A test bench of a multi-heat-source air-cooled radiator based on a loop heat pipe

Abstract

The utility model relates to a kind of test bench of multiple heat source air-cooled radiator based on loop heat pipe in the test technical field of loop heat pipe air-cooled radiator, including multiple heat source air-cooled radiating module, N heat source, temperature acquisition instrument, air duct, air parameter acquisition instrument, power adapter and support;The multiple heat source air-cooled radiating module includes steam header, liquid header, radiator and N group of radiating unit;The radiating unit includes evaporator, steam pipeline and liquid pipeline.The utility model has multiple heat source scene simulation ability, test working condition flexible adjustable, and can realize the multiple heat source air-cooled radiator test bench based on loop heat pipe of multidimensional data monitoring, it has important significance to accurately evaluate radiator performance, accelerate product development process.

Description

Technical Field

[0001] This utility model relates to the field of testing technology for loop heat pipe air-cooled radiators, and in particular to a test bench for multi-heat source air-cooled radiators based on loop heat pipes. Background Technology

[0002] With the widespread application of high-performance computing, artificial intelligence, and 3D modeling and rendering technologies in computer workstations, multiple core components such as processors, graphics cards, memory modules, and power chips generate a large amount of heat simultaneously during operation, creating a complex heat dissipation scenario with multiple heat sources. Meanwhile, the internal layout of modern computer workstations is becoming increasingly compact, making it difficult for traditional cooling methods to meet the efficient heat dissipation requirements of multi-heat-source and complex layouts. Multi-heat-source loop heat pipe air coolers, with their ability to connect multiple heat-generating components simultaneously, uniformly and efficiently transfer and distribute heat, and their flexible adaptation to complex and compact layouts, have become an important direction for solving the heat dissipation problem of computer workstations.

[0003] However, in the research and optimization of multi-heat-source loop heat pipe air-cooled radiators, a professional testing platform is urgently needed to evaluate their performance. Traditional radiator test benches are mostly designed for single heat sources or simple heat dissipation structures, making it difficult to simulate the real-world operating conditions of computer workstations with multiple heat sources and complex layouts, resulting in test results that are out of touch with actual application scenarios. Furthermore, existing test benches have poor design flexibility, making it difficult to quickly adjust parameters such as the number, power, and layout of heat sources according to research and development needs, leading to low testing efficiency and high costs. At the same time, most test benches only monitor temperature parameters, resulting in a single data dimension, insufficient data correlation, one-sided evaluation dimensions, and difficulty in supporting multi-parameter collaborative optimization, thus failing to meet the needs of multi-heat-source loop heat pipe air-cooled radiators research and development and iteration.

[0004] Therefore, designing a test bench for multi-heat source air-cooled radiators based on loop heat pipes, which has the ability to simulate multiple heat source scenarios, flexible and adjustable test conditions, and can realize multi-dimensional data monitoring, is of great significance for accurately evaluating radiator performance and accelerating product development. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model proposes a test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe. The test bench includes a multi-heat-source air-cooled radiator module, a heating device, a temperature acquisition instrument, an air duct, and an air parameter acquisition instrument. The layout of the pipes and components of the multi-heat-source loop heat pipe air-cooled radiator module can be adjusted by modifying the support frame to meet the requirements of complex actual layouts. An air duct is established and connected to the air outlet of the air-cooled radiator, and installed on the support frame of the test bench to simulate a real heat dissipation environment. In addition to the conventional loop heat pipe temperature monitoring points, an air parameter monitoring point is added at the air-cooled radiator for more accurate performance evaluation. The test bench can accommodate N heat sources, and the corresponding multi-heat-source loop heat pipe air-cooled radiator is equipped with N evaporators to handle complex operating conditions. The technical solution of this utility model is implemented as follows:

[0006] A test bench for a multi-heat-source air-cooled heat sink based on a loop heat pipe includes a multi-heat-source air-cooled heat sink module, N heat sources, a temperature acquisition instrument, an air duct, an air parameter acquisition instrument, a power adapter, and a bracket.

[0007] The multi-heat source air-cooled heat dissipation module includes a vapor manifold, a liquid manifold, a radiator, and N sets of heat dissipation units;

[0008] The heat dissipation unit includes an evaporator, vapor lines, and liquid lines;

[0009] N groups of heat dissipation units are connected to N heat sources respectively;

[0010] The inlet and outlet of the radiator are respectively connected to the vapor manifold and the liquid manifold;

[0011] The working fluid inlet and outlet of the evaporator are respectively connected to the vapor manifold and the liquid manifold;

[0012] The evaporator is connected to the heat source;

[0013] The multi-heat source air-cooled heat dissipation module, the N heat sources, and the air duct are all installed inside the bracket, and the air duct is installed above the bracket and connected to the heat sink;

[0014] Temperature detection points are provided for all N heat sources, the evaporator, the steam pipeline, the liquid pipeline, and the radiator.

