Integrated ultrasonic low-temperature circumferential atomization assembly and ultrasonic atomizer

Abstract

The application relates to an integrated ultrasonic low-temperature circumferential atomization assembly and an ultrasonic atomizer. An adsorption liquid storage structure abuts against a liquid guide sheet, the liquid guide sheet abuts against a ceramic atomization sheet; an atomization air channel contacts the ceramic atomization sheet and is exposed outside the whole shell; a negative electrode shell is in conductive connection with a negative electrode area of the ceramic atomization sheet; an elastic positive electrode and an elastic support are arranged in the negative electrode shell, the elastic positive electrode is insulated from the negative electrode shell, the elastic positive electrode abuts against the elastic support, the elastic positive electrode has a state of elastically abutting against a positive electrode area of the ceramic atomization sheet and a state of being separated from the positive electrode area. Ultrasonic low-temperature atomization is realized, problems caused by high-temperature atomization of a mesh core, such as high-temperature core burning, are avoided, problems of atomized liquid deterioration caused by high temperature, and potential safety problems of liquid leakage and explosion of electric control devices are avoided; through cooperation of the ceramic atomization sheet and the liquid guide sheet, circumferential atomization effect is realized, liquid guidance is fast, no chemical reaction is generated, therefore, atomization energy consumption is low and the atomization is safer and more reliable.

Description

Technical Field

[0001] This application relates to the field of ultrasonic atomization, and in particular to an integrated ultrasonic low-temperature circumferential atomization assembly and an ultrasonic atomizer. Background Technology

[0002] Mesh atomization, also known as mesh heating atomization, includes ceramic core heating atomization and heating wire atomization. Mesh atomization is a type of high-temperature chemical atomization. The high temperature generated will cause the atomizing liquid to undergo a chemical reaction. High-temperature atomization will produce some harmful substances that will harm the user's body. Furthermore, the high-temperature smoke produced by high-temperature atomization such as ceramic core heating atomization and heating wire atomization can also cause harm to the user's body.

[0003] For example, ceramic core heating atomization and heating wire atomization can produce a burning phenomenon, commonly known as core burning, which seriously affects the lifespan of the atomizing element. The resulting burnt smell causes discomfort to the user and also affects the user's health. Moreover, the high temperature generated by ceramic core atomization and heating wire atomization can reduce the product's lifespan. The high temperature atomization generated by ceramic core atomization and heating wire atomization can cause unexpected changes in the taste of the atomizing liquid. Furthermore, the high temperature atomization of ceramic core atomization and heating wire atomization places extremely high requirements on the device's battery and related basic materials, especially the battery, which is prone to leakage and explosion, posing a danger to personal safety. Utility Model Content

[0004] Therefore, it is necessary to provide an integrated ultrasonic low-temperature circumferential atomizing component and an ultrasonic atomizer.

[0005] One embodiment of this application is an integrated ultrasonic low-temperature circumferential atomizing component, which includes an overall shell and a negative electrode shell, an elastic positive electrode, an elastic support member, a ceramic atomizing plate, a liquid guiding plate, and an adsorption and storage structure located in the overall shell.

[0006] The adsorption storage structure abuts against the liquid guiding sheet, and the liquid guiding sheet abuts against the ceramic atomizing sheet;

[0007] The integrated ultrasonic low-temperature circumferential atomizing component has an atomizing channel in the adsorption and storage structure, and the atomizing channel contacts the ceramic atomizing sheet and is exposed outside the overall shell.

[0008] The negative electrode housing is installed in the overall housing and has a portion exposed outside the overall housing. The negative electrode housing is electrically connected to the negative electrode region of the ceramic atomizing sheet.

[0009] The elastic positive electrode and the elastic support are installed in the negative electrode shell. The elastic positive electrode is insulated from the negative electrode shell and abuts against the elastic support. The elastic positive electrode has a state of elastically abutting against the positive electrode area of ​​the ceramic atomizing sheet and a state of disengaging from the positive electrode area.

[0010] The aforementioned integrated ultrasonic low-temperature circumferential atomizing component, through the cooperation of a negative electrode shell, an elastic positive electrode, an elastic support component, a ceramic atomizing plate, a liquid guiding plate, an overall shell, and an adsorption and storage structure, achieves ultrasonic low-temperature atomization on the one hand, avoiding problems such as high-temperature core burning caused by heating the core for atomization, as well as the deterioration of the atomizing liquid caused by high temperature and safety hazards such as leakage and explosion of the electronic control components; on the other hand, through the cooperation of the ceramic atomizing plate and the liquid guiding plate, a circumferential atomization effect is achieved, and the liquid guiding is rapid and does not produce chemical reactions, thus the atomization energy consumption is low and it is safer and more reliable.

[0011] In some embodiments, the resilient positive electrode includes an insulated body and a protrusion connected together;

[0012] The insulating body abuts against the elastic support member, and under the action of the elastic support member, it has a state of abutting against the negative electrode shell;

[0013] The protrusion has a state of elastically abutting against the positive electrode region and a state of disengaging from the positive electrode region.

[0014] In some embodiments, the elastic positive electrode also has a through hole penetrating the insulating body.

[0015] In some embodiments, the elastic support member has a communicating mounting cavity and a mounting position;

[0016] The elastic positive electrode passes through the mounting position and has a state of elastically abutting against the positive electrode region in the mounting cavity, and a state of being disconnected from the positive electrode region.

[0017] In some embodiments, the mounting position snaps and fixes the elastic positive electrode in place while the elastic positive electrode is in elastic contact with the positive electrode region.

[0018] In some embodiments, the negative electrode housing is provided with a limiting connection portion;

[0019] The ceramic atomizing plate is located between the limiting connection portion and the elastic support member;

[0020] The elastic support member elastically abuts against the ceramic atomizing sheet, so that the negative electrode area of ​​the ceramic atomizing sheet makes conductive contact with the limiting connection portion.

