Modular splicing auxiliary circuit board jig

Abstract

This utility model relates to the field of circuit board fixture technology, specifically a modular splicing auxiliary circuit board fixture. The utility model includes a high-temperature resistant placement tray for placing a limiting plate and two high-temperature resistant magnetic locking blocks fixedly connected to the high-temperature resistant placement tray. Through the setting of high-temperature resistant magnetic locking blocks and locking slots, this utility model allows for the splicing of multiple high-temperature resistant placement trays with different circuit board placement slots according to the usage requirements of the circuit board. By inserting the high-temperature resistant magnetic locking blocks into the locking slots and then inserting the high-temperature resistant magnetic limiting components into the limiting slots, multiple high-temperature resistant placement trays can be spliced ​​together. This allows for the placement of circuit boards of different sizes using circuit board placement slots of different sizes, enabling reflow soldering of circuit boards of different sizes, meeting the needs of small-batch, multi-batch work, and improving production efficiency.

Description

Technical Field

[0001] This utility model relates to the field of circuit board fixture technology, specifically a modular splicing auxiliary circuit board fixture. Background Technology

[0002] Circuit board fixtures are specialized tools used in electronics manufacturing to assist in circuit board processing and soldering. They can precisely position, reliably support, and stably fix circuit boards, ensuring the accuracy and consistency of the processing. In the high-temperature environment of reflow soldering, they effectively reduce circuit board deformation and displacement, guarantee soldering quality, and improve production efficiency. They are an indispensable and important piece of equipment in electronics manufacturing.

[0003] Currently, most traditional circuit board fixtures are fixed structures of a single specification, which can only be adapted to circuit boards of specific sizes. As electronic products develop towards miniaturization and diversification, the size and component layout of circuit boards are becoming increasingly complex. When reflow soldering different models of circuit boards, companies need to frequently change special fixtures, resulting in long fixture change times and high costs. Moreover, it is difficult to meet the needs of small-batch, multi-batch work, which seriously affects production efficiency. To address this, we propose a modular splicing auxiliary circuit board fixture. Summary of the Invention

[0004] The purpose of this utility model is to provide a modular splicing auxiliary circuit board fixture to solve the problems mentioned in the background art.

[0005] The objective of this utility model can be achieved through the following technical solutions:

[0006] A modular splicing auxiliary circuit board fixture includes a high-temperature resistant placement tray for placing a limiting plate and two high-temperature resistant magnetic snap-fit ​​blocks fixedly connected to the high-temperature resistant placement tray. The two high-temperature resistant magnetic snap-fit ​​blocks are respectively fixedly connected to the middle of the two side walls at a corner of the high-temperature resistant placement tray. The two side walls of the high-temperature resistant placement tray away from the two high-temperature resistant magnetic snap-fit ​​blocks are provided with snap-fit ​​grooves. The surfaces of the two high-temperature resistant magnetic snap-fit ​​blocks and the two snap-fit ​​grooves on the high-temperature resistant placement tray are provided with limiting grooves for splicing the device. The inner cavity of the limiting groove is movably inserted with a high-temperature resistant magnetic limiting member for limiting and fixing the device. The top surface of the high-temperature resistant placement tray is provided with a circuit board placement groove for placing the circuit board.

[0007] Preferably, the top surface of the high-temperature resistant placement tray is provided with multiple magnetic slots around the perimeter for fixing the circuit board, and magnetic plugs are movably inserted into the multiple magnetic slots around the top surface of the high-temperature resistant placement tray.

[0008] Preferably, each of the multiple magnetic plugs has a high-temperature resistant connecting plate fixedly connected to its top for fixing the circuit board, and a high-temperature resistant silicone pad is fixedly connected to the bottom of the end of each of the multiple high-temperature resistant connecting plates away from the magnetic plugs.

[0009] Preferably, the bottom surface of each of the high-temperature resistant silicone pads is provided with multiple anti-slip grooves to increase friction.

[0010] Preferably, there are multiple high-temperature resistant placement trays, and the circuit board placement slots opened on the multiple high-temperature resistant placement trays are of different sizes, and the multiple magnetic slots on the high-temperature resistant placement trays are respectively located on the outer side of the slot wall of the circuit board placement slot.

[0011] Preferably, the bottom surface of each of the multiple high-temperature resistant placement trays is fixedly connected with a graphene composite material for heat dissipation.

