Plating solution system

Abstract

The application discloses a plating solution system. The plating solution system comprises a plating solution circulating system, which is suitable for being connected to a plating solution requiring device and is used for driving plating solution to flow circularly between the inside of the plating solution requiring device and the plating solution circulating system. According to the plating solution system, the plating solution is driven to flow circularly between the inside of the plating solution requiring device and the plating solution circulating system by the plating solution circulating system, so that the plating solution in the inside of the plating solution requiring device is reduced, the cost investment of the plating solution system and the plating solution requirement is reduced, and resource waste is reduced.

Description

Technical Field

[0001] This application relates to the field of plating solution technology, and more specifically, to a plating solution system. Background Technology

[0002] In related technologies, the equipment to be plated is usually placed in a plating bath to complete the plating process. However, as the size of the equipment to be plated gradually increases, the required size of the plating bath also increases, and the demand for plating solution also increases. This plating method is costly and easily leads to resource waste. Utility Model Content

[0003] This application aims to at least partially address one of the aforementioned technical problems in the prior art. To this end, this application proposes a plating solution system that helps reduce costs and minimize resource waste.

[0004] The plating solution system according to this embodiment includes a plating solution circulation system, which is adapted to connect to a device to be plated, and is used to drive the plating solution to circulate between the device to be plated and the plating solution circulation system.

[0005] According to the plating solution system of this embodiment, the plating solution is driven to circulate between the inside of the equipment to be plated and the plating solution circulation system through the plating solution circulation system, so that the plating solution inside the equipment to be plated reduces the cost of the plating solution system and the amount of plating solution required, and reduces the waste of resources.

[0006] In some embodiments, the plating solution circulation system includes a plating solution storage tank, a first plating solution pipeline, and a second plating solution pipeline. One end of the first plating solution pipeline is connected to a first storage tank interface of the plating solution storage tank, and the other end of the first plating solution pipeline is configured as a first pipeline interface for connecting to a device to be plating. The plating solution in the plating solution storage tank is adapted to enter the device to be plating via the first plating solution pipeline. One end of the second plating solution pipeline is connected to a second storage tank interface of the plating solution storage tank, and the other end of the second plating solution pipeline is configured as a second pipeline interface for connecting to the device to be plating. The plating solution in the device to be plating is adapted to flow to the plating solution storage tank via the second plating solution pipeline.

[0007] In some embodiments, the first pipe interface is located below the second pipe interface.

[0008] In some embodiments, a first plating solution valve is provided on the first plating solution pipeline, and the first plating solution valve controls the opening and closing of the first plating solution pipeline; a second plating solution valve is provided on the second plating solution pipeline, and the second plating solution valve controls the opening and closing of the second plating solution pipeline.

[0009] In some embodiments, a first valve for plating solution is provided on the first pipeline of plating solution, and the first valve for plating solution controls the opening and closing of the first pipeline of plating solution.

[0010] In some embodiments, a second plating solution valve is provided on the second plating solution pipeline, and the second plating solution valve controls the opening and closing of the second plating solution pipeline.

[0011] In some embodiments, the plating solution system further includes a plating solution recovery pipeline, which is connected in parallel with the first plating solution pipeline and is located between the plating solution storage tank and the equipment to be plated.

[0012] In some embodiments, a first plating solution valve is provided on the first plating solution pipeline, which controls the opening and closing of the first plating solution pipeline; a third plating solution valve is provided on the plating solution recovery pipeline, which controls the opening and closing of the plating solution recovery pipeline.

[0013] In some embodiments, the plating solution circulation system further includes a first pump disposed on the first plating solution pipeline, the first pump being used to drive the plating solution in the first plating solution pipeline to flow to the equipment to be plated.

[0014] In some embodiments, the plating solution circulation system further includes a plating solution temperature monitoring and control unit, a plating solution concentration monitoring and control unit, and a plating solution pH monitoring and control unit. The plating solution temperature monitoring and control unit is used to monitor the temperature of the plating solution in the plating solution storage tank and control the temperature of the plating solution in the plating solution storage tank to maintain within a preset temperature range. The plating solution concentration monitoring and control unit is used to monitor the concentration of the plating solution in the plating solution storage tank and control the concentration of the plating solution in the plating solution storage tank to maintain within a preset concentration range. The plating solution pH monitoring and control unit is used to monitor the pH value of the plating solution in the plating solution storage tank and control the pH value of the plating solution in the plating solution storage tank to maintain within a preset pH value range.

[0015] In some embodiments, a distributor is provided at the first interface of the pipeline, and the distributor is adapted to be installed in the equipment for plating solution.

[0016] In some embodiments, the plating solution system further includes a cleaning solution circulation system for introducing cleaning solution into the interior of the equipment to be plated and recovering cleaning solution flowing out of the interior of the equipment.

[0017] In some embodiments, the cleaning fluid circulation system includes a cleaning fluid storage tank, a cleaning fluid recovery tank, a first cleaning fluid pipeline, a second cleaning fluid pipeline, and a cleaning fluid temperature control unit. The cleaning fluid storage tank is used to store cleaning fluid, the cleaning fluid recovery tank is used to recover cleaning fluid flowing out of the plating solution equipment, the first cleaning fluid pipeline is used to connect the outlet of the cleaning fluid storage tank to the cleaning fluid inlet of the plating solution equipment, the second cleaning fluid pipeline is used to connect the cleaning fluid outlet of the plating solution equipment to the inlet of the cleaning fluid recovery tank, and the cleaning fluid temperature control unit is used to control the temperature of the cleaning fluid in the cleaning fluid storage tank.

[0018] In some embodiments, a first cleaning fluid valve is provided on the first cleaning fluid pipeline, which controls the opening and closing of the first cleaning fluid pipeline; a second cleaning fluid valve is provided on the second cleaning fluid pipeline, which controls the opening and closing of the second cleaning fluid pipeline.

[0019] In some embodiments, the plating solution system further includes an acid pickling solution circulation system, which is used to introduce acid pickling solution into the interior of the equipment to be plated and to circulate and recycle the acid pickling solution flowing out of the interior of the equipment to be plated.