[0021] In some embodiments, the liquid guide plate, the atomizing air channel, and the adsorption liquid storage structure are all cylindrical in shape and coaxially arranged.

[0022] In some embodiments, the overall outer shell has a first cavity, and the overall outer shell has a first limiting protrusion, which restricts the position of the adsorption and storage structure in the first cavity; or...

[0023] The negative electrode shell has a second cavity, and the negative electrode shell has a second limiting protrusion. The negative electrode shell restricts the position of the elastic positive electrode in the second cavity through the second limiting protrusion.

[0024] In some embodiments, the overall outer shell has vents, which are connected to the atomizing air passage through the through holes of the liquid guiding sheet to form an airflow path.

[0025] In some embodiments, the overall housing has a liquid inlet for exposing the adsorption and storage structure.

[0026] In some embodiments, an ultrasonic atomizer includes a power supply component and an integrated ultrasonic low-temperature circumferential atomizing component as described in any embodiment, wherein the power supply component is electrically connected to the negative electrode shell and the elastic positive electrode of the integrated ultrasonic low-temperature circumferential atomizing component. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a structural schematic diagram of an embodiment of the integrated ultrasonic low-temperature circumferential atomizing component described in this application.

[0029] Figure 2 for Figure 1 The illustrated embodiment is shown in an exploded view from another direction.

[0030] Figure 3 for Figure 1 Another schematic diagram of the embodiment shown.

[0031] Figure 4 for Figure 3 A schematic cross-sectional view along the AA direction of the embodiment shown.

[0032] Figure 5 for Figure 4 Another schematic diagram of the embodiment shown.

[0033] Figure 6 for Figure 3 A schematic cross-sectional view along the BB direction of the embodiment shown.

[0034] Figure 7 for Figure 6 Another schematic diagram of the embodiment shown.

[0035] Figure 8 for Figure 7 Another schematic diagram of the embodiment shown.

[0036] Figure 9 for Figure 8 Another schematic diagram of the embodiment shown.

[0037] Figure 10 for Figure 9 The illustrated embodiment is shown in an exploded view from another direction.

[0038] Figure 11 for Figure 10 Another schematic diagram of the embodiment shown.

[0039] Figure 12 This is a schematic diagram of another embodiment of the integrated ultrasonic low-temperature circumferential atomizing component described in this application.

[0040] Figure 13 for Figure 12 The illustrated embodiment is shown in an exploded view from another direction.

[0041] Figure 14 for Figure 13 Another schematic diagram of the embodiment shown.

[0042] Figure 15 This is a schematic diagram of the module structure of an embodiment of the ultrasonic atomizer described in this application.

[0043] Reference numerals: Integrated ultrasonic low-temperature circumferential atomizing component 100, negative electrode shell 101, elastic positive electrode 102, elastic support 103, ceramic atomizing plate 104, liquid guiding plate 105, overall shell 106, atomizing air channel 107, adsorption and liquid storage structure 108, liquid inlet 109, mounting cavity 110, second cavity 111, insulating body 112, through hole 113, protrusion 114, mounting position 115, limiting connection part 116, positive electrode area 117, through hole 118, first cavity 119, negative electrode area 120, first limiting protrusion 121, second limiting protrusion 122, air hole 123, airflow path 124, power supply component 200, ultrasonic atomizer 300. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application's specification are for illustrative purposes only and do not represent the only possible implementation.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0049] This application discloses an integrated ultrasonic low-temperature circumferential atomizing component and an ultrasonic atomizer, which includes some or all of the technical features of the following embodiments; In one embodiment of this application, an integrated ultrasonic low-temperature circumferential atomizing component includes an integral shell and a negative electrode shell, an elastic positive electrode, an elastic support member, a ceramic atomizing plate, a liquid guiding plate, and an adsorption and storage structure located in the integral shell; the adsorption and storage structure abuts against the liquid guiding plate, and the liquid guiding plate abuts against the ceramic atomizing plate; the integrated ultrasonic low-temperature circumferential atomizing component has a [missing information - likely a feature or design] in the adsorption and storage structure. The atomizing air passage contacts the ceramic atomizing plate and protrudes outside the overall housing; the negative electrode housing is installed in the overall housing and has a portion protruding outside the overall housing, and the negative electrode housing is electrically connected to the negative electrode area of ​​the ceramic atomizing plate; the elastic positive electrode and the elastic support are installed in the negative electrode housing, the elastic positive electrode is insulated from the negative electrode housing, and the elastic positive electrode abuts against the elastic support, the elastic positive electrode has a state of elastically abutting against the positive electrode area of ​​the ceramic atomizing plate, and a state of disengaging from the positive electrode area. The aforementioned integrated ultrasonic low-temperature circumferential atomizing component, through the cooperation of a negative electrode shell, an elastic positive electrode, an elastic support component, a ceramic atomizing plate, a liquid guiding plate, an overall shell, and an adsorption and storage structure, achieves ultrasonic low-temperature atomization on the one hand, avoiding problems such as high-temperature core burning caused by mesh core heating atomization, as well as the deterioration of the atomizing liquid caused by high temperatures and safety hazards such as leakage and explosion of electronic control components; on the other hand, through the cooperation of the ceramic atomizing plate and the liquid guiding plate, it achieves a circumferential atomization effect, and the liquid guiding is rapid and does not produce chemical reactions, thus the atomization energy consumption is low and it is safer and more reliable. The following is a further explanation... Figures 1 to 15 The integrated ultrasonic low-temperature circumferential atomizing component and ultrasonic atomizer are described in detail below.

