A silicon wafer silicon carbide particle separation device
By designing a silicon carbide particle separation device for silicon wafers, the substandard particles were further crushed using a screen and auger lifting mechanism, solving the problem of incomplete separation after crushing and improving processing efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU DEBI MATERIAL TECH CO LTD
- Filing Date
- 2025-06-24
- Publication Date
- 2026-06-23
AI Technical Summary
The existing equipment cannot effectively separate substandard particles after silicon carbide particles are crushed, which affects subsequent processing and increases the complexity of screening steps.
A silicon carbide particle separation device for silicon wafers was designed, comprising a particle separator, a lifting mechanism and a screen, which further crushes substandard particles by screening and lifting them with an auger.
This technology enables efficient re-separation of pulverized silicon carbide particles, simplifies the screening process, and improves processing efficiency.
Smart Images

Figure CN224388957U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of silicon carbide particle separation technology, and specifically relates to a silicon carbide particle separation device for silicon wafers. Background Technology
[0002] Silicon carbide particles are third-generation semiconductor materials composed of carbon and silicon elements. They have high hardness, high thermal conductivity, wide bandgap, and excellent chemical stability. Before processing, silicon carbide particles need to be further crushed using a pulverizer to reduce the particle diameter.
[0003] The aforementioned device lacks a structure for separating and secondary crushing of silicon carbide particles after crushing. As a result, when silicon carbide particles are crushed using a pulverizer, some of the silicon carbide particles cannot reach the required diameter after crushing and are mixed with the qualified particles. This not only affects subsequent processing but also adds a cumbersome step of sieving the particles separately. Based on the shortcomings of the existing technology, this utility model designs a silicon carbide particle separation device for silicon wafers. Utility Model Content
[0004] To address the aforementioned problems in the existing technology, this utility model provides a coolant separation and collection device for silicon wafer cutting, which features secondary crushing and separation of silicon carbide particles after pulverization.
[0005] To achieve the above objectives, the present invention provides the following technical solution: a silicon carbide particle separation device for silicon wafers, comprising a particle separator, wherein a fixing strip is fixedly connected to one side of the particle separator, and a lifting mechanism is provided at the bottom of the particle separator;
[0006] The lifting mechanism includes a feeding cylinder, a screen, a connecting cylinder, a motor, and an auger. The feeding cylinder is located at the bottom of the particle separator. A screen is fixedly connected inside the feeding cylinder. A connecting cylinder is fixedly connected to one side of the feeding cylinder. The motor is located on one side of the particle separator. An auger is located at the bottom of the motor.
[0007] As a preferred technical solution of the silicon carbide particle separation device of this utility model, the bottom of the particle separator is fixedly connected with a support foot, and the top of the particle separator is fixedly connected with a feed hopper.
[0008] As a preferred technical solution of the silicon carbide particle separation device for silicon wafers of this utility model, a fixing tube is fixedly connected inside the fixing strip, an inlet pipe is fixedly connected to one side of the fixing tube, and an outlet pipe is fixedly connected to one side of the fixing strip.
[0009] As a preferred technical solution of the silicon wafer silicon carbide particle separation device of this utility model, the feeding cylinder is arranged on one side of the support foot, and the screen is arranged at the bottom of the particle separator.
[0010] As a preferred technical solution of the silicon wafer silicon carbide particle separation device of this utility model, the connecting cylinder is arranged on one side of the screen, and the motor is arranged on the top of the fixing bar.
[0011] As a preferred technical solution of the silicon wafer silicon carbide particle separation device of this utility model, the auger is arranged inside the fixed bar and the auger is arranged on one side of the feed pipe.
[0012] As a preferred technical solution of the silicon wafer silicon carbide particle separation device of this utility model, the fixed pipe is set on one side of the particle separator, and the feed pipe is fixedly connected to one side of the connecting cylinder.
[0013] As a preferred technical solution of the silicon wafer silicon carbide particle separation device of this utility model, the feed pipe is arranged on one side of the screen and the discharge pipe is arranged inside the feed hopper.
[0014] Compared with the prior art, the beneficial effects of this utility model are:
[0015] 1. In use, this utility model, by setting up a feeding cylinder, when it is necessary to further separate the crushed particles, the crushed particles first fall into the inside of the feeding cylinder inside the particle separator, and are screened by the screen inside the feeding cylinder. The screened particles fall directly from the feeding cylinder for collection, while the particles that do not meet the screening standards slide from the screen into the inside of the connecting cylinder and then into the inside of the feed pipe. At this time, the auger lifts the particles that do not meet the screening standards and makes them enter the inside of the feed hopper for further processing through the fixed pipe and the discharge pipe. This device facilitates the further separation of crushed particles. Attached Figure Description
[0016] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:
[0017] Figure 1 This is a schematic diagram of the particle separator of this utility model;
[0018] Figure 2 This is a schematic diagram of the support foot structure of this utility model;
[0019] Figure 3 This is a schematic diagram of the fixing strip structure of this utility model;
[0020] Figure 4 This is a schematic diagram of the screen structure of this utility model;
[0021] Figure 5 This is a schematic diagram of the lifting mechanism of this utility model.
[0022] In the diagram: 1. Particle separator; 101. Support leg; 102. Feed hopper; 2. Fixing bar; 201. Fixing pipe; 202. Feed pipe; 203. Discharge pipe; 3. Lifting mechanism; 301. Feeding cylinder; 302. Screen; 303. Connecting cylinder; 304. Motor; 305. Screwdriver. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] Example 1
[0025] Please see Figure 1-5 The present invention provides the following technical solution: a silicon carbide particle separation device for silicon wafers, including a particle separator 1, a fixing strip 2 fixedly connected to one side of the particle separator 1, and a lifting mechanism 3 provided at the bottom of the particle separator 1;
[0026] The bottom of the particle separator 1 is fixedly connected to a support foot 101, and the top of the particle separator 1 is fixedly connected to a feed hopper 102.
