel along the X direction. The heat dissipation components 400 have a first receiving groove 410 arranged along the Z direction. The secondary heat-conducting components 200 and the tertiary heat-conducting components 300 are located in the first receiving groove 410. The two sides of each set of secondary heat-conducting components 200 along the X direction contact the two adjacent sets of heat dissipation components 400 respectively. The two sides of each set of tertiary heat-conducting components 300 along the X direction contact the two adjacent sets of heat dissipation components 400 respectively. The X and Z directions are set perpendicularly here.

[0058] The heat dissipation device is arranged in the Z direction with a secondary heat conduction component 200 and a tertiary heat conduction component 300, which helps to increase the heat conduction distance along the Z direction, thereby improving the heat dissipation power and making it suitable for high-power heat dissipation conditions, thus expanding the applicability of the heat dissipation device.

[0059] Please continue reading Figure 2The secondary heat-conducting component 200 includes multiple secondary heat-conducting elements 210, each comprising a secondary heat-absorbing portion 211 and two secondary heat-conducting portions 212. The secondary heat-absorbing portions 211 are arranged along the Y-direction (third direction), and the multiple secondary heat-absorbing portions 211 are arranged parallel to each other along the X-direction, with adjacent secondary heat-absorbing portions 211 abutting face-to-face. This facilitates increasing the heat absorption efficiency of the secondary heat-conducting component 200 from the primary heat-conducting component 100. The two secondary heat-conducting portions 212 are connected to both ends of the secondary heat-absorbing portions 211, and each secondary heat-conducting portion 212 has a U-shaped structure with its opening facing the secondary heat-absorbing portion 211. The secondary heat-conducting portions 212 of the multiple secondary heat-conducting elements 210 are arranged coplanarly. This secondary heat-conducting element 210 increases the contact length with the heat dissipation component 400, thereby increasing the contact area between the secondary heat-conducting element 210 and the heat dissipation component 400, and improving heat dissipation efficiency. In this embodiment, the X, Y, and Z directions are only used to describe the position of the structure in this embodiment and are not intended to limit this application.

[0060] The square-section primary heat-conducting element 120 can make surface-to-surface contact with the secondary heat-absorbing part 211, which is beneficial to improve the heat dissipation effect of the heat dissipation device by increasing the contact area between the primary heat-conducting element 120 and the secondary heat-absorbing part 211.

[0061] Optionally, the secondary heat-conducting component 210 is a heat pipe. The heat pipe utilizes capillary action to conduct and dissipate heat. Moreover, the heat pipe's heat absorption, conduction, and dissipation technologies are mature, which helps to ensure the heat dissipation effect of the heat dissipation device, and the cost is low.

[0062] For example, each group of secondary heat conduction components 200 may include two, three, four, five, or even more secondary heat conduction elements 210. In this embodiment, the secondary heat conduction component 200 includes four secondary heat conduction elements 210, and the four secondary heat absorption parts 211 of the four secondary heat conduction elements 210 abut against the mounting plate 110, so that as much area of ​​the mounting plate 110 as possible abuts against the secondary heat absorption parts 211, thereby improving the heat dissipation effect.

[0063] The secondary heat-conducting section 212 includes a first extension tube 2121, a bent tube 2122, and a second extension tube 2123. One end of the first extension tube 2121 is connected to the secondary heat-absorbing section 211, one end of the bent tube 2122 is connected to the other end of the first extension tube 2121, and the second extension tube 2123 is connected to the other end of the bent tube 2122. The first extension tube 2121, the bent tube 2122, and the second extension tube 2123 are connected in a U-shape, thereby increasing the heat conduction distance and heat conduction area of ​​the secondary heat-conducting section 212. When multiple secondary heat-conducting sections 212 of each group of secondary heat-conducting components 200 are arranged coplanarly, the multiple secondary heat-conducting sections 212 can be arranged in a wrap-around manner from large to small, so that more of the side surface of the heat dissipation component 400 contacts the secondary heat-conducting section 212, thereby improving the heat conduction efficiency.

[0064] Optionally, the cross-sectional shape of the secondary heat absorption part 211 is square, so that the secondary heat absorption part 211 and the primary heat conduction element 120 are in surface-to-surface contact, forming a heat-conducting whole between the secondary heat absorption part 211 and the primary heat conduction element 120, increasing the contact area between the two, improving the heat conduction effect, and thus improving the heat dissipation effect of the heat dissipation device.

[0065] Optionally, the cross-sectional shape of the first extension tube 2121 is square, which helps to increase the contact area between the first extension tube 2121 and the heat dissipation component 400, thereby improving the heat conduction efficiency.

[0066] Optionally, the cross-sectional shape of the bent tube 2122 is flattened oval. Since the secondary heat sink 420 is a heat pipe, the flattened oval cross-sectional shape of the bent tube 2122 can be achieved simply by a flattening process. This increases the contact area between the bent tube 2122 and the heat sink 400, improving the heat dissipation effect of the heat sink. It also reduces the processing steps and costs associated with making the bent tube 2122 square, thus improving production efficiency. Simultaneously, a portion of the tertiary heat-conducting component 300 can contact the side of the bent tube 2122. The flattened oval shape of the bent tube 2122 increases the contact area between the tertiary heat-conducting component 300 and the bent tube 2122, thereby improving the heat conduction effect.