[0050] In some embodiments, an integrated ultrasonic cryogenic circumferential atomizing component 100, such as... Figure 1 and Figure 2 As shown, it includes an overall outer shell 106 and a negative electrode shell 101, an elastic positive electrode 102, an elastic support 103, a ceramic atomizing plate 104, a liquid guiding plate 105, and an adsorption and storage structure 108 located within the overall outer shell 106; combined with Figure 3 and Figure 4 The adsorption storage structure 108 abuts against the liquid guiding sheet 105, and the liquid guiding sheet 105 abuts against the ceramic atomizing sheet 104; combined with Figure 5 and Figure 6The integrated ultrasonic low-temperature circumferential atomizing component 100 has an atomizing air channel 107 in the adsorption and storage structure 108. The atomizing air channel 107 contacts the ceramic atomizing plate 104 and is exposed outside the overall shell 106. The negative electrode shell 101 is installed in the overall shell 106 and has a portion exposed outside the overall shell 106. The negative electrode shell 101 is electrically connected to the negative electrode region 120 of the ceramic atomizing plate 104. The elastic positive electrode 102 and the elastic support member 103 are installed in the negative electrode shell 101. The elastic positive electrode 102 is insulated from the negative electrode shell 101 and abuts against the elastic support member 103. The elastic positive electrode 102 has a state of elastically abutting against the positive electrode region 117 of the ceramic atomizing plate 104 and a state of being disconnected from the positive electrode region 117. This design, through the cooperation of the negative electrode shell 101, the elastic positive electrode 102, the elastic support 103, the ceramic atomizing plate 104, the liquid guiding plate 105, the overall shell 106, and the adsorption and storage structure 108, achieves ultrasonic low-temperature atomization on the one hand, avoiding problems such as high-temperature core burning caused by heating atomization of the mesh core, and also avoiding the deterioration of the atomizing liquid caused by high temperature and safety hazards such as leakage and explosion of the electronic control device; on the other hand, through the cooperation of the ceramic atomizing plate 104 and the liquid guiding plate 105, a circumferential atomization effect is achieved, and the liquid guiding is fast and does not produce chemical reactions, so the atomization energy consumption is low and it is safer and more reliable.

[0051] In each embodiment, such as Figure 4 and Figure 6As shown, the adsorption storage structure 108 abuts against the liquid guiding plate 105, and the liquid guiding plate 105 abuts against the ceramic atomizing plate 104. The adsorption storage structure 108 is used to store liquid atomizing media by adsorption, including but not limited to e-liquid, sesame oil, and medicinal liquids. Exemplarily, the adsorption storage structure 108 is also used to adsorb condensate for recycling. This design, on the one hand, forms an efficient atomizing media transport path through the abutment between the adsorption storage structure 108 and the liquid guiding plate 105, and the abutment between the liquid guiding plate 105 and the ceramic atomizing plate 104. Therefore, this structure ensures that the atomizing media can be smoothly transported from the adsorption storage structure 108 to the ceramic atomizing plate 104, improving atomization efficiency. On the other hand, the adsorption storage structure 108 can adsorb various liquid atomizing media, such as e-liquid, sesame oil, and medicinal liquids, making the integrated ultrasonic low-temperature circumferential atomizing component 100 suitable for various application scenarios and possessing wide applicability. On the other hand, the adsorption storage structure 108 can not only store the atomizing medium but also adsorb condensate and recycle it, which reduces the waste of the atomizing medium, improves resource utilization, lowers operating costs, and reduces potential environmental impact. Furthermore, because the adsorption storage structure 108 stores the atomizing medium through adsorption, this design effectively prevents leakage of the atomizing medium during transmission, improving the safety and reliability of the integrated ultrasonic low-temperature circumferential atomizing component 100. Moreover, the adsorption performance of the adsorption storage structure 108 ensures uniform distribution of the atomizing medium during transmission, thereby improving the uniformity and stability of the atomization effect. This design not only improves the user experience but also extends the service life of the ceramic atomizing plate 104.

[0052] For example, the ceramic atomizing plate 104 is typically made of porous ceramic material with tiny micropores. Due to surface tension and capillary action, the atomizing medium can uniformly penetrate from the adsorption storage structure 108 into the micropores of the ceramic atomizing plate 104 via the liquid guiding plate 105 and be adsorbed onto the surface of the ceramic atomizing plate 104. This uniform penetration and adsorption process ensures that the atomizing medium is evenly distributed on the ceramic atomizing plate 104, providing a good foundation for the subsequent atomization process. Furthermore, the adsorption storage structure 108 can store the liquid atomizing medium by adsorption and ensures that the atomizing medium is evenly distributed within it through its adsorption performance. This uniform adsorption capacity also allows the atomizing medium to be stably stored in the adsorption storage structure 108 and uniformly transferred to the ceramic atomizing plate 104 via the liquid guiding plate 105 when needed. The liquid guiding plate 105 is positioned between the adsorption storage structure 108 and the ceramic atomizing plate 104, thus acting as a liquid guide. The design of the liquid guiding plate 105 allows the atomizing medium to flow uniformly from the adsorption storage structure 108 to the ceramic atomizing plate 104, further ensuring the uniform distribution of the atomizing medium on the ceramic atomizing plate 104. Furthermore, the atomizing holes on the ceramic atomizing plate 104 are uniformly distributed and have consistent pore sizes. This design allows the atomizing medium to form uniform mist particles when passing through the atomizing holes. In addition, the uniformly distributed atomizing holes not only improve the uniformity of the atomization effect but also prevent excessive accumulation or insufficient atomization medium in local areas. Through the above-mentioned homogenization mechanism, this application achieves the combined effect of the ceramic atomizing plate 104 and the adsorption storage structure 108, ensuring the uniform distribution of the atomizing medium during transmission and atomization, thereby improving the stability and consistency of the atomization effect.

