Water-cooling heat dissipation structure of laser

Abstract

This utility model relates to the field of laser heat dissipation technology, and discloses a water-cooled heat dissipation structure for a laser, including a cover plate, a flow divider plate, and an interface plate. The cover plate is made of aluminum nitride and has a smooth top surface. The interface plate has spaced-apart inlet and outlet water channels. The flow divider plate is disposed between the cover plate and the interface plate, and is fixedly connected to both the cover plate and the interface plate. The flow divider plate has a flow area that communicates with the inlet and outlet water channels to form a water-cooled flow path. By using an aluminum nitride cover plate, aluminum nitride is easier to process, has a higher surface flatness, which is beneficial for the installation of the laser chip. Furthermore, the thermal expansion coefficient of aluminum nitride matches well with that of the laser chip, helping to reduce stress during use.

Description

Technical Field

[0001] This utility model relates to the field of laser heat dissipation technology, and in particular to a water-cooled heat dissipation structure for lasers. Background Technology

[0002] Lasers are essential core components in industries such as fiber optic communication and data transmission. The "heart" of a laser is the laser chip, which generates a significant amount of heat during operation, in addition to converting electrical energy into light energy. If this heat cannot be dissipated quickly, it can cause a series of problems, such as redshift of the lasing wavelength, reduced efficiency, decreased power, and increased threshold current. Therefore, heat dissipation structures are needed to cool the laser and ensure its lifespan and reliability.

[0003] Chinese utility model patent with publication number CN220172575U discloses a coaxial packaging base for a high-power laser.

[0004] In the above technical solution, an oxygen-free copper substrate is used to achieve consistency in chip mounting position and overall precision. Oxygen-free copper has good heat dissipation function, thereby controlling the temperature of high-power lasers. However, due to the processing methods and the relatively soft material, traditional oxygen-free copper is not easy to process and maintain the quality of the edges. The size and defect status of the edges directly affect the heat dissipation effect. Utility Model Content

[0005] To overcome at least one of the defects described in the prior art, this utility model provides a water-cooled heat dissipation structure for a laser. By using an aluminum nitride cover plate, aluminum nitride is easier to process, has a higher surface flatness, which is beneficial for the installation of the laser chip. Moreover, the thermal expansion coefficient of aluminum nitride matches the thermal expansion coefficient of the laser chip well, which helps to reduce stress during use.

[0006] The technical solution of this utility model is implemented as follows:

[0007] A water-cooled heat dissipation structure for a laser includes a cover plate, a flow divider plate, and an interface plate. The cover plate is made of aluminum nitride and has a smooth top surface. The interface plate has an inlet channel and an outlet channel spaced apart. The flow divider plate is disposed between the cover plate and the interface plate and is fixedly connected to both the cover plate and the interface plate. The flow divider plate has a flow area that communicates with the inlet channel and the outlet channel to form a water-cooled flow path.

[0008] Based on the above technical solutions, preferably, the cover plate is inclined along its four edges in the circumferential direction toward the top surface axis to form ridges.

[0009] Based on the above technical solutions, preferably, the edge line is chamfered at the edge of the cover plate.

[0010] Based on the above technical solutions, preferably, the bottom surface of the cover plate, the top and bottom surfaces of the diverter plate, and the four edges of the top surface of the interface plate are all provided with chamfers.

[0011] Based on the above technical solutions, preferably, the top surface of the diverter plate is welded and fixed to the bottom surface of the cover plate, and the bottom surface of the diverter plate is welded and fixed to the top surface of the interface plate.

[0012] Based on the above technical solutions, preferably, the water inlet channel has a first water inlet and a first water outlet that are interconnected, wherein the first water inlet and the first water outlet are arranged in an L-shape; the first water inlet is located on one side wall of the interface plate; and the first water outlet is located on the top wall of the interface plate.

[0013] Based on the above technical solutions, preferably, the water outlet channel has a second inlet and a second outlet that are interconnected, wherein the second outlet and the second inlet are arranged in an L-shape, the second outlet is located on the other side wall of the interface plate, and the second outlet and the first inlet are symmetrically distributed about the axis of the interface plate; the second inlet is located on the top wall of the interface plate; the second inlet and the first outlet are symmetrically distributed about the axis of the interface plate.

