Reflow soldering heating device

Abstract

The utility model discloses a kind of reflow soldering heating devices, including booster volute, motor, rectifier plate, rectifier box, air duct box, return air strip and return air board;First air outlet is penetrated in rectifier plate, rectifier plate covers the upper surface of rectifier box, rectifier box is located in air duct box, and air inlet channel is formed between rectifier box and air duct box, heating wire is equipped in air inlet channel, and the periphery of rectifier box is connected with the periphery of air duct box by return air board and return air strip;First air outlet is penetrated in rectifier box bottom, first air inlet is penetrated in air duct box bottom, booster volute is equipped with second air outlet and second air inlet, second air inlet is communicated with first air inlet, wind wheel is equipped in second air inlet, motor drives wind wheel rotation, and second air outlet extends to rectifier box after passing through air duct box. Its advantage is that air flow reciprocating circulation, improve equipment heat preservation effect, reduce reflow soldering furnace heat loss, reduce electric energy consumption, improve temperature uniformity.

Description

Technical Field

[0001] This utility model relates to the field of SMT reflow soldering technology, and in particular to a reflow soldering heating device. Background Technology

[0002] To improve production efficiency, most factories use dual-rail reflow ovens to weld products simultaneously. In the welding process, the hot reflow heating module has a large internal space and many structures that obstruct airflow. The airflow generated by the blower has a large difference in wind speed after passing through the rectifier plate. Therefore, the temperature difference between the two rails is relatively large, which makes the welding quality of products passing through different rails unstable and may even cause serious welding quality problems. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a reflow soldering heating device to address the shortcomings of the existing technology.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution.

[0005] A reflow soldering heating device includes a pressurized volute, a motor, a rectifier plate, a rectifier box, an air duct box, return air strips, and a return air plate. The rectifier plate has a first air outlet and covers the upper surface of the rectifier box. The rectifier box is located inside the air duct box, and an air inlet channel is formed between the bottom of the rectifier box and the bottom of the air duct box. A heating wire is installed in the air inlet channel. The left and right sides of the rectifier box are connected to the left and right sides of the air duct box respectively via the return air plate. The front and rear sides of the rectifier box are connected to the front and rear sides of the air duct box respectively via the return air strips. The return air strip has a first air inlet hole, and the return air plate has a second air inlet hole. The first and second air inlets are respectively connected to the air inlet channel. The bottom of the rectifier box has a first air outlet, and the bottom of the air duct box has a first fixing port and a first air inlet. The pressurizing vortex shell has a second air outlet and a second air inlet. The second air inlet is connected to the first air inlet. A fan wheel is provided in the second air inlet. The motor drives the fan wheel to rotate. The second air outlet passes through the first fixing port and the first air outlet in sequence and extends into the rectifier box.

[0006] A preferred embodiment is that a rectifier is provided at the top of the second air outlet. The rectifier includes a top plate, a bottom plate, and a support column. The bottom plate is fixedly sleeved outside the second air outlet. The bottom of the support column is connected to the bottom plate, and the top is connected to the top plate. The rectifier disperses the airflow from the second air outlet into the rectifier box.

[0007] A preferred embodiment is that the air inlet channel is equipped with a thermocouple for measuring the gas temperature.

[0008] A preferred embodiment is that the air duct box is equipped with thermal insulation cotton.

[0009] The reflow soldering heating device provided in this embodiment of the utility model has at least the following beneficial effects: After the motor is powered on, the motor drives the impeller to rotate, and the airflow is blown into the rectifier box through the second air outlet of the pressurized volute, and finally blown onto the circuit board on the upper surface of the rectifier plate. The airflow in the reflow oven furnace enters the air inlet channel through the first air inlet hole of the return air bar, and the airflow enters the air inlet channel through the second air inlet hole of the return air plate. After being heated by the heating wire, the airflow in the air inlet enters the second air inlet through the first air inlet. The airflow in the second air inlet passes through the pressurized volute, and is driven by the motor to rotate the impeller, flowing from the second air outlet into the rectifier box. The airflow circulates back and forth, completing the soldering and curing of the circuit board. The insulation cotton improves the heat preservation effect of the equipment, reduces heat loss in the reflow oven, reduces power consumption, improves temperature uniformity, and thus improves the stability of product soldering.

