A semiconductor plastic package raw material constant temperature box discharging system

Abstract

A kind of semiconductor plastic package raw material thermostat discharge system, including: box, the upper end of two opposite side plates of which is equipped with coaxial through-hole, box outside corresponding one of through-hole below is equipped with discharge slot, another through-hole is equipped with push rod, the bottom of box is equipped with strip slot;Crossbar, be located in box, along vertical direction movement setting, the top surface of crossbar is equipped with two clamps, V-shaped groove is formed between two clamps, for carrying plastic package raw material, the opening width of V-shaped groove is consistent with the outer diameter of plastic package raw material, the distance between the outer edge of two clamps is less than or equal to the width of strip slot;Baffle, be located in strip slot, support spring is equipped between the bottom of baffle and the bottom surface of strip slot, when support spring is natural state, the top surface of baffle is flush with the bottom surface of box or higher than the bottom surface of box.This scheme can automatically discharge, reduce manual operation, and help to keep the temperature inside thermostat.

Description

Technical Field

[0001] This utility model belongs to the technical field of auxiliary devices for semiconductor device molding, and in particular relates to a semiconductor molding raw material constant temperature box discharge system. Background Technology

[0002] In winter or low-temperature environments, semiconductor molding processes require preheating of the molding compound using a constant-temperature chamber. This improves the flowability of the compound, ensuring molding quality and shortening molding time. The molding compound is typically epoxy resin and usually has a cylindrical structure. Existing constant-temperature chambers have relatively simple structures, often using a standard chamber design. To retrieve the compound, the operator must open the chamber lid and manually remove it; the chamber cannot automatically dispense the compound. This manual process not only increases workload but also disrupts the internal temperature balance, requiring frequent activation of the heating system and increasing energy consumption. Utility Model Content

[0003] To address the shortcomings of existing technologies, this utility model provides a semiconductor molding compound raw material constant temperature chamber discharge system, which can automatically discharge materials, reduce manual operation, and help maintain the internal temperature of the constant temperature chamber.

[0004] In order to achieve the purpose of this utility model, the following solution is proposed:

[0005] A semiconductor molding compound raw material constant temperature chamber discharging system includes:

[0006] The box body has two coaxial through holes on its upper side plates. The through holes are located below the top cover of the box body. The inner diameter of the through holes is larger than the outer diameter of the plastic sealing material. A discharge groove is provided below one of the through holes on the outside of the box body. A push rod is inserted into the other through hole. The push rod is movable along the axis of the through hole. A strip groove is provided below the axis of the through hole on the bottom of the box body. The strip groove is parallel to the axis of the through hole.

[0007] A crossbar is installed inside the box and is parallel to the axis of the through hole. The axis of the crossbar and the axis of the through hole are on the same vertical plane. The crossbar is moved vertically. Two clamping plates are provided parallel to each other on the top surface of the crossbar. A V-shaped groove is formed between the two clamping plates to support the molding material. The opening width of the V-shaped groove is consistent with the outer diameter of the molding material. The distance between the outer edges of the two clamping plates is less than or equal to the width of the groove.

[0008] A baffle is installed in the strip groove. A support spring is provided between the bottom of the baffle and the bottom surface of the strip groove. When the support spring is in its natural state, the top surface of the baffle is flush with or higher than the bottom surface of the box.

[0009] The beneficial effects of this invention are as follows: This solution utilizes an automatically lifting crossbar to lift the encapsulating material inside the chamber. Due to the limitation of the V-groove width, the encapsulating material can only be placed parallel within the V-groove. When the crossbar moves to a predetermined height, the encapsulating material in the V-groove will be coaxial with the through hole. At this point, a push rod can be used to push the encapsulating material in the V-groove towards the discharge chute, thereby achieving automatic discharge. This avoids frequent opening of the top cover, preventing frequent temperature fluctuations inside the constant temperature chamber, and also reduces the operator's workload. Attached Figure Description

[0010] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of this invention.

[0011] Figure 1 A schematic diagram of the structure inside and outside the box of this application is shown.

[0012] Figure 2 A cross-sectional view of this application is shown when the crossbar is raised to a predetermined position.

[0013] Figure 3 It shows Figure 2 A magnified view of a portion of point A in the middle.

[0014] Figure 4 A cross-sectional view of this application is shown when both the crossbar and the clamping plate are located inside the slot.

[0015] Figure 5 A schematic diagram of a preferred structure for the crossbar and clamping plate is shown.

[0016] The markings in the diagram are: box body-1, through hole-11, discharge chute-12, strip groove-13, slide groove-14, push rod-2, lifting rod-33, cross bar-3, spindle-31, U-shaped groove-32, lifting rod-33, protrusion-34, clamping plate-4, baffle-5, support spring-6, lifting cylinder-7, telescopic cylinder-8. Detailed Implementation

[0017] To make the objectives, technical solutions and advantages of the present utility model clearer, the implementation methods of the present utility model will be described in detail below with reference to the accompanying drawings. However, the embodiments described in the present utility model are only some embodiments of the present utility model, and not all embodiments.

