A PCB testing device for post-reflow soldering detection

Abstract

The application relates to a PCB testing device for post-reflow soldering detection, which comprises a pressing mechanism, a tray supporting mechanism and a support box seat, the bearing platform is provided with a plurality of test module interfaces and probe conversion interfaces, the tray supporting mechanism is adapted to a to-be-tested PCB and is positioned, the pressing mechanism realizes compression of the to-be-tested PCB, ensures that test needles are in contact with the to-be-tested PCB, the device is compatible with various test modules such as test fans, test loudspeakers, communication antennas and the like with PWM speed regulation functions, and realizes state visualization through an indicator light bearing mechanism and a display bearing mechanism, and based on the plurality of test module interfaces and the probe conversion interfaces which are flexibly adapted to different test needles, different functional test modules can be quickly connected, the electrical performance, signal transmission capacity and functional integrity of the PCB can be comprehensively detected, the multi-dimensional detection requirement of a high-integration-degree PCB can be met without replacing a complete set of equipment, equipment investment cost is greatly reduced, and the reuse rate of the detection equipment is improved.

Description

Technical Field

[0001] This application relates to the field of electronic manufacturing testing technology, specifically to a PCB testing device for post-reflow soldering inspection. Background Technology

[0002] In the electronics manufacturing industry, after the reflow soldering process, PCBs (printed circuit boards) must undergo rigorous testing to ensure their electrical performance and structural integrity, which is a crucial step in ensuring the quality of electronic equipment. However, existing testing equipment has many limitations: on the one hand, the test modules of traditional equipment have fixed functions, making it difficult to adapt to the testing of PCBs of different models and with different functional requirements. When testing PCBs with different functions such as indicator lights, fans, audio, or communication, it is often necessary to replace the entire testing equipment, resulting in low testing efficiency and high equipment investment costs. On the other hand, the compatibility between test probes and interfaces is poor, and replacing test probes requires cumbersome wiring operations, which not only prolongs the test preparation time but also easily affects the test accuracy due to wiring errors. In addition, the positioning and pressing mechanism of some testing equipment is poorly designed, which can easily lead to positioning deviations or uneven pressure when fixing and testing the PCB under test, resulting in distorted test data or even damage to the PCB board.

[0003] With the rapid pace of electronic product updates and iterations, and the increasing functional integration of PCBs, higher demands are being placed on the versatility, flexibility, and testing accuracy of testing equipment. Existing technologies can no longer meet the needs of efficient and accurate testing of diverse PCBs. Therefore, there is an urgent need for a testing device that can flexibly adapt to various testing modules, simplify the operation process, and ensure testing stability to solve the above problems. Utility Model Content

[0004] To overcome the shortcomings of the prior art, this application provides a PCB testing device for post-reflow soldering inspection, specifically adopting the following technical solution:

[0005] A PCB testing device for post-reflow soldering inspection includes a pressing mechanism, a tray support mechanism, and a support box base. The support box base is provided with a bearing platform on top, the tray support mechanism is disposed on the bearing platform, and the pressing mechanism is located above the bearing platform.

[0006] The support platform is equipped with multiple test module interfaces and probe conversion interfaces. The test module interfaces are used to connect test modules with different functions, and the probe conversion interfaces are used to adapt to the test probes of different test modules. The test probes and the probe conversion interfaces are connected by plug-in connection. The probe conversion interfaces and the test module interfaces are connected through cables configured inside the support box.

[0007] The tray support mechanism includes a carrying tray, which is disposed on the surface of the carrying platform, and the carrying tray is provided with a mounting slot adapted to the PCB under test, and the bottom of the mounting slot is provided with a through hole adapted to the test probe.

[0008] The pressing mechanism includes a pressing push rod and a pressing plate. The pressing push rod extends perpendicularly toward the bearing platform, and the pressing plate is fixedly connected to the pressing push rod.

[0009] Optionally: Multiple pallet supports are provided between the carrying pallet and the carrying platform. The corners of the carrying pallet are provided with mounting holes adapted to the pallet supports. The upper ends of the pallet supports are connected to the mounting holes of the carrying pallet, and the lower ends of the pallet supports are connected to the surface of the carrying platform.