[0053] In each embodiment, the atomized medium adsorbed by the adsorption storage structure 108 enters the liquid guiding plate 105 under the influence of gravity or diffusion due to molecular motion. That is, the liquid guiding plate 105 adsorbs the atomized medium originating from the adsorption storage structure 108. The liquid guiding plate 105 abuts against the ceramic atomizing plate 104, allowing the atomized medium to contact the ceramic atomizing plate 104. The ceramic atomizing plate 104 utilizes the piezoelectric effect to convert high-frequency electrical energy into mechanical energy, generating high-frequency vibrations to produce ultrasonic waves. This creates a cavitation effect in the liquid atomized medium, breaking the liquid into tiny mist particles, thus achieving the effect of ultrasonic low-temperature atomization. The entire process does not require heating, and the energy consumption is significantly reduced compared to traditional heating methods. The design of the liquid guiding plate 105, which works in conjunction with the adsorption and storage structure 108 and abuts against the ceramic atomizing plate 104, serves two purposes. First, the liquid guiding plate 105, positioned between the adsorption and storage structure 108 and the ceramic atomizing plate 104, can uniformly transfer the atomizing medium from the adsorption and storage structure 108 to the ceramic atomizing plate 104. This uniform liquid guiding ensures a more even distribution of the atomizing medium on the ceramic atomizing plate 104, thereby improving the stability and consistency of the atomization effect. Second, the material and structural design of the liquid guiding plate 105 can increase the transmission speed of the atomizing medium. For example, a liquid guiding plate made of a material with a small fiber diameter can accelerate the transmission of the atomizing medium through capillary action and surface tension, reducing dry burning caused by untimely liquid guiding. Furthermore, the design of the liquid guiding plate 105 can effectively prevent leakage of the atomizing medium during transmission. Through reasonable porosity and structural design, the liquid guiding plate 105 can ensure stable transmission of the atomizing medium and reduce the risk of leakage caused by mechanical vibration or external impact. Furthermore, the uniform liquid guiding effect of the liquid guiding plate 105 not only improves the transmission efficiency of the atomizing medium but also optimizes the atomization effect. The uniformly distributed atomizing medium on the ceramic atomizing plate 104 can form more uniform mist particles, improving the uniformity and efficiency of atomization. Additionally, the liquid guiding plate 105 can also provide some protection, preventing the atomizing medium from directly impacting the ceramic atomizing plate 104, thereby extending the service life of the ceramic atomizing plate.

[0054] The liquid guiding plate 105 plays multiple roles in the atomization process, including uniform liquid guiding, improving the liquid guiding rate, preventing leakage, optimizing the atomization effect, and protecting the ceramic atomizing plate. For example, the liquid guiding plate 105, in conjunction with the adsorption and storage structure 108, forms a two-stage adsorption-permeation liquid guiding channel, delivering the atomizing medium to the ceramic atomizing plate 104 in a dual-channel liquid guiding manner to ensure a stable input supply to the ceramic atomizing plate 104. This is one of the key inventive points of this application. Through the two-stage adsorption-permeation liquid guiding channel, the atomizing medium can be transferred from the adsorption and storage structure 108 to the ceramic atomizing plate 104 more quickly and uniformly. This dual-channel liquid guiding method not only improves the liquid guiding speed but also reduces the problem of insufficient or uneven atomizing medium supply caused by single-channel transmission. Moreover, the two-stage adsorption-permeation design ensures that the atomizing medium undergoes two adsorption and permeation processes during transmission, further optimizing the uniformity of the atomizing medium distribution. This uniform distribution ensures that the ceramic atomizing plate 104 can contact sufficient and uniform atomizing medium during operation, thereby improving the uniformity and stability of atomization. Furthermore, the dual-channel liquid guiding method ensures that the ceramic atomizing plate 104 always has a sufficient supply of atomizing medium during operation, effectively reducing the dry burning phenomenon caused by insufficient atomizing medium supply. This not only extends the service life of the ceramic atomizing plate 104 but also improves the safety and reliability of the entire integrated ultrasonic low-temperature circumferential atomizing assembly 100. Further, the uniform distribution and stable supply of atomizing medium enable the ceramic atomizing plate 104 to more efficiently convert the atomizing medium into tiny mist particles, improving the uniformity and consistency of the atomization effect. Therefore, this optimized atomization effect can better meet the needs of different application scenarios, such as electronic cigarettes, aromatherapy diffusers, or medical atomizers. The two-stage adsorption and permeation liquid guiding channel can more effectively utilize the atomizing medium, reducing waste caused by uneven transmission or leakage. This not only reduces operating costs but also improves resource utilization, meeting the requirements of environmental protection and sustainable development. In addition, this dual-channel liquid guiding design makes the fit between the liquid guiding plate 105 and the adsorption storage structure 108 tighter, enhancing the structural stability of the entire integrated ultrasonic low-temperature circumferential atomizing assembly 100. This stability not only improves the service life of the integrated ultrasonic low-temperature circumferential atomizing component 100, but also reduces the risk of failure caused by mechanical vibration or external impact.

[0055] In each embodiment, such as Figure 5 and Figure 6 As shown, the integrated ultrasonic low-temperature circumferential atomizing component 100 has an atomizing air channel 107 in the adsorption storage structure 108, combined with Figure 7 The atomizing air passage 107 contacts the ceramic atomizing plate 104 and protrudes outside the overall housing 106; in some embodiments, combined with Figure 8 and Figure 9The overall outer shell 106 has vents 123, combined with Figure 13 and Figure 14 The vent 123 is connected to the atomizing airway 107 through the through hole 118 of the liquid guiding plate 105, forming an airflow path 124. This design allows for the smooth discharge of atomized microparticles, such as aerosols, through the atomizing airway 107, which can be flexibly configured as needed and can also be designed as part of the atomizing airway 107. Furthermore, the inclusion of the vent 123 and through hole 118 further optimizes the airflow path 124, enabling the atomized particles to diffuse more freely and evenly into the external environment, improving atomization efficiency and uniformity. Moreover, this airflow path design helps prevent the atomizing medium from accumulating inside the integrated ultrasonic low-temperature circumferential atomizing component 100, further reducing the internal pressure and enhancing the stability and lifespan of the integrated ultrasonic low-temperature circumferential atomizing component 100. On the other hand, the integrated ultrasonic low-temperature circumferential atomizing component 100 can achieve ultrasonic low-temperature atomization through the ceramic atomizing plate 104 and belongs to the circumferential atomization method. Furthermore, the integrated ultrasonic low-temperature circumferential atomizing component 100 has a simple overall structure and is easy to assemble into a component and then use it with other structural parts as an atomizing device. Therefore, it is called an integrated ultrasonic low-temperature circumferential atomizing component 100.