[0067] Optionally, the cross-sectional shape of the second extension tube 2123 is flattened oval. Since the secondary heat sink 420 is a heat pipe, the flattened oval cross-sectional shape of the second extension tube 2123 can be achieved simply by a flattening process, which increases the contact area between the second extension tube 2123 and the heat sink 400, improves the heat dissipation effect of the heat sink, and also reduces the processing steps and processing costs of the second extension tube 2123, which is conducive to improving production efficiency.

[0068] In one embodiment, the three-stage heat conduction assembly 300 includes a plurality of three-stage heat conduction elements 310, which are arranged coplanarly. Each three-stage heat conduction element 310 includes a three-stage heat conduction section 312 and two three-stage heat absorption sections 311. The three-stage heat absorption sections 311 are collinear along the Y direction and spaced apart. The two three-stage heat absorption sections 311 are in surface-to-surface contact with the two-stage heat conduction assembly 200. The two ends of the three-stage heat conduction section 312 are respectively connected to the adjacent ends of the two three-stage heat absorption sections 311. The three-stage heat conduction section 312 and the two three-stage heat absorption sections 311 are arranged in a Z-shape.

[0069] In another embodiment, the tertiary heat-conducting part 312 and the two tertiary heat-absorbing parts 311 can also be connected in a U-shape. In another embodiment, both the Z-shaped and U-shaped tertiary heat-conducting elements 310 can coexist.

[0070] The three - stage heat conducting member 310 absorbs heat from the second - stage heat conducting part 212 through the three - stage heat absorbing part 311, and conducts heat by using the three - stage heat conducting part 312, achieving the effect of increasing the heat conduction distance. Exemplarily, in this embodiment, the three - stage heat conducting component 300 includes three three - stage heat conducting members 310. One of the three three - stage heat conducting members 310 is in a shape similar to a capital letter 'J', and the other two are in a shape similar to a square. The three - stage heat conducting member in the shape of a 'J' is located in the middle, and the two three - stage heat absorbing parts 311 of the two three - stage heat conducting members in the shape of a square are respectively located on both sides of the three - stage heat conducting member in the shape of a 'J'. This structure is beneficial to increasing the contact area between the three - stage heat conducting member 310 and the heat dissipation component 400.

[0071] Optionally, the three - stage heat conducting member 310 is a heat pipe. The heat pipe uses the capillary phenomenon to achieve heat conduction and heat dissipation, and the heat absorption, heat conduction, and heat dissipation technologies of the heat pipe are mature, which is beneficial to ensuring the heat dissipation effect of the heat dissipation device and has a relatively low cost.

[0072] Optionally, the cross - sectional shape of the three - stage heat absorbing part 311 is square. The three - stage heat absorbing part 311 is a splicing structure of the three - stage heat conducting component 300 and the second - stage heat conducting component 200. By designing the cross - sectional shape of the three - stage heat absorbing part 311 to be square, the contact area between the three - stage heat absorbing part 311 and the heat dissipation component 400 and the second - stage heat dissipation part 420 is increased, which is beneficial to improving the heat conduction effect.

[0073] Optionally, the cross - sectional shape of the three - stage heat conducting part 312 is oblate. Since the three - stage heat conducting member 310 is a heat pipe, the oblate cross - sectional shape of the three - stage heat conducting part 312 can be achieved only through a flattening process. That is, it increases the contact area between the three - stage heat conducting part 312 and the heat dissipation component 400, improves the heat dissipation effect of the heat dissipation device, and at the same time reduces the processing procedures and processing costs of bending the pipe 2122 into a square shape, which is beneficial to improving production efficiency.

[0074] As Figure 3 shown, the heat dissipation component 400 includes multiple heat dissipation parts 420. The multiple heat dissipation parts 420 are formed by stamping and riveting along the Z - direction, which is beneficial to improving production efficiency. Further, in order to automatically rivet the multiple heat dissipation parts 420 in a continuous stamping die, four rows of riveting points on the same plane and of the same thickness are added to the heat dissipation part 420.

[0075] Furthermore, there are two first receiving slots 410, located on opposite sides of the heat dissipation assembly 400 along the X direction. One first receiving slot 410 is used to house the secondary heat conduction component 200, and the other is used to house the tertiary heat conduction component 300. The two first receiving slots 410 create a stepped shape on both sides of the heat dissipation component 420, allowing the secondary heat conduction component 210 and the tertiary heat conduction component 310 to be located in the two first receiving slots 410 respectively. This also facilitates partial contact between adjacent heat conduction components, improving the mutual heat conduction effect between the heat dissipation components 420.

[0076] Further, please see Figure 1 The heat dissipation device also includes a fixing plate 500, which is connected to the end face of the tertiary heat-conducting component 300 away from the primary heat-conducting component 100, thereby improving the structural strength of the heat dissipation device. Specifically, the fixing plate 500 can be welded to the end face of the tertiary heat-conducting component 300 away from the primary heat-conducting component 100, and also welded to the end face of the heat sink 420 to increase the fixing strength.