[0010] Optionally: the upper end of the pallet support passes through the mounting hole of the carrying pallet, and the upper end of the pallet support is provided with a limiting boss; a return spring is sleeved in the pallet support at the position between the carrying pallet and the carrying platform, one end of the return spring abuts against the carrying pallet, and the other end of the return spring abuts against the carrying platform.

[0011] Optionally: The lower surface of the pressure plate is provided with multiple pressure columns for supporting the test PCB.

[0012] Optionally, the test module interface includes at least an indicator light signal interface, a display signal interface, a fan signal interface, an audio signal interface, and a communication signal interface.

[0013] Optionally: The support platform is provided with an indicator light support mechanism and a display support mechanism, which are respectively arranged opposite to each other on both sides of the pressing mechanism;

[0014] The indicator light carrier mechanism is used to fix status indicator lights with different testing functions, and the status indicator lights are connected to the indicator light signal interface through signal lines;

[0015] The display support mechanism is used to fix displays of different sizes, and the displays are connected to the display signal interface via signal lines.

[0016] Optionally: The test module includes at least one test fan with PWM speed control function, the test fan is fixed to the support platform, and the test fan is connected to the fan signal interface through a signal line.

[0017] Optionally, the test module includes at least one test speaker, which is fixed to the support platform and connected to the audio signal interface via a signal line.

[0018] Optionally, the test module includes at least one communication antenna, which is located behind the pressing mechanism and fixed to the support platform. The communication antenna is connected to the communication signal interface via a signal line.

[0019] Optionally, the pressing mechanism further includes a support frame, the support frame having a limiting slider adapted to the pressing push rod, the limiting slider maintaining the pressing push rod's free vertical movement; the support frame having at least one limiting slide rod, the pressing plate having a limiting hole adapted to the limiting slide rod, the limiting slide rod and the limiting hole maintaining the pressing plate's free vertical movement.

[0020] The technical solution of this application achieves the following beneficial effects:

[0021] The PCB testing device of this application is compatible with various testing modules such as test fans with PWM speed control, test speakers, and communication antennas. It achieves status visualization through indicator light carrier mechanism and display carrier mechanism. Based on multiple test module interfaces and probe conversion interface that flexibly adapts to different test tips, it can quickly connect test modules with different functions to comprehensively test the electrical performance, signal transmission capability and functional integrity of PCB. It can meet the multi-dimensional testing needs of highly integrated PCB without replacing the entire set of equipment, which greatly reduces the equipment investment cost and improves the reusability of testing equipment. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the overall structure of the PCB testing device used for post-reflow soldering inspection in the embodiments of this application.

[0023] Figure 2 This is a schematic diagram of the transmission connection between the PCB under test and different test modules in an embodiment of this application.

[0024] The specific meanings of the reference numerals in the attached figures are as follows:

[0025] 1-Support box base; 101-Bearing platform; 1011-Test module interface; 2-Pressing mechanism; 201-Pressing push rod; 202-Pressing plate; 2021-Pressing column; 203-Supporting frame; 3-Tray support mechanism; 301-Mounting slot; 302-Through hole; 303-Tray support column; 304-Test probe; 4-Indicator light bearing mechanism; 5-Display bearing mechanism; 6-Test speaker; 7-Test fan; 8-Communication antenna. Detailed Implementation

[0026] The present application will now be further described with reference to the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solutions of the present application and should not be construed as limiting the scope of protection of the present application. It should be noted that the following detailed descriptions are exemplary and intended to provide further explanation of the present application.

[0027] This application discloses a PCB testing device for post-reflow soldering inspection. It organically integrates testing modules with different functions to construct a closed-loop testing system encompassing "positioning-contact-detection-feedback." Each testing module complements the PCB under test, forming a complete testing chain characterized by precise positioning, reliable contact, multi-dimensional detection, and intuitive feedback. Compared to traditional fixtures, this achieves a breakthrough in both testing efficiency and accuracy.

