Atomizing disc device with air cooling structure

Abstract

The utility model relates to atomizing disc technical field, and concretely is atomizing disc device with air cooling structure, including atomizer body, atomizing disc and cooling assembly, the cooling assembly includes miniature semiconductor refrigeration piece, miniature heat dissipation fan, miniature fan and bracket, the both sides bottom of atomizer body is installed with first concave bracket and second concave bracket from top to bottom through bolt respectively, in atomizing disc work time, through miniature semiconductor refrigeration piece refrigeration, through miniature heat dissipation fan suction end corresponding miniature semiconductor refrigeration piece top carries out suction cooling, and through the bracket fixed miniature fan supports in miniature semiconductor refrigeration piece bottom, real -time with miniature semiconductor refrigeration piece bottom cold air blows to atomizing disc, to realize its cooling effect to avoid its high temperature easy to block problem.

Description

Technical Field

[0001] This utility model relates to the field of atomizing disc technology, and specifically to an atomizing disc device with an air-cooled structure. Background Technology

[0002] The atomizer in a centrifugal spray dryer is a device that uses the centrifugal force of high-speed rotation to atomize liquid into tiny droplets. The liquid in the atomizer is introduced into an atomizing disc with high-speed rotation capability. As the disc rotates, the liquid is dispersed into many tiny droplets and thrown out along the edge of the disc.

[0003] In existing centrifugal atomization drying processes, the atomizing disc is easily affected by high temperatures and prone to clogging, resulting in spray interruption. Therefore, an atomizing disc device with an air-cooled structure is proposed to reduce the temperature of the atomizing disc through a cooling device to avoid the problem of high temperature clogging. Utility Model Content

[0004] To address the problems in the prior art, this utility model provides an atomizing disc device with an air-cooled structure, which reduces the temperature of the atomizing disc through a cooling device to avoid the problem of high temperature clogging.

[0005] The technical solution adopted by this utility model to solve its technical problem is an atomizing disc device with an air-cooled structure, including an atomizer body, an atomizing disc and a cooling component, wherein the cooling component includes a micro semiconductor cooling chip, a micro heat dissipation fan, a micro fan and a bracket;

[0006] The atomizer body has a first concave bracket and a second concave bracket installed on both sides of the bottom from top to bottom by bolts.

[0007] By adopting the above technical solution, the first concave bracket and the second concave bracket are used to support and fix the first carrier frame and the second carrier frame respectively, and the first carrier frame and the second carrier frame are used to support and fix the miniature cooling fan and the miniature fan of the cooling component respectively, so as to improve the stability of the support.

[0008] When the atomizing disc is working, it is cooled by a micro-semiconductor cooling chip. A micro-cooling fan is used to draw air from the top of the micro-semiconductor cooling chip to dissipate heat. The micro-fan is fixed to the bottom of the micro-semiconductor cooling chip by a bracket, and the cool air from the bottom of the micro-semiconductor cooling chip is blown onto the atomizing disc in real time to achieve a cooling effect and avoid the problem of high temperature clogging.

[0009] Specifically, the atomizer body includes an atomizing disc, which is disposed at the bottom of the atomizer body.

[0010] By adopting the above technical solution, as the atomizing disc rotates, the liquid is dispersed into many tiny droplets and flung out along the edge of the disc.

[0011] Specifically, the cooling component is provided in two sets, and the micro cooling fans are all bolted to the top of the micro semiconductor refrigeration chip, with the exhaust end of the micro cooling fan corresponding to the top surface of the micro semiconductor refrigeration chip.

[0012] By adopting the above technical solution, the exhaust end of a miniature cooling fan is used to exhaust and dissipate heat from the top of the miniature semiconductor cooling chip.

[0013] Specifically, the micro fans are all mounted on the bottom of the micro semiconductor refrigeration chip via brackets and bolts, the exhaust end of the micro fans corresponds to the bottom of the micro semiconductor refrigeration chip, and the exhaust end of the micro fans corresponds to the atomizing disc.

[0014] By adopting the above technical solution, a bracket is used to fix a micro fan to the bottom of the micro semiconductor refrigeration chip, and the cold air at the bottom of the micro semiconductor refrigeration chip is blown towards the atomizing plate in real time to achieve a cooling effect.