[0012] The beneficial effects of this utility model are:

[0013] 1. This utility model, through the setting of high-temperature resistant magnetic snap-fit ​​blocks and snap-fit ​​slots, allows for the splicing of multiple high-temperature resistant placement trays with different circuit board placement slots according to the usage requirements of the circuit board. By inserting the high-temperature resistant magnetic snap-fit ​​blocks into the snap-fit ​​slots and then inserting the high-temperature resistant magnetic limiting components into the limiting slots, multiple high-temperature resistant placement trays can be spliced ​​together. This allows for the placement of circuit boards of different sizes in circuit board placement slots, enabling reflow soldering of circuit boards of different sizes, meeting the needs of small-batch, multi-batch work, and improving production efficiency.

[0014] 2. This utility model uses a magnetic plug-in insertion into a magnetic groove. By inserting the magnetic plug-in into the magnetic groove, the magnetic groove and the magnetic plug-in magnetically attract and move the high-temperature resistant connecting plate downward. The high-temperature resistant silicone pad contacts the circuit board and limits and fixes the circuit board. The shrinkage characteristics of the high-temperature resistant silicone pad can prevent excessive limiting force from damaging the circuit board. At the same time, the anti-slip groove on the high-temperature resistant silicone pad can enhance the friction between the contact with the circuit board. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0017] Figure 2 This is a schematic diagram of the overall and partial structure of this utility model;

[0018] Figure 3 This is a utility model Figure 2 Enlarged structural diagram at point A;

[0019] Figure 4 This is a utility model Figure 2 Enlarged structural diagram at point B.

[0020] The attached diagram is labeled as follows: 1. High-temperature resistant magnetic snap-fit ​​block; 2. Snap-fit ​​groove; 3. Limiting groove; 4. High-temperature resistant magnetic limiting component; 51. High-temperature resistant placement tray; 52. Circuit board placement groove; 53. Magnetic suction groove; 54. Magnetic suction plug; 55. High-temperature resistant connecting plate; 56. High-temperature resistant silicone pad; 57. Anti-slip groove. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0022] like Figures 1-4 As shown, a modular splicing auxiliary circuit board fixture includes a high-temperature resistant placement tray 51 for placing a limiting plate and two high-temperature resistant magnetic snap-fit ​​blocks 1 fixedly connected to the high-temperature resistant placement tray 51. The two high-temperature resistant magnetic snap-fit ​​blocks 1 are respectively fixedly connected to the middle of the two side walls at a corner of the high-temperature resistant placement tray 51. Snap-fit ​​grooves 2 are provided on the two side walls of the high-temperature resistant placement tray 51 away from the two high-temperature resistant magnetic snap-fit ​​blocks 1. Limiting grooves 3 for splicing the device are provided on the surfaces of the two high-temperature resistant magnetic snap-fit ​​blocks 1 and the two snap-fit ​​grooves 2. A high-temperature resistant magnetic limiting member 4 for limiting and fixing the device is movably inserted into the inner cavity of the limiting groove 3. A circuit board placement groove 52 for placing the circuit board is provided in the middle of the top surface of the high-temperature resistant placement tray 51.

[0023] In practice, according to the usage requirements of the circuit board, multiple high-temperature resistant placement trays 51 of different circuit board placement slots 52 are spliced ​​together. The high-temperature resistant magnetic snap-fit ​​block 1 is inserted into the snap-fit ​​slot 2, and the high-temperature resistant magnetic limiting piece 4 is inserted into the limiting slot 3. This allows for the splicing of multiple high-temperature resistant placement trays 51, thereby placing circuit boards of different sizes in different circuit board placement slots 52 and reflow soldering the circuit boards.

[0024] By inserting the high-temperature resistant magnetic snap-fit ​​block 1 into the snap-fit ​​groove 2 and then inserting the high-temperature resistant magnetic limiting piece 4 into the limiting groove 3, multiple high-temperature resistant placement trays 51 can be spliced ​​together, making it easy to assemble the device to a suitable size for use.

[0025] As a technical optimization of this utility model, the top surface of the high-temperature resistant placement tray 51 is provided with multiple magnetic grooves 53 for fixing the circuit board. Magnetic plugs 54 are movably inserted into the multiple magnetic grooves 53 around the top surface of the high-temperature resistant placement tray 51. The top of each of the multiple magnetic plugs 54 is fixedly connected to a high-temperature resistant connecting plate 55 for fixing the circuit board. A high-temperature resistant silicone pad 56 is fixedly connected to the bottom of the end of the multiple high-temperature resistant connecting plate 55 away from the magnetic plug 54. The bottom surface of each of the multiple high-temperature resistant silicone pads 56 is provided with multiple anti-slip grooves 57 to increase friction.

