A multi-layer encapsulated sensor device

Abstract

The utility model relates to a kind of multi-layer encapsulated sensing device, including mainboard shell, the top of the mainboard shell is fixedly provided with multilayer encapsulated component, the inside of the multilayer encapsulated component is provided with the sensor of several numbers, the top of the multilayer encapsulated component is fixedly provided with mounting plate, the top of the mounting plate is provided with display screen.The multi-layer encapsulated sensing device, when needing to increase or reduce sensor, by pulling the pull plate of the front side of any one encapsulated frame of first encapsulated frame, second encapsulated frame and third encapsulated frame, pull plate drives two fixed blocks to move outward, two fixed plates drive bearing plate to move outward, so that sensor can be taken out or put in, so as to easily increase or reduce sensor type and quantity, adapt to different application scene needs, by the above setting, fault sensor module can be quickly replaced alone, without overall shutdown, and by clear physical and functional layering, reduce system complexity, improve reliability.

Description

Technical Field

[0001] This utility model relates to the field of sensing device technology, specifically to a multi-layer packaged sensing device. Background Technology

[0002] A sensing device, often simply called a sensor, is a device that detects and responds to specific types of inputs or stimuli, converting these inputs into usable signals for further processing, analysis, display, or control. Sensors are an indispensable component of various monitoring, measurement, and control systems, and are widely used in industrial automation, environmental monitoring, medical equipment, smart homes, transportation, and many other fields.

[0003] With the development of the Internet of Things and smart devices, the demand for sensors is increasing. Existing sensor systems usually have the following problems: sensors usually work independently and lack effective integration and data fusion capabilities; the system design is fixed and it is difficult to flexibly add or reduce the types and number of sensors according to application requirements; sensor modules are usually tightly integrated with the system, and the entire system needs to be disassembled for maintenance and upgrades, which increases maintenance costs and time. Therefore, a multi-layer packaged sensing device is proposed to solve the above problems. Utility Model Content

[0004] To address the shortcomings of existing technologies, this utility model provides a multi-layered packaged sensing device that uses a modular design to facilitate flexible adjustment of the number of sensors to meet user needs.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a multi-layer encapsulated sensing device, comprising a motherboard housing, a multi-layer encapsulation assembly fixedly disposed on the top of the motherboard housing, a plurality of sensors disposed inside the multi-layer encapsulation assembly, a mounting plate fixedly disposed on the top of the multi-layer encapsulation assembly, and a display screen disposed on the top of the mounting plate.

[0006] The multi-layer packaging assembly includes a first packaging frame, which is fixedly installed on the top of the motherboard casing. A second packaging frame is fixedly installed on the top of the first packaging frame, and a third packaging frame is fixedly installed on the top of the second packaging frame. Two T-shaped blocks are fixedly installed inside the first packaging frame. Fixing blocks are slidably installed on the surfaces of the two T-shaped blocks. A carrier plate is fixedly installed between the two fixing blocks, and a pull plate is fixedly installed on the front side of the two fixing blocks.

[0007] Furthermore, the motherboard body is fixedly installed inside the motherboard casing.

[0008] Furthermore, a T-shaped guide groove is provided inside the fixing block, and the T-shaped block is slidably installed on the fixing block through the T-shaped guide groove.

[0009] Furthermore, a sensor is provided on the top of the support plate, and a pull ring is fixedly provided on the front side of the pull plate.

[0010] Furthermore, an opening is provided on the front side of the first encapsulation frame, and the pull plate extends to the outside of the first encapsulation frame through the opening.

[0011] Furthermore, the internal structures of the first encapsulation frame, the second encapsulation frame, and the third encapsulation frame are identical, and the mounting plate is fixedly installed on the top of the third encapsulation frame.

[0012] Furthermore, a support rod is fixedly installed on the top of the mounting plate, a display screen is fixedly installed on the top of the support rod, and a cable interface is provided at the bottom of the display screen.