[0056] To facilitate the addition of atomizing media to the adsorption storage structure 108, or to replenish the adsorption storage structure 108 with atomizing media, in some embodiments, such as Figure 8 and Figure 9 As shown, the overall outer casing 106 has a liquid inlet 109, which exposes the adsorption storage structure 108. This design allows users to easily and quickly add or replenish the atomizing medium to the adsorption storage structure 108, ensuring the continuous and stable operation of the integrated ultrasonic low-temperature circumferential atomizing component 100, extending its service life, and saving operating costs. Furthermore, the liquid inlet 109 facilitates rapid filling of the atomizing medium during production, improving production efficiency and reducing production costs.

[0057] To facilitate the power connection and installation of the negative electrode housing 101, in various embodiments, the negative electrode housing 101 is installed within the overall housing 106 and has a portion protruding outside the overall housing 106. The negative electrode housing 101 is electrically connected to the negative electrode region 120 of the ceramic atomizing plate 104; in some embodiments, combined with Figure 1 , Figure 4 and Figure 10The negative electrode housing 101 has a second cavity 111, and a second limiting protrusion 122 protrudes from the negative electrode housing 101. The negative electrode housing 101 restricts the position of the elastic positive electrode 102 in the second cavity 111 through the second limiting protrusion 122. In this embodiment, the second limiting protrusion 122 protrudes outside the overall housing 106. This design allows the elastic positive electrode 102 to stably perform elastic expansion and contraction within the second cavity 111. At the same time, the second limiting protrusion 122 effectively prevents the elastic positive electrode 102 from excessively deviating or leaving the predetermined track during movement, thereby ensuring the stability and reliability of the elastic positive electrode 102 when in contact with the positive electrode region 117 of the ceramic atomizing plate 104, and improving the performance and service life of the integrated ultrasonic low-temperature circumferential atomizing component 100.

[0058] In each embodiment, such as Figure 4 and Figure 5 As shown, the elastic positive electrode 102 and the elastic support member 103 are installed in the negative electrode housing 101. The elastic positive electrode 102 is insulated from the negative electrode housing 101, and the elastic positive electrode 102 abuts against the elastic support member 103. The elastic positive electrode 102 has a state of elastically abutting against the positive electrode region 117 of the ceramic atomizing sheet 104, and a state of being out of contact with the positive electrode region 117. As an example, combined with... Figure 13 and Figure 14 In use, pressing the elastic positive electrode 102 once causes it to snap into a specific position, such as mounting position 115, of the elastic support 103 and maintain that position. At this time, the elastic positive electrode 102 abuts against the positive electrode area 117 of the ceramic atomizing plate 104. Because it is subjected to the force of the elastic support 103, this is called elastic abutting against the positive electrode area 117. At this time, the ceramic atomizing plate 104 of the integrated ultrasonic low-temperature circumferential atomizing component 100 is energized and begins to work. Pressing the elastic positive electrode 102 again causes it to disengage from the specific position of the elastic support 103 and reset under the action of the elastic support 103, disengaging from the positive electrode area 117. At this time, the ceramic atomizing plate 104 is de-energized and no longer works. This design enables rapid start-stop control of the ceramic atomizing plate 104, allowing users to flexibly control the operating state of the integrated ultrasonic low-temperature circumferential atomizing assembly 100 according to actual needs, thus improving the convenience and flexibility of its use. Simultaneously, the elastic force of the elastic support 103 ensures reliable contact and separation between the elastic positive electrode 102 and the positive electrode region 117, preventing circuit failures caused by poor or excessive contact, and improving the overall stability and reliability of the integrated ultrasonic low-temperature circumferential atomizing assembly 100.

[0059] In some of these embodiments, such as Figure 13 and Figure 14 As shown, the elastic positive electrode 102 includes an insulating body 112 and a protrusion 114 connected to each other; the insulating body 112 abuts against the elastic support member 103, and under the action of the elastic support member 103, has a state of abutting against the negative electrode shell 101; the protrusion 114 has a state of elastically abutting against the positive electrode region 117, and a state of disengaging from the positive electrode region 117. Figure 12 In this embodiment, the elastic positive electrode 102 also has a through hole 113 penetrating the insulating body 112 for installing the elastic positive electrode 102 or for ventilation. Exemplarily, the protrusion 114 has a snap-fit ​​structure for engaging with the elastic support 103. When snapped with the elastic support 103, the protrusion 114 elastically abuts against the positive electrode region 117; and under stress, it disengages from the elastic support 103, disengaging from the positive electrode region 117. This design, on the one hand, achieves separation of insulation and conductivity functions through the structural design of the insulating body 112 and the protrusion 114; the insulating body 112 ensures insulation between the elastic positive electrode 102 and the negative electrode shell 101, avoiding short-circuit risks, while the protrusion 114 is responsible for elastic contact with the positive electrode region 117 of the ceramic atomizing sheet 104, ensuring good conductivity. On the other hand, the elastic abutment design of the protrusion 114 allows the elastic positive electrode 102 to reliably and easily contact or detach from the positive electrode region 117. This elastic contact method can effectively address contact problems caused by mechanical vibration or thermal expansion, improving the stability and reliability of the integrated ultrasonic low-temperature circumferential atomizing component 100. Furthermore, the through hole 113 not only facilitates the installation and fixation of the elastic positive electrode 102 but also provides ventilation. This ventilation helps balance the internal air pressure of the integrated ultrasonic low-temperature circumferential atomizing component 100, serving as part of the airflow path and preventing leakage of the atomizing medium or abnormal internal pressure due to air pressure changes, further improving the safety and performance of the integrated ultrasonic low-temperature circumferential atomizing component 100. Moreover, this structural design simplifies the internal structure of the entire integrated ultrasonic low-temperature circumferential atomizing component 100, reducing the number and complexity of parts, lowering production costs, and improving assembly efficiency and maintenance convenience.

