Chip measurement and control device

Abstract

The application provides a chip measurement and control device, which comprises a case, a circuit mother board, a circuit sub-board group and a measurement and control signal output end. A plurality of circuit sub-boards are fixedly connected to the two sides of the circuit mother board to form a whole, and then the mother board is fixed on the side wall of the case, so that the fixed connection of the circuit mother board and the circuit sub-boards in the case is realized. In addition, the upper and lower circuit sub-boards on the two sides of the circuit mother board are alternately arranged in the fixing holes on the circuit mother board. The fixing holes and fixing columns in other mother board areas are arranged to realize the fixed connection of the circuit mother board and the case, effectively reducing the interference, deviation and stress between the PCB sub-boards, and reducing the risks of PCB bending deformation, falling off, electrical connection failure and the like.

Description

Technical Field

[0001] This application belongs to the field of semiconductor equipment, and more specifically, relates to a device for chip testing and control. Background Technology

[0002] With the rapid development of quantum information technology, optical quantum chips, as an important platform for realizing cutting-edge applications such as quantum computing, quantum communication, and quantum precision measurement, are gradually becoming a research hotspot. Among them, on-chip electro-optic or thermo-optic modulators are one of the indispensable core components of optical quantum chips, used to precisely control the phase, polarization, and time characteristics of light waves, thereby achieving dynamic manipulation of the quantum state. In large-scale optical quantum chips, hundreds or even thousands of modulators are typically integrated, each requiring independent control signal input. Therefore, multi-channel chip measurement and control devices (such as multi-channel constant current and constant voltage sources) are needed to test and control each modulator.

[0003] A multi-channel constant current and constant voltage power supply typically consists of power supply modules, regulation modules, protection circuits, interface units, and display and operation modules. Each module has corresponding PCB (printed circuit board) daughter boards, such as power conversion daughter boards, constant current control daughter boards, constant voltage control daughter boards, auxiliary power supply daughter boards, drive and protection daughter boards, communication and interface daughter boards, and display and operation daughter boards. All daughter boards are electrically connected through a mother PCB, which acts as the system's "skeleton" and "backbone," providing power distribution and signal connection paths between all daughter boards.

[0004] With the rapid increase in the device scale of quantum chips, the demand for the number of current or voltage channels required for chip measurement and control is also increasing rapidly. This leads to an increase in the number of PCB daughter boards required for constant current and constant voltage sources, and the PCB mother board needs to be fixedly connected to more PCB daughter boards. On the one hand, the increased area of ​​the PCB mother board results in the space being squeezed for other components in the chip measurement and control device, or an increase in the overall size of the chip measurement and control device. On the other hand, it is necessary to design connectors to assemble or fix the PCB daughter boards, PCB mother board and chassis. Due to the existence of processing tolerances, interference, misalignment and inter-board stress may easily occur between PCB daughter boards after assembly, causing the PCB assembly structure to become unstable, thereby increasing the risk of PCB bending deformation, detachment and electrical connection failure. Summary of the Invention

[0005] To address the aforementioned issues, this application proposes a chip measurement and control device, the specific solution of which is as follows.

[0006] This application discloses a chip measurement and control device, including a chassis, a circuit motherboard, a circuit daughterboard assembly, and a measurement and control signal output terminal;

[0007] The chassis is used to carry and fix the circuit motherboard and the measurement and control signal output terminals;

[0008] The measurement and control signal output terminal is located on the side of the chassis and is electrically connected to the circuit motherboard, and is used to output chip measurement and control signals.

[0009] The circuit motherboard is fixedly connected to the first side wall of the chassis by a plurality of first fixing posts. The circuit sub-board group includes at least one upper circuit sub-board located on the side of the circuit motherboard away from the first side wall and at least one lower circuit sub-board located on the side of the circuit motherboard close to the first side wall. The circuit motherboard is fixedly connected to the upper circuit sub-board by a plurality of second fixing posts and the circuit motherboard is fixedly connected to the lower circuit sub-board by a plurality of third fixing posts.

[0010] The circuit motherboard is provided with a first fixing hole corresponding to the first fixing post, a second fixing hole corresponding to the second fixing post, and a third fixing hole corresponding to the third fixing post. The first fixing hole is located outside the projection area of ​​the upper circuit sub-board and the lower circuit sub-board on the circuit motherboard. The second fixing hole and the third fixing hole are distributed alternately at equal distances.