[0020] In some embodiments, the pickling solution circulation system includes a pickling solution storage tank, a first pickling solution pipeline, a second pickling solution pipeline, and a pickling solution temperature control unit. The pickling solution storage tank is used to store pickling solution. The first pickling solution pipeline is used to connect the outlet of the pickling solution storage tank to the pickling solution inlet of the equipment to be plated. The second pickling solution pipeline is used to connect the pickling solution outlet of the equipment to be plated to the inlet of the pickling solution storage tank. The pickling solution temperature control unit is used to control the temperature of the pickling solution in the pickling solution storage tank.

[0021] In some embodiments, the cleaning liquid inlet and the pickling liquid inlet of the equipment to be plated are the same common inlet. The first cleaning liquid pipeline and the first pickling liquid pipeline are connected in parallel and connected to the common inlet through a common pipeline 28. A common valve is provided on the common pipeline 28, and the common valve is used to control the opening and closing of the common pipeline 28.

[0022] In some embodiments, the first pickling solution pipeline is provided with a first pickling solution valve, which controls the opening and closing of the first pickling solution pipeline; the second pickling solution pipeline is provided with a second pickling solution valve, which controls the opening and closing of the second pickling solution pipeline.

[0023] In some embodiments, the plating solution system further includes a second pump disposed on the common pipeline 28, the second pump being used to drive the liquid in the common pipeline 28 to flow to the equipment to be plated.

[0024] In some embodiments, one end of the common conduit 28 is provided with a nozzle, which is adapted to extend into the interior of the plating solution equipment.

[0025] In some embodiments, the plating solution system further includes a purging system for selectively introducing purging gas into the interior of the equipment to be plated.

[0026] In some embodiments, the purging system includes a purging storage tank and a purging pipeline, wherein the purging storage tank is used to store purging gas and the purging pipeline is used to connect the purging storage tank to the plating solution equipment.

[0027] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the plating solution system according to this embodiment;

[0029] Figure 2 This is a schematic diagram of the pipeline connection during the operation of the plating solution circulation system according to this embodiment;

[0030] Figure 3 This is a schematic diagram of the pipeline connection during operation of the plating solution recovery pipeline according to this embodiment;

[0031] Figure 4 This is a schematic diagram of the pipeline connection during operation of the cleaning fluid circulation system according to this embodiment;

[0032] Figure 5 This is a schematic diagram of the pipeline connection during operation of the pickling solution circulation system according to this embodiment;

[0033] Figure 6 This is a schematic diagram of the pipeline connection during operation of the purging system according to this embodiment.

[0034] Figure label:

[0035] Plating solution system 100, plating solution circulation system 200, cleaning solution circulation system 300, pickling solution circulation system 400, purging system 500, plating solution equipment 1, plating solution first interface 101, plating solution second interface 102, common inlet 103, purging storage tank 2, plating solution storage tank 3, plating solution temperature monitoring and control unit 31, plating solution concentration monitoring and control unit 32, plating solution pH monitoring and control unit 33, storage tank first interface 34, storage tank second interface 35, cleaning solution storage tank 4, cleaning solution temperature control unit 41, cleaning solution recovery tank 5, pickling solution storage tank 6, pickling solution temperature control unit 61, first pump 7, second pump 8, third filter 9, common Valve 10, Cleaning solution first valve 12, Pickling solution first valve 11, Pickling solution second valve 13, Cleaning solution second valve 14, Fourth filter 15, Plating solution first valve 16, Plating solution third valve 17, Purge valve 18, Plating solution second valve 19, Distributor 20, Nozzle 21, First filter 22, Plating solution first pipeline 231, Pipeline first interface 2311, Plating solution second pipeline 232, Pipeline second interface 2321, Plating solution recovery pipeline 233, Cleaning solution first pipeline 241, Cleaning solution second pipeline 242, Pickling solution first pipeline 251, Pickling solution second pipeline 252, Purge pipeline 26, Second filter 27, Common pipeline 28. Detailed Implementation

[0036] The following describes this embodiment in detail. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application.

[0037] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0038] In the description of the embodiments of this application, the term "and / or" is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, P and / or Q can represent three cases: P exists alone, P and Q exist simultaneously, and Q exists alone.

[0039] The following is combined with Figures 1-6 A detailed description of the plating solution system 100 according to this embodiment.

[0040] Reference Figure 1As shown, the plating solution system 100 according to this embodiment includes a plating solution circulation system 200, which is adapted to connect to the plating solution device 1. The plating solution circulation system 200 is used to drive the plating solution to circulate between the inside of the plating solution device 1 and the plating solution circulation system 200. Thus, by driving the plating solution to circulate between the inside of the plating solution device 1 and the plating solution circulation system 200, only the inner wall of the plating solution device 1 is coated with plating solution to form a coating, while the outer wall of the plating solution device 1 does not need to be coated with plating solution. Therefore, the plating solution system 100 has no size limitation, eliminating the need to dig large-sized plating solution tanks, reducing the cost of the plating solution system 100 and the required amount of plating solution, and reducing resource waste.

[0041] Alternatively, the plating solution can be zinc, nickel, tin, etc. The following description uses nickel plating in equipment 1 as an example.

[0042] Optionally, the plating solution device 1 can be a gas-liquid separator in an electrolytic water system, a tank for the plating solution, etc.

[0043] In related technologies, the equipment to be plated is usually placed in a plating bath to complete the plating process. However, as the size of the equipment to be plated gradually increases, the size requirements of the plating bath also increase, and the demand for plating solution also increases. This plating method is costly and easily leads to resource waste.

[0044] According to the plating solution system 100 of this embodiment, the plating solution is driven to circulate between the inside of the plating solution device 1 and the plating solution circulation system 200 by the plating solution circulation system 200, so that the inner wall of the plating solution device 1 is coated with the plating solution to form a plating layer, and the outer wall of the plating solution device 1 does not need to be coated with plating solution, thereby reducing the cost of the plating solution system 100 and the amount of plating solution required, and reducing the waste of resources.

