High-efficiency heat dissipation computer mainboard structure integrated with heat pipe

Abstract

This utility model discloses a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes, including: a computer motherboard, a fixing bolt 1 fixedly installed at one end of the computer motherboard, a heat dissipation plate 1 sleeved at one end of the fixing bolt 1, and a fixing bolt 2 fixedly installed at the other end of the computer motherboard, a heat dissipation plate 2 sleeved at one end of the fixing bolt 2. By integrating such a finned heat pipe heat dissipation structure on the motherboard, this utility model achieves a more efficient heat dissipation effect, better than the heat dissipation armor on traditional computer motherboards, and effectively improves the heat dissipation effect of inductors and capacitors. Furthermore, the heat dissipation plate structure of heat dissipation plate 1 and heat dissipation plate 2 allows for convenient disassembly, maintenance, or cleaning of the heat pipe heat dissipation structure in the future. During heat dissipation, after installing a CPU cooler, air cooling can be achieved through the CPU cooler's cooling fan. Alternatively, a cooling fan can be added to the outside of the heat dissipation fins near the I / O interface to further improve the heat dissipation effect.

Description

Technical Field

[0001] This utility model relates to the field of computer motherboard equipment technology, specifically a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes. Background Technology

[0002] The motherboard, also known as the mainboard, system board, or motherboard, is one of the most basic and important components of a computer. The motherboard plays a core role in the computer system, providing installation slots and connection interfaces for various hardware devices such as CPU, memory, and graphics card, enabling these components to communicate with each other and work together.

[0003] The motherboard is like the traffic hub of a computer, coordinating and managing the data transmission and instruction execution between various hardware components to ensure the stable operation of the computer system. However, the heat dissipation of existing computer motherboards is poor, and most of them use heat sinks to dissipate heat. This structure not only has poor heat dissipation performance, but also makes it inconvenient to disassemble, maintain and clean later. Utility Model Content

[0004] The purpose of this invention is to address the problem that existing computer motherboards often have poor heat dissipation performance and rely on adding heat sinks for cooling. However, such structures not only have poor heat dissipation performance but are also inconvenient to disassemble, maintain, and clean. This invention provides a computer motherboard structure with integrated heat pipes for high-efficiency heat dissipation.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes, comprising: a computer motherboard, a fixing bolt 1 fixedly disposed at one end of the computer motherboard, a heat spreader 1 sleeved at one end of the fixing bolt 1, a fixing bolt 2 fixedly disposed at the other end of the computer motherboard, a heat spreader 2 sleeved at one end of the fixing bolt 2, and finned heat pipes fixedly disposed at one end of the heat spreader 1 and the heat spreader 2.

[0006] As a further embodiment of this utility model: the computer motherboard includes a motherboard PCB board, and one end of the motherboard PCB board is soldered with inductors, capacitors, I / O interfaces, memory slots, graphics card slots and CPU slots. The number of inductors and capacitors is set in multiple groups, and the number of memory slots is set in four groups.

[0007] As a further embodiment of this utility model: the fixing bolt includes a fixing bolt shank, a fixing nut is screwed onto one of the upper outer ends of the fixing bolt shank, and a buffer elastic element is movably sleeved on the upper outer end of the fixing bolt shank below the fixing nut.

[0008] As a further embodiment of this utility model: the heat spreader includes an upper cover plate and a lower bonding plate. An upper heat pipe groove is formed in the middle of one end of the upper cover plate, and upper bolt through holes are formed through both sides inside the upper cover plate. A lower heat pipe groove is formed in the middle of one end of the lower bonding plate, and lower bolt through holes are formed through both sides inside the lower bonding plate. The upper heat pipe groove and the lower heat pipe groove are matched in size and position, and the upper bolt through holes and the lower bolt through holes are matched in size and position.