[0015] The temperature acquisition instrument collects temperature information from the temperature detection point via wired or wireless means and communicates with the host computer.

[0016] Air parameter collection points are provided in the air duct and the multi-heat source air-cooled heat dissipation module;

[0017] The air parameter acquisition instrument collects information from the air parameter acquisition points via wired or wireless means and communicates with the host computer.

[0018] The power adapter is connected to the heat source.

[0019] Preferably, the heat source includes a top cover, a heating block, a heating rod, a base, and bolts;

[0020] The heating block includes a heat source measuring point groove, the heating rod is connected to the heating block, the heating block is disposed in the base, and the top cover, the heating block and the base are fixed by the bolts.

[0021] Preferably, the heating rod includes a positive electrode and a negative electrode.

[0022] Preferably, the temperature parameter acquisition instrument includes a first RS485 communication interface.

[0023] Preferably, the power adapter includes a positive electrode and a negative electrode of the electric heating device;

[0024] The positive electrode of the electric heating device is connected to the positive electrode of the heating rod, and the negative electrode of the electric heating device is connected to the negative electrode of the heating rod.

[0025] Preferably, the power of the heat source is 600W-1500kW.

[0026] Preferably, the heat source includes at least two heating rods;

[0027] The positive electrodes of at least two heating rods are connected in parallel and then connected to the positive electrode of the electric heating device, and the negative electrodes of at least two heating rods are connected in parallel and then connected to the negative electrode of the electric heating device.

[0028] Preferably, among the N heat sources, the specifications of the heat sources are the same or different.

[0029] Preferably, the radiator includes an air-cooled radiator and a fan.

[0030] Preferably, the air parameter acquisition instrument includes a second RS485 communication interface.

[0031] The advantages of this utility model are as follows:

[0032] 1. This utility model uses a three-dimensionally adjustable bracket to arrange the pipes and components of the loop heat pipe air-cooled radiator according to the actual scenario, so as to improve the installation efficiency and accuracy.

[0033] 2. This utility model designs a detachable air duct on the test bench for air-cooled heat sinks to accurately simulate the real heat dissipation environment.

[0034] 3. This utility model combines a multi-heat-source loop heat pipe platform with a multi-evaporator adapter architecture to meet the needs of multiple heat sources under complex working conditions.

[0035] 4. This utility model combines an air parameter acquisition instrument with a temperature acquisition instrument to improve the accuracy of loop heat pipe test data, deepen the understanding of the performance of multi-heat source loop heat pipe air-cooled radiators, and provide a theoretical basis for optimization and product selection. Attached Figure Description

[0036] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only one embodiment of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0037] Identical parts are indicated by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "bottom surface," "top surface," "inner," and "outer" refer to directions toward or away from the geometric center of a specific part, respectively.

[0038] Figure 1 This is a schematic diagram of the structure of Embodiment 1 of the present utility model;

[0039] Figure 2 for Figure 1 The structural side view of the embodiment shown;

[0040] Figure 3 for Figure 1 The right view of the structure of the embodiment shown;

[0041] Figure 4 for Figure 1 The illustrated embodiment shows a side view of the structure of the multi-heat source air-cooled heat dissipation module;

[0042] Figure 5 for Figure 1 The right view of the multi-heat source air-cooled heat dissipation module structure in the embodiment shown;

[0043] Figure 6 for Figure 1 The embodiment shown is a side view of the structure of the first heat source;

[0044] Figure 7 for Figure 1 The exploded view of the first heat source structure in the embodiment shown;

[0045] Figure 8 This is a schematic diagram of the structure of Embodiment 2 of the present invention;

[0046] Figure 9 for Figure 8The structural side view of the embodiment shown;

[0047] Figure 10 for Figure 8 The illustrated embodiment shows a side view of the multi-heat source air-cooled heat dissipation module structure.