[0014] Based on the above technical solutions, preferably, the flow area includes a first groove, a second groove, and a third groove. The first groove and the second groove are both formed by recessing inward from the bottom wall of the flow divider plate, and the first groove and the second groove are spaced apart. The third groove is formed by recessing inward from the top wall of the flow divider plate, wherein the third groove is connected to the first groove and the second groove respectively.

[0015] Based on the above technical solutions, preferably, the top wall of the interface plate is recessed to form a first overflow groove and a second overflow groove that are spaced apart. The top end of the first overflow groove corresponds to the first groove, the bottom end of the first overflow groove corresponds to the first outlet, the top end of the second overflow groove corresponds to the second groove, and the bottom end of the second overflow groove corresponds to the second inlet.

[0016] Based on the above technical solutions, preferably, the length of the first overflow trough is adapted to the length of the first groove, and the length of the first overflow trough is longer than the length of the first outlet; the length of the second overflow trough is adapted to the length of the second groove, and the length of the second overflow trough is longer than the length of the second inlet.

[0017] In summary, the water-cooled heat dissipation structure for lasers provided by this utility model has the following advantages over the prior art:

[0018] (1) By setting inlet and outlet channels on the interface plate and setting flow areas connected to the inlet and outlet channels on the distribution plate, the cooling water can form an effective circulation path, so that the cooling water can flow on the interface plate and the distribution plate, thereby improving the uniformity and comprehensiveness of heat dissipation.

[0019] (2) The thermal expansion coefficient of the aluminum nitride cover plate is similar to that of the laser chip material, which can maintain good thermal matching with the laser chip under different temperature environments, reduce structural stress problems caused by thermal expansion differences, and improve the compatibility of the entire heat dissipation structure with the laser chip and the reliability of long-term use.

[0020] (3) Aluminum nitride has high hardness and good mechanical properties, making it easier to ensure dimensional accuracy, surface quality and surface smoothness during processing. At the same time, it has good structural stability during use and is not easily damaged by external forces, reducing maintenance costs and difficulties. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a three-dimensional structural diagram of an embodiment of the present utility model;

[0023] Figure 2 This is a cross-sectional structural diagram of an embodiment of the present utility model;

[0024] Figure 3 This is a top view of the splitter plate according to an embodiment of the present utility model;

[0025] Figure 4 This is a bottom view of the splitter plate according to an embodiment of the present utility model;

[0026] Figure 5 This is a schematic diagram of the cover plate according to an embodiment of the present utility model;

[0027] The meanings of the reference numerals in the attached drawings are as follows: 1. Cover plate; 11. Ridge; 12. Chamfer; 2. Diverter plate; 21. Flow area; 211. First groove; 2111. First drainage groove; 2112. First guide hole; 212. Second groove; 2121. Second drainage groove; 2122. Second guide hole; 213. Third groove; 2131. Guide groove; 3. Interface plate; 31. Water inlet channel; 311. First water inlet; 312. First water outlet; 32. Water outlet channel; 321. Second water inlet; 322. Second water outlet; 33. First overflow groove; 34. Second overflow groove; 35. Mounting hole; 4. First partition plate; 5. Second partition plate; 6. Third partition plate; 7. Fourth partition plate. Detailed Implementation

[0028] The technical solutions of this utility model will be clearly and completely described below with reference to the embodiments of this utility model. Obviously, the described embodiments are only a part of the embodiments of this utility model, and not all of them. Based on the embodiments of this utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of this utility model.

[0029] See Figures 1-5 This utility model discloses a water-cooled heat dissipation structure for a laser, including a cover plate 1, a splitter plate 2, and an interface plate 3.