[0018] like Figures 1 to 5 As shown, a semiconductor molding compound raw material constant temperature chamber discharge system includes: a chamber body 1, a crossbar 3, and a baffle 5.

[0019] Specifically, such as Figure 1 , Figure 2As shown, two coaxial through holes 11 are provided on the two opposite side plates at the upper end of the box body 1. The through holes 11 are located below the top cover of the box body 1. The inner diameter of the through holes 11 is larger than the outer diameter of the plastic sealing material. A discharge groove 12 is provided below one of the through holes 11 on the outer side of the box body 1. A push rod 2 is inserted into the other through hole 11. The push rod 2 is movable along the axis of the through hole 11. A strip groove 13 is provided at the bottom of the box body 1 below the axis of the through hole 11. The strip groove 13 is parallel to the axis of the through hole 11.

[0020] Specifically, such as Figures 1 to 4 As shown, the crossbar 3 is located inside the housing 1 and is parallel to the axis of the through hole 11. The axis of the crossbar 3 and the axis of the through hole 11 are on the same vertical plane. The crossbar 3 is moved vertically. Two clamping plates 4 are provided parallel to each other on the top surface of the crossbar 3. A V-shaped groove is formed between the two clamping plates 4 to support the molding material. The opening width of the V-shaped groove is consistent with the outer diameter of the molding material. Therefore, only one molding material can be supported in the V-shaped groove of the same cross section. The distance between the outer edges of the two clamping plates 4 is less than or equal to the width of the strip groove 13.

[0021] Specifically, such as Figure 2 , Figure 4 As shown, the baffle 5 is located in the strip groove 13. A support spring 6 is provided between the bottom of the baffle 5 and the bottom surface of the strip groove 13. When the support spring 6 is in its natural state, the top surface of the baffle 5 is flush with or higher than the bottom surface of the box 1.

[0022] The discharge principle of the above scheme is as follows: First, the crossbar 3 is moved downward, and the crossbar 3 pushes the baffle 5 to move towards the bottom of the strip groove 13 until the crossbar 3 and the clamping plate 4 enter the strip groove 13. This process allows the V-shaped groove to be below the bottom surface of the box 1, which facilitates the automatic falling of the plastic sealing material into the V-shaped groove. Moreover, this structural design can also ensure that even if there is only a small amount of plastic sealing material in the box 1, the plastic sealing material can fall smoothly into the V-shaped groove. Then, the crossbar 3 is moved upward to a predetermined height so that the plastic sealing material in the V-shaped groove is coaxial with the through hole 11. Then, the push rod 2 is used to push the plastic sealing material into the discharge groove 12. The operator can then directly obtain the plastic sealing material from the discharge groove 12, avoiding frequent opening of the top cover. This not only simplifies the operation process but also effectively avoids affecting the temperature inside the constant temperature chamber.

[0023] As another embodiment, during the material discharge interval, the crossbar 3 can be moved up and down continuously inside the box 1 to agitate the plastic-sealed material inside the box 1, thereby improving the uniformity of the material heating.

[0024] Preferably, in order to further reduce the impact on the internal temperature of the constant temperature chamber, a flexible material baffle, such as a plastic sheet or a cloth sheet, is provided on the outside of the through hole 11 connected to the discharge trough 12 to reduce the dissipation of the internal temperature of the constant temperature chamber, while allowing the sealing material to pass smoothly.

[0025] Preferred, such as Figure 2 , Figure 4 As shown, the top two sides of the baffle 5 are inclined surfaces, and the inclined surfaces on both sides are located above the bottom surface of the box 1 to prevent the plastic sealing material from accumulating above the baffle 5 and affecting the contact between the crossbar 3 and the baffle 5. During the descent of the crossbar 3, the plastic sealing material can also slide along the inclined surfaces on both sides of the baffle 5 through the bottom surface of the crossbar 3.

[0026] Preferred, such as Figure 1 , Figure 2 , Figure 4 As shown, a vertical lifting rod 33 is provided at the bottom of the middle section of the crossbar 3. The lifting rod 33 passes downward through the baffle 5. A lifting cylinder 7 is provided at the bottom of the box body 1. The lower end of the lifting rod 33 is connected to the movable end of the lifting cylinder 7. The lifting cylinder 7 is used to control the crossbar 3 to move up and down.

[0027] Preferred, such as Figure 1 As shown, the outer end of the push rod 2 is connected to the movable end of a telescopic cylinder 8. The telescopic cylinder 8 is located on the outside of the housing 1, and the push rod 2 is moved by the telescopic cylinder 8.

[0028] Preferred, such as Figure 2 , Figure 4 As shown, the bottom surface of the box 1 has an inclined structure on both sides corresponding to the strip groove 13, and the inclined direction is towards the upper part of the middle of the box 1, so that the molding material automatically gathers in the middle, making it convenient for the molding material to enter the V-shaped groove.

[0029] Preferably, the crossbar 3 is a circular tube structure, which can push the plastic sealing material below to move to both sides to avoid it during its descent, and prevent the plastic sealing material from getting stuck between the bottom surface of the crossbar 3 and the top surface of the baffle 5.

