A general test device for fully encapsulated modulators

Abstract

The utility model is a kind of general testing device of full package modulator, including bottom plate, temperature control component and full package modulator fixture, the temperature control component includes TEC piece and TEC control circuit board, TEC piece and TEC control circuit board are set on bottom plate, heat transfer carrier plate is provided on TEC piece, and the full package modulator fixture includes full package modulator placing groove and cover plate, the bottom surface of full package modulator placing groove is equipped with the hollowing-out matched with heat transfer carrier plate, full package modulator placing groove is equipped on TEC piece and heat transfer carrier plate, and the cover plate is set in full package modulator placing groove above.The utility model has the advantages that: utilize full package modulator placing groove and cover plate to clamp and fix full package modulator, and the full package modulator of type adaptation can be adapted;Integrated with TEC temperature control module, without connecting additional temperature control device;Full package modulator fixture and bottom plate can be heat dissipated, and heat dissipation effect is good.

Description

Technical Field

[0001] This utility model relates to the field of optoelectronic testing, and in particular to a universal testing device for fully packaged modulators. Background Technology

[0002] In the field of optoelectronic testing, optical modulators are core components of high-speed optical communication, photonic computing, and quantum technology. With technological advancements, optical modulators are increasingly miniaturized and fully encapsulated, resulting in diverse packaging forms and significant differences in temperature characteristics between different models. During testing, fully encapsulated modulators need to be clamped and secured, and required to operate at varying temperatures. However, traditional testing equipment cannot accommodate these diverse packaging forms, making effective clamping and securing of fully encapsulated modulators difficult and necessitating the use of additional temperature control devices, thus causing inconvenience. Summary of the Invention

[0003] This invention mainly solves the above-mentioned problems and provides a universal testing device for fully encapsulated modulators, which can be adapted to various types of fully encapsulated modulators; it integrates a TEC temperature control module, eliminating the need for an additional temperature control device; both the fully encapsulated modulator fixture and the base plate can dissipate heat, resulting in good heat dissipation.

[0004] The technical solution adopted by this utility model to solve its technical problem is a universal testing device for fully encapsulated modulators, including a base plate, a temperature control component, and a fully encapsulated modulator fixture. The temperature control component includes a TEC chip and a TEC control circuit board, which are mounted on the base plate. A heat-conducting carrier plate is mounted on the TEC chip. The fully encapsulated modulator fixture includes a fully encapsulated modulator placement slot and a cover plate. The bottom surface of the fully encapsulated modulator placement slot has a cutout that matches the heat-conducting carrier plate. The fully encapsulated modulator placement slot is fitted onto the TEC chip and the heat-conducting carrier plate. The cover plate is positioned above the fully encapsulated modulator placement slot.

[0005] As a preferred embodiment of the above solution, the first side of the fully encapsulated placement slot extends to a first platform. The first side of the fully encapsulated placement slot is provided with a first notch and a second notch for placing the RF interface of the fully encapsulated modulator and the bias pin. The first platform is provided with a first wiring slot and a second wiring slot corresponding to the first notch and the second notch.

[0006] As a preferred embodiment of the above solution, the second wiring slot is provided with an adapter board, the first end of the adapter board is provided with a pin interface, the second end of the adapter board is provided with an RF interface, and the pin interface is electrically connected to the bias pin of the fully encapsulated modulator.

[0007] As a preferred embodiment of the above solution, the second notch is provided with a pressure plate for pressing the bias pin of the fully encapsulated adjuster into the pin interface.

[0008] As a preferred embodiment of the above solution, the second side and the ground side adjacent to the first side of the fully encapsulated placement slot are respectively provided with a third notch and a fourth notch for placing the input interface and output interface of the fully encapsulated adjuster.

[0009] As a preferred embodiment of the above solution, a fifth notch for placing the power line of the TEC chip is provided below the third or fourth notch.

[0010] As a preferred embodiment of the above solution, the heat-conducting carrier plate extends outward with several mounting portions, each mounting portion having a first mounting hole. The heat-conducting carrier plate is fixed to the base plate through the first mounting hole, and the TEC sheet is clamped and fixed between the heat-conducting carrier plate and the base plate.

[0011] As a preferred embodiment of the above solution, the fully encapsulated modulator placement slot is provided with a plurality of second mounting holes and third mounting holes, the cover plate is fixed to the fully encapsulated placement slot through the second mounting holes, and the fully encapsulated placement slot is fixed to the base plate through the third mounting holes.