[0048] In the above figures, the figure numbers indicate the following:

[0049] 1. Multi-heat source air-cooled heat dissipation module;

[0050] 1-1, First Evaporator;

[0051] 1-2, Second evaporator;

[0052] 1-3, Third Evaporator;

[0053] 1-4, Fourth Evaporator;

[0054] 1-5, First steam pipeline;

[0055] 1-6, Second steam pipeline;

[0056] 1-7, Third steam pipeline;

[0057] 1-8, Fourth steam pipeline;

[0058] 1-9. Steam header;

[0059] 1-10. Air-cooled radiator;

[0060] 1-11. Liquid manifold;

[0061] 1-12, First liquid pipeline;

[0062] 1-13, Second liquid pipeline;

[0063] 1-14, Third liquid pipeline;

[0064] 1-15, Fourth liquid pipeline;

[0065] 1-16. Fan;

[0066] 2. Primary heat source;

[0067] 2-1. Top cover;

[0068] 2-2. Heating block;

[0069] 2-2-1. Heat source measuring point slot;

[0070] 2-3. Heating rod;

[0071] 2-3-1, Positive electrode of heating rod;

[0072] 2-3-2, Negative electrode of heating rod;

[0073] 2-4. Base;

[0074] 2-5. Bolts;

[0075] 3. Second heat source;

[0076] 4. Third heat source;

[0077] 5. The fourth heat source;

[0078] 6. Temperature acquisition instrument;

[0079] 6-1. Temperature measuring point of the first heat source;

[0080] 6-2. Temperature measuring point of the first evaporator;

[0081] 6-3. Temperature measuring point of the first steam pipeline;

[0082] 6-4. Temperature measuring point of the first liquid pipeline;

[0083] 6-5. Temperature measuring point of the second heat source;

[0084] 6-6. Temperature measuring point of the second evaporator;

[0085] 6-7. Temperature measuring points on the second steam pipeline;

[0086] 6-8. Temperature measuring points in the second liquid pipeline;

[0087] 6-9. Temperature measuring point of the third heat source;

[0088] 6-10. Temperature measuring points of the third evaporator;

[0089] 6-11. Temperature measuring point of the third steam pipeline;

[0090] 6-12. Temperature measuring point of the third liquid pipeline;

[0091] 6-13. Temperature measuring point of the fourth heat source;

[0092] 6-14. Temperature measuring point of the fourth evaporator;

[0093] 6-15. Temperature measuring point of the fourth steam pipeline;

[0094] 6-16. Temperature measuring point of the fourth liquid pipeline;

[0095] 6-17. Temperature measuring points in the steam manifold;

[0096] 6-18. Temperature measuring point in the liquid manifold;

[0097] 6-19. Inlet temperature measurement point of air-cooled radiator;

[0098] 6-20. Temperature measurement point at the outlet of the air-cooled radiator;

[0099] 6-21. First RS485 communication interface; 7. Air duct;

[0100] 7-1. Measuring point opening;

[0101] 8. Air parameter acquisition instrument;

[0102] 8-1. Inlet air temperature measuring point;

[0103] 8-2. Inlet air humidity measurement point;

[0104] 8-3. Atmospheric pressure measurement points;

[0105] 8-4. Air outlet temperature measuring point;

[0106] 8-5. Air outlet humidity measurement point;

[0107] 8-6. Wind speed measurement points;

[0108] 8-7. Second RS485 communication interface;

[0109] 9. Power adapter;

[0110] 9-1. Positive electrode of the electric heating device;

[0111] 9-2, Negative electrode of the electric heating device;

[0112] 10. Host computer;

[0113] 11. Bracket. Detailed Implementation

[0114] The technical solution of this utility model will be clearly and completely described below with reference to the embodiments and accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0115] Unless otherwise defined, all technical and scientific terms used in this invention have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains; the terminology used in the detailed description is for the purpose of describing particular embodiments only and is not intended to limit the invention; the terms “comprising” and “having” and any variations thereof in the specification, claims and foregoing description of the invention are intended to cover non-exclusive inclusion.

[0116] In the description of the specific embodiments of this utility model, technical terms such as "first" and "second" are used only to distinguish different objects and should not be construed as indicating or implying relative importance or implicitly specifying the number, specific order, or primary and secondary relationship of the indicated technical features. In the description of the embodiments of this utility model, "multiple" means two or more, unless otherwise explicitly defined.

[0117] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described in this invention can be combined with other embodiments.

[0118] In the description of this utility model embodiment, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, in this utility model, the character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0119] The embodiments of the present invention will be described in more detail below through examples. It should be noted that the embodiments of the present invention are not limited to these examples.

[0120] In a specific embodiment 1, such as Figure 1-3 As shown, a test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe includes a multi-heat-source air-cooled radiator module 1, a first heat source 2, a second heat source 3, a third heat source 4, a fourth heat source 5, a temperature acquisition instrument 6, an air duct 7, an air parameter acquisition instrument 8, a power adapter 9, a host computer 10, and a bracket 11.