[0015] Specifically, the first concave bracket has a first support frame fixed to its inner side by bolts, and one end of the first support frame is fixed to a miniature cooling fan by bolts.

[0016] By adopting the above technical solution, the first concave bracket is used to support and fix the first carrier frame, and the first carrier frame is used to support and fix the miniature cooling fan.

[0017] Specifically, the inner side of the second concave bracket is fixed with a second support frame by bolts, and one end of the second support frame is fixed to the miniature fan by bolts.

[0018] By adopting the above technical solution, the second concave bracket is used to support and fix the second carrier frame, and the micro fan is supported and fixed by the second carrier frame.

[0019] The beneficial effects of this utility model are:

[0020] (1) The atomizing disc device with air-cooled structure described in this utility model is cooled by a micro semiconductor refrigeration chip when the atomizing disc is working. The micro cooling fan exhaust end is directed to the top of the micro semiconductor refrigeration chip to exhaust and cool it. The micro fan is fixed to the bottom of the micro semiconductor refrigeration chip by a bracket, and the cold air at the bottom of the micro semiconductor refrigeration chip is blown to the atomizing disc in real time to achieve the cooling effect and avoid the problem of high temperature and easy blockage.

[0021] (2) The atomizing disc device with air-cooled structure described in this utility model supports and fixes the first carrier frame and the second carrier frame respectively through the first concave bracket and the second concave bracket, and supports and fixes the miniature cooling fan and the miniature fan of the cooling component respectively through the first carrier frame and the second carrier frame, so as to improve the stability of the support. Attached Figure Description

[0022] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0023] Figure 1 This is a schematic diagram of the overall design of this utility model;

[0024] Figure 2 This is a schematic diagram of the cooling component of this utility model;

[0025] Figure 3 This is a schematic diagram of the first concave bracket and the second concave bracket of this utility model;

[0026] In the figure: 1. Atomizer body; 2. Atomizing disc; 3. Cooling component; 301. Miniature semiconductor cooling chip; 302. Miniature cooling fan; 303. Miniature fan; 304. Bracket; 5. First concave bracket; 6. First support frame; 7. Second concave bracket; 8. Second support frame. Detailed Implementation

[0027] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0028] To avoid its tendency to clog at high temperatures, such as Figure 1-3 As shown, the atomizing disc device with air-cooled structure of this utility model includes an atomizer body 1, an atomizing disc 2 and a cooling component 3. The cooling component 3 includes a micro semiconductor cooling chip 301, a micro cooling fan 302, a micro fan 303 and a bracket 304.

[0029] The atomizer body 1 has a first concave bracket 5 and a second concave bracket 7 installed on both sides of the bottom from top to bottom by bolts.

[0030] In use, the first concave bracket 5 and the second concave bracket 7 respectively support and fix the first carrier frame 6 and the second carrier frame 8, and the first carrier frame 6 and the second carrier frame 8 respectively support and fix the miniature cooling fan 302 and the miniature fan 303 of the cooling component 3 to improve the stability of the support.

[0031] When the atomizing disc 2 is working, it is cooled by the micro semiconductor cooling chip 301. The micro cooling fan 302 exhausts air from the top of the micro semiconductor cooling chip 301 to dissipate heat. The micro fan 303 is fixed to the bottom of the micro semiconductor cooling chip 301 by the bracket 304, so that the cold air at the bottom of the micro semiconductor cooling chip 301 is blown to the atomizing disc 2 in real time to achieve the cooling effect and avoid the problem of high temperature and easy blockage.

[0032] To avoid its tendency to clog at high temperatures, for example, such as Figure 1As shown, the present invention also includes an atomizer body 1 comprising an atomizing disc 2, which is disposed at the bottom end of the atomizer body 1.

[0033] When in use, as the atomizing disc 2 rotates, the liquid is dispersed into many tiny droplets and flung out along the edge of the disc.

[0034] For example, such as Figure 1 , Figure 2 As shown, the present invention also includes two sets of cooling components 3, and the micro cooling fans 302 are all bolted to the top of the micro semiconductor cooling chip 301, with the exhaust ends of the micro cooling fans 302 corresponding to the top surface of the micro semiconductor cooling chip 301.

[0035] In use, the micro cooling fan 302 draws air from the top of the micro semiconductor cooling chip 301 to dissipate heat.

