PCB gantry copper electroplating production line double anode electroplating device

Abstract

The utility model discloses a kind of PCB gantry copper plating production line double anode electroplating devices, it includes: electroplating tank;Gantry, the gantry is set on the electroplating tank, driving component is provided on the gantry;Fixed assembly, it is set on the driving component, the driving component drives the fixed assembly to do vertical motion, the fixed assembly is connected with power supply cathode;Anode assembly, it includes two anode plates set in the electroplating tank, two the anode plate is set in the opposite sides of the fixed assembly, the anode plate is connected with power supply anode.The utility model compared with prior art can solve the problem of long time consumption of single anode electroplating, electroplating is not complete and PCB board electroplating bending.

Description

Technical Field

[0001] This utility model relates to the field of circuit board processing equipment technology, and in particular to a dual-anode electroplating device for a PCB gantry copper plating production line. Background Technology

[0002] Electroplating is a crucial step in PCB manufacturing. It involves depositing a plating layer onto a substrate using electrolysis. The plating metal serves as the anode, and the PCB board as the cathode, both immersed parallel or perpendicularly into an electroplating solution. Currently, the electroplating industry primarily uses single-anode electrodes. The disadvantages of single-anode electroplating tanks include: long plating time, incomplete plating, spots on the surface of the plated object, and the possibility of PCB boards bending during electroplating. Utility Model Content

[0003] The purpose of this utility model is to provide a dual-anode electroplating device for a PCB gantry copper electroplating production line, in order to solve the problems of long single-anode electroplating time, incomplete electroplating, and PCB board bending during electroplating.

[0004] To achieve the above objectives, this utility model adopts the following technical solution: a dual-anode electroplating device for a PCB gantry copper plating production line, comprising:

[0005] Electroplating tank;

[0006] A gantry frame is mounted on the electroplating tank, and a driving component is mounted on the gantry frame;

[0007] A fixing component is disposed on the driving component, the driving component drives the fixing component to perform vertical movement, and the fixing component is connected to the power cathode;

[0008] An anode assembly includes two anode plates disposed within the electroplating tank, the two anode plates being disposed on opposite sides of the fixed assembly, and the anode plates being connected to a power anode.

[0009] As a further description of the above technical solution:

[0010] The fixed assembly includes a connecting frame, an electrode plate, an upper clip, a lower clip, and a telescopic rod. The connecting frame is connected to the driving component. The electrode plate is on the connecting frame. The electrode plate is provided with a plurality of lower clips. Each lower clip is provided with an upper clip above it. The lower clips are connected to the telescopic rod, which is connected to the connecting frame. The electrode plate is connected to the power cathode.

[0011] As a further description of the above technical solution:

[0012] The telescopic rod includes a first connecting rod and a second connecting rod. The first connecting rod is connected to the connecting frame and has an adjusting screw hole inside. One end of the second connecting rod is screwed into the adjusting screw hole.

[0013] As a further description of the above technical solution:

[0014] The connecting frame has guide holes at both ends, and guide rods are inserted through the guide holes and connected to the gantry frame.

[0015] As a further description of the above technical solution:

[0016] The connecting frame is an insulated connecting frame.

[0017] As a further description of the above technical solution:

[0018] The driving component is a pneumatic cylinder or an electric cylinder.

[0019] In summary, due to the adoption of the above technical solution, the beneficial effects of this utility model are as follows: by adding anode plates, two anode plates are respectively set on both sides of the fixing component, which can improve electroplating efficiency, make the electroplated surface uniform and smooth, and improve the electroplating quality; by setting the telescopic rod, the distance between the upper and lower hanging clamps can be adjusted, thereby fixing PCB boards of different sizes, and also making the PCB board stretch straighter, avoiding bending and preventing damage to the PCB board. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a dual-anode electroplating device in a PCB gantry copper plating production line. Figure 1 .

[0022] Figure 2 This is a schematic diagram of the structure of a dual-anode electroplating device in a PCB gantry copper plating production line. Figure 2 .

[0023] Figure 3 This is a schematic diagram of the telescopic rod in a dual-anode electroplating device of a PCB gantry copper plating production line.

[0024] Legend:

[0025] 1. Electroplating tank; 2. Gantry frame; 3. Drive unit; 4. Fixing assembly; 41. Connecting frame; 42. Electrode plate; 43. Upper hanging clamp; 44. Lower hanging clamp; 45. Telescopic rod; 451. First connecting rod; 452. Second connecting rod; 5. Power supply; 6. Anode plate; 7. Adjusting screw hole; 8. Guide rod. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figure 1-3 This utility model provides a technical solution: a dual-anode electroplating device for a PCB gantry copper plating production line, comprising:

[0028] Electroplating tank 1;

[0029] Gantry frame 2, the gantry frame 2 is mounted on the electroplating tank 1, and the gantry frame 2 is equipped with a driving component 3;

[0030] A fixing component 4 is disposed on the driving component 3. The driving component 3 drives the fixing component 4 to move vertically. The fixing component 4 is connected to the cathode of the power supply 5.