[0010] The above description is merely an overview of the technical solution of this utility model. In order to better understand the technical means of this utility model and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0011] Figure 1 This is an exploded view of this utility model;

[0012] Figure 2 This is a cross-sectional view of the present invention. Figure 1 ;

[0013] Figure 3 This is a cross-sectional view of the present invention. Figure 2 ;

[0014] Figure 4 This is a perspective view of the present invention installed inside the furnace chamber of a reflow oven. Detailed Implementation

[0015] To illustrate the ideas and objectives of this application, the following description will be provided in conjunction with the accompanying drawings and specific embodiments.

[0016] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," "left," "right," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0017] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0018] like Figures 1 to 4 As shown, a reflow soldering heating device includes a pressure booster volute 10, a motor 20, a rectifier plate 30, a rectifier box 40, an air duct box 50, a return air strip 60, and a return air plate 70. The rectifier plate 30 has a first air outlet 31 extending through it. The rectifier plate 30 covers the upper surface of the rectifier box 40, which is located inside the air duct box 50. An air inlet channel 41 is formed between the bottom of the rectifier box 40 and the bottom of the air duct box 50. A heating wire is installed inside the air inlet channel 41. The left and right sides of the rectifier box 40 are connected to the left and right sides of the air duct box 50 respectively via the return air plate 70. The front and rear sides of the rectifier box 40 are connected to the front and rear sides of the air duct box 50 respectively via the return air strip 60. The return air strip 60 has a first air inlet 61 through it, and the return air plate 70 has a second air inlet 71 through it. The first air inlet 61 and the second air inlet 71 are respectively connected to the air inlet channel 41. The bottom of the rectifier box 40 has a first air outlet 41 through it, and the bottom of the air duct box 50 has a first fixing port 51 and a first air inlet 52 through it. The pressurizing vortex shell 10 is provided with a second air outlet 11 and a second air inlet 12. The second air inlet 12 is connected to the first air inlet 52. A fan wheel 21 is provided in the second air inlet 12. The motor 20 drives the fan wheel 21 to rotate. The second air outlet 11 passes through the first fixing port 51 and the first air outlet 41 in sequence and extends into the rectifier box 40.

[0019] like Figures 1 to 4 As shown, this utility model is installed inside the furnace chamber of a reflow oven 90. A fixing frame is riveted inside the air duct box 50 to fix the heating wire. The second air inlet 12 of the pressure booster volute 10 is connected to the first air inlet 52 at the bottom of the air duct box 50. Return air plates 70 are fixed on the left and right sides of the rectifier box 40, one return air plate 70 is connected to the left side of the air duct box 50, and the other return air plate 70 is connected to the right side of the air duct box 50. The front and rear sides of the rectifier box 40 are respectively connected by return air strips 60, one return air strip 60 is connected to the front side of the air duct box 50, and the other return air strip 60 is connected to the rear side of the air duct box 50. The rectifier box 40 is located inside the air duct box 50, and an air inlet channel 41 is formed between the bottom of the rectifier box 40 and the bottom of the air duct box 50. The second air outlet 11 passes through the first fixing port 51 and the first air outlet 41 in sequence and extends into the rectifier box 40. The airflow direction is as follows. Figure 1 and Figure 2 As shown, after the motor 20 is powered on, it drives the impeller 21 to rotate, blowing airflow through the second air outlet 11 of the pressurized volute 10 into the rectifier box 40, and finally blowing it from the rectifier plate 30 onto the circuit board on the upper surface of the rectifier plate 30. The airflow in the furnace chamber of the reflow oven 90 enters the air inlet channel 41 through the first air inlet 61 of the return air bar 60, and then enters the air inlet channel 41 through the second air inlet 71 of the return air plate 70. After being heated by the heating wire, the airflow in the air inlet channel 41 enters the second air inlet 12 through the first air inlet 52. The airflow in the second air inlet 12 enters the pressurized volute 10, and the motor 20 drives the impeller 21 to rotate, flowing from the second air outlet 11 into the rectifier box 40. The airflow circulates repeatedly, completing the circuit board soldering and curing. This improves the equipment's heat preservation effect, reduces heat loss from the reflow oven 90, reduces power consumption, improves temperature uniformity, and thus enhances the stability of product soldering.