[0012] As a preferred embodiment of the above solution, the base plate is stepped and includes a connected low platform and a high platform. The TEC chip is disposed on the high platform, and the TEC chip control circuit board is disposed on the low platform. The TEC control circuit board is electrically connected to the TEC chip.

[0013] As a preferred embodiment of the above solution, the base plate is a heat-dissipating aluminum plate.

[0014] The advantages of this invention are: the fully encapsulated modulator is clamped and fixed by the fully encapsulated modulator placement slot and cover plate, which can accommodate various types of fully encapsulated modulators; it integrates a TEC temperature control module, eliminating the need for an additional temperature control device; both the fully encapsulated modulator clamp and the base plate can dissipate heat, resulting in good heat dissipation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of a general-purpose test device for fully encapsulated modulators.

[0016] Figure 2 This is an exploded block diagram of a general-purpose test apparatus for fully packaged modulators.

[0017] 1-Base plate 2-Fully encapsulated modulator fixture 3-Temperature control assembly 4-Fully encapsulated modulator 101-High platform 102-Low platform 201-Fully encapsulated modulator placement slot 202-First platform 203-First wiring slot 204-Second notch 205-Third notch 206-Fourth notch 207-Kuvehole 208-Pressure plate 209-Cover plate 301-TEC control circuit board 302-TEC sheet 303-Heat-conducting carrier plate. Detailed Implementation

[0018] The technical solution of this utility model will be further described below through embodiments and in conjunction with the accompanying drawings.

[0019] Example:

[0020] This embodiment presents a universal testing device for fully encapsulated modulators, such as... Figure 1 and Figure 2 As shown, the device includes a base plate 1, a temperature control component 3, and a fully encapsulated modulator clamp 2. The base plate 1 is a heat-dissipating aluminum plate and is stepped, including a connected low platform 102 and a high platform 101. The temperature control component 3 includes a TEC chip 302 and a TEC control circuit board 301. The TEC chip 302 is disposed on the high platform 101, and the TEC chip control circuit board 301 is disposed on the low platform 102. The TEC control circuit board 301 is electrically connected to the TEC chip 302. A heat-conducting carrier plate 303 is disposed on the TEC chip 302. The heat-conducting carrier plate 303 is used to support the fully encapsulated modulator 4. The heat-conducting carrier plate 303 extends outward with several mounting portions. The mounting portions are provided with first mounting holes. The heat-conducting carrier plate 303 is fixed to the high platform 101 through the first mounting holes. The TEC chip 302 is clamped and fixed between the heat-conducting carrier plate 303 and the high platform 101. The fully encapsulated modulator fixture 2 includes a fully encapsulated modulator placement slot 201 and a cover plate 209. The bottom surface of the fully encapsulated modulator placement slot 201 is provided with a cutout 207 that matches the heat-conducting carrier plate 303. The fully encapsulated modulator placement slot 201 is sleeved on the TEC plate 302 and the heat-conducting carrier plate 303. The cover plate 209 is disposed above the fully encapsulated modulator placement slot. In this embodiment, the fully encapsulated modulator placement slot is provided with a plurality of second mounting holes and third mounting holes. The cover plate is fixed to the fully encapsulated placement slot through the second mounting holes, and the fully encapsulated placement slot is fixed to the base plate through the third mounting holes.

[0021] Furthermore, a first platform 202 extends from the first side of the fully encapsulated placement slot 201. The first side of the fully encapsulated placement slot 201 is provided with a first notch and a second notch for placing the RF interface and bias pin of the fully encapsulated modulator 4. The second side adjacent to the first side and the ground side are respectively provided with a third notch 205 and a fourth notch 206 for placing the input and output interfaces of the fully encapsulated modulator. Below the third or fourth notch is a fifth notch for placing the TEC chip power line 304. In this embodiment, the fifth notch is located below the third notch 205.

[0022] Furthermore, the first platform 202 has a first wiring slot 203 and a second wiring slot corresponding to the first and second notches. An adapter plate 204 is provided in the second wiring slot. The upper surface of the first end of the adapter plate 204 has a pin interface, and the second end of the adapter plate 204 has an RF interface. The pin interface is electrically connected to the bias pin of the fully packaged modulator. To ensure the reliability of the connection between the pin interface and the bias pin, a pressure plate 208 is provided at the second notch for pressing the bias pin of the fully packaged modulator into the pin interface.

