A die-bonding adhesive thickness detection jig
By designing a fixture for measuring the thickness of adhesive residue, and utilizing a combination of an electric push rod and a white light interferometric thickness sensor, the problem of adhesive residue bonding detection stage was solved, enabling rapid removal and efficient, accurate measurement of adhesive residue thickness.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- JIANGSU MINGXIN ADVANCED TECHNOLOGY CO LTD
- Filing Date
- 2025-09-10
- Publication Date
- 2026-06-23
AI Technical Summary
The adhesive residue tends to stick to the surface of the testing station after testing, making it difficult to remove quickly and affecting testing efficiency.
A fixture for measuring the thickness of adhesive film was designed, comprising a placement component and an adjustment component. The adhesive film is lifted by an electric push rod, and the position of the white light interferometric thickness sensor is adjusted. The thickness of the adhesive film is measured by analyzing the changes in interference fringes using the white light interferometric thickness sensor.
This technology enables rapid removal of adhesive residue, improving testing efficiency and accuracy, and ensuring the comprehensiveness and accuracy of the testing.
Smart Images
Figure CN224398598U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of adhesive thickness detection technology, and in particular to an adhesive thickness detection fixture. Background Technology
[0002] Component adhesives are widely used in many industrial and manufacturing sectors. For example, in the electronics industry, they are essential for bonding chips to substrates and fabricating multilayer circuit boards. The thickness of the adhesive has a crucial impact on the performance of the bonded components. If the adhesive is too thin, it may lead to weak adhesion, delamination, and other problems, affecting product reliability and lifespan. Conversely, if the adhesive is too thick, it may result in material waste and may not meet design requirements in some space-constrained products.
[0003] During testing, the adhesive is placed on the testing stage and then measured using a white light interferometric thickness sensor. However, after the test, the adhesive tends to stick to the surface of the testing stage, making it difficult to remove quickly and affecting subsequent tests, thus reducing testing efficiency. Therefore, we propose an adhesive thickness measurement fixture. Utility Model Content
[0004] To solve the above-mentioned technical problems, this utility model provides a fixture for detecting the thickness of adhesive film.
[0005] This utility model is achieved using the following technical solution: a fixture for detecting the thickness of adhesive film, including a fixed platform, a fixed frame fixedly connected to the top of the fixed platform, a placement component provided on the top of the fixed platform, a white light interferometric thickness sensor provided at the upper end of the placement component, an adjustment component provided inside the fixed frame, a data acquisition card fixedly connected to the top of the fixed frame, and a computer processing device fixedly connected to the top of the fixed frame.
[0006] The placement assembly includes a placement platform, with support columns fixedly connected to the four corners of the bottom of the placement platform. A through groove is provided in the middle of the support column, and limit grooves are provided on both sides of the through groove. A lifting plate is provided inside the through groove, and an electric push rod is fixedly connected to the bottom of the lifting plate.
[0007] By connecting the electric push rod to an external power source, the output end of the electric push rod pushes the lifting plate upward, lifting the adhesive and preventing it from sticking to the surface of the placement stage. This facilitates quick removal of the adhesive and improves testing efficiency.
[0008] As a further improvement to the above solution, the top of the support column is fixedly connected to the top of the fixed platform, and both ends of the lifting plate are in contact with the inner wall of the limiting groove.
[0009] The above technical solution uses limiting grooves to limit the two ends of the lifting plate, thus preventing excessive movement of the lifting plate.
[0010] As a further improvement to the above solution, the bottom of the electric push rod is fixedly connected to the top of the fixed platform.
[0011] As a further improvement to the above solution, the adjustment component includes a motor, the output end of which is fixedly connected to a lead screw, the surface of which is threadedly connected to a mounting base, the front end of which is fixedly connected to a first cylinder, the front end of which is fixedly connected to a mounting plate, and the top of which is fixedly connected to a second cylinder.
[0012] With the above technical solution, the motor is connected to an external power source during use, and the first and second cylinders are connected to an external air source for easy subsequent use. The motor drives the lead screw to rotate, causing the mounting base to move, thereby adjusting the left and right position of the white light interferometric thickness sensor. The first cylinder pushes the mounting plate forward to adjust the front and back position of the white light interferometric thickness sensor. The second cylinder drives the white light interferometric thickness sensor downward, which facilitates the detection of different positions of the adhesive film by the white light interferometric thickness sensor and improves the comprehensiveness of the detection.
[0013] As a further improvement to the above solution, the left end of the motor is fixedly connected to the right end of the fixed frame, and both ends of the lead screw are rotatably connected to the inner wall of the fixed frame.