[0045] In some embodiments, see Figure 1 As shown, the plating solution circulation system 200 includes a plating solution storage tank 3, a first plating solution pipeline 231, and a second plating solution pipeline 232. The plating solution storage tank 3 is used to store the plating solution. One end of the first plating solution pipeline 231 is connected to the first storage tank interface 34 of the plating solution storage tank 3, and the other end of the first plating solution pipeline 231 is formed as a first pipeline interface 2311 for connecting to the equipment 1 to be plating. The plating solution in the plating solution storage tank 3 is suitable to enter the equipment 1 to be plating through the first plating solution pipeline 231. One end of the second plating solution pipeline 232 is connected to the second storage tank interface 35 of the plating solution storage tank 3, and the other end of the second plating solution pipeline 232 is formed as a second pipeline interface 2321 for connecting to the equipment 1 to be plating. The plating solution in the equipment 1 to be plating is suitable to flow to the plating solution storage tank 3 through the second plating solution pipeline 232.

[0046] Specifically, the plating solution device 1 has a first plating solution interface 101 and a second plating solution interface 102. The first pipeline interface 2311 is connected to the first plating solution interface 101, and the second pipeline interface 2321 is connected to the second plating solution interface 102.

[0047] Specifically, see Figure 2 As shown, when the plating solution circulation system 200 is working, the plating solution in the plating solution storage tank 3 flows into the first plating solution pipeline 231 from the first port 34 of the storage tank. The plating solution in the first plating solution pipeline 231 enters the plating solution device 1 from the first port 2311 of the pipeline and the first port 101 of the solution to be plated, completing the plating solution coating work on the inner wall of the plating solution device 1. The plating solution in the plating solution device 1 enters the second plating solution pipeline 232 from the second port 102 of the solution to be plated and the second port 2321 of the pipeline. The plating solution in the second plating solution pipeline 232 flows into the plating solution storage tank 3 through the second port 35 of the storage tank, completing one plating solution cycle. Thus, it can be ensured that the plating solution device 1 can complete the plating solution coating work while the plating solution circulation system 200 is working.

[0048] When it is necessary to coat the inner wall of the plating solution equipment 1 with plating solution, the plating solution can be circulated once or multiple times. Multiple circulations are beneficial for the plating solution to be coated more evenly on the inner wall of the plating solution equipment 1, thereby improving the coating quality.

[0049] In some embodiments, see Figure 1 As shown, the first interface 2311 of the pipeline is located below the second interface 2321 of the pipeline. In other words, the first interface 101 of the plating solution is located below the second interface 102 of the plating solution. Therefore, after the plating solution enters the plating solution device 1 through the first interface 101, it will preferentially fill the plating solution device 1 and then flow out from the upper second interface 102, making the plating solution coating on the inner wall surface of the plating solution device 1 more uniform and ensuring that the plating solution can completely cover the inner wall of the plating solution device 1 without omissions or defects.

[0050] In some embodiments, see Figure 1 , Figure 2 As shown, a first plating solution valve 16 is provided on the first plating solution pipeline 231, which controls the opening and closing of the first plating solution pipeline 231. A second plating solution valve 19 is provided on the second plating solution pipeline 232, which controls the opening and closing of the second plating solution pipeline 232. Specifically, the first plating solution valve 16 controls the opening and closing of the first plating solution pipeline 231, and the second plating solution valve 19 controls the opening and closing of the second plating solution pipeline 232, so that the flow of plating solution between the plating solution storage tank 3 and the equipment to be plating 1 can be more precisely controlled.

[0051] In some embodiments, the flow rate of the plating solution can be precisely controlled by the valve opening of the first valve 16 and the valve opening of the second valve 19 to meet the flow rate requirements of different equipment 1 to be plated.

[0052] Optionally, the first valve 16 of the plating solution can be one, two, or more, such as Figure 1 As shown, there are two first valves 16 for the plating solution, which are installed at the inlet and outlet ends of the first pump 7, respectively.

[0053] In some embodiments, see Figure 1 , Figure 2 As shown, a first filter 22 is provided on the second plating solution pipeline 232. The first filter 22 is used to filter impurities in the plating solution that flows from the plating solution equipment 1 into the plating solution storage tank 3 through the second plating solution pipeline 232.

[0054] In some embodiments not shown, a first plating solution valve 16 is provided only on the first plating solution pipeline 231, which controls the opening and closing of the first plating solution pipeline 231, while a second plating solution valve 19 is no longer provided on the second plating solution pipeline 232.

[0055] In some embodiments not shown, a second plating solution valve 19 is provided only on the second plating solution pipeline 232, which controls the opening and closing of the second plating solution pipeline 232, while a first plating solution valve 16 is no longer provided on the first plating solution pipeline 231.

[0056] Optionally, the connection between the first port 34 of the storage tank and the first port 101 of the plating solution can also be controlled by the first port 2311 of the pipeline and the first port 101 of the plating solution. Connecting the first port 2311 of the pipeline and the first port 101 of the plating solution connects the first port 34 of the storage tank and the first port 101 of the plating solution, and disconnecting the first port 2311 of the pipeline and the first port 101 of the plating solution disconnects the first port 34 of the storage tank and the first port 101 of the plating solution. Similarly, the connection between the second port 35 of the storage tank and the second port 102 of the plating solution can also be controlled by the second port 2321 of the pipeline and the second port 102 of the plating solution. Connecting the second port 2321 of the pipeline and the second port 102 of the plating solution connects the second port 35 of the storage tank and the second port 102 of the plating solution, and disconnecting the second port 2321 of the pipeline and the second port 102 of the plating solution disconnects the second port 35 of the storage tank and the second port 102 of the plating solution.

[0057] In some embodiments, see Figure 1 , Figure 3As shown, the plating solution system 100 also includes a plating solution recovery pipeline 233, which is connected in parallel with the first plating solution pipeline 231. The plating solution recovery pipeline 233 is located between the plating solution storage tank 3 and the equipment to be plated 1, and is used to recover the plating solution in the equipment to be plated 1 back to the plating solution storage tank 3. Specifically, the plating solution recovery pipeline 233 enables the plating solution in the equipment to be plated 1 to be recovered into the plating solution storage tank 3, realizing the recycling of the plating solution. This not only reduces plating solution waste but also lowers production costs.

[0058] In some embodiments, see Figure 1 , Figure 3 As shown, the plating solution recovery pipeline 233 and the first plating solution pipeline 231 are both connected to the first interface 101 of the plating solution to be plated and the first interface 34 of the storage tank. The plating solution recovery pipeline 233 and the first plating solution pipeline 231 are arranged in parallel between the first interface 101 of the plating solution to be plated and the first interface 34 of the storage tank.

