Wafer non-contact inspection apparatus

Abstract

The utility model discloses a kind of wafer non-contact detection equipment, including measuring rack, measuring platform, XY axis module, gantry crossbeam and Z axis module;Measuring platform is located on the upper end surface of measuring rack, and measuring platform is connected by the air bag being equipped between measuring rack, and measuring platform surface is equipped with a carrier, and the carrier is connected by the XY axis module being equipped between measuring platform;Gantry crossbeam is fixedly installed in measuring platform by the pillar being equipped in both sides, Z axis module is installed in one side of gantry crossbeam, and the first measuring sensor and the second measuring sensor of Z axis module lower end are installed on Z axis module by the adapter plate being equipped, and measuring sensor position and detection position on carrier correspond to each other, and the position of measuring sensor is adjusted by the cooperation of XY axis module and Z axis module, and then data acquisition is carried out to wafer surface.The utility model realizes the high-precision rapid measurement of wafer surface topography and thickness, small space occupation and reduced cost.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing testing equipment technology, and in particular to a high-precision non-contact testing device for wafer morphology and thickness, which is suitable for rapid measurement of surface morphology flatness, local thickness and overall thickness uniformity of silicon wafers and compound semiconductor wafers. Background Technology

[0002] In the semiconductor manufacturing industry, wafer quality inspection is a crucial step in ensuring chip performance and yield. Parameters such as wafer surface morphology flatness, local thickness, and overall thickness uniformity have a significant impact on the performance of semiconductor devices. Therefore, high-precision, fast, and reliable wafer inspection technology has always been a research hotspot in this field. However, traditional wafer inspection methods have several limitations, including: First, separate inspection is currently a common method, which involves using a profilometer to inspect the wafer's surface morphology and a thickness gauge to inspect the wafer's thickness separately. This separate inspection method is inefficient, requiring two separate devices for measurement, which not only increases equipment costs but also prolongs inspection time. Furthermore, traditional equipment is often incompatible with multi-size wafers, limiting its application in different production scenarios.

[0003] Secondly, contact thickness gauges (such as micrometers) pose a risk of scratching the wafer surface during measurement. Wafer surfaces typically have extremely high precision requirements, and even the smallest scratch can render the wafer unusable, thereby increasing production costs.

[0004] Furthermore, while optical interferometry, a commonly used non-contact measurement method, has certain advantages, it also has significant drawbacks. Optical interferometry requires a high reflectivity of the wafer surface; when the wafer surface is rough or contains thin films, the measurement error increases significantly. This makes optical interferometry unsuitable for meeting high-precision requirements when inspecting certain special types of wafers.

[0005] In summary, existing wafer inspection technologies face challenges in terms of efficiency, compatibility, accuracy, and security. Therefore, developing a high-precision, non-contact inspection device capable of simultaneously measuring wafer surface morphology and thickness, compatible with multiple wafer sizes, is of significant practical importance for improving semiconductor manufacturing efficiency and quality. Utility Model Content

[0006] To address the shortcomings of existing technologies, this utility model discloses a non-contact wafer inspection device to solve the problems mentioned in the background section.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a non-contact wafer inspection device, comprising a measurement rack, a measurement platform, an XY-axis module, a gantry beam, and a Z-axis module; the measurement platform is located on the upper surface of the measurement rack, and the measurement platform is connected to the measurement rack via an airbag; a carrier is provided on the surface of the measurement platform for placing the wafer to be inspected, and the carrier is connected to the measurement platform via the XY-axis module; a gantry beam is provided at the upper end of the carrier, and the gantry beam is provided with airbags on both sides. The support column is fixedly installed on the measurement platform. The Z-axis module is installed on one side of the gantry beam. The lower end of the Z-axis module is respectively provided with a first measurement sensor and a second measurement sensor. The first and second measurement sensors are installed on the Z-axis module through a connecting plate. The position of the measurement sensor corresponds to the detection position on the carrier. By cooperating with the XY-axis module and the Z-axis module, the position of the measurement sensor is adjusted, thereby collecting data on the wafer surface. The measurement platform, carrier and gantry beam are all made of marble.