[0121] like Figure 4 and Figure 5 As shown, the multi-heat source air-cooled radiator module 1 includes a first evaporator 1-1, a second evaporator 1-2, a third evaporator 1-3, a fourth evaporator 1-4, a first steam pipe 1-5, a second steam pipe 1-6, a third steam pipe 1-7, a fourth steam pipe 1-8, a steam manifold 1-9, an air-cooled radiator 1-10, a liquid manifold 1-11, a first liquid pipe 1-12, a second liquid pipe 1-13, a third liquid pipe 1-14, a fourth liquid pipe 1-15, and a fan 1-16. This embodiment has four heat sources, corresponding to four evaporators, four steam pipes, and four liquid pipes.

[0122] After absorbing heat, the working fluid in the first evaporator 1-1, second evaporator 1-2, third evaporator 1-3, and fourth evaporator 1-4 evaporates into gas and enters the first steam pipe 1-5, second steam pipe 1-6, third steam pipe 1-7, and fourth steam pipe 1-8 respectively. The steam from each pipe is collected in the steam manifold 1-9 and then enters the air-cooled radiator 1-10. The steam exchanges heat with the air and condenses into liquid, which enters the liquid manifold 1-11 and is then distributed to the first liquid pipe 1-12, second liquid pipe 1-13, third liquid pipe 1-14, and fourth liquid pipe 1-15. Finally, the liquid flows back to the first evaporator 1-1, second evaporator 1-2, third evaporator 1-3, and fourth evaporator 1-4 respectively to form a self-driven two-phase fluid loop.

[0123] like Figure 6 , Figure 7 As shown, the first heat source 2 includes a top cover 2-1, a heating block 2-2, a heating rod 2-3, a base 2-4, and bolts 2-5. The heating block 2-2 has a heat source measuring point groove 2-2-1 machined on it. Two power lines extend from the heating rod 2-3, namely the positive electrode 2-3-1 and the negative electrode 2-3-2 of the heating rod. The heating rod 2-3 is soldered to the heating block 2-2. The heating block 2-2 is placed inside the base 2-4. After the top cover 2-1 is closed, the top cover 2-1, the heating block 2-2, and the base 2-4 are assembled together using bolts 2-5.

[0124] The structures of the second heat source 3, the third heat source 4, and the fourth heat source 5 are exactly the same as those of the first heat source 2.

[0125] In this embodiment, the first heat source 2 is fitted to the first evaporator 1-1, the second heat source 3 to the second evaporator 1-2, the third heat source 4 to the third evaporator 1-3, and the fourth heat source 5 to the fourth evaporator 1-4, respectively. The air duct 7 is connected to the air-cooled radiator 1-10, and a measuring point opening 7-1 is reserved on the air duct 7. According to the requirements of the actual application scenario, the multi-heat source air-cooled radiator module 1, the first heat source 2, the second heat source 3, the third heat source 4, the fourth heat source 5, and the air duct 7 are fixed with the bracket 11.

[0126] The temperature acquisition instrument 6 includes a first heat source temperature measuring point 6-1, a first evaporator temperature measuring point 6-2, a first steam pipe temperature measuring point 6-3, a first liquid pipe temperature measuring point 6-4, a second heat source temperature measuring point 6-5, a second evaporator temperature measuring point 6-6, a second steam pipe temperature measuring point 6-7, a second liquid pipe temperature measuring point 6-8, a third heat source temperature measuring point 6-9, a third evaporator temperature measuring point 6-10, a third steam pipe temperature measuring point 6-11, a third liquid pipe temperature measuring point 6-12, a fourth heat source temperature measuring point 6-13, a fourth evaporator temperature measuring point 6-14, a fourth steam pipe temperature measuring point 6-15, a fourth liquid pipe temperature measuring point 6-16, a steam manifold temperature measuring point 6-17, a liquid manifold temperature measuring point 6-18, an air-cooled radiator inlet temperature measuring point 6-19, an air-cooled radiator outlet temperature measuring point 6-20, and a first RS485 communication interface 6-21.

[0127] The first heat source temperature measuring point 6-1 monitors the temperature T1 of the first heat source 2 through the heat source measuring point slot 2-2-1. Similarly, the second heat source temperature measuring point 6-1 monitors the temperature T2 of the second heat source 3, the third heat source temperature measuring point 6-9 monitors the temperature T3 of the third heat source 4, and the fourth heat source temperature measuring point 6-13 monitors the temperature T4 of the fourth heat source 5.