[0060] In some of these embodiments, such as Figure 13 and Figure 14 As shown, the elastic support 103 has a communicating mounting cavity 110 and a mounting position 115; combined with Figure 4 and Figure 6The elastic positive electrode 102 passes through the mounting position 115 and has a state of elastically abutting against the positive electrode region 117 in the mounting cavity 110, and a state of being disengaged from the positive electrode region 117. In some embodiments, when the elastic positive electrode 102 is elastically abutting against the positive electrode region 117, the mounting position 115 snaps and fixes the elastic positive electrode 102 in place. For example, the mounting position 115 has a snap-fit ​​area, and the protrusion 114 has a snap-fit ​​structure. The snap-fit ​​structure and the snap-fit ​​area are snapped together in a first state so that the elastic positive electrode 102 snaps onto and fixes the elastic support member 103, while the protrusion 114 elastically abuts against the positive electrode area 117 to achieve conductivity. In a second state, the snap-fit ​​structure and the snap-fit ​​area are disengaged so that the elastic positive electrode 102 and the elastic support member 103 are in a free-moving state, that is, no longer constrained by the snap-fit ​​relationship, so that the protrusion 114 is disengaged from the positive electrode area 117. In this state, the ceramic atomizing plate 104 does not work.

[0061] This design, on the one hand, through the structural design of the mounting position 115 and the mounting cavity 110, ensures that the elastic positive electrode 102 can be firmly snapped and fixed when it needs to contact the positive electrode area 117, guaranteeing good electrical contact and stable atomization operation; and when it needs to detach, the elastic positive electrode 102 can move flexibly within the mounting cavity 110 to achieve rapid power-off, improving the convenience and flexibility of operation. On the other hand, the snapping and fixing function of the mounting position 115 makes the position of the elastic positive electrode 102 more precise, avoiding problems such as poor contact or short circuits caused by positional deviations, thereby ensuring the stable operation of the ceramic atomizing plate 104 and improving the performance and reliability of the entire integrated ultrasonic low-temperature circumferential atomizing component 100. Furthermore, through the interconnected design of the mounting cavity 110 and the mounting position 115, the movement path of the elastic positive electrode 102 is more compact, reducing the internal space occupied by the integrated ultrasonic low-temperature circumferential atomizing component 100, which is conducive to the miniaturization and weight reduction of the integrated ultrasonic low-temperature circumferential atomizing component 100, adapting to more application scenarios. On the other hand, the elastic support 103 reduces the hard contact and wear between the elastic positive electrode 102 and the positive electrode region 117, thereby extending the service life of the elastic positive electrode 102 and the ceramic atomizing plate 104 and reducing maintenance costs.

[0062] In some of these embodiments, such as Figure 5 and Figure 6 As shown, the negative electrode shell 101 has a protruding limiting connection portion 116; the ceramic atomizing plate 104 is located between the limiting connection portion 116 and the elastic support member 103; combined with Figure 10 and Figure 11The elastic support 103 elastically abuts against the ceramic atomizing plate 104, so that the negative electrode region 120 of the ceramic atomizing plate 104 makes conductive contact with the limiting connection portion 116. Exemplarily, when the elastic support 103, along with the negative electrode housing 101 and the elastic positive electrode 102, is installed together in the overall housing 106, the elastic support 103 elastically abuts against the ceramic atomizing plate 104. This design, on the one hand, ensures stable conductive contact between the negative electrode region 120 of the ceramic atomizing plate 104 and the limiting connection portion 116 through the elastic abutment action of the elastic support 103. This contact method not only ensures reliable current transmission but also avoids poor contact problems caused by mechanical vibration or thermal expansion, improving the electrical stability of the entire integrated ultrasonic low-temperature circumferential atomizing assembly 100. On the other hand, the cooperative design of the limiting connection 116 and the elastic support 103 makes the position of the ceramic atomizing plate 104 more fixed inside the integrated ultrasonic low-temperature circumferential atomizing assembly 100, reducing the risk of failure due to positional displacement. This compact structural design not only improves the reliability of the integrated ultrasonic low-temperature circumferential atomizing assembly 100, but also optimizes the utilization of internal space. Furthermore, the clamping structure between the limiting connection 116 and the elastic support 103 provides physical protection for the ceramic atomizing plate 104, preventing it from being damaged by external impact or excessive compression during use, thus extending the service life of the ceramic atomizing plate 104. Moreover, this structural relationship makes the installation and disassembly of the ceramic atomizing plate 104 more convenient, facilitating rapid assembly during production and maintenance and replacement during use, reducing production costs and maintenance difficulty.