[0009] As a further embodiment of this utility model: the finned heat pipe includes heat dissipation fins, a heat dissipation sleeve is fixedly embedded at one end of the heat dissipation fin, a heat dissipation sleeve is fixedly embedded at the other end of the heat dissipation fin, a heat pipe is fixedly installed at one end of the heat dissipation sleeve, and a heat pipe is fixedly installed at one end of the heat dissipation sleeve.

[0010] As a further embodiment of this utility model: the second fixing bolt has the same specifications and model as the first fixing bolt, the second heat-spreading plate has the same specifications and model as the first heat-spreading plate, and the number of the first fixing bolt and the second fixing bolt is set to six.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] This invention integrates a finned heat pipe cooling structure on the motherboard, achieving a more efficient heat dissipation effect. This is superior to traditional heatsinks on computer motherboards, effectively improving the heat dissipation of inductors and capacitors. Furthermore, the heatsink structure of both heatsink 1 and heatsink 2 allows for convenient disassembly, maintenance, and cleaning of the heat pipe cooling structure. During heat dissipation, the CPU cooler can be installed, and its cooling fan can achieve air cooling. Alternatively, a cooling fan can be added to the outside of the heatsink fins near the I / O ports to further enhance the cooling effect. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of a high-efficiency heat dissipation computer motherboard with integrated heat pipes as described in this utility model;

[0014] Figure 2 This is a structural diagram of a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes as described in this utility model;

[0015] Figure 3 This is a structural diagram of a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes as described in this utility model;

[0016] Figure 4This is a structural diagram of a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes as described in this utility model;

[0017] Figure 5 This is a structural diagram of a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes as described in this utility model.

[0018] In the diagram: 1. Computer motherboard; 2. Fixing bolt one; 3. Heat spreader one; 4. Fixing bolt two; 5. Heat spreader two; 6. Finned heat pipe; 10. Motherboard PCB; 11. Inductor; 12. Capacitor; 13. I / O interface; 14. Memory slot; 15. Graphics card slot; 16. CPU socket; 20. Fixing bolt rod; 21. Fixing nut; 22. Buffer elastic element; 30. Heat spreader upper cover plate; 31. Heat spreader lower bonding plate; 32. Upper heat pipe slot; 33. Upper bolt through hole; 34. Lower heat pipe slot; 35. Lower bolt through hole; 60. Heat sink fins; 61. Heat spreader sleeve one; 62. Heat spreader sleeve two; 63. Heat pipe one; 64. Heat pipe two. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In the description of this utility model, it should be noted that unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "setting" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances. The embodiments of this utility model will be described below based on its overall structure.

[0021] Reference Figure 1 In this embodiment of the utility model, a high-efficiency heat dissipation computer motherboard structure with integrated heat pipes includes: a computer motherboard 1, a fixing bolt 2 fixedly disposed at one end of the computer motherboard 1, a heat spreader 3 sleeved at one end of the fixing bolt 2, a fixing bolt 4 fixedly disposed at the other end of the computer motherboard 1, a heat spreader 5 sleeved at one end of the fixing bolt 4, and finned heat pipes 6 fixedly disposed at one end of the heat spreader 3 and the heat spreader 5. The fixing bolt 4 has the same specifications and model as the fixing bolt 2, and the heat spreader 5 has the same specifications and model as the heat spreader 3. There are six sets of fixing bolts 2 and 4.

[0022] The above solution integrates a finned heat pipe cooling structure on the motherboard, achieving a more efficient heat dissipation effect. This is better than the heat dissipation armor on traditional computer motherboards and can effectively improve the heat dissipation of inductors and capacitors. Furthermore, the heat pipe cooling structure of vapor chambers 1-3 and 2-5 allows for easier disassembly, maintenance, and cleaning of the heat pipe cooling structure in the future.

[0023] Reference Figure 2 The computer motherboard 1 includes a motherboard PCB board 10. One end of the motherboard PCB board 10 is soldered with inductors 11, capacitors 12, I / O interfaces 13, memory slots 14, graphics card slots 15 and CPU slots 16. There are multiple sets of inductors 11 and capacitors 12, and four sets of memory slots 14.