[0027] The fixing strip 2 is internally fixedly connected to a fixing pipe 201. A feed pipe 202 is fixedly connected to one side of the fixing pipe 201, and a discharge pipe 203 is fixedly connected to one side of the fixing strip 2.
[0028] The fixed pipe 201 is set on one side of the particle separator 1, and the feed pipe 202 is fixedly connected to one side of the connecting cylinder 303.
[0029] The feed pipe 202 is located on one side of the screen 302, and the discharge pipe 203 is located inside the feed hopper 102.
[0030] Further explanation is needed: silicon carbide particles for silicon wafers are fed into the particle separator 1 from the feed hopper 102. After being processed and crushed, they are screened by the lifting mechanism 3. The silicon carbide particles that do not meet the standards are lifted back into the feed hopper 102 for further crushing.
[0031] Example 2
[0032] Please see Figure 2-5 The present invention provides the following technical solution:
[0033] The lifting mechanism 3 includes a feeding cylinder 301, a screen 302, a connecting cylinder 303, a motor 304, and an auger 305. The feeding cylinder 301 is located at the bottom of the particle separator 1. The screen 302 is fixedly connected inside the feeding cylinder 301. The connecting cylinder 303 is fixedly connected to one side of the feeding cylinder 301. The motor 304 is located on one side of the particle separator 1. The auger 305 is located at the bottom of the motor 304.
[0034] The feed cylinder 301 is located on one side of the support foot 101, and the screen 302 is located at the bottom of the particle separator 1.
[0035] The connecting cylinder 303 is located on one side of the screen 302, and the motor 304 is located on the top of the fixing strip 2.
[0036] The auger 305 is located inside the fixed bar 2 and is located on one side of the feed pipe 202.
[0037] Further explanation is needed: After being crushed inside the particle separator 1, the particles fall into the feed cylinder 301 and are screened by the screen 302 inside the feed cylinder 301. The screened particles fall directly from the feed cylinder 301 for collection, while the particles that do not meet the screening standards slide from the screen 302 into the connecting cylinder 303 and then into the feed pipe 202. At this time, the screw conveyor 305 lifts the particles that do not meet the screening standards and makes them enter the feed hopper 102 for further processing through the fixed pipe 201 and the discharge pipe 203.
[0038] Working principle: When a silicon carbide particle separation device is used, the silicon carbide particles are first fed into the particle separator 1 from the feed hopper 102. After being processed and crushed, they are screened by the lifting mechanism 3. The silicon carbide particles that do not meet the standards are lifted back into the feed hopper 102 for further crushing.
[0039] When the crushed particles need to be separated again, the crushed particles first fall into the feed cylinder 301 inside the particle separator 1 and are screened by the screen 302 inside the feed cylinder 301. The screened particles fall directly from the feed cylinder 301 for collection, while the particles that do not meet the screening standards slide from the screen 302 into the connecting cylinder 303 and then into the feed pipe 202. At this time, the screw conveyor 305 lifts the particles that do not meet the screening standards and makes them enter the feed hopper 102 for further processing through the fixed pipe 201 and the discharge pipe 203. This device facilitates the further separation of crushed particles.
[0040] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A silicon carbide particle separation device for silicon wafers, comprising a particle separator (1), characterized in that: A fixing bar (2) is fixedly connected to one side of the particle separator (1), and a lifting mechanism (3) is provided at the bottom of the particle separator (1). The lifting mechanism (3) includes a feeding cylinder (301), a screen (302), a connecting cylinder (303), a motor (304), and an auger (305). The feeding cylinder (301) is located at the bottom of the particle separator (1). The screen (302) is fixedly connected inside the feeding cylinder (301). The connecting cylinder (303) is fixedly connected to one side of the feeding cylinder (301). The motor (304) is located on one side of the particle separator (1). The auger (305) is located at the bottom of the motor (304).
2. The silicon carbide particle separation device for silicon wafers according to claim 1, characterized in that: The bottom of the particle separator (1) is fixedly connected to a support foot (101), and the top of the particle separator (1) is fixedly connected to a feed hopper (102).
3. The silicon carbide particle separation device for silicon wafers according to claim 1, characterized in that: The fixing strip (2) is fixedly connected to a fixing tube (201), and a feed tube (202) is fixedly connected to one side of the fixing tube (201). A discharge tube (203) is fixedly connected to one side of the fixing strip (2).
4. The silicon carbide particle separation device for silicon wafers according to claim 1, characterized in that: The feed cylinder (301) is located on one side of the support foot (101), and the screen (302) is located at the bottom of the particle separator (1).
5. The silicon carbide particle separation device for silicon wafers according to claim 1, characterized in that: The connecting cylinder (303) is located on one side of the screen (302), and the motor (304) is located on the top of the fixing bar (2).
6. The silicon carbide particle separation device for silicon wafers according to claim 1, characterized in that: The auger (305) is located inside the fixing bar (2) and is located on one side of the feed pipe (202).
7. The silicon carbide particle separation device for silicon wafers according to claim 3, characterized in that: The fixed pipe (201) is located on one side of the particle separator (1), and the feed pipe (202) is fixedly connected to one side of the connecting cylinder (303).
8. The silicon carbide particle separation device for silicon wafers according to claim 3, characterized in that: The feed pipe (202) is located on one side of the screen (302), and the discharge pipe (203) is located inside the feed hopper (102).