[0028] Specifically, such as Figure 1 As shown, the device in this embodiment includes a pressing mechanism 2, a pallet support mechanism 3, and a support box base 1. The support box base 1 has a top support platform 101, the pallet support mechanism 3 is disposed on the support platform 101, and the pressing mechanism 2 is located above the support platform 101. The support box base 1 serves as a basic support unit, integrating various functional modules through the top support platform 101.

[0029] Preferably, the support base 1 is made of bakelite substrate. This material not only has strong insulation properties, eliminating the risk of leakage during testing, but also reduces weight by approximately 80% compared to traditional metal materials, greatly improving the portability of the device. Simultaneously, bakelite has excellent high-temperature adaptability; its structure will not deform even when exposed to residual heat of 80-120°C from the PCB after reflow soldering, avoiding the misalignment of the test probes 304 due to material softening, a problem easily encountered with traditional ABS materials. Furthermore, bakelite has better wear resistance than ABS, and the accuracy of the positioning holes decays more slowly over long-term use, significantly extending the lifespan of the device.

[0030] It should be noted that the support box 1 described in this embodiment generally has a mounting cavity inside, and a microcontroller and relays are built in. It can serve as the control center of the entire testing device to realize functions such as module collaborative control, probe signal detection, and data interaction transmission. Furthermore, the connecting cables between the PCB under test and different testing modules can be uniformly integrated in the mounting cavity, completely solving the problems of messy cables and signal interference in traditional fixtures, and avoiding the impact of cables on testing efficiency.

[0031] Furthermore, such as Figure 1As shown, the support platform 101 is equipped with multiple test module interfaces 1011 and probe conversion interfaces. The test module interfaces 1011 are used to connect test modules with different functions. For example, in this embodiment, they include at least indicator light signal interfaces, display signal interfaces, fan signal interfaces, audio signal interfaces, and communication signal interfaces, etc., and can connect corresponding test modules according to actual testing needs. The probe conversion interface is used to adapt to the test probes 304 of different test modules. The test probes 304 and the probe conversion interface are connected by a plug-in connection, which facilitates quick replacement of probes to adapt to different testing needs. At the same time, the probe conversion interface and the test module interfaces 1011 are connected through cables configured inside the support housing 1, making signal transmission more stable and reliable and reducing external interference.

[0032] Based on the above structure, the device in this embodiment has excellent compatibility and flexibility, and can flexibly and selectively connect test modules according to the specifications of the PCB under test. For example, for a PCB that only requires basic continuity testing, only the indicator light signal interface and the communication signal interface can be connected, and the test results can be fed back through the status indicator light and the data can be uploaded; while for a PCB that includes an audio module and a display module, the audio signal interface, display signal interface, etc. can be connected at the same time to realize the synchronous testing of multiple functions.

[0033] Meanwhile, the test probes 304 can be flexibly selected and arranged to meet the testing needs of PCBs of different sizes. Since the test probes 304 and probe conversion interfaces are pluggable, operators can select test probes 304 of different diameters, lengths, or tip types (e.g., pointed probes are suitable for high-density solder joints, while round-tipped probes are suitable for large conductive areas) based on the distribution density, spacing, and conductivity characteristics of the test points on the PCB. In terms of layout, the distribution of test probes 304 can be perfectly matched to the PCB test points by adjusting the number and position of the activated probe conversion interfaces. For example, for small PCBs, only the probe conversion interfaces in the central area of ​​the support platform 101 can be activated; for large PCBs, the interfaces can be extended to the edge areas, ensuring that all test points can accurately contact the corresponding probes, avoiding missed or false detections due to improper probe layout.

[0034] Furthermore, since the test probe 304 and the probe conversion interface in the above structure are connected by a plug-in connection, the test signal loss can be minimized, ensuring stable conduction with the PCBA test point. Compared with the traditional plug-in wire harness method, the use of test probe 304 can reduce connector loss, reduce plug-in time, reduce contact impedance by 90%, shorten test preparation time from 30 seconds to 0.5 seconds, adaptive pressure control avoids PCBA damage, and track probe wear status in real time.

