A multi-piece positioning mechanism for wafer polishing film

Abstract

The utility model discloses a kind of multi-piece positioning mechanism for wafer grinding film, belong to wafer positioning technical field, including supporting mechanism and limiting mechanism, the supporting mechanism includes base and movable disc, the inside of base is equipped with servo motor, the inside equidistance distribution of base is equipped with electric push rod, the movable end of electric push rod is fixedly connected with support disc, the output shaft of servo motor penetrates support disc and is fixedly connected with movable disc;The limiting mechanism includes positioning table and microporous vacuum chuck;The utility model is positioned by setting rotatable movable disc and the bearing of positioning table, the positioning of wafer and fixed ring is completed by positioning table cooperation microporous vacuum chuck, multiple wafers can be positioned on movable disc simultaneously, by switching the positioning table corresponding at processing mouth, to carry out the switching of wafer, can continuously carry out wafer's film processing, improve the overall efficiency of wafer grinding or film.

Description

Technical Field

[0001] This utility model specifically relates to a multi-piece positioning mechanism for wafer grinding and film application, belonging to the field of wafer positioning technology. Background Technology

[0002] In the semiconductor industry, wafer grinding and lamination are key manufacturing steps that directly affect wafer performance and determine the quality and reliability of the final product. Traditional wafer grinding and lamination processes typically involve processing one or a few wafers together, which is not only inefficient but also makes it difficult to ensure the positional consistency between wafers, ultimately leading to fluctuations in product quality. With the development of semiconductor technology, market demands have placed higher requirements on wafer processing capabilities. How to improve production efficiency while ensuring the positioning accuracy of multiple wafers during grinding and lamination has become an urgent technical challenge.

[0003] In existing wafer lamination technology, each wafer usually needs to be individually positioned, which is a cumbersome and time-consuming process. This means that if multiple wafers need to be processed at the same time during wafer lamination, the efficiency of the line will be greatly reduced. Especially in high-capacity production lines, this individual positioning method significantly limits the efficiency and continuity of the entire production system, resulting in low equipment utilization and production efficiency.

[0004] To address the aforementioned technical issues, a multi-piece positioning mechanism for wafer grinding and film application is proposed. Utility Model Content

[0005] The purpose of this invention is to address the shortcomings of existing technologies by providing a multi-wafer positioning mechanism for wafer grinding and film application. This mechanism allows for wafer switching by changing the positioning stage at the processing port, enabling continuous wafer film application and improving the overall efficiency of wafer grinding or film application.

[0006] A multi-piece positioning mechanism for wafer grinding and film application includes a support mechanism and a limiting mechanism. The support mechanism includes a base and a movable plate. A servo motor is installed inside the base. Electric push rods are equidistantly distributed inside the base. The movable end of the electric push rod is fixedly connected to the support plate. The output shaft of the servo motor passes through the support plate and is fixedly connected to the movable plate. Limiting grooves are equidistantly distributed on the top of the support plate. Locking blocks are integrally formed equidistantly distributed on the bottom of the movable plate. The locking blocks engage with the limiting grooves.

[0007] The limiting mechanism includes a positioning platform and a micro-perforated vacuum suction cup. The positioning platform is equidistantly distributed and installed on the top of the movable disk. The micro-perforated vacuum suction cup is installed inside the positioning platform. The top of the positioning platform is integrally formed with a limiting post. The top of the positioning platform is provided with a fixing ring, which engages with the limiting post. The top of the micro-perforated vacuum suction cup is provided with a wafer.

[0008] Furthermore, a film-removal groove is provided on one side of the positioning platform, and symmetrical removal grooves are provided on the top of the positioning platform.

[0009] Furthermore, an annular guide rail is installed inside the base, and the movable end of the annular guide rail is fixedly connected to the movable disk.

[0010] Furthermore, an anti-slip pad is fixedly connected to the bottom of the base.

[0011] Furthermore, a dustproof shell is fixedly connected to the top of the base, and a processing port is provided on one side of the dustproof shell.

[0012] Furthermore, a placement opening is provided on one side of the dustproof shell, and a guide ring is integrally formed inside the placement opening. Beneficial effects

[0013] This invention uses a rotatable movable disk to support the positioning stage. The positioning stage, in conjunction with a microporous vacuum chuck, completes the positioning of the wafer and the fixing ring. Multiple wafers can be positioned simultaneously on the movable disk. By switching the positioning stage corresponding to the processing port, wafer switching can be performed, enabling continuous wafer lamination processing and improving the overall efficiency of wafer grinding or lamination. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of this utility model;

[0015] Figure 2 This is a schematic diagram of the connection structure of the base in this utility model;

[0016] Figure 3 This is a schematic diagram of the positioning platform in this utility model;

[0017] Figure 4 This is a schematic diagram of the internal structure of the base in this utility model;

[0018] Figure 5 This is a schematic diagram of the internal cross-sectional structure of the base in this utility model.

[0019] In the diagram: 10. Support mechanism; 11. Base; 12. Anti-slip pad; 13. Movable plate; 14. Dustproof shell; 15. Processing port; 16. Placement port; 17. Guide ring; 18. Circular guide rail; 19. Support plate; 31. Limiting groove; 32. Servo motor; 33. Locking block; 34. Electric push rod; 20. Limiting mechanism; 21. Positioning stage; 22. Micro-perforated vacuum suction cup; 23. Fixing ring; 24. Wafer; 25. Removal groove; 26. Film peeling groove; 27. Limiting post. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-5 As shown, a multi-piece positioning mechanism for wafer grinding and film application consists of a support mechanism 10 and a limiting mechanism 20.