[0024] Reference Figure 3 The fixing bolt 2 includes a fixing bolt rod 20, and a fixing nut 21 is screwed to one of the upper outer ends of the fixing bolt rod 20. A buffer elastic element 22 is movably sleeved on the upper outer side of the fixing bolt rod 20 below the fixing nut 21.

[0025] Reference Figure 4 The heat spreader 3 includes an upper heat spreader cover plate 30 and a lower heat spreader bonding plate 31. The upper heat spreader cover plate 30 has an upper heat pipe groove 32 in the middle of one end, and upper bolt through holes 33 are opened through both sides inside the upper heat spreader cover plate 30. The lower heat spreader bonding plate 31 has a lower heat pipe groove 34 in the middle of one end, and lower bolt through holes 35 are opened through both sides inside the lower heat spreader bonding plate 31. The upper heat pipe groove 32 and the lower heat pipe groove 34 are matched in size and position, and the upper bolt through holes 33 and the lower bolt through holes 35 are matched in size and position.

[0026] Reference Figure 5The finned heat pipe 6 includes a heat dissipation fin 60. A heat dissipation sleeve 61 is fixedly embedded at one end of the heat dissipation fin 60, and a heat dissipation sleeve 62 is fixedly embedded at the other end of the heat dissipation fin 60. A heat pipe 63 is fixedly installed at one end of the heat dissipation sleeve 61, and a heat pipe 64 is fixedly installed at one end of the heat dissipation sleeve 62.

[0027] The above solution is adopted as follows: A thermal pad is attached to the underside of the heat spreader plate 31, and the lower bolt through-hole 35 is aligned with the fixing bolt rod 20 and inserted until the heat spreader plate 31 is attached to the multiple sets of inductors 11 and capacitors 12 below. Then, the heat spreader plate 2 5 on the other side is installed with the fixing bolt 2 4 in the same manner. Finally, the heat spreader plate upper cover 30 in heat spreader plate 1 3 and the identical structure in heat spreader plate 2 5 are respectively located above one end of heat pipe 1 63 and heat pipe 2 64, and are attached through the upper heat pipe groove 32 structure. Align the upper bolt through hole 33 with the same structure inside the fixing bolt rod 20 and fixing bolt 2 4 from above, and then press them down to fit. In this way, heat pipe 1 63 and heat pipe 2 64 are clamped between heat spreader 1 3 and heat spreader 2 5. Before clamping and installation, thermal grease can be applied to the surface of heat pipe 1 63 and heat pipe 2 64 to improve the thermal conductivity. Then, multiple sets of buffer elastic elements 22 are sleeved on the outside of the fixing bolt rod 20 inside fixing bolt 1 2 and fixing bolt 2 4, and then multiple sets of fixing nuts 21 are screwed on to complete the fixed installation of the heat pipe heat dissipation assembly.

[0028] The working principle of this utility model is as follows: First, attach a thermal pad with silicone grease below the lower bonding plate 31 of the heat spreader. Then, align the lower bolt through-hole 35 with the fixing bolt rod 20 and insert it until the lower bonding plate 31 of the heat spreader adheres to the multiple sets of inductors 11 and capacitors 12 below. Next, install the heat spreader 2 5 and fixing bolt 2 4 on the other side in the same way. Then, attach the heat spreader upper cover plate 30 in the heat spreader 1 3 and the same structure in the heat spreader 2 5 above one end of heat pipe 1 63 and heat pipe 2 64 respectively through the upper heat pipe groove 32 structure. Align the upper bolt through-hole 33 with the same structure in the fixing bolt rod 20 and fixing bolt 2 4 from above and press down to attach them. This clamps heat pipe 1 63 and heat pipe 2 64 between heat spreader 1 3 and heat spreader 2 5. Before clamping and installation, thermal grease can be applied to the surface of heat pipe 1 63 and heat pipe 2 64. To improve thermal conductivity, multiple sets of buffer elastic elements 22 are then fitted onto the outside of the fixing bolt rod 20 inside fixing bolt 1 2 and fixing bolt 2 4, and then multiple sets of fixing nuts 21 are screwed on to complete the fixed installation of the heat pipe heat dissipation component. By integrating such a finned heat pipe heat dissipation structure on the motherboard, a more efficient heat dissipation effect can be achieved, which is better than the heat dissipation armor on traditional computer motherboards. It can effectively improve the heat dissipation effect of inductors and capacitors. At the same time, the heat dissipation plates 1 3 and 2 5, with such a structure, can be easily disassembled, maintained, or cleaned in the later stages, making it more convenient to use. When heat dissipating, after installing the CPU cooler, the cooling fan of the CPU cooler can achieve the effect of air cooling. Alternatively, a cooling fan can be added to the outside of the heat dissipation fins 60 near the I / O interface 13 to further improve the heat dissipation effect.