[0035] Furthermore, such as Figure 1As shown, the tray support mechanism 3 in this embodiment is used to support and position the PCB under test. Specifically, it includes a support tray disposed on the surface of the support platform 101. The support tray has a mounting groove 301 adapted to the PCB under test, ensuring accurate and rapid positioning of the PCB and the test probe 304, preventing PCB displacement during testing. Furthermore, the bottom of the mounting groove 301 has a through hole 302 adapted to the test probe 304. During testing, the test probe 304 can contact the test point on the PCB through the through hole 302 to achieve signal transmission and detection.

[0036] It should be noted that the carrier tray described in this embodiment can be quickly replaced according to the PCB specifications in actual testing, improving the device's adaptability to different types of PCBs. Since different PCB specifications differ in size, shape, and positioning hole positions, the through-hole 302 of the carrier tray is adjusted accordingly. This structure allows the same testing device to flexibly meet the testing needs of different PCB specifications, avoiding the high cost of customizing a complete set of testing fixtures for different PCB specifications. Furthermore, the standardized connection structure ensures the installation accuracy of the carrier tray after replacement, guaranteeing that the correspondence between the test probe 304 and the PCB test points remains accurate. This improves the device's versatility while maintaining the stability and reliability of the testing process.

[0037] Furthermore, in this embodiment, multiple pallet supports 303 may be provided between the carrying pallet and the carrying platform 101. The corner of the carrying pallet is provided with mounting holes adapted to the pallet supports 303. The upper end of the pallet support 303 is connected to the mounting hole of the carrying pallet, and the lower end of the pallet support 303 is connected to the surface of the carrying platform 101. The pallet supports 303 support the carrying pallet to ensure its stability.

[0038] Furthermore, to ensure that the test probe 304 has a certain elastic range of motion and to ensure uniform contact pressure, in this embodiment, the upper end of the tray support 303 passes through the mounting hole of the tray support 303, and the upper end of the tray support 303 is provided with a limiting boss to prevent the carrier tray from falling off the tray support 303; a return spring is sleeved in the tray support 303 at the position between the carrier tray and the carrier platform 101, one end of the return spring abutting against the carrier tray, and the other end of the return spring abutting against the carrier platform 101. When the carrier tray is subjected to downward pressure, the return spring is compressed, and the carrier tray moves downward, causing the test probe 304 in the through hole 302 to extend and contact the test point on the PCB. When the downward pressure disappears, the return spring can drive the carrier tray to automatically return to its original position, and the test probe 304 in the through hole 302 retracts, and the test probe 304 disengages from the test point on the PCB. This structure improves the convenience of operation and also protects the test probe 304 from bending or damage due to external forces.

[0039] More specifically, the pressing mechanism 2 described in this embodiment applies a certain pressure to the PCB under test, ensuring close contact between the test points of the PCB and the test probes 304, thus ensuring stable testing. The pressing mechanism 2 specifically includes a pressing push rod 201 and a pressing plate 202. The extension direction of the pressing push rod 201 is perpendicular to the support platform 101, and the pressing plate 202 is fixedly connected to the pressing push rod 201. When the pressing push rod 201 extends, it drives the pressing plate 202 to move downwards, pressing the PCB under test firmly into the mounting groove 301 of the support tray, ensuring reliable contact between the test probes 304 and the PCB test points. Furthermore, this embodiment provides multiple pressing columns 2021 on the lower surface of the pressing plate 202 to abut against the PCB under test. This design maintains a fixed distance between the pressing plate and the support tray, ensuring consistent contact depth between the PCB and the test probes 304 during pressing, resulting in more uniform pressure distribution and preventing excessive local pressure that could damage the PCB.

[0040] Furthermore, such as Figure 1 As shown, the pressing mechanism 2 in this embodiment also includes a support frame 203. The support frame 203 is provided with a limiting slider adapted to the pressing push rod 201. The limiting slider keeps the pressing push rod 201 moving freely vertically, which can prevent deviation during the pressing process. At the same time, the support frame 203 is provided with at least one limiting slide rod, and the pressing plate 202 is provided with a limiting hole adapted to the limiting slide rod. The limiting slide rod and the limiting hole keep the pressing plate 202 moving freely vertically, which further improves the stability and accuracy of the pressing process.