[0030] See Figure 1 As shown, in this embodiment, the cover plate 1 is made of aluminum nitride. In the prior art, the cover plate 1 is usually made of oxygen-free copper. Oxygen-free copper is relatively soft, and it is difficult to ensure the dimensional accuracy and surface quality of the cover plate 1 structure during processing, which affects the heat dissipation effect. Moreover, the quality of the ridge line 11 of oxygen-free copper is difficult to guarantee, which can easily lead to obstruction of the heat dissipation path and a decrease in heat transfer efficiency. The thermal expansion coefficient of oxygen-free copper is significantly different from that of the laser chip. When the temperature changes, the difference in thermal expansion between oxygen-free copper and the chip can easily cause the interface to loosen, increase the contact thermal resistance, and affect the heat dissipation efficiency. In this embodiment, aluminum nitride is used. Aluminum nitride has high hardness, high bending strength, and excellent mechanical properties. Its cost is relatively low, and it is easier to form during processing. It can maintain the quality of the ridge line 11, reduce processing defects, and has good structural stability. It is not easily damaged by external forces or temperature fluctuations, and can ensure the integrity of the heat dissipation structure for a long time. Moreover, the coefficient of thermal expansion of aluminum nitride is closer to that of the laser chip. When the temperature changes, the difference in the coefficient of thermal expansion between aluminum nitride and the chip is small, which can reduce poor contact or structural damage caused by thermal stress and ensure the stability of heat transfer.

[0031] In this embodiment, the cover plate 1 is in contact with the laser chip. More specifically, the laser and the laser chip are in direct contact. The thermal expansion coefficient of the aluminum nitride cover plate 1 matches well with that of the laser chip, which helps to reduce stress during use. This eliminates the need for a heat sink between the chip and the oxygen-free copper substrate. Direct contact allows the aluminum nitride cover plate 1 to directly absorb the heat generated by the chip and quickly dissipate the heat due to its high thermal conductivity. Compared to indirect contact, this significantly improves the efficiency of heat transfer from the chip to the heat dissipation structure, reducing heat accumulation near the chip from the source. Moreover, the direct contact design results in minimal deformation difference between the cover plate 1 and the laser chip when the temperature changes, maintaining a good fit.

[0032] See Figure 5 As shown, in this embodiment, the cover plate 1 has four edges along its circumference inclined toward the top surface axis to form ridges 11. A chamfer 12 is provided at the edge of the cover plate 1 from the ridge 11. Specifically, the cover plate 1 has four edges along its upper part inclined toward the top surface axis to form ridges 11. More specifically, the chamfer 12 of the ridge 11 is processed to within one micrometer, which can avoid the bottleneck of heat transfer caused by the chamfer 12 being too large or rough. Moreover, the chamfer 12 within one micrometer can eliminate the small burrs and stress concentration points at the ridge 11.

[0033] More specifically, in this embodiment, the bottom surface of the cover plate 1, the top and bottom surfaces of the diverter plate 2, and the top surface of the interface plate 3 are all provided with chamfers 12 around their edges. The chamfers 12 can create a certain gap at the edge of the component connection, providing sufficient operating space for the welding gun and welding rod, making it convenient for the operator to accurately feed the welding material into the welding area, and avoiding the welding material not being able to fully fill due to the connection edge being too tight.

[0034] See Figure 5 As shown, the top surface of the cover plate 1 is smoothly set, and the top surface of the cover plate 1 is the contact surface with the laser chip. The clean and smooth surface is conducive to the installation of the laser chip, and can also avoid physical damage such as scratches and indentations to the chip surface caused by the small particles, burrs or protrusions in the surface roughness when in contact with the laser chip, during assembly or relative displacement caused by temperature changes, thus protecting the structural integrity and performance stability of the chip.

[0035] See Figure 1 As shown in this embodiment, the splitter plate 2 is also made of oxygen-free copper. The thermal conductivity of oxygen-free copper is about 400W / (m·K). The high thermal conductivity of oxygen-free copper allows the heat of the laser chip to be quickly transferred from the cover plate 1 to the splitter plate 2.

[0036] See Figure 1 , Figure 3 and Figure 4As shown, in this embodiment, the interface board 3 is made of oxygen-free copper. The thermal conductivity of oxygen-free copper is about 400W / (m·K). The high thermal conductivity of oxygen-free copper allows the heat of the laser chip to be quickly transferred from the splitter board 2 to the interface board 3.

[0037] See Figure 2 As shown, in this embodiment, the interface plate 3 is provided with an inlet channel 31 and an outlet channel 32 spaced apart. The inlet channel 31 and the outlet channel 32 are separated by a first partition plate 4. Both the inlet channel 31 and the outlet channel 32 are hollow channels to facilitate the flow of cooling water.