[0026] In practice, by inserting the magnetic plug 54 into the magnetic groove 53, the magnetic groove 53 and the magnetic plug 54 magnetically attract the high-temperature resistant connecting plate 55 to move downward, and the high-temperature resistant silicone pad 56 contacts the circuit board to limit and fix the circuit board. The shrinkage characteristics of the high-temperature resistant silicone pad 56 can prevent the circuit board from being damaged by excessive limiting force. At the same time, the anti-slip groove 57 on the high-temperature resistant silicone pad 56 can enhance the friction between the contact with the circuit board.

[0027] As a technical optimization of this utility model, there are multiple high-temperature resistant placement trays 51, and the circuit board placement slots 52 opened on the multiple high-temperature resistant placement trays 51 are of different sizes. The multiple magnetic slots 53 on the high-temperature resistant placement trays 51 are respectively located on the outer side of the slot wall of the circuit board placement slot 52. The bottom surface of the multiple high-temperature resistant placement trays 51 is fixedly connected with graphene composite material for heat dissipation.

[0028] In practice, graphene composite materials have excellent thermal conductivity, which can quickly conduct away the heat generated by the circuit board during reflow soldering, avoiding local overheating. At the same time, the material is lightweight and high-strength, which will not add too much weight to the fixture and helps maintain the stability of the fixture in the reflow soldering equipment.

[0029] In use, this invention involves splicing together multiple high-temperature resistant placement trays 51 in different circuit board placement slots 52 according to the requirements of the circuit board. A high-temperature resistant magnetic snap-fit ​​block 1 is inserted into the snap-fit ​​slot 2, and a high-temperature resistant magnetic limiting member 4 is inserted into the limiting slot 3 to complete the splicing of multiple high-temperature resistant placement trays 51. Then, circuit boards of different sizes are placed in the circuit board placement slots 52. A magnetic suction plug 54 is inserted into the magnetic suction slot 53, and the magnetic suction slot 53 and magnetic suction plug 54 magnetically attract and move the high-temperature resistant connecting plate 55 downwards. The high-temperature resistant silicone pad 56 contacts the circuit board, limiting and fixing the circuit board. The circuit boards on this device are then reflow soldered. During the reflow soldering process, the graphene composite material conducts away the generated heat, preventing localized overheating.

[0030] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A modular splicing auxiliary circuit board fixture, comprising a high-temperature resistant placement tray (51) for placing a limiting plate and two high-temperature resistant magnetic snap-fit ​​blocks (1) fixedly connected to the high-temperature resistant placement tray (51), characterized in that, Two high-temperature resistant magnetic snap-fit ​​blocks (1) are fixedly connected to the middle of the two side walls at a corner of the high-temperature resistant placement tray (51). The two side walls of the high-temperature resistant placement tray (51) away from the two high-temperature resistant magnetic snap-fit ​​blocks (1) are provided with snap-fit ​​grooves (2). The surfaces of the two high-temperature resistant magnetic snap-fit ​​blocks (1) and the two snap-fit ​​grooves (2) on the high-temperature resistant placement tray (51) are provided with limiting grooves (3) for splicing the device. The inner cavity of the limiting groove (3) is movably inserted with a high-temperature resistant magnetic limiting member (4) for limiting and fixing the device. The top surface of the high-temperature resistant placement tray (51) is provided with a circuit board placement groove (52) for placing the circuit board.

2. The modular splicing auxiliary circuit board fixture according to claim 1, characterized in that, The high-temperature resistant placement tray (51) has multiple magnetic slots (53) around its top surface for fixing the circuit board. Magnetic plugs (54) are movably inserted into the multiple magnetic slots (53) around the top surface of the high-temperature resistant placement tray (51).

3. The modular splicing auxiliary circuit board fixture according to claim 2, characterized in that, Each of the magnetic plugs (54) has a high-temperature resistant connecting plate (55) fixedly connected to its top end for fixing the circuit board, and a high-temperature resistant silicone pad (56) is fixedly connected to the bottom end of each of the high-temperature resistant connecting plates (55) away from the magnetic plugs (54).

4. The modular splicing auxiliary circuit board fixture according to claim 3, characterized in that, The bottom surface of each of the high-temperature resistant silicone pads (56) is provided with multiple anti-slip grooves (57) to increase friction.

5. A modular splicing auxiliary circuit board fixture according to claim 2, characterized in that, There are multiple high-temperature resistant placement trays (51), and the circuit board placement slots (52) opened on the multiple high-temperature resistant placement trays (51) are of different sizes, and the multiple magnetic slots (53) on the high-temperature resistant placement trays (51) are located on the outside of the slot wall of the circuit board placement slot (52).

6. A modular splicing auxiliary circuit board fixture according to claim 5, characterized in that, The bottom surfaces of the multiple high-temperature resistant placement trays (51) are all fixedly connected with graphene composite material for heat dissipation.

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