[0014] As a further improvement to the above solution, the front end of the mounting base is slidably connected to the inner wall of the fixing frame.
[0015] The above technical solution provides a limiting groove at the front end of the mounting bracket to limit the front end of the mounting base, ensuring the stability of the mounting base during movement and preventing deviation.
[0016] As a further improvement to the above solution, the output end of the second cylinder passes through the mounting plate and is fixedly connected to the top of the white light interferometric thickness sensor.
[0017] Based on the above technical solution, the white light interferometric thickness sensor is model SGC10. The measurement principle of the white light interferometric thickness sensor is based on the phenomenon of light interference. When two or more coherent light waves meet at a certain point in space, if their phase difference is an integer multiple of 2π, light enhancement will occur at that point, i.e., interference phenomenon. Using this principle, the multicolor light waves emitted by the white light source interact with the light waves reflected or transmitted from the surface of the object being measured to form interference fringes, thereby achieving high-precision measurement of the surface morphology of the object.
[0018] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0019] This invention improves testing efficiency by setting up a placement component. Specifically, by activating an electric push rod, the output end of the electric push rod pushes the lifting plate upward, lifting the adhesive and preventing it from sticking to the placement table surface. This facilitates quick removal of the adhesive and increases testing efficiency.
[0020] This invention utilizes an adjustment mechanism. Specifically, a motor drives a lead screw to rotate, causing the mounting base to move and thus adjusting the left-right position of the white light interferometric thickness sensor. A first cylinder pushes the mounting plate forward, adjusting the front-back position of the white light interferometric thickness sensor. A second cylinder moves the white light interferometric thickness sensor downward. Once the white light interferometric thickness sensor is adjusted to the appropriate position, it emits white light. By analyzing the changes in interference fringes, the thickness of the adhesive is measured, facilitating the detection of different positions of the adhesive and improving detection accuracy. Attached Figure Description
[0021] Figure 1 This is a schematic diagram of the overall structure of this utility model;
[0022] Figure 2 This is a schematic cross-sectional view of the present invention.
[0023] Figure 3 This is a schematic diagram of the component placement structure of this utility model;
[0024] Figure 4 This is a schematic diagram of the adjustment component structure of this utility model;
[0025] Figure 5 This is a side view of the structure of this utility model.
[0026] Explanation of key symbols:
[0027] 1. Fixed platform; 2. Fixed frame; 3. White light interferometric thickness sensor; 4. Placement assembly; 401. Placement platform; 402. Support column; 403. Through groove; 404. Limiting groove; 405. Lifting plate; 406. Electric push rod; 5. Adjustment assembly; 501. Motor; 502. Lead screw; 503. Mounting base; 504. First cylinder; 505. Mounting plate; 506. Second cylinder; 6. Data acquisition card; 7. Computer processing equipment. Detailed Implementation
[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0029] Example:
[0030] Please combine Figure 1-5This embodiment of a bonding adhesive thickness detection fixture includes a fixed platform 1, a fixed frame 2 fixedly connected to the top of the fixed platform 1, a placement component 4 provided on the top of the fixed platform 1, a white light interferometric thickness sensor 3 provided at the upper end of the placement component 4, an adjustment component 5 provided inside the fixed frame 2, a data acquisition card 6 fixedly connected to the top of the fixed frame 2, and a computer processing device 7 fixedly connected to the top of the fixed frame 2.
[0031] The placement component 4 includes a placement stage 401. Support columns 402 are fixedly connected to the four corners of the bottom of the placement stage 401. A through groove 403 is opened in the middle of the support column 402. Limiting grooves 404 are opened on both sides of the through groove 403. A lifting plate 405 is set inside the through groove 403. An electric push rod 406 is fixedly connected to the bottom of the lifting plate 405. The white light interferometric thickness sensor 3 emits white light and measures the thickness of the adhesive by analyzing the changes in the interference fringes. After the detection is completed, the electric push rod 406 is activated. The output end of the electric push rod 406 pushes the lifting plate 405 upward, lifting the adhesive and preventing it from sticking to the surface of the placement stage 401. This facilitates the quick removal of the adhesive, thereby improving the detection efficiency. The data detected by the white light interferometric thickness sensor is transmitted to a computer processing device for processing, analysis and storage through a data acquisition card.
[0032] The top of the support column 402 is fixedly connected to the top of the fixed platform 1, and both ends of the lifting plate 405 are in contact with the inner wall of the limiting groove 404.
[0033] The bottom of the electric push rod 406 is fixedly connected to the top of the fixed platform 1.