[0059] In some embodiments not shown in the figure, the plating solution recovery pipeline 233 and the plating solution first pipeline 231 do not share the plating solution first interface 101 and / or the storage tank first interface 34, but are respectively connected to the plating solution device 1 and the plating solution storage tank 3 through their respective interfaces.

[0060] In some embodiments, see Figures 1-3 As shown, a first plating solution valve 16 is installed on the first plating solution pipeline 231, which controls the opening and closing of the first plating solution pipeline 231. A third plating solution valve 17 is installed on the plating solution recovery pipeline 233, which controls the opening and closing of the plating solution recovery pipeline 233. Specifically, by precisely controlling the opening and closing of the plating solution recovery pipeline 233 through the third plating solution valve 17, after the plating coating work is completed, the remaining plating solution in the plating solution equipment 1 can flow into the plating solution storage tank 3 through the plating solution recovery pipeline 233, realizing the recycling of the plating solution. This not only reduces the waste of plating solution, but also reduces production costs.

[0061] In some embodiments, see Figure 1 As shown, a second filter 27 is provided on the plating solution recovery pipeline 233. The second filter 27 is used to filter impurities in the plating solution flowing from the plating solution equipment 1 into the plating solution storage tank 3 through the plating solution recovery pipeline 233.

[0062] In some embodiments, see Figure 1 , Figure 2As shown, the plating solution circulation system 200 also includes a first pump 7, which is installed on the first plating solution pipeline 231. The first pump 7 is used to drive the plating solution in the first plating solution pipeline 231 to flow to the plating solution equipment 1. Thus, the first pump 7 provides a power source for the plating solution circulation system 200, which can efficiently drive the plating solution in the first plating solution pipeline 231 to flow to the plating solution equipment 1, ensuring that the plating solution can be delivered to the plating solution equipment 1 in a timely and stable manner to meet the requirements of the electroplating process. At the same time, since the first pump 7 provides driving force to the plating solution in the first plating solution pipeline 231, the plating solution also has a large force when flowing out of the plating solution equipment 1, thereby enabling the plating solution in the second plating solution pipeline 232 to flow efficiently to the plating solution storage tank 3.

[0063] In some embodiments, the first pump 7 is a variable frequency pump, which can adjust the circulation rate according to the volume of the equipment 1 to be plated and the concentration of the plating solution. Thus, by adjusting the rotation speed or power of the first pump 7, the flow rate of the plating solution can be precisely controlled, which helps to achieve uniform distribution and precise control of the plating solution and ensures that the coating efficiency of the plating solution reaches the optimal level.

[0064] In some embodiments, see Figure 1 As shown, the plating solution circulation system 200 also includes a plating solution temperature monitoring and control unit 31, a plating solution concentration monitoring and control unit 32, and a plating solution pH monitoring and control unit 33. The plating solution temperature monitoring and control unit 31 is used to monitor the temperature of the plating solution in the plating solution storage tank 3 and control the temperature of the plating solution in the plating solution storage tank 3 to maintain within a preset temperature range. The plating solution concentration monitoring and control unit 32 is used to monitor the concentration of the plating solution in the plating solution storage tank 3 and control the concentration of the plating solution in the plating solution storage tank 3 to maintain within a preset concentration range. The plating solution pH monitoring and control unit 33 is used to monitor the pH value of the plating solution in the plating solution storage tank 3 and control the pH value of the plating solution in the plating solution storage tank 3 to maintain within a preset pH value range.

[0065] Specifically, in some embodiments, the plating solution temperature monitoring and control unit 31 includes a plating solution heating device and a plating solution cooling device. When the temperature is lower than the lower limit of a preset temperature range, the plating solution temperature monitoring and control unit 31 controls the plating solution heating device to heat the plating solution, controlling the temperature to rise to the preset temperature range. When the temperature exceeds the upper limit of the preset temperature range, the plating solution temperature monitoring and control unit 31 controls the plating solution cooling device to cool the plating solution, controlling the temperature to drop to the preset temperature range.

[0066] In some embodiments, the plating solution concentration monitoring and control unit 32 includes a plating solution compensation device. When the plating solution concentration monitoring and control unit 32 detects that the ion concentration of the plating solution is lower than the lower limit of a preset concentration range, the plating solution concentration monitoring and control unit 32 controls the plating solution compensation device to start, and the plating solution compensation device increases the ion concentration in the plating solution to the preset concentration range.

[0067] In some embodiments, the plating solution pH monitoring and control unit 33 includes a plating solution pH stabilizing device. When the plating solution pH monitoring and control unit 33 detects that the pH value of the plating solution exceeds the preset pH value range, the plating solution pH monitoring and control unit 33 controls the plating solution pH stabilizing device to add stabilizers and buffers to the plating solution to ensure that the pH value of the plating solution is within the preset pH value range.

[0068] The plating solution temperature monitoring and control unit 31, plating solution concentration monitoring and control unit 32, and plating solution pH value monitoring and control unit 33 enable controllable plating quality, improve the performance of the plating layer of the equipment 1 to be plated, and ensure stable operation of the equipment to be plated.

[0069] Optionally, the preset temperature range can be 40℃-120℃. When the temperature rises, some aromatic components in the plating solution additives will evaporate, requiring more time for coating deposition.

[0070] It should be noted that the preset temperature range can also be 40℃-90℃, 75℃-85℃, 70℃-100℃, 50℃-90℃, 70℃-90℃, 70℃-120℃, or other ranges between 40℃-120℃. The specific range can be selected according to the actual situation.

[0071] Optionally, the preset concentration range is 15g / L-40g / L. Taking nickel plating as an example, a lower nickel ion concentration will result in a slower nickel layer deposition process. If the concentration is too high, it will result in a faster deposition rate, uneven nickel layer deposition, and affect the plating quality.

[0072] It should be noted that the preset concentration range can also be 15g / L-30g / L, 20g / L-35g / L, 25g / L-30g / L, 30g / L-40g / L, or other ranges between 15g / L-40g / L. The specific range can be selected according to the actual situation.