[0063] In some of these embodiments, such as Figure 2 and Figure 4As shown, the liquid guiding plate 105, the atomizing air channel 107, and the adsorption and storage structure 108 are all cylindrical in shape and coaxially arranged. As an example, a hollow cylinder is referred to as a cylindrical body. The atomizing air channel 107 has a cylindrical shape, and the liquid guiding plate 105 and the adsorption and storage structure 108 have cylindrical shapes. As an example, the liquid guiding plate 105 is a flat cylindrical shape. Exemplarily, the adsorption and storage structure 108 is cylindrical, and the atomizing air channel 107 is located in the middle of the adsorption and storage structure 108. Exemplarily, the atomizing air channel 107 is also cylindrical, and the atomizing air channel 107 is coaxially arranged with the adsorption and storage structure 108. This design, on the one hand, ensures that the coaxially arranged cylindrical liquid guide plate 105, atomizing air channel 107, and adsorption storage structure 108 ensure that the atomizing medium flows uniformly from the adsorption storage structure 108 through the liquid guide plate 105 to the ceramic atomizing plate 104, improving the liquid guiding efficiency and the uniformity of the atomization effect. On the other hand, the coaxial cylindrical structure makes the internal structure of the entire integrated ultrasonic low-temperature circumferential atomizing component 100 more compact, reducing space occupation and facilitating the miniaturization and weight reduction of the integrated ultrasonic low-temperature circumferential atomizing component 100, adapting to more application scenarios. Furthermore, the coaxial structure reduces vibration and uneven force caused by eccentricity, improving the stability of the integrated ultrasonic low-temperature circumferential atomizing component 100 during operation and extending its service life. Moreover, the atomizing air channel 107 is located in the middle of the adsorption storage structure 108 and is coaxial with it. This design optimizes the airflow path, allowing the atomized microparticles to be discharged more smoothly through the atomizing air channel 107, improving atomization efficiency and diffusion effect.

[0064] In some of these embodiments, such as Figure 10 or Figure 13As shown, the overall outer shell 106 has a first cavity 119, and the overall outer shell 106 has a first limiting protrusion 121. The overall outer shell 106 restricts the position of the adsorption storage structure 108 in the first cavity 119 by the first limiting protrusion 121. In some embodiments, the overall outer shell 106 has a first cavity 119, and the overall outer shell 106 has a first limiting protrusion 121. The overall outer shell 106 restricts the position of the adsorption storage structure 108 in the first cavity 119 by the first limiting protrusion 121; and the negative electrode shell 101 has a second cavity 111, and the negative electrode shell 101 has a second limiting protrusion 122. The negative electrode shell 101 restricts the position of the elastic positive electrode 102 in the second cavity 111 by the second limiting protrusion 122. This design serves two purposes. First, the first limiting protrusion 121 and the second limiting protrusion 122 respectively limit the adsorption storage structure 108 and the elastic positive electrode 102, ensuring their precise and stable positions within their respective cavities. This precise positioning effectively avoids problems such as poor atomization or poor circuit contact caused by component displacement, improving the overall performance and reliability of the integrated ultrasonic low-temperature circumferential atomizing assembly 100. Second, fixing the components with the limiting protrusions enhances the stability of the internal structure of the integrated ultrasonic low-temperature circumferential atomizing assembly 100, reducing the risk of component loosening or damage due to mechanical vibration or external impact. Therefore, this design not only improves the service life of the integrated ultrasonic low-temperature circumferential atomizing assembly 100 but also enhances its safety during use. Third, this limiting design makes the installation of the adsorption storage structure 108 and the elastic positive electrode 102 more convenient and quick, and also facilitates maintenance and replacement when needed. Furthermore, the structure of the limiting protrusions simplifies the assembly process, reducing production costs and maintenance difficulty. On the other hand, the design of the first cavity 119 and the second cavity 111 allows the various components to be compactly arranged inside the overall housing 106 and the negative electrode housing 101, reducing the overall volume of the integrated ultrasonic low-temperature circumferential atomizing component 100. This is beneficial for miniaturizing and lightening the integrated ultrasonic low-temperature circumferential atomizing component 100, making it suitable for more application scenarios.

[0065] The following will continue to combine Figures 1 to 14The integrated ultrasonic low-temperature circumferential atomizing component 100 is illustrated as an example and not a limitation. In this integrated ultrasonic low-temperature circumferential atomizing component 100, the atomizing medium, such as atomizing liquid, enters the adsorption storage structure 108 through the liquid inlet 109, i.e., the liquid guide hole. The adsorption storage structure 108 serves as the liquid storage system, i.e., the liquid storage element, of the integrated ultrasonic low-temperature circumferential atomizing component 100, and the atomizing liquid is stored in the adsorption storage structure 108. The atomizing air passage 107 serves as the smoke storage system, i.e., the smoke storage chamber. After the atomizing liquid is ultrasonically atomized by the ceramic atomizing plate 104, the resulting smoke is stored here for use, thus achieving an unobstructed center-outflow method to export the smoke generated by atomization. The liquid guide plate 105 serves as the liquid guide system, i.e., the liquid guide element, and is used to guide the atomizing liquid into the atomizing system for atomization.

[0066] The atomization system is part of the integrated ultrasonic low-temperature circumferential atomization assembly 100, including a negative electrode shell 101, an elastic positive electrode 102, an elastic support 103, and a ceramic atomizing plate 104, which can serve as the power transmission structure required for low-temperature atomization. An adsorption storage structure 108 is used as an oil storage element to store the atomizing liquid, and the liquid guide plate 105 uses a dual-channel liquid guide to supply the atomizing liquid to the ceramic atomizing plate 104. Since the periphery of the liquid guide plate 105 can be used to input the atomizing liquid into the ceramic atomizing plate 104, circumferential introduction of the atomizing liquid into the atomization system or its ceramic atomizing plate 104 is achieved. Furthermore, by adjusting the dimensions of the liquid guide plate 105 and the liquid inlet 109, different atomization volumes and effect requirements can be achieved. Moreover, through the cooperation of the negative electrode shell 101, the elastic positive electrode 102, the elastic support 103, and the ceramic atomizing plate 104, power transmission using an elastic structure is achieved, making it easy to control the working state of the ceramic atomizing plate 104. The integrated ultrasonic low-temperature circumferential atomizing component 100 has the advantages of simple structure and easy mass production and assembly.

