Mask production individual package sealing temperature reducing device

Abstract

The utility model relates to a mask production technology field, specifically is a kind of mask production individual package sealing mouth cooling device, including air outlet barrel, air supply sleeve and mounting plate, recessed platform is provided in the upper end in air supply sleeve, positioning sleeve is sleeved in the upper end in air supply sleeve and the upper end of positioning sleeve is peripherally sleeved with the positioning ring welded, the positioning ring is located recessed platform top and is fixed on recessed platform by locating screw, the top of positioning sleeve is equipped with sealing net cover by screw and is equipped with suction fan by mounting seat in positioning sleeve;Air outlet barrel is sleeved in the bottom end in air supply sleeve, and fine copper pipe is laid equidistantly in air outlet barrel by copper pipe positioning baffle, and the outside of air outlet barrel is equidistantly installed with semiconductor refrigerator by mounting hole;Mask production individual package sealing mouth cooling device is rapidly cooled to the mask individual package after heat sealing mouth, and the overall cooling device structure is simple, and it is convenient for production application.

Description

Technical Field

[0001] This utility model relates to the field of mask production technology, specifically to a mask production package sealing and cooling device. Background Technology

[0002] The sealing process in mask production is a crucial step in ensuring the mask's airtightness, protective effect, and hygiene safety. It typically involves processes such as folding, pressing, and cutting. Mask packaging is mostly sealed by heat pressing, requiring a specialized mask packaging sealing and cooling device to cool the sealing area and prevent sticking.

[0003] Existing individual packaging sealing and cooling devices are not convenient for quickly cooling down individual mask packages after heat sealing, and existing cooling devices have complex structures, making them inconvenient for production and application. Utility Model Content

[0004] To address the problems in the existing technology, this utility model provides a mask production package sealing and cooling device. This device rapidly cools down the heat-sealed mask packages. The overall cooling device has a simple structure and is easy to apply in production.

[0005] The technical solution adopted by this utility model to solve its technical problem is a mask production package sealing and cooling device, including an air outlet, an air supply sleeve and an installation plate. The upper end of the air supply sleeve is provided with a recessed platform. The upper end of the air supply sleeve is fitted with a positioning sleeve and a positioning ring is welded to the upper periphery of the positioning sleeve. The positioning ring is located on the top of the recessed platform and is fixed to the recessed platform by positioning screws. The top of the positioning sleeve is fitted with a sealing mesh cover by screws and a suction fan is installed inside the positioning sleeve by an installation seat.

[0006] An air outlet is fitted inside the bottom of the air supply sleeve. Thin copper tubes are arranged at equal intervals inside the air outlet through a copper tube positioning partition. Semiconductor coolers are installed at equal intervals on the outside of the air outlet through mounting holes. A multi-channel temperature controller is installed on one side of the top of the air outlet by screws.

[0007] By adopting the above technical solution, the mask production package sealing and cooling device can quickly cool down the heat-sealed mask packages. The overall cooling device has a simple structure and is easy to use in production.

[0008] Specifically, the detection end of the multi-channel temperature controller is located inside the air outlet duct, and the output end of the multi-channel temperature controller is electrically connected to the input end of the semiconductor cooler via a wire.

[0009] By adopting the above technical solution, the multi-channel temperature controller controls the semiconductor cooler to maintain a constant temperature inside the air outlet duct, thereby reducing the temperature of the surface of the thin copper tube.

[0010] Specifically, the cooling end of the semiconductor cooler is located inside the air outlet duct, and the heating end of the semiconductor cooler is located outside the air outlet duct.

[0011] Specifically, one side of the air supply sleeve is connected to a mounting plate via a connecting plate, and the mounting plate is provided with mounting holes.

[0012] By adopting the above technical solution, the mounting holes on the mounting plate and the matching bolts make it easy to fix the entire cooling device to the support frame for use.

[0013] Specifically, the bottom end of the positioning sleeve is bonded with elastic support blocks at equal intervals, and the elastic support blocks are pressed against the inner wall of the air supply sleeve.

[0014] Specifically, a duckbill-shaped air outlet is installed at the bottom of the air outlet duct by screws.