[0020] like Figures 1 to 4 As shown, in this utility model, there are two second air outlets 11 and two first fixed outlets 51.

[0021] like Figures 1 to 4 As shown, the reflow soldering heating device of this utility model reduces the internal space of the air inlet channel 41, reduces heat loss from the reflow soldering furnace 90, reduces power consumption, and increases economic benefits.

[0022] like Figures 1 to 4 As shown, the top of the second air outlet 11 is provided with a rectifier 80. The rectifier 80 includes a top plate 81, a bottom plate 82 and a support column 83. The bottom plate 82 is fixedly sleeved on the outside of the second air outlet 11. The bottom of the support column 83 is connected to the bottom plate 82 and the top is connected to the top plate 81. The rectifier 80 disperses the airflow from the second air outlet 11 into the rectifier box 40.

[0023] like Figures 1 to 4 As shown, after the airflow passes through the second air outlet 11, it changes its flow direction after passing through the top plate 81. The top plate 81 disperses the airflow from the second air outlet 11 into the rectifier box 40, and then flows evenly to the rectifier plate 30. The airflow from the rectifier plate 30 is blown onto the circuit board more evenly.

[0024] like Figures 1 to 4 As shown, a thermocouple for measuring gas temperature is installed inside the air inlet channel 41. The thermocouple can measure the airflow temperature inside the air inlet channel 41, which facilitates the control of the heating time of the heating wire.

[0025] like Figures 1 to 4As shown, the air duct box 50 is equipped with insulation cotton 53. The air inlet channel 41 provides insulation for the airflow within the air duct box 50. The insulation cotton 53 improves the equipment's insulation effect, reduces heat loss from the reflow oven 90, reduces power consumption, ensures smooth airflow circulation, and improves temperature uniformity, thereby enhancing the stability of product welding.

[0026] The above are specific embodiments of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the protection scope of this utility model.

Claims

1. A reflow soldering heating device, characterized in that, The system includes a booster volute, a motor, a rectifier plate, a rectifier box, an air duct box, return air strips, and a return air plate. The rectifier plate has a first air outlet and covers the upper surface of the rectifier box. The rectifier box is located inside the air duct box, and an air inlet channel is formed between the bottom of the rectifier box and the bottom of the air duct box. A heating wire is installed in the air inlet channel. The left and right sides of the rectifier box are connected to the left and right sides of the air duct box respectively via return air plates, and the front and rear sides of the rectifier box are connected to the front and rear sides of the air duct box respectively via return air strips. The return air strip has a first air inlet hole, and the return air plate has a second air inlet hole. The first and second air inlets are respectively connected to the air inlet channel. The bottom of the rectifier box has a first air outlet, and the bottom of the air duct box has a first fixing port and a first air inlet. The pressurizing vortex shell has a second air outlet and a second air inlet. The second air inlet is connected to the first air inlet. A fan wheel is installed in the second air inlet. The motor drives the fan wheel to rotate. The second air outlet passes through the first fixing port and the first air outlet in sequence and extends into the rectifier box.

2. The reflow soldering heating apparatus according to claim 1, characterized in that, The top of the second air outlet is provided with a rectifier, which includes a top plate, a bottom plate and a support column. The bottom plate is fixedly sleeved outside the second air outlet. The bottom of the support column is connected to the bottom plate and the top is connected to the top plate. The rectifier disperses the airflow from the second air outlet into the rectifier box.

3. The reflow soldering heating apparatus according to claim 1, characterized in that, The air inlet channel is equipped with a thermocouple for measuring gas temperature.

4. The reflow soldering heating apparatus according to claim 1, characterized in that, The air duct box is equipped with thermal insulation cotton.

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