[0023] The universal testing device for fully packaged modulators in this embodiment is compact and rationally designed, enabling efficient testing of fully packaged modulators. During testing, the cover plate presses the fully packaged modulator into the fully packaged modulator placement slot to achieve stable clamping. Simultaneously, both the fully packaged modulator and the cover plate are made of metal, which facilitates heat dissipation for the fully packaged modulator. The heat-conducting carrier plate and the base plate made of heat-dissipating aluminum plate can conduct away the heat generated during TEC chip operation, preventing excessively high or low temperatures from affecting the temperature control effect of the TEC chip. The base plate also provides heat dissipation for the TEC control circuit board. Furthermore, the integration of the TEC temperature control module allows the testing device to perform precise temperature control of the fully packaged modulator according to different testing requirements, further improving the flexibility and reliability of the testing.

[0024] The specific embodiments described herein are merely illustrative of the spirit of the invention. Those skilled in the art to which this invention pertains may make various modifications or additions to the described specific embodiments or use similar methods to substitute them, without departing from the spirit of the invention or exceeding the scope defined by the appended claims.

Claims

1. A universal testing device for fully encapsulated modulators, characterized in that: The device includes a base plate, a temperature control component, and a fully encapsulated modulator fixture. The temperature control component includes a TEC chip and a TEC control circuit board, which are mounted on the base plate. A thermally conductive carrier plate is mounted on the TEC chip. The fully encapsulated modulator fixture includes a fully encapsulated modulator placement slot and a cover plate. The bottom surface of the fully encapsulated modulator placement slot has a cutout that matches the thermally conductive carrier plate. The fully encapsulated modulator placement slot is fitted onto the TEC chip and the thermally conductive carrier plate. The cover plate is positioned above the fully encapsulated modulator placement slot.

2. The universal test apparatus for fully encapsulated modulators according to claim 1, characterized in that: The first side of the fully encapsulated modulator placement slot extends to a first platform. The first side of the fully encapsulated modulator placement slot is provided with a first notch and a second notch for placing the fully encapsulated modulator RF interface and bias pin. The first platform is provided with a first wiring slot and a second wiring slot corresponding to the first notch and the second notch.

3. The universal test apparatus for fully encapsulated modulators according to claim 2, characterized in that: The second wiring slot is provided with an adapter board. The first end of the adapter board is provided with a pin interface, and the second end of the adapter board is provided with an RF interface. The pin interface is electrically connected to the bias pin of the fully encapsulated modulator.

4. The universal test apparatus for fully encapsulated modulators according to claim 3, characterized in that: The second notch is provided with a pressure plate for pressing the bias pin of the fully encapsulated adjuster into the pin interface.

5. The universal test apparatus for fully encapsulated modulators according to claim 2, characterized in that: The second side and the ground side adjacent to the first side of the fully encapsulated modulator placement slot are respectively provided with a third notch and a fourth notch for placing the input interface and output interface of the fully encapsulated modulator.

6. The universal test apparatus for fully encapsulated modulators according to claim 5, characterized in that: Below the third or fourth notch is a fifth notch for placing the power cable of the TEC chip.

7. The universal test apparatus for fully encapsulated modulators according to claim 1, characterized in that: The heat-conducting carrier plate extends outward with several mounting portions. Each mounting portion has a first mounting hole. The heat-conducting carrier plate is fixed to the base plate through the first mounting hole, and the TEC sheet is clamped and fixed between the heat-conducting carrier plate and the base plate.

8. The universal test apparatus for fully encapsulated modulators according to claim 1, characterized in that: The fully encapsulated modulator placement slot is provided with a plurality of second mounting holes and third mounting holes. The cover plate is fixed to the fully encapsulated placement slot through the second mounting holes, and the fully encapsulated placement slot is fixed to the base plate through the third mounting holes.

9. The universal test apparatus for fully encapsulated modulators according to claim 1, characterized in that: The base plate is stepped and includes a low platform and a high platform. The TEC chip is disposed on the high platform, and the TEC chip control circuit board is disposed on the low platform. The TEC control circuit board is electrically connected to the TEC chip.

10. The universal test apparatus for fully encapsulated modulators according to claim 1, characterized in that: The base plate is a heat-dissipating aluminum plate.

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