[0034] The adjustment component 5 includes a motor 501, with a lead screw 502 fixedly connected to the output end of the motor 501. A mounting base 503 is threaded onto the surface of the lead screw 502. A first cylinder 504 is fixedly connected to the front end of the mounting base 503, and a mounting plate 505 is fixedly connected to the front end of the first cylinder 504. A second cylinder 506 is fixedly connected to the top of the mounting plate 505. The motor 501 drives the lead screw 502 to rotate, causing the mounting base 503 to move, thereby adjusting the left and right position of the white light interferometric thickness sensor 3. The first cylinder 504 pushes the mounting plate 505 forward, adjusting the front and rear position of the white light interferometric thickness sensor 3. The second cylinder 506 drives the white light interferometric thickness sensor 3 downward, facilitating the detection of different positions of the adhesive film and improving detection accuracy.
[0035] The left end of the motor 501 is fixedly connected to the right end of the fixed frame 2, and both ends of the lead screw 502 are rotatably connected to the inner wall of the fixed frame 2.
[0036] The front end of the mounting base 503 is slidably connected to the inner wall of the fixing bracket 2.
[0037] The output end of the second cylinder 506 passes through the mounting plate 505 and is fixedly connected to the top of the white light interferometric thickness sensor 3.
[0038] The implementation principle of the adhesive thickness detection fixture in this embodiment is as follows: During use, the adhesive to be tested is placed on the placement platform 401. The motor 501 drives the lead screw 502 to rotate, causing the mounting base 503 to move, thereby adjusting the left-right position of the white light interferometric thickness sensor 3. The first cylinder 504 pushes the mounting plate 505 forward, adjusting the front-back position of the white light interferometric thickness sensor 3. The second cylinder 506 drives the white light interferometric thickness sensor 3 downward. When the white light interferometric thickness sensor 3 is adjusted to the appropriate position, the adhesive thickness is detected. The optical interferometric thickness sensor 3 emits white light. By analyzing the changes in interference fringes, the thickness of the adhesive is measured, which facilitates the detection of different positions of the adhesive and improves the detection accuracy. After the detection is completed, the data detected by the white light interferometric thickness sensor 3 is transmitted to the computer processing device 7 through the data acquisition card 6 for processing, analysis and storage. The electric push rod 406 is activated, and the output end of the electric push rod 406 pushes the lifting plate 405 upward to lift the adhesive, preventing the adhesive from sticking to the surface of the placement stage 401, which facilitates the quick removal of the adhesive and thus improves the detection efficiency.
[0039] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.
Claims
1. A die-bonding adhesive thickness detection jig, characterized by, Includes a fixed platform (1), a fixed frame (2) is fixedly connected to the top of the fixed platform (1), a placement component (4) is provided on the top of the fixed platform (1), a white light interferometric thickness sensor (3) is provided at the upper end of the placement component (4), an adjustment component (5) is provided inside the fixed frame (2), a data acquisition card (6) is fixedly connected to the top of the fixed frame (2), and a computer processing device (7) is fixedly connected to the top of the fixed frame (2). The placement component (4) includes a placement platform (401), with support columns (402) fixedly connected to the four corners of the bottom of the placement platform (401). A through groove (403) is provided in the middle of the support column (402), and limit grooves (404) are provided on both sides of the through groove (403). A lifting plate (405) is provided inside the through groove (403), and an electric push rod (406) is fixedly connected to the bottom of the lifting plate (405).
2. The die-bonding adhesive thickness detection tool of claim 1, wherein: The top of the support column (402) is fixedly connected to the top of the fixed platform (1), and both ends of the lifting plate (405) are in contact with the inner wall of the limiting groove (404).
3. The die-bonding adhesive thickness detection tool of claim 1, wherein: The bottom of the electric push rod (406) is fixedly connected to the top of the fixed platform (1).
4. The die-bonding adhesive thickness detection tool of claim 1, wherein: The adjustment component (5) includes a motor (501), the output end of which is fixedly connected to a lead screw (502), the surface of which is threadedly connected to a mounting base (503), the front end of which is fixedly connected to a first cylinder (504), the front end of which is fixedly connected to a mounting plate (505), and the top of which is fixedly connected to a second cylinder (506).
5. The adhesive thickness detection fixture as described in claim 4, characterized in that: The left end of the motor (501) is fixedly connected to the right end of the fixed frame (2), and the two ends of the lead screw (502) are rotatably connected to the inner wall of the fixed frame (2).
6. The adhesive thickness detection fixture as described in claim 4, characterized in that: The front end of the mounting base (503) is slidably connected to the inner wall of the fixing frame (2).
7. The adhesive thickness detection fixture as described in claim 4, characterized in that: The output end of the second cylinder (506) passes through the mounting plate (505) and is fixedly connected to the top of the white light interferometric thickness sensor (3).