[0041] Furthermore, since the test module interface 1011 in this embodiment includes at least an indicator light signal interface, a display signal interface, a fan signal interface, an audio signal interface, and a communication signal interface, the corresponding test module can be connected according to the actual test requirements during the actual test process.

[0042] Combination Figure 2 As shown, in this embodiment, the modules work together to support PCB testing. The power supply, as the energy core of the entire testing device, can power multiple testing modules. For example, it powers the PCB under test (DUT) to ensure its own operation; it powers the communication antenna to ensure it functions properly for wireless communication; and it powers the relays so that they can operate according to I / O control signals, thereby controlling the power supply to components such as the test fan and test speaker. Furthermore, the DUT interacts and controls with multiple testing modules through signals. For example, when testing a fan, the PCB under test (DUT) adjusts its speed using a PWM signal to verify different speed requirements; for status indicator lights, the DUT outputs signals to control their on / off state or display different statuses, providing intuitive feedback on the test progress or results; in terms of interaction with the display screen, the DUT can transmit test data and images to the display screen via HDMI signals, making it easy for operators to view detailed information; for test speakers, the DUT sends audio signals so that the test speaker can emit alarm sounds or other prompts when needed; the connection with the PC can be achieved via Ethernet, enabling the transmission, storage, or remote control of large amounts of test data; and for the start-up board, CAN communication can be used to complete the interaction of relevant commands and data, ensuring the orderly start and progress of the test process.

[0043] Furthermore, the test module includes at least one test fan 7 with PWM speed control function. The test fan 7 is fixed to the support platform 101, and the test fan 7 is connected to the fan signal interface through a signal line. During the test, the fan speed can be adjusted according to the fan speed control function of the PCB to perform functional verification. At the same time, the PCB can also be cooled to ensure the stability of the test environment.

[0044] Furthermore, the test module includes at least one test speaker 6, which is fixed to the support platform 101 and connected to the audio signal interface via a signal line. This module can serve as the audio verification terminal of the test device to verify the integrity of the audio output function of the PCBA and broadcast the results.

[0045] Furthermore, the test module includes at least one communication antenna 8, which is located behind the pressing mechanism 2 and fixed to the support platform 101. The communication antenna 8 is connected to the communication signal interface through a signal line to realize wireless communication between the test device and external devices, facilitating the transmission of test data and remote monitoring.

[0046] It should be noted that in this embodiment, multiple control switches can also be set on the carrier platform 101. The test fan 7 and the test speaker 6 can be turned on and off by the control switches, and the physical state can be used to ensure that each function is verified individually to prevent missed tests and false tests.

[0047] Furthermore, in this embodiment, an indicator light carrier mechanism 4 and a display carrier mechanism 5 are provided on the carrier platform 101, respectively arranged opposite to each other on both sides of the pressing mechanism 2. The indicator light carrier mechanism 4 is used to fix status indicator lights with different testing functions, and the status indicator lights are connected to the indicator light signal interface via signal lines, which can intuitively display different test states, such as test in progress, test passed, test failed, etc. The display carrier mechanism 5 is used to fix display screens of different sizes, and the display screens are connected to the display signal interface via signal lines, which can display detailed test data, waveforms, and other information for easy viewing by operators.

[0048] Furthermore, it should be noted that the carrier platform 101 described in this embodiment can serve as the upper cover of the support box 1. The two are connected by a hinge and locked with a latch, which greatly facilitates the maintenance, debugging, and internal cable management of the device. When it is necessary to inspect the cable connections, interface modules, or other core components inside the support box 1, the operator only needs to unlock the latch and flip the carrier platform 101 to fully expose the internal space of the support box 1, significantly shortening the maintenance time. When the latch is locked, the two form a closed overall structure. At this time, the carrier platform 101 not only serves as the installation base for each test module, but also protects the cables and components inside the support box 1, preventing external dust, impurities from entering, or accidental contact that could cause circuit failures.