[0011] Optionally, the chip measurement and control device provided in this application also includes multiple flexible circuit boards, with the upper circuit sub-board, the lower circuit sub-board and the circuit motherboard being electrically connected through the flexible circuit boards.

[0012] Optionally, the circuit motherboard is provided with a busbar, and the upper circuit sub-board and the lower circuit sub-board are provided with pin headers. The upper circuit sub-board and the lower circuit sub-board are electrically connected to the circuit motherboard through the pin headers and the busbar.

[0013] Optionally, the first fixing post, the second fixing post, and the third fixing post are screws or studs, and the first fixing hole, the second fixing hole, and the third fixing hole are threaded holes.

[0014] Optionally, the circuit motherboard or upper circuit sub-board and lower circuit sub-board include a power module. The circuit motherboard or upper circuit sub-board and lower circuit sub-board are also provided with additional fixing holes and copper studs fixed in the additional fixing holes near the power module to enhance the heat dissipation of the power module.

[0015] Optionally, heat sinks are also attached to the surfaces of the upper and lower circuit sub-boards, with the heat sinks covering multiple upper circuit sub-boards or multiple lower circuit sub-boards.

[0016] Optionally, the chip measurement and control device provided in this application also includes a grounding fixing post, a ground potential fixing hole is provided on the circuit motherboard, a grounding module is provided on the chassis, one end of the grounding fixing post is fixed to the ground potential fixing hole, and the other end is connected to the grounding module on the chassis.

[0017] Optionally, at least one cooling fan is provided on the first side wall of the chassis for cooling the lower circuit board.

[0018] Optionally, the chassis also includes a second sidewall opposite to the first sidewall, and at least one cooling fan is provided on the second sidewall for cooling the upper circuit board.

[0019] Optionally, the chassis also includes a third sidewall and a fourth sidewall perpendicular to the first sidewall and the second sidewall. At least one cooling fan is provided on the third sidewall or the fourth sidewall for dissipating heat from the side to the circuit motherboard, the upper circuit sub-board, and the lower circuit sub-board.

[0020] In summary, compared with the prior art, the above-described technical solutions conceived in this application can achieve the following beneficial effects:

[0021] This application achieves a fixed connection between the circuit motherboard and the circuit sub-boards by fixing multiple circuit sub-boards to both sides of the motherboard, forming a whole. The motherboard is then fixed to the side wall of the chassis, effectively reducing the area occupied by the assembled motherboard and sub-boards, improving the integration of modules within the chassis, and avoiding an increase in chassis size due to an excessive number of circuit sub-boards. Furthermore, the fixing holes on the upper and lower circuit sub-boards on both sides of the motherboard are arranged alternately. Fixing holes and posts are provided in other areas of the motherboard to achieve a fixed connection between the motherboard and the chassis. This effectively reduces interference, misalignment, and inter-board stress between PCB sub-boards, lowering the risks of PCB bending deformation, detachment, and electrical connection failure. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in this embodiment or the prior art, the drawings used in the description of the embodiment or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a three-dimensional schematic diagram of the fixed connection of the circuit motherboard and the circuit daughterboard assembly in the embodiments of this application;

[0024] Figure 2 This is a schematic diagram of the hole positions on the circuit motherboard in the embodiments of this application;

[0025] Figure 3 This is a side perspective view of the chip measurement and control device provided in the embodiments of this application;

[0026] Figure 4 This is a side perspective view of a chip measurement and control device provided in another embodiment of this application;

[0027] Figure 5 This is a side perspective view of a chip measurement and control device provided in another embodiment of this application;

[0028] Figure 6 This is a side perspective view of a chip measurement and control device provided in another embodiment of this application. Detailed Implementation

[0029] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the embodiments of this application will be further described in detail below with reference to the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0031] As the scale of quantum chip devices continues to expand, the number of current and voltage channels required for measurement and control increases, leading to a rise in the number of constant current and constant voltage source PCB sub-boards. This results in a larger PCB motherboard area that needs to connect to more sub-boards, squeezing space for other devices or increasing the size of the measurement and control device. Simultaneously, due to manufacturing tolerances, interference, misalignment, and stress can easily occur during connector assembly, causing structural instability and increasing the risk of PCB deformation, detachment, and electrical failure.