[0008] Preferably, both the XY-axis module and the Z-axis module are linear motor modules. The Z-axis module is directly fixed to the gantry beam with screws, and the XY-axis module is directly locked to the marble platform with screws. The vehicle is locked to the motion platform of the XY-axis module with screws.

[0009] Preferably, the number of airbags is four, and they are located at the four corners of the measuring frame.

[0010] Preferably, the airbag is bell-shaped and has a base plate at the wide end. The base plate has drilled holes and bolts are used to install the airbag on the inner wall of the measurement platform. The airbag is made of synthetic rubber and its structure allows for effective vibration isolation without causing excessive horizontal deformation.

[0011] Preferably, the outer end wall of the base plate of the airbag is provided with an anti-slip pad.

[0012] Preferably, the side wall of the measuring frame is provided with an air injection port, which is connected to the airbag. The air volume inside the airbag is increased or decreased through the air injection port, thereby adjusting the levelness of the measuring platform.

[0013] Preferably, the carrier includes two forms: edge contact and full-surface adsorption, which can be compatible with wafers of multiple sizes.

[0014] Compared with the prior art, the beneficial effects of this utility model are as follows: 1. With the cooperation of the measurement frame, measurement platform, XY axis module, Z axis module and measurement sensor, this utility model realizes rapid measurement of wafer surface morphology and thickness. The measurement accuracy is high, the error is low, and the morphology and detection are integrated into one device. It can work independently, occupy little space, and reduce the overall cost.

[0015] 2. In this utility model, the adjustable airbag has shock absorption and level adjustment functions, which effectively isolates vibration and avoids platform breakage or angle deviation, ensuring that the wafer is in a standard plane and significantly improving measurement accuracy.

[0016] 3. In this utility model, both the measurement platform and the carrier adopt a high-precision marble platform, which can effectively ensure the measurement accuracy from the hardware perspective and reduce measurement errors. Attached Figure Description

[0017] The accompanying drawings are provided to further understand the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention and do not constitute a limitation thereof.

[0018] In the attached diagram:

[0019] Figure 1 This is a schematic diagram of the overall structure of the non-contact wafer inspection device of this utility model;

[0020] Figure 2 This is a schematic diagram of the structure of the airbag of this utility model;

[0021] The following are the labels in the diagram: 1. Measurement frame; 101. Air injection port; 2. Measurement platform; 3. XY axis module; 4. Gantry beam; 401. Support column; 5. Z axis module; 501. Adapter plate; 6. Carrier; 7. First measurement sensor; 8. Second measurement sensor; 9. Airbag; 901. Base plate; 902. Drill hole; 903. Anti-slip pad. Detailed Implementation

[0022] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0023] Example: Figure 1 and Figure 2 As shown, a non-contact wafer inspection device includes a measurement rack 1, a measurement platform 2, an XY axis module 3, a gantry beam 4, and a Z axis module 5.

[0024] The measurement platform 2 is located on the upper surface of the measurement frame 1. The measurement platform 2 and the measurement frame 1 are connected by airbags 9. In this embodiment, there are four airbags 9, which are located at the four corners of the measurement frame 1. The airbags 9 are bell-shaped, and a base plate 901 is provided on the wide end of the airbag. Drill holes 902 are provided on the base plate 901, and the airbags 9 are installed on the inner wall of the measurement platform 2 with bolts. The airbags 9 are made of high-quality synthetic rubber. Their structure not only achieves shock absorption, but also allows for effective vibration isolation, and will not cause excessive horizontal deformation. The components will not break due to excessive load or sudden pressure drop. The outer end wall of the base plate 901 of the airbag 9 is provided with an anti-slip pad 903. The side wall of the measuring frame 1 is provided with an air injection port 101, which is connected to the airbag 9. The airbag is inflated to 5-6 bar through a standard valve. At the same time, the air volume inside the airbag 9 can be increased or decreased through the air injection port 101 to adjust the level of the measuring platform 2. The measurement platform 2 has a carrier 6 on its surface for placing the wafer to be inspected. The carrier 6 includes two types: edge contact and full-surface adsorption, which are compatible with wafers of various sizes. The carrier 6 is connected to the measurement platform 2 through an XY axis module 3. A gantry beam 4 is provided at the upper end of the carrier 6, and the gantry beam 4 is fixedly installed on the measurement platform 2 through support columns 401 on both sides. The Z axis module 5 is installed on one side of the gantry beam 4. The lower end of the Z axis module 5 is provided with a first measurement sensor 7 and a second measurement sensor 8, which are installed on the Z axis module 5 through an adapter plate 501. The positions of the measurement sensors correspond to the detection positions on the carrier 6. By cooperating with the XY axis module 3 and the Z axis module 5, the positions of the measurement sensors are adjusted to collect data from the wafer surface.