[0073] Optionally, the preset pH range can be 3.8-5. Taking nickel plating as an example, an increase in pH will generate more hydroxide ions. These hydroxide ions combine with nickel ions to form nickel hydroxide, which is light green and affects the nickel plating effect of the equipment.

[0074] It should be noted that the preset pH range can also be 3.8-4, 4-4.5, 4.3-4.8, 4-5, or other ranges between 3.8 and 5. The specific range can be selected according to the actual situation.

[0075] In some embodiments, see Figure 1As shown, a distributor 20 is provided at the first interface 2311 of the pipeline, and the distributor 20 is adapted to be installed inside the plating solution equipment 1. Thus, the distributor 20 makes the plating solution more evenly distributed when it enters the plating solution equipment 1, making the plating solution distribution on the inner wall surface of the plating solution equipment 1 more uniform, ensuring that the plating solution can cover the inner wall of the plating solution equipment 1 as much as possible, and reducing omissions and defects.

[0076] In some embodiments, see Figure 1 , Figure 4 As shown, the plating solution system 100 also includes a cleaning solution circulation system 300. The cleaning solution circulation system 300 is used to introduce cleaning solution into the plating solution equipment 1 and to recover the cleaning solution flowing out of the equipment 1. Specifically, the cleaning solution circulation system 300 allows for a comprehensive and thorough cleaning of the interior of the plating solution equipment 1, effectively removing residual plating solution, impurities, etc., thus improving the stability and service life of the equipment 1. By recovering the cleaning solution flowing out of the equipment 1, resource waste and consumption can be significantly reduced.

[0077] In some embodiments, see Figure 1 , Figure 4 As shown, the cleaning fluid circulation system 300 includes a cleaning fluid storage tank 4, a cleaning fluid recovery tank 5, a first cleaning fluid pipeline 241, a second cleaning fluid pipeline 242, and a cleaning fluid temperature control unit 41. The cleaning fluid storage tank 4 is used to store the cleaning fluid, the cleaning fluid recovery tank 5 is used to recover the cleaning fluid flowing out of the plating solution equipment 1, the first cleaning fluid pipeline 241 is used to connect the outlet of the cleaning fluid storage tank 4 to the cleaning fluid inlet of the plating solution equipment 1, the second cleaning fluid pipeline 242 is used to connect the cleaning fluid outlet of the plating solution equipment 1 to the inlet of the cleaning fluid recovery tank 5, and the cleaning fluid temperature control unit 41 is used to control the temperature of the cleaning fluid in the cleaning fluid storage tank 4, for example, the cleaning fluid temperature can be adjusted to around 35°C, around 45°C, around 50°C, etc.

[0078] Specifically, the first cleaning fluid pipeline 241 delivers the cleaning fluid from the cleaning fluid storage tank 4 to the cleaning fluid inlet of the plating solution equipment 1, ensuring efficient and accurate dispensing of the cleaning fluid and improving cleaning efficiency. The cleaning fluid recovery tank 5 promptly recovers the cleaning fluid flowing out of the plating solution equipment 1, avoiding waste and helping to maintain a clean cleaning environment. The cleaning fluid temperature control unit 41 controls the temperature of the cleaning fluid to achieve both cold and hot cleaning processes.

[0079] Optionally, the cleaning solution can be deionized water used to clean the inner wall of the equipment 1 to be plated, or it can be a water-based cleaning agent, or other cleaning agents that can be used to clean the inner wall of the equipment 1 to be plated.

[0080] In some embodiments, see Figure 1 , Figure 4As shown, a first cleaning fluid valve 12 is provided on the first cleaning fluid pipeline 241, which controls the opening and closing of the first cleaning fluid pipeline 241. A second cleaning fluid valve 14 is provided on the second cleaning fluid pipeline 242, which controls the opening and closing of the second cleaning fluid pipeline 242. Specifically, the first cleaning fluid valve 12 controls the opening and closing of the first cleaning fluid pipeline 241, and the second cleaning fluid valve 14 controls the opening and closing of the second cleaning fluid pipeline 242, so that the flow of cleaning fluid between the cleaning fluid storage tank 4 and the equipment to be plated 1 can be more precisely controlled, improving the flexibility and reliability of the cleaning fluid circulation system 300.

[0081] In some embodiments, see Figure 1 As shown, a third filter 9 is provided on the second cleaning fluid pipeline 242. The third filter 9 is used to filter impurities in the plating solution that flows from the plating solution equipment 1 into the cleaning fluid recovery tank 5 through the second cleaning fluid pipeline 242.

[0082] In some embodiments, see Figure 1 , Figure 5 As shown, the plating solution system 100 also includes a pickling solution circulation system 400. The pickling solution circulation system 400 is used to introduce pickling solution into the interior of the plating solution equipment 1 and to circulate and recover the pickling solution flowing out of the interior of the plating solution equipment 1. Thus, the pickling solution circulation system 400 ensures that the plating solution equipment 1 receives sufficient pickling effect, improves the cleanliness of the inner wall of the plating solution equipment 1, and reduces environmental pollution and lowers costs by recycling the pickling solution flowing out of the plating solution equipment 1.

[0083] In some embodiments, see Figure 1 , Figure 5 As shown, the pickling solution circulation system 400 includes a pickling solution storage tank 6, a first pickling solution pipeline 251, a second pickling solution pipeline 252, and a pickling solution temperature control unit 61. The pickling solution storage tank 6 is used to store pickling solution. The first pickling solution pipeline 251 is used to connect the outlet of the pickling solution storage tank 6 to the pickling solution inlet of the plating solution equipment 1. The second pickling solution pipeline 252 is used to connect the outlet of the pickling solution of the plating solution equipment 1 to the inlet of the pickling solution storage tank 6. The pickling solution temperature control unit 61 is used to control the temperature of the pickling solution in the pickling solution storage tank 6, for example, the temperature of the pickling solution can be adjusted to around 35°C, around 45°C, around 50°C, etc.

[0084] Specifically, the setup of the first pickling solution pipeline 251 and the second pickling solution pipeline 252 allows the pickling solution to circulate between the pickling solution storage tank 6 and the plating solution equipment 1. The pickling solution flowing out of the plating solution equipment 1 is returned to the pickling solution storage tank 6 through the second pickling solution pipeline 252, realizing the recycling of the pickling solution, which helps to reduce environmental pollution and production costs.