[0032] To address the above problems, this application proposes a chip measurement and control device, with reference to... Figure 1 and Figure 3 , Figure 1 This is a three-dimensional schematic diagram of the fixed connection between the circuit motherboard and the circuit daughterboard assembly. The viewpoint in the diagram is from a slightly downward angle from the lower circuit daughterboard. The chip testing and control device includes a chassis 1, a circuit motherboard 2, a circuit daughterboard assembly, and a testing and control signal output terminal 3. The circuit daughterboard assembly includes at least one upper circuit daughterboard 5 located on the side of the circuit motherboard 2 away from the first sidewall and at least one lower circuit daughterboard 6 located on the side of the circuit motherboard 2 closer to the first sidewall. The diagram uses four upper and four lower circuit daughterboards as an example. The chassis 1 is used to support and fix the circuit motherboard 2 and the testing and control signal output terminal 3. The circuit motherboard 2 and the testing and control signal output terminal 3 are connected by signal lines 4. The testing and control signal output terminal 3 is located on the side of the chassis 1 and outputs multiple control signals for testing or controlling the chip. The multiple control signals are current signals or voltage signals; the voltage signal accuracy is typically 0.01V, and the current signal accuracy is typically in the milliampere range.

[0033] The circuit motherboard 2 is fixedly connected to the first side wall 10 of the chassis 1 by multiple first fixing posts 7. The circuit motherboard 2 is fixedly connected to the upper circuit sub-board 5 by multiple second fixing posts 8. The circuit motherboard 2 is fixedly connected to the lower circuit sub-board 6 by multiple third fixing posts 9.

[0034] The circuit motherboard 2 is provided with a first fixing hole 81 corresponding to the first fixing post, a second fixing hole 82 corresponding to the second fixing post, and a third fixing hole 83 corresponding to the third fixing post. The first fixing hole is located outside the projection area of ​​the upper circuit sub-board 5 and the lower circuit sub-board 6 on the circuit motherboard 2. The second fixing hole and the third fixing hole are distributed alternately at equal distances.

[0035] The positions of the first fixing hole 81, the second fixing hole 82, and the third fixing hole 83 are distributed as follows: Figure 2 As shown. Figure 2 This is a schematic diagram of the hole positions of the upper circuit sub-board 5 in this embodiment of the application. Figure 3 This is a schematic diagram of the hole positions of the lower circuit sub-board 6 in this embodiment of the application. Figure 4 This is a schematic diagram of the hole positions of the circuit motherboard 2 in this embodiment. The blue area represents the circuit motherboard 2. The second fixing hole 82 and the third fixing hole 83 are located on the long edge or four corners of the upper circuit sub-board 5 or the lower circuit sub-board 6, which facilitates the fixing of the sub-board. The first fixing hole 81 is located on the edge, four corners, and gaps between adjacent lower circuit sub-boards 6 of the circuit motherboard 2, so that the first fixing post 81 passes through the gaps between adjacent lower circuit sub-boards 6 and is fixedly connected to the first side wall of the chassis 1.

[0036] In this application, multiple circuit sub-boards are grouped into upper circuit sub-board 5 and lower circuit sub-board 6, distributed on the upper and lower sides of the circuit motherboard 2, forming a multi-layer PCB interconnection structure. The circuit motherboard 2 is then fixed to the side wall of the chassis 1, achieving a fixed connection between the circuit motherboard 2 and the circuit sub-boards within the chassis 1. Traditional PCB assembly methods for multi-layer PCBs typically involve soldering slots onto the circuit motherboard 2, then inserting the sub-boards perpendicularly into these slots. Multiple sub-boards are inserted into multiple slots, resulting in a large overall size that encroaches on the space of other circuit components and the chassis 1. This application adopts a double-sided distribution of sub-boards, maximizing the utilization of the area of ​​the circuit motherboard 2, effectively reducing the area occupied by the assembled circuit motherboard 2 and circuit sub-boards, improving the integration of modules within the chassis 1, and avoiding an increase in the size of the chassis 1 due to an excessive number of circuit sub-boards.