[0038] See Figure 1 and Figure 2 As shown, in this embodiment, specifically, the water inlet channel 31 has a first water inlet 311 and a first water outlet 312 that are interconnected. The first water inlet 311 and the first water outlet 312 are located at both ends of the water inlet channel 31, and the first water inlet 311 and the second water inlet 312 are arranged in an L-shape. The first water inlet 311 is located on one side wall of the interface plate 3 and is used to connect the external cooling water supply pipe and the water pump. The first water outlet 312 is located on the top wall of the interface plate 3. The top wall of the interface plate 3 is recessed to form a first overflow groove 33. The bottom end of the first overflow groove 33 is correspondingly arranged with the first water outlet 312. Moreover, in this embodiment, the length of the first overflow groove 33 is longer than the length of the first water outlet 312. This design facilitates the entry of cooling water from the first water outlet 312 into the first overflow groove 33, which facilitates the subsequent introduction of cooling water into the diverter plate 2, increases the contact area between the cooling water and the internal part of the interface plate 3, and improves the heat exchange efficiency.

[0039] See Figure 2 As shown, in this embodiment, specifically, the water outlet channel 32 has a second inlet 321 and a second outlet 322 that are interconnected. The second outlet 322 and the second inlet 321 are located at both ends of the water outlet channel 32, respectively. The second outlet 322 and the second inlet 321 are arranged in an L-shape. The second outlet 322 is located on the side wall of the interface plate 3 opposite to the first inlet 311, and the second inlet 321 is located on the top wall of the interface plate 3. The second outlet 322 and the first inlet 311 are symmetrically distributed about the axis of the interface plate 3. The second inlet 321 and the first outlet 312 are symmetrically distributed about the axis of the interface plate 3. The top wall of the interface plate 3 is recessed to form a second overflow groove 34. The bottom end of the second overflow groove 34 is positioned corresponding to the second water inlet 321. In this embodiment, the length of the second overflow groove 34 is longer than the length of the second water inlet 321. This design facilitates the extraction of cooling water from the diversion plate 2 and gathers the cooling water flowing out of the diversion plate 2 into the water outlet channel 32, thereby improving the uniformity of the water flow.

[0040] It should also be noted that the first overflow channel 33 and the second overflow channel 34 are set apart to prevent them from being connected, which would cause cooling water to flow directly from the first outlet 312 to the second inlet 321 and affect the heat exchange efficiency.

[0041] See Figure 1 As shown, in some embodiments, the interface board 3 is provided with mounting holes 35 for easy installation of lasers. The mounting holes 35 are provided through the interface board 3. This design allows the interface board 3 to be connected quickly, simplifies the assembly process, and improves installation efficiency.

[0042] See Figure 1 and Figure 2 As shown, the flow divider 2 is disposed between the cover plate 1 and the interface plate 3. The flow divider 2 is fixedly connected to both the cover plate and the interface plate. Specifically, the top surface of the flow divider 2 is fixedly connected to the cover plate 1, and the bottom surface of the flow divider 2 is fixedly connected to the interface plate 3. More specifically, the top surface of the flow divider 2 is welded to the cover plate 1, and the bottom surface of the flow divider 2 is welded to the interface plate 3. Furthermore, the welding is performed along the chamfer 12 of the top and bottom surfaces of the flow divider 2, the bottom surface of the cover plate 1, and the top surface of the interface plate 3, resulting in a better welding effect. In this embodiment, the welding method between the flow divider 2 and the cover plate 1, and between the flow divider 2 and the interface plate 3, is brazing. Brazing provides high connection strength, allowing the cover plate 1, the flow divider 2, and the interface plate 3 to form a unified whole. This ensures stable connections between components under long-term use and complex operating conditions, preventing loosening or separation and ensuring the integrity and reliability of the heat dissipation structure. Moreover, brazing provides good sealing performance, preventing cooling water leakage and ensuring the normal operation of the laser.