[0049] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the technical principles of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A PCB testing device for post-reflow soldering inspection, characterized in that, The device includes a pressing mechanism (2), a pallet support mechanism (3), and a support box base (1). The support box base (1) is provided with a bearing platform (101) on top. The pallet support mechanism (3) is disposed on the bearing platform (101). The pressing mechanism (2) is located above the bearing platform (101). The support platform (101) is provided with multiple test module interfaces (1011) and probe conversion interfaces. The test module interfaces (1011) are used to connect test modules with different functions. The probe conversion interfaces are used to adapt the test probes (304) of different test modules. The test probes (304) and the probe conversion interfaces are connected by plug-in connection. The probe conversion interfaces and the test module interfaces are connected through cables configured inside the support box (1). The tray support mechanism (3) includes a carrying tray, which is disposed on the surface of the carrying platform (101), and the carrying tray is provided with a mounting groove (301) adapted to the PCB to be tested, and the bottom of the mounting groove (301) is provided with a through hole (302) adapted to the test probe (304). The pressing mechanism (2) includes a pressing push rod (201) and a pressing plate (202). The pressing push rod (201) extends perpendicularly toward the bearing platform (101), and the pressing plate (202) is fixedly connected to the pressing push rod (201).

2. The PCB testing apparatus for post-reflow soldering inspection according to claim 1, characterized in that, Multiple pallet supports (303) are provided between the carrying pallet and the carrying platform (101). The corner of the carrying pallet is provided with mounting holes adapted to the pallet supports (303). The upper end of the pallet support (303) is connected to the mounting hole of the carrying pallet, and the lower end of the pallet support (303) is connected to the surface of the carrying platform (101).

3. The PCB testing apparatus for post-reflow soldering inspection according to claim 2, characterized in that, The upper end of the pallet support (303) passes through the mounting hole of the carrying pallet, and the upper end of the pallet support (303) is provided with a limiting boss; a return spring is sleeved in the pallet support (303) at the position between the carrying pallet and the carrying platform (101), one end of the return spring abuts against the carrying pallet, and the other end of the return spring abuts against the carrying platform (101).

4. The PCB testing apparatus for post-reflow soldering inspection according to claim 1, characterized in that, The lower surface of the pressure plate (202) is provided with a plurality of pressure posts (2021) for abutting the PCB under test.

5. The PCB testing apparatus for post-reflow soldering inspection according to claim 1, characterized in that, The test module interface (1011) includes at least an indicator light signal interface, a display signal interface, a fan signal interface, an audio signal interface, and a communication signal interface.

6. The PCB testing apparatus for post-reflow soldering inspection according to claim 5, characterized in that, The support platform (101) is provided with an indicator light support mechanism (4) and a display support mechanism (5), which are respectively arranged opposite to each other on both sides of the pressing mechanism (2); The indicator light carrier (4) is used to fix status indicator lights with different testing functions, and the status indicator lights are connected to the indicator light signal interface through signal lines; The display support mechanism (5) is used to fix displays of different sizes, and the displays are connected to the display signal interface via signal lines.

7. The PCB testing apparatus for post-reflow soldering inspection according to claim 5, characterized in that, The test module includes at least one test fan (7) with PWM speed regulation function. The test fan (7) is fixed to the support platform (101), and the test fan (7) is connected to the fan signal interface through a signal line.

8. The PCB testing apparatus for post-reflow soldering inspection according to claim 5, characterized in that, The test module includes at least one test speaker (6), which is fixed to the support platform (101) and is connected to the audio signal interface via a signal line.

9. The PCB testing apparatus for post-reflow soldering inspection according to claim 5, characterized in that, The test module includes at least one communication antenna (8), which is located behind the pressing mechanism (2) and fixed to the bearing platform (101). The communication antenna (8) is connected to the communication signal interface through a signal line.

10. The PCB testing apparatus for post-reflow soldering inspection according to claim 1, characterized in that, The pressing mechanism (2) further includes a support frame (203), which is provided with a limiting slider adapted to the pressing push rod (201). The pressing push rod (201) is kept to move freely vertically by the limiting slider. The support frame (203) is provided with at least one limiting slide rod. The pressing plate (202) is provided with a limiting hole adapted to the limiting slide rod. The pressing plate (202) is kept to move freely vertically by the limiting slide rod and the limiting hole.

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