[0037] Traditional PCB assembly methods for fixing multi-layer circuit boards typically use a single fixing post that runs through multiple PCB boards and the chassis 1. While the assembly process is simple and straightforward, it is prone to interference between sub-boards, sub-board misalignment, and uneven internal stress leading to deformation. In this application, the fixing holes on the upper and lower sub-boards 5 and 6 on both sides of the circuit motherboard 2 are arranged in an alternating pattern. Fixing holes and fixing posts are used in other areas of the motherboard to achieve a fixed connection between the circuit motherboard 2 and the chassis 1. This effectively reduces interference, misalignment, and inter-board stress between PCB sub-boards, and lowers the risks of PCB bending deformation, detachment, and electrical connection failure.

[0038] In other embodiments of this application, the chip measurement and control device further includes multiple flexible circuit boards, with the upper circuit sub-board 5, the lower circuit sub-board 6, and the circuit motherboard 2 electrically connected via the flexible circuit boards. The ultra-thin and flexible nature of the FPC allows it to adapt to narrow spaces and complex layouts, enabling three-dimensional wiring and solving the problem of limited installation on rigid PCBs. The FPC also supports integrated shielding, reducing electromagnetic interference and improving EMC (electromagnetic compatibility) performance. In terms of production and maintenance, the FPC facilitates automated assembly and modular replacement, significantly improving efficiency.

[0039] In other embodiments of this application, the circuit motherboard 2 is provided with a header nut, and the upper circuit daughterboard 5 and the lower circuit daughterboard 6 are provided with header pins. The upper circuit daughterboard 5, the lower circuit daughterboard 6 and the circuit motherboard 2 are electrically connected to the circuit motherboard 2 through header pins 11 and header nut 12, such as Figure 4 As shown, the motherboard and daughterboard are connected via pin headers and sockets, ensuring a stable electrical connection over a long period, making it particularly suitable for the stringent requirements of industrial equipment. Its standardized design not only offers low cost and a mature supply chain but also significantly reduces material costs, while the universal specifications make maintenance and replacement extremely convenient. The modular pluggable feature allows the daughterboard to be assembled and tested independently, and it can be quickly replaced without desoldering during maintenance, significantly improving production efficiency.

[0040] In other embodiments of this application, the first fixing post, the second fixing post, and the third fixing post can be screws or studs, and the first fixing hole, the second fixing hole, and the third fixing hole are threaded holes. The assembly process involves screwing the screws or studs into the respective threaded holes, which is simple and easy to operate, uses inexpensive raw materials, and has a mature and stable process.

[0041] In the circuit motherboard 2 and circuit daughterboard assembly, some areas, such as power modules and power supply modules, have higher voltage and current, resulting in higher heat generation and requiring more robust heat dissipation measures than other areas. In some embodiments, the circuit motherboard 2 or the upper circuit daughterboard 5 and lower circuit daughterboard 6 are further provided with additional mounting holes and copper studs fixed in the additional mounting holes near the power modules to enhance heat dissipation of the power modules, such as... Figure 5As shown, the circuit motherboard 2 includes a power module 13, with additional mounting holes 14 and copper studs 15 located adjacent to the power module 13. The copper studs have a high thermal conductivity, which helps to quickly conduct heat from the power module 13 to other PCBs or to the chassis 1. Furthermore, heat sinks 16 are attached to the surfaces of the upper circuit sub-boards 5 and lower circuit sub-boards 6, covering multiple upper circuit sub-boards 5 or multiple lower circuit sub-boards 6. The heat sinks can function independently for heat dissipation or work in conjunction with the copper studs to synergistically enhance overall heat dissipation performance.

[0042] Continue to refer to Figure 5 In some embodiments, the chip measurement and control device further includes a grounding fixing post 17, a ground potential fixing hole 18 is provided on the circuit motherboard 2, and a grounding module 19 is provided on the chassis 1. One end of the grounding fixing post is fixed to the ground potential fixing hole, and the other end is connected to the grounding module on the chassis 1. The grounding module can be a specially designed circuit module that provides ground potential, or it can be the ground wire in the power plug of the chip measurement and control device.

[0043] To further enhance the heat dissipation performance of the circuit motherboard 2, the upper circuit daughterboard 5, and the lower circuit daughterboard 6, in some embodiments, at least one cooling fan 20 is provided on the first side wall of the chassis 1 for heat dissipation of the lower circuit daughterboard 6, such as... Figure 6 As shown. In addition, cooling fans can be installed on other side walls. For example, the chassis 1 also includes a second side wall 21 opposite to the first side wall, and at least one cooling fan is installed on the second side wall for cooling the upper circuit board 5.