[0025] Furthermore, in this embodiment, both the XY axis module 3 and the Z axis module 5 are linear motor modules. The Z axis module 5 is directly fixed to the gantry beam 4 with screws, the XY axis module 3 is directly locked to the marble platform with screws, and the carrier 6 is locked to the motion platform of the XY axis module 3 with screws.

[0026] Furthermore, in this embodiment, the measurement platform 2, the carrier 6, and the gantry beam 4 are all made of marble.

[0027] The specific working principle includes: 1) Placing the wafer carrier 6 on the measurement platform 2 and adjusting the level of the measurement platform 2 by adjusting the air volume of the airbag 9; 2) Then, through the cooperation of the XY axis module 3 and the Z axis module 5, the first measurement sensor 7 is used to simultaneously measure the position of the upper and lower surfaces of the wafer to obtain the data of the upper and lower surfaces of the wafer; 3) The wafer thickness parameter is calculated based on the data of the upper and lower surfaces of the wafer; 4) At the same time, through the cooperation of the XY axis module 3 and the Z axis module 5, the wafer is driven into the measurement area of ​​the second measurement sensor 8; 5) The second measurement sensor 8 is used to take full coverage points on the wafer surface to obtain the data of the entire wafer surface; 6) Finally, the morphology parameters of the wafer surface are calculated based on the data of the wafer surface.

[0028] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A non-contact wafer inspection device, characterized in that, The system includes a measurement rack, a measurement platform, an XY-axis module, a gantry beam, and a Z-axis module. The measurement platform is located on the upper surface of the measurement rack and is connected to the measurement rack via an airbag. A carrier is mounted on the surface of the measurement platform for placing the wafer to be inspected. The carrier is connected to the measurement platform via the XY-axis module. A gantry beam is mounted on the upper end of the carrier and is fixedly installed on the measurement platform via supports on both sides. The Z-axis module is mounted on one side of the gantry beam. A first measurement sensor and a second measurement sensor are respectively mounted on the lower end of the Z-axis module. The first and second measurement sensors are mounted on the Z-axis module via an adapter plate, and the positions of the measurement sensors correspond to the detection positions on the carrier. By cooperating with the XY-axis module and the Z-axis module, the positions of the measurement sensors are adjusted to collect data from the wafer surface.

2. The non-contact wafer inspection device according to claim 1, characterized in that: Both the XY-axis module and the Z-axis module are linear motor modules. The Z-axis module is directly fixed to the gantry beam with screws, and the XY-axis module is directly locked to the marble platform with screws. The vehicle is locked to the motion platform of the XY-axis module with screws.

3. The non-contact wafer inspection device according to claim 1, characterized in that: The number of airbags is four, and they are located at the four corners of the measuring frame.

4. The non-contact wafer inspection device according to claim 3, characterized in that: The airbag is bell-shaped and has a base plate on its wide end. The base plate has drilled holes and is used with bolts to install the airbag on the inner wall of the measurement platform.

5. The non-contact wafer inspection device according to claim 4, characterized in that: The outer end wall of the base plate of the airbag is provided with an anti-slip pad.

6. The non-contact wafer inspection device according to claim 3, characterized in that: The side wall of the measuring frame is provided with an air injection port, which is connected to the airbag. The level of the measuring platform can be adjusted by increasing or decreasing the amount of air inside the airbag through the air injection port.

7. The non-contact wafer inspection device according to claim 1, characterized in that: The carrier includes two forms: edge contact and full-surface adsorption.

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