[0067] With this design, the integrated ultrasonic low-temperature circumferential atomizing component 100 adopts a low-temperature atomization scheme, which does not produce chemical reactions and therefore does not produce harmful substances from high-temperature heating that could harm the user's body. Furthermore, the liquid guiding plate 105 achieves rapid liquid guiding without causing high-temperature burning of the atomizing element. At the same time, since no high temperature is generated, it will not damage other components of the atomizing module, nor will it change the original flavor of the atomizing liquid, nor will it produce high-temperature atomized smoke that could harm the user.

[0068] In some embodiments, an ultrasonic atomizer 300, such as Figure 15As shown, it includes a power supply component 200 and an integrated ultrasonic low-temperature circumferential atomizing component 100 as described in any embodiment. The power supply component 200 is electrically connected to the negative electrode shell 101 and the elastic positive electrode 102 of the integrated ultrasonic low-temperature circumferential atomizing component 100. Since the integrated ultrasonic low-temperature circumferential atomizing component 100 as described in any embodiment is used, the ultrasonic atomizer 300 also has the beneficial technical effects of the integrated ultrasonic low-temperature circumferential atomizing component 100, which will not be elaborated here.

[0069] It should be noted that other embodiments of this application also include an integrated ultrasonic low-temperature circumferential atomizing component and an ultrasonic atomizer formed by combining the technical features of the above embodiments. In each embodiment, the integrated ultrasonic low-temperature circumferential atomizing component can also be referred to as an atomizing component, an ultrasonic atomizing component, or an integrated ultrasonic low-temperature atomizing component.

[0070] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0071] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. An integrated ultrasonic low-temperature circumferential atomizing component (100), characterized in that, It includes an overall outer shell (106) and a negative electrode shell (101), an elastic positive electrode (102), an elastic support (103), a ceramic atomizing plate (104), a liquid guiding plate (105), and an adsorption and storage structure (108) located in the overall outer shell (106). The adsorption storage structure (108) abuts against the liquid guiding sheet (105), and the liquid guiding sheet (105) abuts against the ceramic atomizing sheet (104). The integrated ultrasonic low-temperature circumferential atomizing component (100) has an atomizing air channel (107) in the adsorption storage structure (108), the atomizing air channel (107) contacts the ceramic atomizing plate (104) and is exposed outside the overall shell (106); The negative electrode housing (101) is installed in the overall housing (106) and has a portion exposed outside the overall housing (106). The negative electrode housing (101) is electrically connected to the negative electrode region (120) of the ceramic atomizing plate (104). The elastic positive electrode (102) and the elastic support (103) are installed in the negative electrode shell (101). The elastic positive electrode (102) is insulated from the negative electrode shell (101) and abuts against the elastic support (103). The elastic positive electrode (102) has a state of elastically abutting against the positive electrode region (117) of the ceramic atomizing sheet (104) and a state of being disconnected from the positive electrode region (117).

2. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 1, characterized in that, The elastic positive electrode (102) includes an insulating body (112) and a protrusion (114) connected to each other. The insulating body (112) abuts against the elastic support (103), and under the action of the elastic support (103), it abuts against the negative electrode shell (101); The protrusion (114) has a state of elastically abutting against the positive electrode region (117) and a state of disengaging from the positive electrode region (117).

3. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 2, characterized in that, The elastic positive electrode (102) also has a through hole (113) that penetrates the insulating body (112).

4. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 1, characterized in that, The elastic support (103) has a communicating mounting cavity (110) and a mounting position (115). The elastic positive electrode (102) passes through the mounting position (115) and has a state in which it elastically abuts against the positive electrode region (117) in the mounting cavity (110), and a state in which it is disengaged from the positive electrode region (117).

5. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 4, characterized in that, With the elastic positive electrode (102) elastically abutting against the positive electrode region (117), the mounting position (115) snaps and fixes the elastic positive electrode (102).

6. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 1, characterized in that, The negative electrode shell (101) has a protruding limiting connection portion (116); the ceramic atomizing plate (104) is located between the limiting connection portion (116) and the elastic support member (103); the elastic support member (103) elastically abuts against the ceramic atomizing plate (104) so ​​that the negative electrode area (120) of the ceramic atomizing plate (104) is electrically connected to the limiting connection portion (116); or, The liquid guide plate (105), the atomizing air channel (107), and the adsorption liquid storage structure (108) are all cylindrical in shape and coaxially arranged.

7. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 1, characterized in that, The overall outer shell (106) has a first cavity (119), and the overall outer shell (106) has a first limiting protrusion (121) protruding therefrom. The overall outer shell (106) restricts the position of the adsorption storage structure (108) in the first cavity (119) by the first limiting protrusion (121); or, The negative electrode shell (101) has a second cavity (111) and a second limiting protrusion (122) protrudes from the negative electrode shell (101). The negative electrode shell (101) restricts the position of the elastic positive electrode (102) in the second cavity (111) through the second limiting protrusion (122).

8. The integrated ultrasonic low-temperature circumferential atomizing component (100) according to claim 1, characterized in that, The overall outer shell (106) has vents (123), which are connected to the atomizing air passage (107) through the through hole (118) of the liquid guide plate (105) to form an airflow path (124).

9. The integrated ultrasonic low-temperature circumferential atomizing assembly (100) according to any one of claims 1 to 8, characterized in that, The overall outer shell (106) has a liquid inlet (109) for exposing the adsorption storage structure (108).

10. An ultrasonic atomizer (300), characterized in that, Includes a power supply assembly (200) and an integrated ultrasonic low-temperature circumferential atomizing assembly (100) as described in any one of claims 1 to 9, wherein the power supply assembly (200) is electrically connected to the negative electrode shell (101) and the elastic positive electrode (102) of the integrated ultrasonic low-temperature circumferential atomizing assembly (100).

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