[0029] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A high-efficiency heat dissipation computer motherboard structure with integrated heat pipes, characterized in that, include: A computer motherboard (1) is fixedly provided with a fixing bolt 1 (2) at one end of the computer motherboard (1), and a heat spreader 1 (3) is sleeved on one end of the fixing bolt 1 (2). A fixing bolt 2 (4) is fixedly provided on the other end of the computer motherboard (1), and a heat spreader 2 (5) is sleeved on one end of the fixing bolt 2 (4). A finned heat pipe (6) is fixedly provided on one end of the heat spreader 1 (3) and the heat spreader 2 (5).

2. The high-efficiency heat dissipation computer motherboard structure with integrated heat pipes according to claim 1, characterized in that, The computer motherboard (1) includes a motherboard PCB board (10). One end of the motherboard PCB board (10) is soldered with an inductor (11), a capacitor (12), an I / O interface (13), a memory slot (14), a graphics card slot (15), and a CPU slot (16). The number of inductors (11) and capacitors (12) is set in multiple groups, and the number of memory slots (14) is set in four groups.

3. The high-efficiency heat dissipation computer motherboard structure with integrated heat pipes according to claim 1, characterized in that, The fixing bolt (2) includes a fixing bolt rod (20), and a fixing nut (21) is screwed onto one of the upper outer ends of the fixing bolt rod (20). A buffer elastic element (22) is movably sleeved on the upper outer side of the fixing bolt rod (20) below the fixing nut (21).

4. The high-efficiency heat dissipation computer motherboard structure with integrated heat pipes according to claim 1, characterized in that, The heat spreader (3) includes an upper heat spreader cover plate (30) and a lower heat spreader bonding plate (31). An upper heat pipe groove (32) is provided in the middle of one end of the upper heat spreader cover plate (30). Upper bolt through holes (33) are provided through both sides inside the upper heat spreader cover plate (30). A lower heat pipe groove (34) is provided in the middle of one end of the lower heat spreader bonding plate (31). Lower bolt through holes (35) are provided through both sides inside the lower heat spreader bonding plate (31). The upper heat pipe groove (32) and the lower heat pipe groove (34) are matched in size and position. The upper bolt through holes (33) and the lower bolt through holes (35) are matched in size and position.

5. The high-efficiency heat dissipation computer motherboard structure with integrated heat pipes according to claim 1, characterized in that, The finned heat pipe (6) includes heat dissipation fins (60). A heat-spreading sleeve (61) is fixedly embedded at one end of the heat dissipation fin (60), and a heat-spreading sleeve (62) is fixedly embedded at the other end of the heat dissipation fin (60). A heat pipe (63) is fixedly installed at one end of the heat-spreading sleeve (61), and a heat pipe (64) is fixedly installed at one end of the heat-spreading sleeve (62).

6. The high-efficiency heat dissipation computer motherboard structure with integrated heat pipes according to claim 1, characterized in that, The specifications and models of the second fixing bolt (4) are the same as those of the first fixing bolt (2), and the specifications and models of the second heat-spreading plate (5) are the same as those of the first heat-spreading plate (3). There are six sets of both the first fixing bolt (2) and the second fixing bolt (4).

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