[0043] See Figure 2As shown, in this embodiment, a flow region 21 is provided on the flow divider 2. One end of the flow region 21 is connected to the water inlet channel 31, and the other end of the flow region 21 is connected to the water outlet channel 32 to form a water-cooled flow path. Specifically, the flow region 21 includes a first groove 211, a second groove 212, and a third groove 213. The first groove 211 and the second groove 212 are both formed by recessing inward from the bottom wall of the flow divider 2, and the first groove 211 and the second groove 212 are arranged at intervals. In this embodiment, the first groove 211 and the second groove 212 are separated by a second partition plate 5. The first partition plate 4 and the second partition plate 5 are arranged in contact to prevent cooling water from flowing directly from the first groove 211 into the second groove 212, thus affecting the heat exchange efficiency. The third groove 213 is formed by recessing inward from the top wall of the diversion plate 2. The first groove 211 includes a first drain groove 2111 and a first guide hole 2112 arranged sequentially. Specifically, the first drain groove 2111 is located on one side of the first groove 211, and the first guide hole 2112 is located on the other side of the first groove 211. The first drain groove 2111 and the first guide hole 2112 occupy the space of the first groove 211. The groove 212 includes a second drainage groove 2121 and a second guide hole 2122 arranged sequentially. Specifically, the second drainage groove 2121 is located on one side of the second groove 212, and the second guide hole 2122 is located on the other side of the second groove 212. The second drainage groove 2121 and the second guide hole 2122 occupy the space of the second groove 212. The third groove 213 includes a guide groove 2131. One end of the guide groove 2131 is connected to the first guide hole 2112, and the other end of the guide groove 2131 is connected to the second guide hole 2122. The top end of the first overflow groove 33 is correspondingly arranged with the first groove 211, and the top end of the second overflow groove 34 is correspondingly arranged with the second groove 212.

[0044] In this embodiment, the length of the first overflow groove 33 is adapted to the length of the first groove 211, and the length of the second overflow groove 34 is adapted to the length of the second groove 212. This design facilitates the flow of all the cooling water in the first overflow groove 33 into the first groove 211, and facilitates the flow of all the cooling water in the second groove 212 into the second groove 212.

[0045] With this design, the water pump delivers cooling water from the external water supply pipe through the first inlet 311. The cooling water then passes through the first outlet 312 and sequentially enters the first overflow trough 33, the first drain trough 2111, the first guide hole 2112, and the guide trough 2131. It then passes through the second guide hole 2122, the second drain trough 2121, the second inlet 321, and the second outlet 322 before being discharged. This design involves multiple components and a long flow path for the cooling water, resulting in higher heat exchange efficiency.

[0046] See Figure 4As shown, in this embodiment, multiple first guide holes 2112 are provided. The first guide holes 2112 are spaced apart along the first groove 211. Multiple parallel third partition plates 6 are provided between adjacent first guide holes 2112. The length of the third partition plate 6 is less than the side length of the first groove 211. The multiple spaced first guide holes 2112 can disperse the water flow and avoid local water flow concentration or excessive flow rate. In conjunction with the third partition plates 6 between adjacent first guide holes 2112, the water flow direction is straightened, so that the water flow enters the subsequent guide groove 2131 more evenly, ensuring that the cooling water and each part of the heat dissipation structure are in full contact.

[0047] See Figure 4 As shown, in this embodiment, multiple second guide holes 2122 are provided. The second guide holes 2122 are spaced apart along the second groove 212, and multiple parallel fourth partition plates 7 are provided between adjacent second guide holes 2122. The length of the fourth partition plate 7 is less than the side length of the first groove 211. The multiple spaced second guide holes 2122 can disperse the water flow, avoid local water flow concentration or excessive flow rate. In conjunction with the fourth partition plates 7 between adjacent second guide holes 2122, the water flow direction is straightened, so that the water flowing in from the guide groove 2131 enters the second guide hole 2122 more evenly, ensuring that the cooling water is in full contact with all parts of the heat dissipation structure.

[0048] See Figure 3 As shown, in this embodiment, multiple guide channels 2131 are provided. The second guide channels 2131 are spaced apart along the third groove 213. The number of second guide channels 2131 is the same as the number of first guide holes 2112 and second guide holes 2122, and they are arranged in a one-to-one correspondence. The multiple guide channels 2131 correspond one-to-one with the first guide holes 2112 and the second guide holes 2122, which can accurately distribute the cooling water flowing in from the first guide hole 2112 to each guide channel 2131, and then discharge it through the corresponding second guide hole 2122. This avoids the problem of concentrated or uneven water flow in the traditional structure and ensures that each area of ​​the diversion plate 2 can be covered by cooling water.