[0015] The beneficial effects of this utility model are:

[0016] (1) The mask production package sealing and cooling device described in this utility model uses the mounting holes on the mounting plate and the matching bolts to make it easy to fix the overall cooling device on the support frame. The duckbill air outlet is aligned with the heat-sealed mask package. The semiconductor cooler is used to cool the air outlet, and the multi-channel temperature controller controls the semiconductor cooler to keep the air outlet at a constant temperature, thereby reducing the temperature of the surface of the thin copper tube.

[0017] (2) The mask production package sealing and cooling device described in this utility model uses a suction fan to blow outside air into the air outlet, and the gas is evenly dispersed into the thin copper tube to achieve rapid reduction of gas temperature. Finally, the cooled gas is blown out from the duckbill air outlet to quickly cool down the heat-sealed mask package. The sealing mesh cover facilitates the filtering of dust and other particulate matter in the air to avoid contaminating the mask package. The overall cooling device has a simple structure and is easy to use in production. Attached Figure Description

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0020] Figure 2 This is an exploded view of the present invention;

[0021] Figure 3 This is a schematic diagram of the suction fan structure of this utility model;

[0022] Figure 4 This is a schematic diagram of the copper tube positioning partition structure of this utility model.

[0023] In the diagram: 1. Duckbill air outlet; 2. Semiconductor cooler; 3. Multi-channel thermostat; 4. Air outlet duct; 5. Air supply sleeve; 6. Positioning ring; 7. Positioning sleeve; 8. Sealing mesh cover; 9. Positioning screw; 10. Mounting hole; 11. Mounting plate; 12. Elastic support block; 13. Recessed platform; 14. Thin copper tube; 15. Suction fan; 16. Copper tube positioning partition. Detailed Implementation

[0024] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model will be further described below in conjunction with specific embodiments.

[0025] To rapidly cool down individual mask packages after heat sealing in mask production, the overall cooling device has a simple structure and is easy to apply in production. Figure 1-4 As shown, the present invention provides a mask production package sealing and cooling device, including an air outlet duct 4, an air supply sleeve 5, and an installation plate 11. The upper end of the air supply sleeve 5 is provided with a recessed platform 13. The upper end of the air supply sleeve 5 is fitted with a positioning sleeve 7, and a positioning ring 6 is welded to the upper periphery of the positioning sleeve 7. The positioning ring 6 is located on the top of the recessed platform 13 and is fixed to the recessed platform 13 by positioning screws 9. The top of the positioning sleeve 7 is fitted with a sealing mesh cover 8 by screws, and a suction fan 15 is installed inside the positioning sleeve 7 by an installation seat.

[0026] An air outlet duct 4 is fitted inside the bottom of the air supply sleeve 5. Fine copper tubes 14 are arranged at equal intervals inside the air outlet duct 4 through a copper tube positioning partition 16. Semiconductor coolers 2 are installed at equal intervals on the outside of the air outlet duct 4 through mounting holes. A multi-channel thermostat 3 is installed on one side of the top of the air outlet duct 4 by screws.

[0027] When in use, the mask production package sealing and cooling device quickly cools down the heat-sealed mask packages. The overall cooling device has a simple structure and is easy to use in production.

[0028] For example, such as Figure 1 As shown, the present invention also includes a detection end of the multi-channel temperature controller 3 located inside the air outlet duct 4, and an output end of the multi-channel temperature controller 3 electrically connected to the input end of the semiconductor cooler 2 via a wire.

[0029] During use, the multi-channel thermostat 3 controls the semiconductor cooler 2 to maintain a constant temperature inside the air outlet duct 4, thereby reducing the surface temperature of the thin copper tube 14.

[0030] For example, such as Figure 1 As shown, the present invention also includes a cooling end of the semiconductor cooler 2 located inside the air outlet duct 4, and a heating end of the semiconductor cooler 2 located outside the air outlet duct 4.

[0031] When in use, the semiconductor cooler 2 is used to cool and lower the temperature inside the air outlet duct 4.