[0085] Optionally, the pickling solution can be sulfuric acid, hydrochloric acid, nitric acid, or other cleaning agents that can be used to pickle the inner wall of the equipment 1 containing the plating solution.

[0086] In some embodiments, see Figure 1 As shown, the cleaning solution inlet and the pickling solution inlet of the plating solution equipment 1 are the same common inlet 103. The first cleaning solution pipeline 241 and the first pickling solution pipeline 251 are connected in parallel and connected to the common inlet 103 through a common pipeline 28. A common valve 10 is provided on the common pipeline 28 to control the opening and closing of the common pipeline 28. Therefore, by setting the cleaning solution inlet and the pickling solution inlet of the plating solution equipment 1 to the same common inlet 103, the number of interfaces on the plating solution equipment 1 is reduced, thereby simplifying the overall structure of the plating solution equipment 1, reducing the manufacturing cost of the plating solution equipment 1, and improving the reliability and stability of the plating solution equipment 1.

[0087] Optionally, the common valve 10 can be one, two, or more, for example... Figure 1 As shown, there are two public valves 10, which are installed at the inlet and outlet ends of the second pump 8, respectively.

[0088] In some embodiments not shown in the figure, the cleaning liquid inlet and the pickling liquid inlet of the plating solution device 1 are two different inlets. In other words, the first cleaning liquid pipeline 241 and the first pickling liquid pipeline 251 are respectively connected to the plating solution device 1.

[0089] In some embodiments, see Figure 1 , Figure 5 As shown, a first pickling solution valve 11 is installed on the first pickling solution pipeline 251, which controls the opening and closing of the first pickling solution pipeline 251. A second pickling solution valve 13 is installed on the second pickling solution pipeline 252, which controls the opening and closing of the second pickling solution pipeline 252. Specifically, the first pickling solution valve 11 controls the opening and closing of the first pickling solution pipeline 251, and the second pickling solution valve 13 controls the opening and closing of the second pickling solution pipeline 252. This allows for more precise control of the pickling solution flow between the pickling solution storage tank 6 and the plating solution equipment 1, improving the flexibility and reliability of the pickling solution circulation system 400.

[0090] In some embodiments, see Figure 1 As shown, a fourth filter 15 is provided on the second pickling solution pipeline 252. The fourth filter 15 is used to filter impurities in the plating solution that flows from the plating solution equipment 1 into the pickling solution storage tank 6 through the second pickling solution pipeline 252.

[0091] In some embodiments, see Figure 1As shown, the plating solution system 100 also includes a second pump 8, which is installed on the common pipeline 28. The second pump 8 is used to drive the liquid in the common pipeline 28 to flow to the plating solution equipment 1. Thus, the second pump 8 can provide a stable power source, allowing the cleaning solution or pickling solution in the common pipeline 28 to flow to the plating solution equipment 1 at a defined flow rate, shortening the rinsing time, and ensuring that the cleaning solution or pickling solution is fully and evenly distributed in the plating solution equipment 1, thereby improving the rinsing efficiency.

[0092] In some embodiments, see Figure 1 As shown, a nozzle 21 is provided at one end of the common pipeline 28, and the nozzle 21 is adapted to extend into the interior of the plating solution equipment 1. Thus, the nozzle 21 can increase the rinsing force, more effectively remove residues from the inner wall of the plating solution equipment 1, and accurately spray the cleaning solution or pickling solution into the interior of the plating solution equipment 1, ensuring that the plating solution equipment 1 is thoroughly rinsed, improving the efficiency of cleaning or pickling, and reducing the waste of cleaning solution or pickling solution.

[0093] In some embodiments, see Figure 1 , Figure 6 As shown, the plating solution system 100 also includes a purging system 500, which is used to selectively introduce purging gas into the interior of the plating solution device 1. Specifically, the purging system 500 can generate compressed gas at room temperature or heated to purge and dry the inner wall of the plating solution device 1, and can also effectively remove residues inside the plating solution device 1, thereby improving the plating quality.

[0094] In some embodiments, see Figure 1 , Figure 6 As shown, the purging system 500 includes a purging storage tank 2 and a purging pipeline 26. The purging storage tank 2 stores purging gas, and the purging pipeline 26 connects the purging storage tank 2 to the plating solution device 1. Specifically, the purging storage tank 2 contains compressed gas at room temperature or heated. The compressed gas enters the plating solution device 1 from the purging storage tank 2 through the purging pipeline 26, removing residues inside the plating solution device 1 and purging and drying the inner wall of the plating solution device 1.

[0095] In some embodiments, the purge storage tank 2 includes gas compression and heating equipment, which can provide compressed gas (nitrogen or air, etc.) at room temperature or heated.

[0096] In some embodiments, the purging system 500 further includes a purging valve 18, which controls the opening and closing of the purging line 26.

[0097] It should be noted that all valves in this utility model are not limited to any particular type or category. The common valve 10, the first valve 12 of the cleaning fluid, the first valve 11 of the pickling fluid, the second valve 13 of the pickling fluid, the second valve 14 of the cleaning fluid, the first valve 16 of the plating solution, the third valve 17 of the plating solution, the purging valve 18, and the second valve 19 of the plating solution can all be any device that can be used to control the flow of fluid in a pipe or container. In some embodiments, any one or more of these valves can also adjust the flow rate in the pipe in which they are located.

[0098] The following will describe the specific implementation process of one embodiment of the present invention, taking the electroless nickel plating of the inner wall of the plating solution equipment 1 as an example.

[0099] Before electroless nickel plating is performed on the inner wall of the large plating solution equipment 1, the plating solution circulation system 200 and its pipelines are not connected to the inlet of the plating solution equipment 1, while the cleaning solution circulation system 300 and the pickling solution circulation system 400 and their pipelines are connected to the inlet of the plating solution equipment 1. The operator should enter the interior of the plating solution equipment 1 through the equipment manhole, visually inspect the inner wall of the plating solution equipment 1, and polish and grind the parts of the inner wall of the plating solution equipment 1 with poor surface quality.