[0030] Further preferred, such as Figures 2 to 5As shown, a U-shaped groove 32 is formed on the top surface of the crossbar 3 along its length. A mandrel 31, coaxial with the crossbar 3, is located within the U-shaped groove 32. Both clamping plates 4 are rotatably connected to the mandrel 31. Specifically, each clamping plate 4 has staggered clearance grooves on its side for connecting the mandrel 31, accommodating the physical parts where the opposite clamping plate 4 connects to the mandrel 31. The structure can be referenced from that of a hinge. When the clamping plate 4 abuts against the side walls of the U-shaped groove 32, the width of the V-shaped groove opening formed between the two clamping plates 4 is consistent with the outer diameter of the molding compound. When the width of the clamping plate 4 is large, this structural design allows for better control during the descent of the crossbar 3. In the middle, the clamping plate 4 can automatically close towards the middle under the squeezing action of the outer plastic sealing material, reducing the projected area on the horizontal plane, thereby reducing the resistance when the crossbar 3 descends. After the clamping plate 4 and the crossbar 3 enter the strip groove 12, because the outer side of the clamping plate 4 loses the squeezing action of the plastic sealing material, the clamping plate 4 will automatically unfold to both sides and form a certain angle. At this time, the angle may be smaller than the angle of the V-shaped groove, but it can still bear the plastic sealing material during the upward movement of the crossbar 3. After the crossbar 3 moves out of the strip groove 12, under the gravity of the plastic sealing material above, the two clamping plates 4 will form a V-shaped groove structure again.

[0031] Preferred, such as Figure 1 , Figure 4 and Figure 5 As shown, both ends of the crossbar 3 are provided with protrusions 34, and the inner wall of the box 1 is provided with a sliding groove 14 that matches the protrusions 34 in the vertical direction to improve the stability of the crossbar 3 when it moves.

[0032] The above description is merely a preferred embodiment of this utility model and does not imply its uniqueness or limitation. Those skilled in the art should understand that various changes or equivalent substitutions made to this utility model without departing from its scope are all within the protection scope of this utility model.

Claims

1. A semiconductor molding compound raw material constant temperature chamber discharge system, characterized in that, include: The box body (1) has two coaxial through holes (11) on its upper side plates. The through holes (11) are located below the top cover of the box body (1). The inner diameter of the through holes (11) is larger than the outer diameter of the plastic sealing material. The outer side of the box body (1) is provided with a discharge groove (12) below one of the through holes (11). A push rod (2) is inserted into the other through hole (11). The push rod (2) is moved along the axis of the through hole (11). The bottom of the box body (1) is provided with a strip groove (13) below the axis of the through hole (11). The strip groove (13) is parallel to the axis of the through hole (11). A crossbar (3) is installed inside the box (1) and is parallel to the axis of the through hole (11). The axis of the crossbar (3) and the axis of the through hole (11) are on the same vertical plane. The crossbar (3) is moved in the vertical direction. Two clamping plates (4) are provided parallel to each other on the top surface of the crossbar (3). A V-shaped groove is formed between the two clamping plates (4) to carry the plastic sealing material. The opening width of the V-shaped groove is consistent with the outer diameter of the plastic sealing material. The distance between the outer edges of the two clamping plates (4) is less than or equal to the width of the strip groove (13). A baffle (5) is provided in the strip groove (13). A support spring (6) is provided between the bottom of the baffle (5) and the bottom surface of the strip groove (13). When the support spring (6) is in its natural state, the top surface of the baffle (5) is flush with or higher than the bottom surface of the box (1).

2. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 1, characterized in that, The top of the baffle (5) has two sloping sides, and the sloping sides are located above the bottom of the box (1).

3. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 1, characterized in that, A vertical lifting rod (33) is provided at the bottom of the middle section of the crossbar (3). The lifting rod (33) passes downward through the baffle (5). A lifting cylinder (7) is provided at the bottom of the box (1). The lower end of the lifting rod (33) is connected to the movable end of the lifting cylinder (7).

4. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 1, characterized in that, The outer end of the push rod (2) is connected to the movable end of a telescopic cylinder (8), which is located on the outside of the housing (1).

5. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 1, characterized in that, The bottom of the box (1) is inclined on both sides of the strip groove (13), and the inclined direction is towards the upper part of the middle of the box (1).

6. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 1, characterized in that, The crossbar (3) is a circular tube structure.

7. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 6, characterized in that, A U-shaped groove (32) is provided on the top surface of the crossbar (3) along the length direction. A mandrel (31) coaxial with the crossbar (3) is provided in the U-shaped groove (32). Both clamping plates (4) are rotatably connected to the mandrel (31). When the clamping plates (4) abut against the side walls on both sides of the U-shaped groove (32), the width of the V-shaped groove opening formed between the two clamping plates (4) is consistent with the outer diameter of the plastic sealing material.

8. The semiconductor molding compound raw material constant temperature chamber discharge system according to claim 1, characterized in that, Both ends of the crossbar (3) are provided with protrusions (34), and the inner wall of the box (1) is provided with a groove (14) matching the protrusions (34) in the vertical direction.

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