[0031] The anode assembly includes two anode plates 6 disposed in the electroplating tank 1. The two anode plates 6 are disposed on opposite sides of the fixing assembly 4, and the anode plates are connected to the anode of the power supply 5.

[0032] The fixing assembly 4 includes a connecting frame 41, an electrode plate 42, an upper clamp 43, a lower clamp 44, and a telescopic rod 45. The connecting frame 41 is connected to the driving component 3. The electrode plate 42 is on the connecting frame 41, and several lower clamps 44 are provided on the electrode plate 42. Each lower clamp 44 has an upper clamp 43 above it. The lower clamps 44 are connected to the telescopic rod 45, which is connected to the connecting frame 41. The electrode plate 42 is connected to the cathode of the power supply 5. By adjusting the length of the telescopic rod, the distance between the upper and lower clamps is adapted to the PCB board, preventing bending of the PCB board during mounting. The upper and lower clamps are used to clamp the waste area of ​​the product, and the clamping force prevents the board from falling off during clamping, thus facilitating the mounting and dismounting of the PCB board.

[0033] The telescopic rod 45 includes a first connecting rod 451 and a second connecting rod 452. The first connecting rod is connected to the connecting frame 41, and an adjusting screw hole 7 is provided in the first connecting rod 451. One end of the second connecting rod 452 is screwed into the adjusting screw hole 7. Rotating the second connecting rod allows it to move up and down within the adjusting screw hole, thereby adjusting the position of the upper clamp.

[0034] The connecting frame 41 has guide holes at both ends, and guide rods 8 are inserted through the guide holes and connected to the gantry frame 2. This makes the movement of the connecting frame more stable.

[0035] The connecting frame 41 is an insulated connecting frame. The connecting frame is made of insulating material, which improves safety.

[0036] The driving component 3 is a pneumatic cylinder or an electric cylinder. Specifically, the driving component is a pneumatic cylinder.

[0037] Working Principle: During electroplating, the length of the telescopic rod is adjusted to match the distance between the upper and lower clamps to the PCB board. The PCB board is then hung between the upper and lower clamps. The drive component lowers the connecting frame, immersing the PCB board in the electroplating solution. Power is then switched on, and electroplating begins. Therefore, this invention improves electroplating efficiency and produces a uniform and smooth electroplated surface by adding two anode plates, positioned on opposite sides of the fixing assembly. This enhances electroplating quality. The telescopic rod allows adjustment of the distance between the upper and lower clamps, enabling the fixing of PCB boards of different sizes and ensuring the PCB board remains straight, preventing bending and damage.

[0038] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A double anode electroplating device for a PCB gantry electroplating copper production line, characterized in that, include: Electroplating tank; A gantry frame is mounted on the electroplating tank, and a driving component is mounted on the gantry frame; A fixing component is disposed on the driving component, the driving component drives the fixing component to perform vertical movement, and the fixing component is connected to the power cathode; An anode assembly includes two anode plates disposed within the electroplating tank, the two anode plates being disposed on opposite sides of the fixed assembly, and the anode plates being connected to a power anode.

2. The double anode electroplating device of a PCB gantry electroplating copper production line according to claim 1, characterized in that, The fixed assembly includes a connecting frame, an electrode plate, an upper clip, a lower clip, and a telescopic rod. The connecting frame is connected to the driving component. The electrode plate is on the connecting frame. The electrode plate is provided with a plurality of lower clips. Each lower clip is provided with an upper clip above it. The lower clips are connected to the telescopic rod, which is connected to the connecting frame. The electrode plate is connected to the power cathode.

3. The double anode electroplating device of claim 2, wherein, The telescopic rod includes a first connecting rod and a second connecting rod. The first connecting rod is connected to the connecting frame and has an adjusting screw hole inside. One end of the second connecting rod is screwed into the adjusting screw hole.

4. The double anode electroplating device of claim 2, wherein, The connecting frame has guide holes at both ends, and guide rods are inserted through the guide holes and connected to the gantry frame.

5. The double anode electroplating device of a PCB gantry electroplating copper production line according to claim 2, characterized in that, The connecting frame is an insulated connecting frame.

6. The double anode electroplating device of a PCB gantry electroplating copper production line according to claim 1, characterized in that, The driving component is a pneumatic cylinder or an electric cylinder.

Images