[0013] Compared with the prior art, the technical solution of this application has the following beneficial effects:

[0014] This multi-layered encapsulated sensing device, through its multi-layered encapsulation components, allows for easy addition or removal of sensors. By pulling the pull plate on the front side of any one of the first, second, or third encapsulation frames, the pull plate moves two fixed blocks outwards, which in turn move a carrier plate outwards, exposing the carrier plate to the outside of the encapsulation frame. This allows for the removal or insertion of sensors, easily increasing or decreasing the type and number of sensors to adapt to different application scenarios. Furthermore, this design enables rapid, individual replacement of faulty sensor modules without requiring a complete system shutdown. The clear physical and functional layering reduces system complexity and improves reliability. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present utility model;

[0016] Figure 2 This is a schematic diagram of the internal structure of the first packaging frame of this utility model;

[0017] Figure 3 This is a perspective view of the connection between the fixing block and the bearing plate of this utility model;

[0018] Figure 4 This is a perspective view of the connection between the pull plate and the fixing block of this utility model;

[0019] Figure 5 This is a perspective view of the fixing block and T-shaped block of this utility model;

[0020] Figure 6 This is a perspective view of the motherboard casing of this utility model;

[0021] Figure 7 This is a top view of the motherboard casing of this utility model.

[0022] In the diagram: 1. Motherboard casing; 2. Motherboard body; 3. Multi-layer encapsulation assembly; 301. First encapsulation frame; 302. Second encapsulation frame; 303. Third encapsulation frame; 304. T-block; 305. Fixing block; 306. Carrier plate; 307. Pull plate; 308. Pull ring; 4. Sensor; 5. Mounting plate; 6. Support rod; 7. Display screen. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] Please see Figure 1-7 In this embodiment, a multi-layer packaged sensing device includes a motherboard housing 1, a multi-layer packaged assembly 3 is fixedly disposed on the top of the motherboard housing 1, a number of sensors 4 are disposed inside the multi-layer packaged assembly 3, a mounting plate 5 is fixedly disposed on the top of the multi-layer packaged assembly 3, and a display screen 7 is disposed on the top of the mounting plate 5.

[0025] The multi-layer encapsulation assembly 3 includes a first encapsulation frame 301, which is fixedly installed on the top of the motherboard housing 1. A second encapsulation frame 302 is fixedly installed on the top of the first encapsulation frame 301, and a third encapsulation frame 303 is fixedly installed on the top of the second encapsulation frame 302. Two T-shaped blocks 304 are fixedly installed inside the first encapsulation frame 301. Fixing blocks 305 are slidably installed on the surfaces of the two T-shaped blocks 304. A carrier plate 306 is fixedly installed between the two fixing blocks 305. A pull plate 307 is fixedly installed on the front side of the two fixing blocks 305.

[0026] like Figure 7As shown, the motherboard housing 1 houses the motherboard body 2, and the combination of the motherboard housing 1 and the motherboard body 2 constitutes the core motherboard of the sensor 4 device, which is also the core foundation layer. The core motherboard is responsible for the following aspects: First, basic computing power. The core foundation layer runs the underlying operating system, manages task scheduling, and processes basic data streams, providing the necessary computing resources and data processing capabilities for the entire system. Second, communication hub. It integrates multiple communication interfaces, including Ethernet, USB, CAN, RS-232 / 485, WiFi / Bluetooth, and even industrial buses such as Modbus and EtherCAT. These interfaces are not only used to connect the upper-layer sensor 4 modules, but also responsible for data exchange with external devices, ensuring the interconnectivity of the system. Third, power management and distribution. The core foundation layer converts and regulates the externally input power and provides a stable and reliable power supply to the upper-layer modules through standardized connectors (such as board-to-board connectors and high-density sockets), which ensures the energy efficiency and reliability of the system.

[0027] like Figure 5 As shown, by opening a T-shaped guide groove inside the fixed block 305, the fixed block 305 can be moved stably inside the first encapsulation frame 301. The T-shaped guide groove also has a guiding effect, preventing the fixed block 305 from shifting in position. The pull ring 308 makes it easy for the staff to pull the pull plate 307.