[0049] Specific implementation steps:

[0050] The cover plate 1, made of aluminum nitride, contacts the laser chip, resulting in higher flatness and easier installation. The heat from the laser chip is transferred to the cover plate 1, the diverter plate 2, and the interface plate 3. The water pump delivers cooling water from the external water supply pipe through the first inlet 311. The cooling water then passes through the first outlet 312 and sequentially enters the first overflow trough 33, the first drainage trough 2111, the first guide hole 2112, and the guide trough 2131. It then passes through the second guide hole 2122, the second drainage trough 2121, the second inlet 321, and the second outlet 322 before being discharged. Heat exchange is achieved through water cooling.

[0051] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A water-cooled heat dissipation structure for a laser, characterized in that, It includes a cover plate (1), a diverter plate (2), and an interface plate (3), wherein, The cover plate (1) is made of aluminum nitride material, and the top surface of the cover plate (1) is smooth. The interface board (3) is provided with an inlet channel (31) and an outlet channel (32) arranged at intervals; The diversion plate (2) is disposed between the cover plate (1) and the interface plate (3). The diversion plate (2) is fixedly connected to the cover plate (1) and the interface plate (3) respectively. A flow area (21) is provided on the diversion plate (2). The flow area (21) is connected to the water inlet channel (31) and the water outlet channel (32) to form a water-cooled flow path.

2. The water-cooled heat dissipation structure for a laser according to claim 1, characterized in that, The cover plate (1) is inclined along its four edges in the circumferential direction toward the top surface axis to form ridges (11).

3. The water-cooled heat dissipation structure for a laser according to claim 2, characterized in that, A chamfer (12) is provided at the edge of the ridge (11) to the edge of the cover plate (1).

4. The water-cooled heat dissipation structure for a laser according to claim 1, characterized in that, The bottom surface of the cover plate (1), the top and bottom surfaces of the diverter plate (2), and the four edges of the top surface of the interface plate (3) are all provided with chamfers (12).

5. The water-cooled heat dissipation structure for a laser according to claim 4, characterized in that, The top surface of the diverter plate (2) is welded and fixed to the bottom surface of the cover plate (1), and the bottom surface of the diverter plate (2) is welded and fixed to the top surface of the interface plate (3).

6. The water-cooled heat dissipation structure for a laser according to claim 1, characterized in that, The water inlet channel (31) has a first water inlet (311) and a first water outlet (312) that are interconnected, wherein, The first inlet (311) and the first outlet (312) are arranged in an L-shape; the first inlet (311) is located on one side wall of the interface plate (3); The first outlet (312) is located on the top wall of the interface plate (3).

7. The water-cooled heat dissipation structure for a laser according to claim 6, characterized in that, The water outlet channel (32) has a second water inlet (321) and a second water outlet (322) that are interconnected, wherein, The second outlet (322) and the second inlet (321) are arranged in an L-shape. The second outlet (322) is located on the other side wall of the interface plate (3). The second outlet (322) and the first inlet (311) are symmetrically distributed about the axis of the interface plate (3). The second inlet (321) is located on the top wall of the interface plate (3); the second inlet (321) and the first outlet (312) are symmetrically distributed about the axis of the interface plate (3).

8. The water-cooled heat dissipation structure for a laser according to claim 7, characterized in that, The flow region (21) includes a first groove (211), a second groove (212) and a third groove (213). The first groove (211) and the second groove (212) are both recessed inward from the bottom wall of the flow divider (2), and the first groove (211) and the second groove (212) are spaced apart. The third groove (213) is recessed inward from the top wall of the flow divider (2), and the third groove (213) is connected to the first groove (211) and the second groove (212) respectively.

9. The water-cooled heat dissipation structure for a laser according to claim 8, characterized in that, The top wall of the interface plate (3) is recessed to form a first overflow groove (33) and a second overflow groove (34) that are spaced apart. The top end of the first overflow groove (33) is corresponding to the first groove (211), the bottom end of the first overflow groove (33) is corresponding to the first outlet (312), the top end of the second overflow groove (34) is corresponding to the second groove (212), and the bottom end of the second overflow groove (34) is corresponding to the second inlet (321).

10. A water-cooled heat dissipation structure for a laser according to claim 9, characterized in that, The length of the first overflow trough (33) is adapted to the length of the first groove (211), and the length of the first overflow trough (33) is longer than the length of the first outlet (312); the length of the second overflow trough (34) is adapted to the length of the second groove (212), and the length of the second overflow trough (34) is longer than the length of the second inlet (321).

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