[0022] The support mechanism 10 includes a base 11 and a movable plate 13. A servo motor 32 is installed inside the base 11. Electric push rods 34 are equidistantly distributed inside the base 11. The servo motor 32 is model FTB-8-0R4G. The movable end of the electric push rod 34 is fixedly connected to the support plate 19. The output shaft of the servo motor 32 passes through the support plate 19 and is fixedly connected to the movable plate 13. Limiting grooves 31 are equidistantly distributed on the top of the support plate 19. The bottom of the movable plate 13 has integrally formed locking blocks 33 equidistantly distributed. The locking blocks 33 engage with the limiting grooves 31. An anti-slip pad 12 is fixedly connected to the bottom of the base 11.

[0023] As a technical optimization of this utility model, in order to enhance the stability of the movable plate 13, an annular guide rail 18 is installed inside the base 11, and the movable end of the annular guide rail 18 is fixedly connected to the movable plate 13.

[0024] As a technical optimization of this utility model, in order to protect the wafer 24 from dust, a dustproof shell 14 is fixedly connected to the top of the base 11. A processing port 15 is opened on one side of the dustproof shell 14, and a placement port 16 is opened on one side of the dustproof shell 14. A guide ring 17 is integrally formed inside the placement port 16 to guide the wafer 24 and the fixing ring 23 when they are placed.

[0025] The limiting mechanism 20 includes a positioning stage 21 and a micro-perforated vacuum suction cup 22. The positioning stage 21 is equidistantly distributed on the top of the movable plate 13. The micro-perforated vacuum suction cup 22 is installed inside the positioning stage 21. The micro-perforated vacuum suction cup 22 is a DISCO8 model and is controlled by a switch. The switch is located on the outside of the base 11 and is connected to an external mains power or portable power supply to power the micro-perforated vacuum suction cup 22, the servo motor 32, and the electric push rod 34. The top of the positioning stage 21 has an integrally formed limiting post 27. The top of the positioning stage 21 has a fixing ring 23, which engages with the limiting post 27. The top of the micro-perforated vacuum suction cup 22 has a wafer 24.

[0026] As a technical optimization of this utility model, in order to facilitate the removal of the film and the removal of the fixing ring 23 after the film is applied, a film removal groove 26 is provided on one side of the positioning platform 21, and a removal groove 25 is symmetrically provided on the top of the positioning platform 21.

[0027] Working principle: The wafer 24 is placed on the micro-perforated vacuum chuck 22 through the placement port 16, and the retaining ring 23 is placed on the positioning stage 21 through the placement port 16. The limiting post 27 of the positioning stage 21 passes through the retaining ring 23 and engages with it. In the initial state, the electric push rod 34 is retracted, and the support plate 19 does not contact the movable plate 13. After the wafer 24 and the retaining ring 23 are placed on the positioning stage 21, the servo motor 32 is started to drive the movable plate 13 to rotate, moving the positioning stage 21, which does not have the wafer 24 and retaining ring 23 placed on it, to the placement port 16. At point 6, after placing multiple wafers 24 on the positioning stage 21, the positioning stage 21 with wafers 24 and fixing rings 23 is rotated to the processing port 15. According to the processing requirements, the wafers 24 are ground or coated with film. During the processing, the electric push rod 34 is activated to push the support plate 19 to move upward and contact the movable plate 13. At the same time, the bottom locking block 33 of the movable plate 13 engages with the limiting groove 31 to enhance the stability of the movable plate 13. After the film coating process, the excess film is removed through the film peeling groove 26, and the fixed rings 23 and wafers 24 after film coating are removed through the removal groove 25.

[0028] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0029] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multi-piece positioning mechanism for wafer grinding and film application, comprising a support mechanism (10) and a limiting mechanism (20), characterized in that: The support mechanism (10) includes a base (11) and a movable plate (13). A servo motor (32) is installed inside the base (11). Electric push rods (34) are installed at equal intervals inside the base (11). The movable end of the electric push rod (34) is fixedly connected to the support plate (19). The output shaft of the servo motor (32) passes through the support plate (19) and is fixedly connected to the movable plate (13). Limiting grooves (31) are provided at equal intervals on the top of the support plate (19). The bottom of the movable plate (13) is integrally formed with locking blocks (33) at equal intervals. The locking blocks (33) engage with the limiting grooves (31). The limiting mechanism (20) includes a positioning platform (21) and a micro-perforated vacuum chuck (22). The positioning platform (21) is evenly distributed and installed on the top of the movable disk (13). The micro-perforated vacuum chuck (22) is installed inside the positioning platform (21). The top of the positioning platform (21) is integrally formed with a limiting post (27). The top of the positioning platform (21) is provided with a fixing ring (23). The fixing ring (23) engages with the limiting post (27). The top of the micro-perforated vacuum chuck (22) is provided with a wafer (24).

2. The multi-piece positioning mechanism for wafer polishing film attachment according to claim 1, wherein: The positioning platform (21) has a film-removing groove (26) on one side and a take-out groove (25) symmetrically opened on the top of the positioning platform (21).

3. The multi-piece positioning mechanism for wafer polishing film attachment according to claim 1, wherein: The base (11) is equipped with an annular guide rail (18), and the movable end of the annular guide rail (18) is fixedly connected to the movable disk (13).

4. The multi-piece positioning mechanism for wafer polishing film attachment according to claim 1, wherein: The bottom of the base (11) is fixedly connected to an anti-slip pad (12).

5. The multi-piece positioning mechanism for wafer grinding and film application as described in claim 1, characterized in that: A dust cover (14) is fixedly connected to the top of the base (11), and a processing port (15) is provided on one side of the dust cover (14).

6. The multi-piece positioning mechanism for wafer grinding and film application as described in claim 5, characterized in that: The dust cover (14) has a placement opening (16) on one side, and a guide ring (17) is integrally formed inside the placement opening (16).

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