[0028] like Figure 3 As shown, a sensor 4 is provided on the top of the carrier plate 306, and the sensors 4 provided on the top of the carrier plate 306 inside the first encapsulation frame 301, the second encapsulation frame 302 and the third encapsulation frame 303 are different, and each sensor 4 module is an independent functional unit.

[0029] like Figure 1 As shown, by setting up the mounting plate 5, the support rod 6 and the display screen 7, the support rod 6 is set up to support the display screen 7. The display screen 7 is an integrated display screen, whose function is to display data in real time. It presents the sensor 4 data, fusion results, system status and other information processed by the core motherboard to the user in an intuitive way (such as values, charts, curves, dashboards and alarm information). Its interface is a human-computer interaction interface, and the display screen 7 can be connected to the motherboard body 2 through the cable interface via internal cables.

[0030] In summary, this multi-layered encapsulated sensing device, by setting up a multi-layered encapsulation component 3, allows for the addition or removal of sensors 4 when necessary. This is achieved by pulling the pull plate 307 on the front side of any one of the encapsulation frames 301, 302, or 303. The pull plate 307 moves two fixing blocks 305 outwards, which in turn moves the carrier plate 306 outwards, exposing the carrier plate 306 to the outside of the encapsulation frame. This allows for the removal or insertion of the sensor 4, easily increasing or decreasing the type and quantity of sensors 4 to adapt to different application scenarios. Furthermore, this design allows for quick and individual replacement of faulty sensor modules without requiring a complete system shutdown. The clear physical and functional layering reduces system complexity and improves reliability.

[0031] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A multi-layer packaged sensing device, comprising a motherboard housing (1), characterized in that: The top of the motherboard housing (1) is fixedly provided with a multi-layer encapsulation assembly (3), and the interior of the multi-layer encapsulation assembly (3) is provided with a number of sensors (4). The top of the multi-layer encapsulation assembly (3) is fixedly provided with a mounting plate (5), and the top of the mounting plate (5) is provided with a display screen (7). The multi-layer encapsulation assembly (3) includes a first encapsulation frame (301), which is fixedly installed on the top of the motherboard housing (1). A second encapsulation frame (302) is fixedly installed on the top of the first encapsulation frame (301), and a third encapsulation frame (303) is fixedly installed on the top of the second encapsulation frame (302). Two T-shaped blocks (304) are fixedly installed inside the first encapsulation frame (301). Fixing blocks (305) are slidably installed on the surfaces of the two T-shaped blocks (304). A carrier plate (306) is fixedly installed between the two fixing blocks (305). A pull plate (307) is fixedly installed on the front side of the two fixing blocks (305).

2. The multi-layer packaged sensing device according to claim 1, characterized in that: The motherboard body (2) is fixedly installed inside the motherboard casing (1).

3. The multi-layer packaged sensing device according to claim 1, characterized in that: The fixing block (305) has a T-shaped guide groove inside, and the fixing block (305) has a T-shaped block (304) slidably installed on it through the T-shaped guide groove.

4. The multi-layer packaged sensing device according to claim 1, characterized in that: A sensor (4) is provided on the top of the bearing plate (306), and a pull ring (308) is fixedly provided on the front side of the pull plate (307).

5. The multi-layer packaged sensing device according to claim 1, characterized in that: The first encapsulation frame (301) has an opening on its front side, and the pull plate (307) extends to the outside of the first encapsulation frame (301) through the opening.

6. The multi-layer packaged sensing device according to claim 1, characterized in that: The internal structures of the first encapsulation frame (301), the second encapsulation frame (302) and the third encapsulation frame (303) are the same, and the mounting plate (5) is fixedly installed on the top of the third encapsulation frame (303).

7. The multi-layer packaged sensing device according to claim 1, characterized in that: A support rod (6) is fixedly installed on the top of the mounting plate (5), and a display screen (7) is fixedly installed on the top of the support rod (6). A cable interface is provided at the bottom of the display screen (7).

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