[0044] In other embodiments, the chassis 1 further includes a third sidewall 23 and a fourth sidewall 24 perpendicular to the first and second sidewalls. At least one cooling fan is provided on the third or fourth sidewall for dissipating heat from the side onto the circuit motherboard 2, the upper circuit daughterboard 5, and the lower circuit daughterboard 6. To ensure that heat can be fully dissipated to the outside of the chassis 1, ventilation holes 22 can be provided on each sidewall of the chassis 1, such as... Figure 6 As shown.

[0045] The various embodiments in this specification are described in a progressive, parallel, or combined manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0046] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that an article or apparatus comprising a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such an article or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the article or apparatus that includes the aforementioned element.

[0047] The above description of the disclosed embodiments enables those skilled in the art to make or use this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip measurement and control device, characterized in that, This includes the chassis, circuit motherboard, circuit daughterboard assembly, and measurement and control signal output terminals; The chassis is used to support and fix the circuit motherboard and the measurement and control signal output terminal; The measurement and control signal output terminal is located on the side of the chassis and is electrically connected to the circuit motherboard, and is used to output chip measurement and control signals; The circuit motherboard is fixedly connected to the first side wall of the chassis by a plurality of first fixing posts. The circuit sub-board group includes at least one upper circuit sub-board located on the side of the circuit motherboard away from the first side wall and at least one lower circuit sub-board located on the side of the circuit motherboard close to the first side wall. The circuit motherboard is fixedly connected to the upper circuit sub-board by a plurality of second fixing posts and the circuit motherboard is fixedly connected to the lower circuit sub-board by a plurality of third fixing posts. The circuit motherboard is provided with a first fixing hole corresponding to the first fixing post, a second fixing hole corresponding to the second fixing post, and a third fixing hole corresponding to the third fixing post. The first fixing hole is located outside the projection area of ​​the upper circuit sub-board and the lower circuit sub-board on the circuit motherboard. The second fixing hole and the third fixing hole are distributed alternately at equal distances.

2. The chip measurement and control device according to claim 1, characterized in that, It also includes multiple flexible circuit boards, and the upper circuit sub-board, the lower circuit sub-board and the circuit motherboard are electrically connected through the flexible circuit boards.

3. The chip measurement and control device according to claim 1, characterized in that, The circuit motherboard is provided with a header, and the upper circuit sub-board and the lower circuit sub-board are provided with header pins. The upper circuit sub-board, the lower circuit sub-board and the circuit motherboard are electrically connected to the header and the header via header pins.

4. The chip measurement and control device according to claim 1, characterized in that, The first fixing post, the second fixing post, and the third fixing post are screws or studs, and the first fixing hole, the second fixing hole, and the third fixing hole are threaded holes.

5. The chip measurement and control device according to claim 1, characterized in that, The circuit motherboard or upper circuit sub-board and lower circuit sub-board include a power module. The circuit motherboard or upper circuit sub-board and lower circuit sub-board are also provided with additional fixing holes and copper studs fixed in the additional fixing holes near the power module to enhance the heat dissipation of the power module.

6. The chip measurement and control device according to claim 5, characterized in that, The surfaces of the upper and lower circuit boards are also covered with heat sinks, which cover multiple upper circuit boards or multiple lower circuit boards.

7. The chip measurement and control device according to claim 1, characterized in that, It also includes a grounding fixing post, and the circuit motherboard is also provided with a ground potential fixing hole. The chassis is provided with a grounding module. One end of the grounding fixing post is fixed to the ground potential fixing hole, and the other end is connected to the grounding module on the chassis.

8. The chip measurement and control device according to claim 1, characterized in that, At least one cooling fan is provided on the first side wall of the chassis for cooling the lower circuit board.

9. The chip measurement and control device according to claim 8, characterized in that, The chassis also includes a second sidewall opposite to the first sidewall, and at least one cooling fan is provided on the second sidewall for cooling the upper circuit board.

10. The chip measurement and control device according to claim 9, characterized in that, The chassis also includes a third side wall and a fourth side wall perpendicular to the first side wall and the second side wall. At least one cooling fan is provided on the third side wall or the fourth side wall for dissipating heat from the side to the circuit motherboard, the upper circuit sub-board and the lower circuit sub-board.

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