[0128] Temperature measuring point 6-2 of the first evaporator is attached to the shell surface of the first evaporator 1-1 to monitor the temperature T5 of the first evaporator 1-1. Temperature measuring point 6-3 of the first steam line is attached to the surface of the first steam line 1-5 to monitor the temperature T6 of the first steam line 1-5. Temperature measuring point 6-4 of the first liquid line is attached to the surface of the first liquid line 1-12 to monitor the temperature T7 of the first liquid line 1-12. Similarly, temperature measuring point 6-6 of the second evaporator monitors the temperature T8 of the second evaporator 1-2; temperature measuring point 6-7 of the second steam line monitors the temperature T9 of the second steam line 1-6; temperature measuring point 6-8 of the second liquid line monitors the temperature T10 of the second liquid line 1-13; temperature measuring point 6-10 of the third evaporator monitors the temperature T11 of the third evaporator 1-3; temperature measuring point 6-11 of the third steam line monitors the temperature T12 of the third steam line 1-7; temperature measuring point 6-12 of the third liquid line monitors the temperature T13 of the third liquid line 1-14; temperature measuring point 6-14 of the fourth evaporator monitors the temperature T14 of the fourth evaporator 1-4; temperature measuring point 6-15 of the fourth steam line monitors the temperature T15 of the fourth steam line 1-8; and temperature measuring point 6-16 of the fourth liquid line monitors the temperature T16 of the fourth liquid line 1-15. Temperature measuring point 6-17 of the steam manifold is attached to the surface of steam manifold 1-9 to monitor the temperature T17 of steam manifold 1-9. Temperature measuring point 6-18 of the liquid manifold is attached to the surface of steam manifold 1-11 to monitor the temperature T18 of steam manifold 1-11. Temperature measuring points 6-19 and 6-20 of the air-cooled radiator inlet and outlet water chambers of air-cooled radiator 1-10 are respectively attached to monitor the inlet temperature T19 and outlet temperature T20 of air-cooled radiator 1-10. Temperatures T1 to T20 are all uploaded to the host computer 10 via the first RS485 communication interface 6-21.

[0129] The air parameter acquisition instrument 8 includes an inlet air temperature measuring point 8-1, an inlet air humidity measuring point 8-2, an atmospheric pressure measuring point 8-3, an outlet air temperature measuring point 8-4, an outlet air humidity measuring point 8-5, an air velocity measuring point 8-6, and a second RS485 communication interface 8-7. The inlet air temperature measuring point 8-1, inlet air humidity measuring point 8-2, and atmospheric pressure measuring point 8-3 are all placed on the side of the fan 1-16 to monitor the inlet air temperature T21, inlet air humidity H1, and atmospheric pressure P0. The outlet air temperature measuring point 8-4, outlet air humidity measuring point 8-5, and air velocity measuring point 8-6 are all placed inside the air duct 7 through the measuring point opening 7-1 to monitor the outlet air temperature T22, outlet air humidity H2, and air velocity W. The measuring point parameters T21, H1, P0, T22, H2, and W are all uploaded to the host computer 10 through the second RS485 communication interface 8-7.

[0130] The power adapter 9 includes a positive electrode 9-1 and a negative electrode 9-2 for the electric heating device. The first heat source 2 contains five electric heating rods 2-3, each with a maximum power of 200W, for a total maximum power of 1000W. The positive electrodes 2-3-1 of the five heating rods are connected in parallel to form the positive electrode, and the negative electrodes 2-3-2 of the five heating rods are connected in parallel to form the negative electrode. Each of the four heat sources has four sets of positive and negative electrodes. The four sets of positive electrodes are connected in parallel to the positive electrode 9-1 of the electric heating device, and the four sets of negative electrodes are connected in parallel to the negative electrode 9-2 of the electric heating device. The maximum total power of each heat source is 1000W. The power adapter 9 adjusts the current and voltage to regulate the output heat power Q of the heat source.

[0131] Temperature data from various measuring points fed back to the host computer 10 via temperature acquisition instrument 6 can be used to evaluate the minimum starting power, heat transfer capacity, temperature uniformity, and system thermal resistance of multi-heat source air-cooled radiators.

[0132] 1. Minimum starting power Qmin [W]: The power is adjusted every 5W by the power adapter 9. When the temperature T1 to T20 rises and can be maintained in a stable state, the power at this time is the minimum starting power Qmin.

[0133] 2. Heat transfer capacity Qmax[W]: The heat transfer capacity Qmax is determined by adjusting the heat power every 50W through the power adapter 9. When the temperature T1 to T20 can be maintained in a stable state, it indicates that the system is operating normally. When the power is adjusted to a certain level Q, any temperature in T1 to T20 rises rapidly. Q-50(W) is the heat transfer capacity Qmax.