[0036] For example, such as Figure 1 , Figure 2 As shown, the present invention also includes the following: the micro fans 303 are all mounted on the bottom of the micro semiconductor cooling chip 301 by brackets 304 and bolts, the exhaust end of the micro fans 303 corresponds to the bottom of the micro semiconductor cooling chip 301, and the exhaust end of the micro fans 303 corresponds to the atomizing disc 2.

[0037] In use, the micro fan 303 is fixed to the bottom of the micro semiconductor refrigeration chip 301 by the bracket 304, and the cold air at the bottom of the micro semiconductor refrigeration chip 301 is blown to the atomizing plate 2 in real time to achieve the cooling effect.

[0038] For example, such as Figure 1 , Figure 2 , Figure 3 As shown, the present invention also includes a first support frame 6 fixed to the inner side of the first concave bracket 5 by bolts, and one end of the first support frame 6 is fixed to the miniature cooling fan 302 by bolts.

[0039] In use, the first concave bracket 5 supports and fixes the first carrier frame 6, and the first carrier frame 6 supports and fixes the miniature cooling fan 302.

[0040] For example, such as Figure 1 , Figure 2 , Figure 3 As shown, the present invention also includes a second support frame 8 fixed to the inner side of the second concave bracket 7 by bolts, and one end of the second support frame 8 is fixed to the miniature fan 303 by bolts.

[0041] In use, the second concave bracket 7 supports and fixes the second carrier frame 8, and the second carrier frame 8 supports and fixes the micro fan 303.

[0042] In use, the first concave bracket 5 and the second concave bracket 7 respectively support and fix the first carrier frame 6 and the second carrier frame 8, and the first carrier frame 6 and the second carrier frame 8 respectively support and fix the miniature cooling fan 302 and the miniature fan 303 of the cooling component 3, so as to improve the stability of the support.

[0043] When the atomizing disc 2 is working, it is cooled by the micro semiconductor cooling chip 301. The micro cooling fan 302 exhausts air from the top of the micro semiconductor cooling chip 301 to dissipate heat. The micro fan 303 is fixed to the bottom of the micro semiconductor cooling chip 301 by the bracket 304, so that the cold air at the bottom of the micro semiconductor cooling chip 301 is blown to the atomizing disc 2 in real time to achieve the cooling effect and avoid the problem of high temperature and easy blockage.

[0044] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. An atomizing disc device with an air-cooled structure, characterized in that, It includes an atomizer body (1), an atomizing disc (2), and a cooling component (3), wherein the cooling component (3) includes a micro semiconductor cooling chip (301), a micro cooling fan (302), a micro fan (303), and a bracket (304); The atomizer body (1) has a first concave bracket (5) and a second concave bracket (7) installed on both sides of the bottom from top to bottom by bolts.

2. The atomizing disc device with an air-cooled structure according to claim 1, characterized in that, The atomizer body (1) includes an atomizing disc (2), which is located at the bottom of the atomizer body (1).

3. The atomizing disc device with an air-cooled structure according to claim 1, characterized in that, The cooling component (3) is provided in two sets. The micro heat dissipation fans (302) are all installed on the top of the micro semiconductor cooling chip (301) by bolts. The exhaust end of the micro heat dissipation fans (302) corresponds to the top surface of the micro semiconductor cooling chip (301).

4. The atomizing disc device with an air-cooled structure according to claim 1, characterized in that, The micro fans (303) are all mounted on the bottom of the micro semiconductor refrigeration chip (301) via brackets (304) and bolts. The exhaust end of the micro fans (303) corresponds to the bottom of the micro semiconductor refrigeration chip (301), and the exhaust end of the micro fans (303) corresponds to the atomizing disc (2).

5. The atomizing disc device with an air-cooled structure according to claim 1, characterized in that, The first concave bracket (5) has a first support frame (6) fixed to its inner side by bolts, and one end of the first support frame (6) is fixed to the miniature cooling fan (302) by bolts.

6. The atomizing disc device with an air-cooled structure according to claim 1, characterized in that, The second concave bracket (7) is fixed with a second support frame (8) by bolts on its inner side, and one end of the second support frame (8) is fixed to the miniature fan (303) by bolts.

Images