[0077] Note that the above description illustrates and describes the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope. All such changes and modifications fall within the scope of the claimed utility model, which is defined by the appended claims and their equivalents.

Claims

1. A heat dissipating device having a graded thermal conductivity, characterized by, include: The primary heat-conducting component (100) is configured as a fixed heat-generating element; Multiple sets of secondary heat-conducting components (200) are arranged in parallel along a first direction, and the secondary heat-conducting components (200) abut against the primary heat-conducting component (100); Multiple sets of three-stage heat-conducting components (300) are arranged in parallel along the first direction. Each three-stage heat-conducting component (300) is arranged in a one-to-one correspondence with a two-stage heat-conducting component (200). The three-stage heat-conducting components (300) and the two-stage heat-conducting components (200) are arranged to abut against each other on opposite sides along the first direction. The three-stage heat-conducting components (300) and the two-stage heat-conducting components (200) are arranged sequentially along the second direction. as well as Multiple sets of heat dissipation components (400) are arranged in parallel along the first direction. Each heat dissipation component (400) has a first receiving groove (410) arranged along the second direction. The secondary heat conduction component (200) and the tertiary heat conduction component (300) are located in the first receiving groove (410). Each set of secondary heat conduction components (200) contacts two adjacent sets of heat dissipation components (400) on two sides along the first direction. Each set of tertiary heat conduction components (300) contacts two adjacent sets of heat dissipation components (400) on two sides along the first direction.

2. The hierarchically thermally conductive heat sink of claim 1, wherein, The primary heat-conducting component (100) includes: Mounting plate (110), the mounting plate (110) is a heat spreader, and the heating element is disposed on the mounting plate (110).

3. The heat dissipation device with graded heat conduction according to claim 2, characterized in that, The mounting plate (110) has a second receiving groove, and the primary heat-conducting assembly (100) further includes: Multiple primary heat-conducting components (120) are arranged in parallel in the second accommodating groove, with two adjacent primary heat-conducting components (120) in contact with each other, and the cross-sectional shape of the primary heat-conducting component (120) is square.

4. The heat dissipation device with graded heat conduction according to claim 1, characterized in that, The secondary heat-conducting assembly (200) includes multiple secondary heat-conducting elements (210), each of which includes: A secondary heat absorption section (211) is provided along a third direction, and a plurality of secondary heat absorption sections (211) are provided in parallel along a first direction, with the surfaces of two adjacent secondary heat absorption sections (211) abutting each other. Two secondary heat-conducting parts (212) are connected to both ends of the secondary heat-absorbing part (211) respectively. The secondary heat-conducting part (212) has a U-shaped structure. The opening of the U-shaped secondary heat-conducting part (212) faces the secondary heat-absorbing part (211), and the secondary heat-conducting parts (212) of the multiple secondary heat-conducting components (210) are arranged on the same plane.

5. The heat dissipation device with graded heat conduction according to claim 4, characterized in that, The secondary heat-conducting part (212) includes: A first extension tube (2121) is provided, one end of which is connected to the secondary heat absorption section (211). A bent tube (2122), one end of which is connected to the other end of the first extension tube (2121); and The second extension tube (2123) is connected to the other end of the bent tube (2122), and the first extension tube (2121), the bent tube (2122) and the second extension tube (2123) are connected in a U-shape.

6. The heat dissipation device with graded heat conduction according to claim 5, characterized in that, The cross-sectional shape of the secondary heat absorption section (211) is square; And / or, the cross-sectional shape of the first extension tube (2121) is square; And / or, the cross-sectional shape of the bent tube (2122) is flat and round; And / or, the cross-sectional shape of the second extension tube (2123) is flat and round.

7. The heat dissipation device with graded heat conduction according to claim 1, characterized in that, The three-stage heat conduction assembly (300) includes multiple three-stage heat conduction elements (310), and the multiple three-stage heat conduction elements (310) are arranged on the same plane; The three-stage heat-conducting component (310) includes: Two tertiary heat-absorbing parts (311) are arranged collinearly along a third direction and spaced apart, and the two tertiary heat-absorbing parts (311) are in surface-to-surface contact with the secondary heat-conducting component (200); The three-stage heat-conducting part (312) has two ends connected to the ends of the two three-stage heat-absorbing parts (311) that are close to each other. The three-stage heat-conducting part (312) and the two three-stage heat-absorbing parts (311) are connected in a U-shape and / or a square shape.

8. The heat dissipation device with graded heat conduction according to claim 7, characterized in that, The cross-sectional shape of the three-stage heat absorption section (311) is square; And / or, the cross-sectional shape of the three-stage heat-conducting part (312) is flat and round.

9. The heat dissipation device with graded heat conduction according to claim 1, characterized in that, The heat dissipation assembly (400) includes: Multiple heat sinks (420) are formed by stamping and riveting along the second direction.

10. The heat dissipation device with graded heat conduction according to claim 1, characterized in that, Also includes: The fixing plate (500) is connected to the end face of the third-stage heat-conducting component (300) opposite to the first-stage heat-conducting component (100).

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