[0134] 3. System temperature uniformity ΔT [°C]: The temperature difference ΔT of the entire system is used as the index to evaluate the system temperature uniformity, that is, ΔT = max(T5,T6,…,T20) - min(T5,T6,…,T20);

[0135] 4. System thermal resistance R [℃ / W]: The heat power Q has a linear relationship with the system temperature uniformity ΔT, and the system thermal resistance R = ΔT / Q;

[0136] 5. Interfacial thermal resistance R_c [℃ / W]: Used to evaluate the contact thermal resistance between the evaporator and the heat source. The heat power of a single heat source is Q / 4, and there is an interfacial thermal resistance between each heat source and the evaporator. The interfacial thermal resistance between the first heat source 2 and the first evaporator 1-1 is shown below. The interfacial thermal resistance between the second heat source 3 and the second evaporator 1-2 The interfacial thermal resistance between the third heat source 4 and the third evaporator 1-3 The interfacial thermal resistance between the fourth heat source 5 and the fourth evaporator 1-4

[0137] By feeding back the parameters from each measuring point to the host computer 10 via the air parameter acquisition instrument 8, the performance of the air-cooled radiators 1-10 and the airflow of the fans 1-16 can be evaluated.

[0138] 1. Performance of air-cooled radiator 1-10: The enthalpy of the inlet air (h1) can be calculated from the inlet air temperature (T21), inlet air humidity (H1), and atmospheric pressure (P0). The enthalpy of the outlet air (h2) can be calculated from the outlet air temperature (T22), outlet air humidity (H2), and atmospheric pressure (P0). The cross-sectional area of ​​the air duct 7 is A, then the air volume (V) = W * A. The system's heat dissipation (Q_out) = V * D * (h2 - h1), where D is the density of air. Given the thermal power (Q), when the system's thermal power (Q) matches the heat dissipation (Q_out), it indicates that the air-cooled radiator 1-10 meets the performance requirements.

[0139] 2. Fan speed control of fans 1-16: When the outlet air temperature T22 increases, reducing the fan speed W can also meet the heat exchange requirements. By adjusting the fan speed W of fans 1-16, we can find the most economical fan speed control strategy under different heat power Q, thus contributing to energy conservation and emission reduction.

[0140] In a specific embodiment 2, such as Figure 8 and Figure 9 As shown, a test bench for a dual-heat-source air-cooled radiator based on a loop heat pipe includes a multi-heat-source air-cooled radiator module 1, a first heat source 2, a second heat source 3, a temperature acquisition instrument 6, an air duct 7, an air parameter acquisition instrument 8, a power adapter 9, a host computer 10, and a bracket 11.

[0141] like Figure 10 As shown, the multi-heat source air-cooled radiator module 1 includes a first evaporator 1-1, a second evaporator 1-2, a first steam pipe 1-5, a second steam pipe 1-6, a steam manifold 1-9, an air-cooled radiator 1-10, a liquid manifold 1-11, a first liquid pipe 1-12, a second liquid pipe 1-13, and a fan 1-16. This embodiment has two heat sources, corresponding to two evaporators, two steam pipes, and two liquid pipes.

[0142] After the first evaporator 1-1 and the second evaporator 1-2 absorb heat, the working fluid evaporates into gas and enters the first steam pipeline 1-5 and the second steam pipeline 1-6 respectively. The steam from each pipeline is collected in the steam manifold 1-9 and then enters the air-cooled radiator 1-10. The steam exchanges heat with the air and condenses into liquid, which enters the liquid manifold 1-11 and is then distributed to the first liquid pipeline 1-12 and the second liquid pipeline 1-13. Finally, it flows back into the first evaporator 1-1 and the second evaporator 1-2 to form a self-driven two-phase fluid loop.

[0143] In this embodiment, the first heat source 2 is attached to the first evaporator 1-1, and the second heat source 3 is attached to the second evaporator 1-2. The air duct 7 is connected to the air-cooled radiator 1-10, and a measuring point opening 7-1 is reserved on the air duct 7. According to the requirements of the actual application scenario, the multi-heat source air-cooled heat dissipation module 1, the first heat source 2, the second heat source 3, and the air duct 7 are fixed with the bracket 11.