[0100] See Figure 4 As shown, after polishing and grinding are completed, the cleaning fluid circulation system 300 is turned on to perform cold cleaning of the plating solution equipment 1. The common valve 10, the first cleaning fluid valve 12 and the second cleaning fluid valve 14 are opened. The cleaning fluid in the cleaning fluid storage tank 4 is driven by the second pump 8, passes through the first cleaning fluid pipeline 241, and through the nozzle 21 to perform cold cleaning of the inner wall of the plating solution equipment 1. The cleaning fluid is then returned to the cleaning fluid recovery tank 5 through the second cleaning fluid pipeline 242 and the third filter 9.

[0101] See Figure 5 As shown, after cold cleaning, the first cleaning fluid valve 12 and the second cleaning fluid valve 14 are closed, and the pickling solution circulation system 400 is turned on to perform pickling on the plating solution equipment 1. The first pickling fluid valve 11 and the second pickling fluid valve 13 are opened. The pickling solution in the pickling solution storage tank 6, driven by the second pump 8, flows through the first pickling fluid pipeline 251 and through the nozzle 21 to pickle the inner wall of the plating solution equipment 1. The pickling solution then flows back to the pickling solution storage tank 6 through the second pickling fluid pipeline 252 and the fourth filter 15. According to process requirements, the pickling solution in the pickling solution storage tank 6 can be heated to the corresponding temperature by the pickling solution temperature control unit 61 before proceeding with the pickling process.

[0102] See Figure 4As shown, after pickling, the second pickling solution pipeline 252 is disconnected from the port of the equipment 1 to be plated, and the corresponding port is sealed. The cleaning solution circulation system 300 is restarted to perform hot cleaning on the equipment 1 to be plated. The cleaning solution in the cleaning solution storage tank 4 is heated to about 50°C by the cleaning solution temperature control unit 41. The first cleaning solution valve 12 and the second cleaning solution valve 14 are opened again. Driven by the second pump 8, the cleaning solution in the cleaning solution storage tank 4 passes through the first cleaning solution pipeline 241 and the nozzle 21 to perform hot cleaning on the inner wall of the equipment 1 to be plated. The cleaning solution flows back to the cleaning solution recovery tank 5 through the second cleaning solution pipeline 242 and the third filter 9.

[0103] See Figure 2 As shown, after the hot cleaning is completed, disconnect the second cleaning fluid pipeline 242 from the port of the plating solution device 1, remove the nozzle 21 from the plating solution device 1, connect the first plating solution pipeline 231 and the second plating solution pipeline 232, install the distributor 20, and finally seal the corresponding ports on the plating solution device 1.

[0104] After adjusting the parameters of the plating solution in the plating solution storage tank 3 to meet the set values ​​through the plating solution temperature monitoring and control unit 31, plating solution concentration monitoring and control unit 32, and plating solution pH value monitoring and control unit 33, the third valve 17 of the plating solution on the plating solution recovery pipeline 233 is closed, the first valve 16 and the second valve 19 of the plating solution are opened, and the first pump 7 is turned on. Driven by the first pump 7, the plating solution in the plating solution storage tank 3 enters the interior of the plating solution equipment 1 through the first plating solution pipeline 231. After the plating solution fills the interior of the plating solution equipment 1, it returns to the plating solution storage tank 3 through the second plating solution pipeline 232 and the first filter 22. Throughout the entire electroless nickel plating process, the plating solution temperature monitoring and control unit 31, plating solution concentration monitoring and control unit 32, and plating solution pH value monitoring and control unit 33 monitor and adjust the parameters of the plating solution in real time to ensure that all process parameters meet the set values, thus making the nickel plating quality of the equipment controllable. The nickel ion consumption and nickel plating time are estimated by the plating solution concentration monitoring and control unit 3232. Combined with the inner surface area of ​​the equipment 1 to be plated, the coating thickness range can be basically determined.

[0105] See Figure 3 As shown, after electroless nickel plating is completed, the first plating solution valve 16 is closed, and the third plating solution valve 17 is opened. The plating solution in the plating solution equipment 1 flows back to the plating solution storage tank 3 through the plating solution recovery pipeline 233. After the plating solution is drained, the first plating solution pipeline 231 and the second plating solution pipeline 232 are disconnected, and the first cleaning solution pipeline 241 and the second cleaning solution pipeline 242 are reconnected. The second pump 8 is started to flush the inner wall of the plating solution equipment 1. (See reference...) Figure 6As shown, after rinsing, disconnect the first cleaning fluid line 241 and the second cleaning fluid line 242. Then, connect the purge line 26 to the plating solution equipment 1, open the purge valve 18, and start the purge storage tank 2. Use the room temperature or heated compressed gas (nitrogen or air, etc.) generated by the purge storage tank 2 to purge and dry the inner wall of the plating solution equipment 1, thereby improving the plating quality. After purging, disconnect the purge line 26, and the electroless nickel plating of the inner wall of the plating solution equipment 1 is complete.

[0106] In the description of this application, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0107] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0108] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0109] Although this embodiment has been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present application.

Claims

1. A plating solution system (100), characterized in that, Includes a plating solution circulation system (200), the plating solution circulation system (200) being adapted to connect to a plating solution device (1), the plating solution circulation system (200) being used to drive the plating solution to circulate between the plating solution device (1) and the plating solution circulation system (200); The plating solution circulation system (200) includes: Plating solution storage tank (3); A first plating solution pipeline (231) is provided, one end of which is connected to the plating solution storage tank (3), and the other end of which is connected to the plating solution equipment (1). The plating solution in the plating solution storage tank (3) is suitable for entering the plating solution equipment (1) through the first plating solution pipeline (231). The second plating solution pipeline (232) is connected at one end to the plating solution storage tank (3) and at the other end to the plating solution device (1). The plating solution in the plating solution device (1) is suitable to flow to the plating solution storage tank (3) through the second plating solution pipeline (232).

2. The plating solution system (100) according to claim 1, characterized in that, One end of the first plating solution pipeline (231) is connected to the first storage tank interface (34) of the plating solution storage tank (3), and the other end of the first plating solution pipeline (231) is formed as a pipeline first interface (2311) for connecting the equipment (1) to be plating. One end of the second plating solution pipeline (232) is connected to the second storage tank interface (35) of the plating solution storage tank (3), and the other end of the second plating solution pipeline (232) is formed as a pipeline second interface (2321) for connecting the equipment (1) to be plating solution.