[0032] For example, such as Figure 1 As shown, the present invention also includes an installation plate 11 connected to one side of the air supply sleeve 5 via a connecting plate, and the installation plate 11 is provided with an installation hole 10.

[0033] When in use, the mounting holes 10 on the mounting plate 11 and the matching bolts make it easy to fix the entire cooling device to the support frame.

[0034] For example, such as Figure 1 , 2 As shown, the present invention also includes elastic support blocks 12 that are bonded at equal intervals to the bottom end of the positioning sleeve 7, and the elastic support blocks 12 are pressed against the inner wall of the air supply sleeve 5.

[0035] During use, the elastic support block 12 provides stable support for the positioning sleeve 7.

[0036] For example, such as Figure 1 As shown, the present invention also includes a duckbill air outlet 1 installed at the bottom of the air outlet 4 by screws.

[0037] During use, the cooled gas is blown out from the duckbill air outlet 1 to quickly cool down the heat-sealed mask package.

[0038] When in use, the mounting holes 10 and matching bolts on the mounting plate 11 are used to fix the overall cooling device to the support frame. The duckbill air outlet 1 is aligned with the heat-sealed mask package. The semiconductor cooler 2 is used to cool the air outlet 4 and the multi-channel temperature controller 3 controls the semiconductor cooler 2 to maintain a constant temperature in the air outlet 4, thereby reducing the surface temperature of the thin copper tube 14.

[0039] The suction fan 15 blows outside air into the air outlet 4, and the gas is evenly dispersed into the thin copper tube 14 to quickly reduce the gas temperature. Finally, the cooled gas is blown out from the duckbill air outlet 1 to quickly cool down the heat-sealed mask pack. The sealing mesh cover 8 is used to filter out dust and other particles in the air to avoid contaminating the mask pack. The overall cooling device has a simple structure and is easy to use in production.

[0040] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The descriptions of the above embodiments and specifications are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of protection claimed by this utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A mask production package sealing and cooling device, characterized in that, It includes an air outlet duct (4), an air supply sleeve (5) and a mounting plate (11). The upper end of the air supply sleeve (5) is provided with a recessed platform (13). The upper end of the air supply sleeve (5) is fitted with a positioning sleeve (7) and a positioning ring (6) is welded to the upper periphery of the positioning sleeve (7). The positioning ring (6) is located on the top of the recessed platform (13) and is fixed on the recessed platform (13) by a positioning screw (9). The top of the positioning sleeve (7) is fitted with a sealing mesh cover (8) by screws and a suction fan (15) is installed inside the positioning sleeve (7) by a mounting seat. An air outlet tube (4) is fitted inside the bottom of the air supply sleeve (5). Fine copper tubes (14) are arranged at equal intervals inside the air outlet tube (4) through a copper tube positioning partition (16). Semiconductor coolers (2) are installed at equal intervals on the outside of the air outlet tube (4) through mounting holes. A multi-channel temperature controller (3) is installed on one side of the top of the air outlet tube (4) by screws.

2. The mask production package sealing and cooling device according to claim 1, characterized in that, The detection end of the multi-channel temperature controller (3) is located inside the air outlet duct (4), and the output end of the multi-channel temperature controller (3) is electrically connected to the input end of the semiconductor cooler (2) through a wire.

3. The mask production package sealing and cooling device according to claim 1, characterized in that, The cooling end of the semiconductor cooler (2) is located inside the air outlet duct (4), and the heating end of the semiconductor cooler (2) is located outside the air outlet duct (4).

4. The mask production package sealing and cooling device according to claim 1, characterized in that, One side of the air supply sleeve (5) is connected to a mounting plate (11) via a connecting plate, and the mounting plate (11) is provided with mounting holes (10).

5. The mask production package sealing and cooling device according to claim 1, characterized in that, The bottom end of the positioning sleeve (7) is bonded with elastic support blocks (12) at equal intervals, and the elastic support blocks (12) are pressed against the inner wall of the air supply sleeve (5).

6. The mask production package sealing and cooling device according to claim 1, characterized in that, The bottom of the air outlet (4) is fitted with a duckbill air outlet (1) by screws.

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