[0144] The temperature acquisition instrument 6 includes a first heat source temperature measuring point 6-1, a first evaporator temperature measuring point 6-2, a first steam pipe temperature measuring point 6-3, a first liquid pipe temperature measuring point 6-4, a second heat source temperature measuring point 6-5, a second evaporator temperature measuring point 6-6, a second steam pipe temperature measuring point 6-7, a second liquid pipe temperature measuring point 6-8, a steam manifold temperature measuring point 6-17, a liquid manifold temperature measuring point 6-18, an air-cooled radiator inlet temperature measuring point 6-19, an air-cooled radiator outlet temperature measuring point 6-20, and a first RS485 communication interface 6-21.

[0145] The first heat source temperature measuring point 6-1 monitors the temperature T1 of the first heat source 2 through the heat source measuring point slot 2-2-1. Similarly, the second heat source temperature measuring point 6-1 monitors the temperature T2 of the second heat source 3.

[0146] Temperature measuring point 6-2 of the first evaporator is attached to the shell surface of the first evaporator 1-1 to monitor the temperature T3 of the first evaporator 1-1. Temperature measuring point 6-3 of the first steam line is attached to the surface of the first steam line 1-5 to monitor the temperature T4 of the first steam line 1-5. Temperature measuring point 6-4 of the first liquid line is attached to the surface of the first liquid line 1-12 to monitor the temperature T5 of the first liquid line 1-12. Similarly, temperature measuring point 6-6 of the second evaporator monitors the temperature T6 of the second evaporator 1-2; temperature measuring point 6-7 of the second steam line monitors the temperature T7 of the second steam line 1-6; temperature measuring point 6-8 of the second liquid line monitors the temperature T8 of the second liquid line 1-13; temperature measuring point 6-17 of the steam manifold is attached to the surface of the steam manifold 1-9 to monitor the temperature T9 of the steam manifold 1-9; and temperature measuring point 6-18 of the liquid manifold is attached to the surface of the steam manifold 1-11 to monitor the temperature T10 of the steam manifold 1-11. The inlet temperature measuring point 6-19 and the outlet temperature measuring point 6-20 of the air-cooled radiator are respectively attached to the inlet and outlet water chambers of the air-cooled radiator 1-10 to monitor the inlet temperature T11 and the outlet temperature T12 of the air-cooled radiator 1-10. Temperatures T1 to T12 are all uploaded to the host computer 10 via the first RS485 communication interface 6-21.

[0147] The air parameter acquisition instrument 8 includes an inlet air temperature measuring point 8-1, an inlet air humidity measuring point 8-2, an atmospheric pressure measuring point 8-3, an outlet air temperature measuring point 8-4, an outlet air humidity measuring point 8-5, a wind speed measuring point 8-6, and a second RS485 communication interface 8-7. The inlet air temperature measuring point 8-1, inlet air humidity measuring point 8-2, and atmospheric pressure measuring point 8-3 are all placed on the side of the fan 1-16 to monitor the inlet air temperature T13, inlet air humidity H1, and atmospheric pressure P0. The outlet air temperature measuring point 8-4, outlet air humidity measuring point 8-5, and wind speed measuring point 8-6 are all placed inside the air duct 7 through the measuring point opening 7-1 to monitor the outlet air temperature T14, outlet air humidity H2, and wind speed W. The measuring point parameters T13, H1, P0, T14, H2, and W are all uploaded to the host computer 10 through the second RS485 communication interface 8-7.

[0148] The structure, connection method, and control of the first heat source 2 and the second heat source 3 in this example are the same as in Example 1. The maximum total power of each heat source group in this example is also 1000W. The output heat power Q of the heat source is adjusted by regulating the current and voltage through the power adapter 9.

[0149] Similarly, in Example 2, temperature data from various measuring points fed back to the host computer 10 via temperature acquisition instrument 6 and air parameter acquisition instrument 8 can be used to evaluate the performance of multi-heat source air-cooled radiators and air-cooled radiators 1-10, as well as the airflow of fans 1-16. The theoretical basis of the evaluation method is the same as in Example 1.

[0150] 1. Minimum starting power Qmin [W]: The power is adjusted every 5W by the power adapter 9. When the temperature of T1 to T12 rises and can be maintained in a stable state, the power at this time is the minimum starting power Qmin.

[0151] 2. Heat transfer capacity Qmax[W]: The heat transfer capacity Qmax is determined by adjusting the heat power every 50W through the power adapter 9. When the temperature T1 to T12 can be maintained in a stable state, it indicates that the system is operating normally. When the power is adjusted to a certain level Q, any temperature in T1 to T12 rises rapidly. Q-50(W) is the heat transfer capacity Qmax.