3. The plating solution system (100) according to claim 2, characterized in that, The first interface (2311) of the pipeline is located below the second interface (2321) of the pipeline.

4. The plating solution system (100) according to claim 2, characterized in that, The first plating solution pipeline (231) is provided with a first plating solution valve (16) for controlling the opening and closing of the first plating solution pipeline (231); and / or, The second plating solution pipeline (232) is provided with a second plating solution valve (19) for controlling the opening and closing of the second plating solution pipeline (232).

5. The plating solution system (100) according to claim 2, characterized in that, The plating solution system (100) also includes a plating solution recovery pipeline (233), which is connected in parallel with the first plating solution pipeline (231) and is located between the plating solution storage tank (3) and the equipment to be plating (1).

6. The plating solution system (100) according to claim 5, characterized in that, The first plating solution pipeline (231) is provided with a first plating solution valve (16) for controlling the opening and closing of the first plating solution pipeline (231), and the third plating solution valve (17) for controlling the opening and closing of the plating solution recovery pipeline (233) is provided on the plating solution recovery pipeline (233).

7. The plating solution system (100) according to claim 2, characterized in that, The plating solution circulation system (200) further includes a first pump (7), which is disposed on the first plating solution pipeline (231). The first pump (7) is used to drive the plating solution in the first plating solution pipeline (231) to flow to the plating solution equipment (1).

8. The plating solution system (100) according to claim 2, characterized in that, The plating solution circulation system (200) also includes: The plating solution temperature monitoring and control unit (31) is used to monitor the temperature of the plating solution in the plating solution storage tank (3) and control the temperature of the plating solution in the plating solution storage tank (3) to maintain within a preset temperature range. The plating solution concentration monitoring and control unit (32) is used to monitor the concentration of the plating solution in the plating solution storage tank (3) and control the concentration of the plating solution in the plating solution storage tank (3) to maintain within a preset concentration range. The plating solution pH value monitoring and control unit (33) is used to monitor the pH value of the plating solution in the plating solution storage tank (3) and control the pH value of the plating solution in the plating solution storage tank (3) to maintain it within a preset pH value range.

9. The plating solution system (100) according to claim 2, characterized in that, A distributor (20) is provided at the first interface (2311) of the pipeline, and the distributor (20) is adapted to be installed in the plating solution equipment (1).

10. The plating solution system (100) according to any one of claims 1-9, characterized in that, The plating solution system (100) further includes a cleaning solution circulation system (300), which is used to introduce cleaning solution into the interior of the plating solution device (1) and to recover the cleaning solution flowing out of the interior of the plating solution device (1).

11. The plating solution system (100) according to claim 10, characterized in that, The cleaning fluid circulation system (300) includes: Cleaning fluid storage tank (4), the cleaning fluid storage tank (4) is used to store cleaning fluid; Cleaning solution recovery tank (5), the cleaning solution recovery tank (5) is used to recover the cleaning solution flowing out from the plating solution equipment (1); The first cleaning fluid pipeline (241) is used to connect the outlet of the cleaning fluid storage tank (4) to the cleaning fluid inlet of the plating solution equipment (1); The second cleaning fluid pipeline (242) is used to connect the cleaning fluid outlet of the equipment to be plated (1) to the inlet of the cleaning fluid recovery tank (5); The cleaning fluid temperature control unit (41) is used to control the temperature of the cleaning fluid in the cleaning fluid storage tank (4).

12. The plating solution system (100) according to claim 11, characterized in that, The first cleaning fluid pipeline (241) is provided with a first cleaning fluid valve (12) for controlling the opening and closing of the first cleaning fluid pipeline (241). The second cleaning fluid pipeline (242) is provided with a second cleaning fluid valve (14) for controlling the opening and closing of the second cleaning fluid pipeline (242).

13. The plating solution system (100) according to claim 11, characterized in that, The plating solution system (100) also includes an acid pickling solution circulation system (400), which is used to introduce acid pickling solution into the interior of the plating solution equipment (1) and to circulate and recover the acid pickling solution flowing out of the interior of the plating solution equipment (1).

14. The plating solution system (100) according to claim 13, characterized in that, The pickling solution circulation system (400) includes: Pickling solution storage tank (6), the pickling solution storage tank (6) is used to store pickling solution; The first pickling solution pipeline (251) is used to connect the outlet of the pickling solution storage tank (6) to the pickling solution inlet of the plating solution equipment (1); The second pickling solution pipeline (252) is used to connect the pickling solution outlet of the plating solution equipment (1) to the inlet of the pickling solution storage tank (6); Pickling solution temperature control unit (61) is used to control the temperature of the pickling solution in the pickling solution storage tank (6).

15. The plating solution system (100) according to claim 14, characterized in that, The cleaning liquid inlet and the pickling liquid inlet of the plating solution equipment (1) are the same common inlet (103). The first cleaning liquid pipeline (241) and the first pickling liquid pipeline (251) are connected in parallel and connected to the common inlet (103) through a common pipeline (28). A common valve (10) is provided on the common pipeline (28), and the common valve (10) is used to control the opening and closing of the common pipeline (28).

16. The plating solution system (100) according to claim 15, characterized in that, The first pickling liquid pipeline (251) is provided with a first pickling liquid valve (11) for controlling the opening and closing of the first pickling liquid pipeline (251); The second pickling liquid pipeline (252) is provided with a second pickling liquid valve (13) for controlling the opening and closing of the second pickling liquid pipeline (252).

17. The plating solution system (100) according to claim 16, characterized in that, The plating solution system (100) also includes a second pump (8), which is disposed on the common pipeline (28) and is used to drive the liquid in the common pipeline (28) to flow to the plating solution device (1).

18. The plating solution system (100) according to claim 16, characterized in that, One end of the common pipeline (28) is provided with a nozzle (21), which is adapted to extend into the interior of the plating solution equipment (1).

19. The plating solution system (100) according to claim 1, characterized in that, The plating solution system (100) further includes a purging system (500) for selectively introducing purging gas into the interior of the plating solution device (1).

20. The plating solution system (100) according to claim 19, characterized in that, The purging system (500) includes: A purge storage tank (2) is used to store purge gas; A purge line (26) is used to connect the purge storage tank (2) to the plating solution equipment (1).

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