[0152] 3. System temperature uniformity ΔT [°C]: The temperature difference ΔT of the entire system is used as the index to evaluate the system temperature uniformity, that is, ΔT = max(T3,T4,…,T12) - min(T3,T4,…,T12);

[0153] 4. System thermal resistance R [℃ / W]: The heat power Q has a linear relationship with the system temperature uniformity ΔT, and the system thermal resistance R = ΔT / Q;

[0154] 5. Interfacial thermal resistance R_c [℃ / W]: Used to evaluate the contact thermal resistance between the evaporator and the heat source. The heat power of a single heat source is Q / 2, and there is an interfacial thermal resistance between each heat source and the evaporator. The interfacial thermal resistance between the first heat source 2 and the first evaporator 1-1 is shown below. The interfacial thermal resistance between the second heat source 3 and the second evaporator 1-2

[0155] 6. Performance of air-cooled radiator 1-10: The enthalpy of the inlet air (h1) can be calculated from the inlet air temperature (T13), inlet air humidity (H1), and atmospheric pressure (P0). The enthalpy of the outlet air (h2) can be calculated from the outlet air temperature (T14), outlet air humidity (H2), and atmospheric pressure (P0). The cross-sectional area of ​​the air duct 7 is A, then the air volume (V) = W * A. The system's heat dissipation (Q_out) = V * D * (h2 - h1), where D is the density of air. Given the thermal power (Q), when the system's thermal power (Q) matches the heat dissipation (Q_out), it indicates that the air-cooled radiator 1-10 meets the performance requirements.

[0156] 7. Fan speed control of fans 1-16: When the outlet air temperature T14 increases, reducing the fan speed W can also meet the heat exchange requirements. By adjusting the fan speed W of fans 1-16, the most economical fan speed control strategy under different heat power Q can be found.

[0157] It should be noted that the above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe, characterized in that, Includes a multi-heat source air-cooled heat dissipation module, N heat sources, a temperature acquisition instrument, an air duct, an air parameter acquisition instrument, a power adapter, and a bracket; The multi-heat source air-cooled heat dissipation module includes a vapor manifold, a liquid manifold, a radiator, and N sets of heat dissipation units; The heat dissipation unit includes an evaporator, vapor lines, and liquid lines; N groups of heat dissipation units are connected to N heat sources respectively; The inlet and outlet of the radiator are respectively connected to the vapor manifold and the liquid manifold; The working fluid inlet and outlet of the evaporator are respectively connected to the vapor manifold and the liquid manifold; The evaporator is connected to the heat source; The multi-heat source air-cooled heat dissipation module, the N heat sources, and the air duct are all installed inside the bracket, and the air duct is installed above the bracket and connected to the heat sink; Temperature detection points are provided for all N heat sources, the evaporator, the steam pipeline, the liquid pipeline, and the radiator. The temperature acquisition instrument collects temperature information from the temperature detection point via wired or wireless means and communicates with the host computer. Air parameter collection points are provided in the air duct and the multi-heat source air-cooled heat dissipation module; The air parameter acquisition instrument collects information from the air parameter acquisition points via wired or wireless means and communicates with the host computer. The power adapter is connected to the heat source.

2. The test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 1, characterized in that, The heat source includes a top cover, a heating block, a heating rod, a base, and bolts; The heating block includes a heat source measuring point groove, the heating rod is connected to the heating block, the heating block is disposed in the base, and the top cover, the heating block and the base are fixed by the bolts.

3. The test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 2, characterized in that, The heating rod includes a positive electrode and a negative electrode.

4. The test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 1, characterized in that, The temperature acquisition instrument includes a first RS485 communication interface.

5. A test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 3, characterized in that, The power adapter includes a positive terminal and a negative terminal of the electric heating device; The positive electrode of the electric heating device is connected to the positive electrode of the heating rod, and the negative electrode of the electric heating device is connected to the negative electrode of the heating rod.

6. The test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 1, characterized in that, The power of the heat source is 600W-1500W.

7. A test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 5, characterized in that, The heat source includes at least two heating rods; The positive electrodes of at least two heating rods are connected in parallel and then connected to the positive electrode of the electric heating device, and the negative electrodes of at least two heating rods are connected in parallel and then connected to the negative electrode of the electric heating device.

8. The test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 1, characterized in that, Among the N heat sources, the specifications of the heat sources may be the same or different.

9. A test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 1, characterized in that, The radiator includes an air-cooled radiator and a fan.

10. A test bench for a multi-heat-source air-cooled radiator based on a loop heat pipe according to claim 1, characterized in that, The air parameter acquisition instrument includes a second RS485 communication interface.

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